Display TOP lamp bead device and light-emitting module

Abstract

The utility model discloses a lamp bead device for displaying TOP and a light-emitting module, and relates to the technical field of semiconductor devices, the lamp bead device comprises an LED support, the LED support comprises a base and a fence extending from the edge of the base, the fence is enclosed on the base to form an accommodating space, and an LED chip is arranged on the base in the accommodating space; the positive electrode of the LED chip is connected to the positive electrode pin through wire bonding; the negative electrode of the LED chip is connected to the negative electrode pin through wire bonding; wherein each of the positive electrode pin and the negative electrode pin comprises a bonding part, a stretching part and a bonding pad part, the bonding parts extend into the accommodating space and are positioned on the base, the bonding pad parts are exposed out of the LED bracket and are used for being connected with a circuit board, the stretching parts are connected between the bonding parts and the bonding pad parts, and the bonding parts are sunken towards the base from the connecting parts of the bonding parts and the stretching parts to the other ends; therefore, the functional area of the lamp bead device is recessed inwards. The LED lamp solves the problem that in the prior art, water vapor is prone to intruding into the lamp bead from the gap of the combination face between the metal pin and the LED support.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, and specifically to a display TOP lamp bead device and a light-emitting module. Background Art

[0002] With the widespread application of display technology, the application of LED display devices, the key components of display screens, has become more important. In particular, as display screens develop towards high viewing angles, high brightness, and high reliability, higher requirements are placed on LED display devices, that is, higher viewing angles, higher brightness, and higher reliability are required of the lamp beads, which are more in line with the requirements for outdoor scenes.

[0003] Existing display TOP lamp bead devices usually use TOP stamping injection molding bracket as LED bracket. The LED bracket is divided into front and back sides. The front side is composed of PPA and the metal pin part after stamping as the functional area of ​​the lamp bead. The PPA part is formed into a fence (bowl cup) by injection molding to protect the functional area. The back side is composed of PPA and metal pins, and the metal pins are bent and exposed. The front functional area uses silver glue or insulating glue to fix the chip in the functional area, and then the wires are welded to the chip electrodes and the functional area to form an electrical connection between the chip and the functional area. The bracket is sealed with glue through a dispensing process, and then the materials are blanked into display TOP lamp bead devices.

[0004] However, due to the material difference between the LED bracket and the metal pin, there will inevitably be a gap between the two, and because the metal pin is a stamping part, its surface is relatively flat, which easily leads to water vapor invading from the gap between the metal pin and the LED bracket, thereby reducing the service life of the display TOP lamp bead device. Utility Model Content

[0005] In view of the deficiencies of the prior art, the purpose of the present utility model is to provide a display TOP lamp bead device and a light-emitting module, aiming to solve the problem in the prior art that water vapor easily invades the interior of the lamp bead from the gap between the joint surface between the metal pin and the LED bracket.

[0006] A first aspect of the present invention is to provide a TOP display lamp bead device, the lamp bead device comprising:

[0007] An LED bracket, the LED bracket comprising a base and a fence extending from an edge of the base, the fence is enclosed on the base to form a containing space, and the LED chip is arranged on the base in the containing space;

[0008] A positive electrode pin, the positive electrode of the LED chip is connected to the positive electrode pin through wire bonding;

[0009] A cathode pin, the cathode of the LED chip is connected to the cathode pin via wire bonding;

[0010] Among them, both the positive electrode pin and the negative electrode pin include a bonding portion, a stretching portion and a pad portion. The bonding portion extends into the accommodating space and is located above the base. The pad portion exposes the LED bracket for connection with a circuit board. The stretching portion is connected between the bonding portion and the pad portion, and the bonding portion is recessed towards the base from its connection portion with the stretching portion to the other end, so that the functional area of the lamp bead device is recessed inward.

[0011] According to one aspect of the above technical solution, the bonding portion and the stretching portion are transitionally connected through the connection portion, and the connection portion is wrapped by the base and the enclosure.

[0012] According to one aspect of the above technical solution, the connection portion includes at least one bend.

[0013] According to one aspect of the above technical solution, the connection portion is embedded in the enclosure between the base and the enclosure.

[0014] According to one aspect of the above technical solution, at least part of the base is embedded in the bending area of the connection portion between the base and the enclosure.

[0015] According to one aspect of the above technical solution, the height difference between the horizontal height of the vertex of the connection portion and the horizontal height of the surface of the bonding portion facing the accommodating space is 0.075 mm - 0.2 mm.

[0016] According to one aspect of the above technical solution, the height difference between the horizontal height of the vertex of the connection portion and the horizontal height of the surface of the bonding portion facing the accommodating space is 0.125 mm - 0.165 mm.

[0017] According to one aspect of the above technical solution, the LED chip includes a first LED chip, a second LED chip and a third LED chip, and the first LED chip, the second LED chip and the third LED chip have different light emitting colors.

[0018] According to one aspect of the above technical solution, any one of the positive electrode pin and the negative electrode pin is a common electrode pin, and the other is a split electrode pin, including a first pin, a second pin and a third pin;

[0019] Among them, one ends of the first LED chip, the second LED chip and the third LED chip are all connected to the common electrode pin, and the other ends are respectively connected to the first pin, the second pin and the third pin.

[0020] The second aspect of the present invention lies in providing a light emitting module, including the display TOP lamp bead device described in the above technical solution.

[0021] Compared with the prior art, the use of the display TOP lamp bead device and the light-emitting module shown in the present utility model has the following beneficial effects:

[0022] By providing a connecting portion between the bonding portion and the stretching portion of the positive electrode pin and the negative electrode pin, such that the horizontal height of the surface of the bonding portion close to the accommodating space is lower than the horizontal height of the vertex of the stretching portion, a good moisture barrier effect can be achieved through the action of the convex points of the stretching portion. Thus, moisture is not easily further intruded into the accommodating space to erode the LED chip. Therefore, the lamp bead device shown in this embodiment improves the sealing performance of the lamp bead device and extends the service life of the lamp bead device, thereby solving the problem in the prior art that moisture easily intrudes into the lamp bead through the gap at the joint surface between the metal pin and the LED bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and / or additional aspects and advantages of the present utility model will become apparent and easier to understand from the following description of the embodiments in conjunction with the accompanying drawings, wherein:

[0024] Figure 1 is a schematic structural diagram of the display TOP lamp bead device shown in an embodiment of the present utility model;

[0025] Figure 2 is a schematic structural diagram of the positive electrode pin in the lamp bead device shown in an embodiment of the present utility model;

[0026] Figure 3 is Figure 1 an enlarged schematic view of part A in

[0027] Figure 4 is a partial schematic structural diagram of the display TOP lamp bead device shown in an embodiment of the present utility model;

[0028] Explanation of the reference numerals in the drawings:

[0029] LED bracket 10, base 11, enclosure 12, accommodating space 13, LED chip 20, positive electrode pin 31, bonding portion 311, stretching portion 312, pad portion 313, connecting portion 314, negative electrode pin 32, first pin 321, second pin 322, third pin 323, wire 40, transparent encapsulation layer 50. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] In order to make the objectives, features, and advantages of the present utility model more apparent and understandable, the following provides a detailed description of the specific embodiments of the present utility model with reference to the accompanying drawings. Several embodiments of the present utility model are shown in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present utility model more thorough and comprehensive.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this utility model belongs. The terms used in the description of this utility model herein are only for the purpose of describing specific embodiments and are not intended to limit this utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0032] Embodiment 1

[0033] Please refer to Figures 1 - 4 , the first embodiment of this utility model provides a display TOP lamp bead device. The lamp bead device shown in this embodiment includes an LED bracket 10, which includes a base 11 and a surrounding wall 12 extending from the edge of the base 11, commonly known as a bowl cup, so as to enclose a receiving space 13 above the base 11. The LED chip 20 is disposed in the receiving space 13 above the base 11. And inside the receiving space 13, a transparent encapsulation layer 50 is provided on the inner side of the surrounding wall 12. The transparent encapsulation layer 50 is usually formed by filling glue in the receiving space 13 and is used to protect the front of the lamp bead device.

[0034] Among them, the LED chip 20 disposed in the receiving space 13 above the base 11 includes a first LED chip, a second LED chip and a third LED chip, for example, an R-LED chip, a G-LED chip and a B-LED chip, which are respectively used to emit red light, green light and blue light. A bonding portion is provided on the base 11 of the LED bracket for fixing the LED chip 20. The above-mentioned first LED chip, second LED chip and third LED chip are all fixed on the base 11 through the bonding portion. The bonding portion is, for example, silver glue.

[0035] The above-mentioned first LED chip, second LED chip and third LED chip are all bonded and connected to the positive electrode pin 31 and the negative electrode pin 32 of the lamp bead device through wires 40. The positive electrode pin 31 and the negative electrode pin 32 are both metal parts formed by stamping. Among them, the positive electrode pin 31 is a common electrode pin, and there is one. The negative electrode pin 32 is a split electrode pin, and there are three in total, namely the first pin 321, the second pin 322 and the third pin 323. Among them, the positive electrodes of the first LED chip, the second LED chip and the third LED chip are respectively bonded and connected to the bonding portion 311 of the positive electrode pin 31 through wires 40, and the negative electrodes of the first LED chip, the second LED chip and the third LED chip are respectively bonded and connected to the bonding portions 311 of the first pin 321, the second pin 322 and the third pin 323 through wires 40 corresponding to them.

[0036] Specifically, both the positive electrode pin 31 and the negative electrode pin 32 are metal structures, usually made of copper metal because copper has good electrical conductivity, ductility, and corrosion resistance, and its chemical properties are relatively stable.

[0037] In this embodiment, since the structures of the first pin 321, the second pin 322, and the third pin 323 of the positive electrode pin 31 and the negative electrode pin 32 are basically the same, the positive electrode pin 31 is taken as an example in this embodiment to detail the structure of the metal pins shown in this embodiment for electrical connection.

[0038] Among them, the positive electrode pin 31 is formed on the LED bracket 10 by injection molding. The positive electrode pin 31 includes a bonding portion 311, a stretching portion 312, and a pad portion 313. The bonding portion 311 is used to connect the LED chip through a wire 40. The pad portion 313 extends out of the LED bracket 10 and is exposed outside the base 11 for welding and fixing to the circuit board. The stretching portion 312 is connected between the bonding portion 311 and the pad portion 313 and is wrapped by the base 11 and the enclosure 12. It can increase the length of the positive electrode pin 31, thereby increasing the contact area between the positive electrode pin 31 and the LED bracket 10 to extend the intrusion path of moisture from between the positive electrode pin 31 and the LED bracket 10.

[0039] Furthermore, the bonding portion 311 and the stretching portion 312 in the positive electrode pin 31 shown in this embodiment are connected through a connecting portion 314. The bonding portion 311 is arranged in a concave shape as a whole compared with the connecting portion 314, that is, the bonding portion 311 does not extend along the horizontal direction of the connecting portion 314, but is recessed inward toward the base 11 side. Specifically, the bonding portion 311 is recessed toward the base 11 from the connecting portion 314 between it and the stretching portion 312 to the other end. Of course, after the bonding portion 311 is recessed, it itself is still in a horizontal extension state, so that the functional area on the front of the lamp bead device is recessed inward.

[0040] Specifically, the bonding portion 311 is arranged in a horizontal extension shape, and the stretching portion 312 is also arranged in a horizontal shape or a slightly inclined state. The bonding portion 311 and the stretching portion 312 are perpendicular or nearly perpendicular to each other. Therefore, in this embodiment, the connecting portion 314 is provided to make a transition connection between the bonding portion 311 and the stretching portion 312, which can not only ensure the structural strength of the positive electrode pin 31 but also aim to improve the sealing performance between the positive electrode pin 31 and the LED bracket 10.

[0041] More specifically, the connecting portion 314 includes at least one bend. In this embodiment, there is one bend. The bend of the connecting portion 314 is used to achieve the transitional connection between the bonding portion 311 and the stretching portion 312 in the positive electrode pin 31. The outer corner of the bend shown in the connecting portion 314 is embedded into the enclosure 12, and at least part of the base 11 is embedded into the inner corner of the bend shown in the connecting portion 314, that is, at least part of the base 11 is embedded into the bending area of the connecting portion 314. Then, the connecting portion 314 between the bonding portion 311 and the stretching portion 312 shown in this embodiment can not only make a transitional connection between the bonding portion 311 and the stretching portion 312 to ensure the structural strength of the positive electrode pin 31, but also ensure the connection stability between the positive electrode pin 31 and the LED bracket 10 through the additional fitting structure formed between the connecting portion 314, the base 11 and the enclosure 12. In addition, by setting the connecting portion 314, the bonding portion 311 at the distal end is recessed towards the base 11, and the connecting portion 314 is at the top of the positive electrode pin 31. This can change the trend of the joint surface between the bonding portion 311 and the stretching portion 312 in the positive electrode pin 31 and the base 11 and the enclosure 12 in the LED bracket 10, so as to effectively prevent water vapor from invading along the joint surface between the positive electrode pin 31 and the LED bracket 10 and improve the device sealing performance.

[0042] Wherein, in the positive electrode pin 31, the height difference between the horizontal height of the vertex of the connecting portion 314 and the horizontal height of the surface of the bonding portion 311 facing the accommodation space 13 is 0.075 mm - 0.2 mm, that is, the depression stroke of the bonding portion 311 relative to the connecting portion 314 reaches 0.075 mm - 0.2 mm. By forming this depression, the blocking effect of the connecting portion 314 located at the vertex of the positive electrode pin 31 on water vapor can be strengthened.

[0043] Certainly, in some more optimal embodiments, the height difference between the horizontal height of the vertex of the connecting portion 314 and the horizontal height of the surface of the bonding portion 311 facing the accommodation space 13 is 0.125 mm - 0.165 mm.

[0044] It is easy to understand that if the above height difference is too small, the blocking effect of the connecting portion 314 is not obvious enough to achieve a good water vapor blocking effect. If the height difference is too large, it means that the connecting portion 314 between the bonding portion 311 and the stretching portion 312 will bear greater force, which will reduce the structural strength of the positive electrode pin 31.

[0045] Finally, it should be noted that the structures of the positive electrode pin 31, the first pin 321, the second pin 322 and the third pin 323 of the negative electrode pin 32 shown in this embodiment are basically the same. Only the length of the bonding portion 311 in the positive electrode pin 31 is slightly longer than that of other pins, and the rest of the structures are exactly the same. Therefore, the structures of the first pin 321, the second pin 322 and the third pin 323 of the negative electrode pin 32 will not be described in detail in this embodiment.

[0046] Compared with the prior art, the beneficial effects of adopting the display TOP lamp bead device shown in this embodiment are as follows:

[0047] By arranging a connecting portion 314 between the bonding portion 311 and the stretching portion 312 of the positive electrode pin 31 and the negative electrode pin 32, the horizontal height of the surface of the bonding portion 311 close to the accommodating space 13 is lower than the horizontal height of the vertex of the stretching portion 312, so that a good moisture barrier effect can be achieved through the bump action of the stretching portion 312. Then, moisture is not likely to further invade the accommodating space 13 to erode the LED chip. Therefore, the lamp bead device shown in this embodiment improves the service life of the lamp bead device by enhancing the sealing performance of the lamp bead device, thereby solving the problem in the prior art that moisture easily invades the inside of the lamp bead from the gap of the joint surface between the metal pin and the LED bracket 10.

[0048] Embodiment 2

[0049] The second embodiment of the present invention provides a light-emitting module, which includes the display TOP lamp bead device shown in the above embodiment, and also includes a circuit board, etc. The positive electrode pin and the negative electrode pin in the display TOP lamp bead device are exposed at one end of the LED bracket and are bonded and connected to the solder joints of the circuit board, thereby completing the electrical connection between the display TOP lamp bead device and the circuit board.

[0050] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0051] The above-described embodiments only represent several implementation manners of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as a limitation on the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the appended claims.

Claims

1. A TOP lamp bead device, characterized in that: The lamp bead device comprises: An LED bracket, the LED bracket comprising a base and a fence extending from an edge of the base, the fence is enclosed on the base to form a containing space, and the LED chip is arranged on the base in the containing space; A positive electrode pin, the positive electrode of the LED chip is connected to the positive electrode pin through wire bonding; A cathode pin, the cathode of the LED chip is connected to the cathode pin via wire bonding; Among them, the positive pin and the negative pin both include a bonding portion, a stretching portion and a pad portion, the bonding portion extends into the accommodating space and is located on the base, the pad portion exposes the LED bracket for connection with a circuit board, the stretching portion is connected between the bonding portion and the pad portion, and the bonding portion is recessed toward the base from the connection portion between it and the stretching portion to the other end, so that the functional area of ​​the lamp bead device is recessed inward.

2. The display TOP lamp bead device according to claim 1, characterized in that: The bonding portion and the stretching portion are transitionally connected via the connecting portion, and the connecting portion is wrapped by the base and the enclosure.

3. The display TOP lamp bead device according to claim 2, characterized in that: The connecting portion includes at least one bend.

4. The display TOP lamp bead device according to claim 2, characterized in that: The connecting portion is embedded in the enclosure between the base and the enclosure.

5. The display TOP lamp bead device according to claim 3, characterized in that: At least a portion of the base is embedded in a bending area of ​​the connection portion between the base and the enclosure.

6. The display TOP lamp bead device according to claim 1, characterized in that: A height difference between a horizontal height of the top of the connecting portion and a horizontal height of a surface of the bonding portion facing the accommodating space is 0.075 mm to 0.2 mm.

7. The display TOP lamp bead device according to claim 6, characterized in that: A height difference between a horizontal height of the top of the connecting portion and a horizontal height of a surface of the bonding portion facing the accommodating space is 0.125 mm to 0.165 mm.

8. The display TOP lamp bead device according to claim 1, characterized in that: The LED chips include a first LED chip, a second LED chip and a third LED chip, and the first LED chip, the second LED chip and the third LED chip have different luminous colors.

9. The display TOP lamp bead device according to claim 8, characterized in that: Any one of the positive electrode pin and the negative electrode pin is a common electrode pin, and the other is a polarity-dividing pin, including a first pin, a second pin and a third pin; One end of the first LED chip, the second LED chip and the third LED chip are all connected to the common pin, and the other ends are connected to the first pin, the second pin and the third pin respectively.

10. A light emitting module, characterized in that: A display TOP lamp bead device comprising any one of claims 1-9.

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