Unfreezing device and low-temperature storage equipment
By setting up the top heating wire, circulating air duct and bottom semiconductor refrigeration plate in the thawing device, the problem of uneven thawing is solved, and uniform heating and efficient thawing of the to-defrost are achieved.
Patent Information
- Application Number
- CN202422204533.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-09-09
AI Technical Summary
The existing thawing device cannot effectively heat the bottom of the thawing, resulting in uneven thawing.
In the thawing device, the first heating wire is arranged on the top, the circulating air duct and the fan are in the thawing chamber, and the hot end of the semiconductor refrigeration plate is located on the bottom, so as to heat each surface of the thawing to be thawed to ensure heating uniformity.
Improve the thawing efficiency and overall thawing effect, ensure that all surfaces of the to be thawed are heated evenly, and reduce thawing time and material loss.
Smart Images
Figure CN223053796U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of cryogenic storage, and particularly to a thawing device and a cryogenic storage device. Background Art
[0002] The rapid thawing of objects to be thawed has always been a challenge in the field of cryogenic storage. Traditional thawing methods usually require a lot of time, especially for large and deeply frozen objects to be thawed. This may lead to problems such as a decline in the quality of the objects to be thawed and the growth of bacteria.
[0003] To solve this problem, the existing thawing device realizes the rapid thawing function by setting heating wires at the upper part of the thawing chamber, but this thawing device cannot effectively heat the bottom of the object to be thawed, resulting in uneven thawing.
[0004] Aiming at the problem that the existing thawing device cannot effectively heat the bottom of the object to be thawed, resulting in uneven thawing, no effective solution has been proposed yet. Summary of the Utility Model
[0005] An embodiment of the utility model provides a thawing device and a cryogenic storage device to solve the problem that the existing thawing device cannot effectively heat the bottom of the object to be thawed, resulting in uneven thawing.
[0006] To solve the above technical problems, the utility model provides a thawing device, which includes:
[0007] A thawing chamber;
[0008] A first heating wire, arranged at the top of the thawing chamber;
[0009] A semiconductor refrigeration plate, with its hot end arranged at the bottom of the thawing chamber and its cold end arranged outside the thawing chamber;
[0010] A circulating air duct, with its inlet arranged around the first heating wire and its outlet arranged at the bottom of the thawing chamber;
[0011] A fan, arranged in the circulating air duct.
[0012] Furthermore, the semiconductor refrigeration plate includes:
[0013] A plurality of semiconductor refrigeration chips, which are evenly distributed on the semiconductor refrigeration plate.
[0014] Furthermore, the inner wall of the thawing chamber is made of alloy material.
[0015] Furthermore, the thawing device further includes:
[0016] A second heating wire is disposed at the top or side of the thawing chamber, and the heating power of the second heating wire is less than that of the first heating wire.
[0017] Furthermore, the thawing device further includes:
[0018] A humidifier is disposed in the thawing chamber.
[0019] Furthermore, the humidifier includes:
[0020] A water storage box for storing liquid water;
[0021] A water delivery pipe, whose water inlet is connected to the water storage box and whose water outlet is connected to an atomizing nozzle;
[0022] The atomizing nozzle is disposed in the thawing chamber and is used to atomize the liquid water in the water storage box and diffuse it into the thawing chamber.
[0023] Furthermore, the thawing device further includes:
[0024] A drain pipe, whose water inlet is disposed at the bottom of the thawing chamber and whose water outlet is disposed outside the thawing chamber.
[0025] Furthermore, the thawing device further includes:
[0026] A weight sensor is disposed at the bottom of the thawing chamber.
[0027] Furthermore, the thawing device further includes:
[0028] A temperature sensor is disposed at the bottom of the thawing chamber.
[0029] Furthermore, the thawing device further includes:
[0030] A humidity sensor is disposed at any position inside the thawing chamber.
[0031] The present utility model further provides a cryogenic storage device, including the above-mentioned thawing device.
[0032] Furthermore, the cryogenic storage device further includes:
[0033] A freezer compartment, and the semiconductor refrigeration plate is disposed in the freezer compartment.
[0034] Furthermore, the cryogenic storage device includes at least one of the following:
[0035] A refrigerator, a freezer, a cold storage.
[0036] Applying the technical solution of the present utility model, a heating wire is arranged at the upper part of the thawing bin to heat the upper surface of the object to be thawed; a circulating air duct and a fan are also arranged. The fan drives the air flow in the circulating air duct, so that the hot air around the first heating wire diffuses to the bottom of the thawing bin to heat the side surface of the object to be thawed; the bottom surface of the object to be thawed is heated by the hot end of the semiconductor refrigeration plate. Through the above solutions, heating of all surfaces of the object to be thawed can be achieved, the heat uniformity of the thawed object can be improved, and thus the thawing efficiency and the overall thawing effect can be improved. Description of the Drawings
[0037] Figure 1 It is a structural diagram of a thawing device according to an embodiment of the present utility model, wherein 1 - thawing bin, 2 - first heating wire, 3 - semiconductor refrigeration plate, 4 - circulating air duct, 5 - fan, 6 - second heating wire, 7 - water storage tank, 8 - water delivery pipe, 9 - atomizing nozzle, 10 - drain pipe, 11 - weight sensor, 12 - temperature sensor, 13 - humidity sensor, 14 - handle;
[0038] Figure 2 It is a structural diagram of the semiconductor refrigeration plate according to an embodiment of the present utility model, wherein 31 - semiconductor refrigeration chip;
[0039] Figure 3 It is an internal structural diagram of the semiconductor refrigeration chip according to an embodiment of the present utility model, wherein 31a - N - type semiconductor, 31b - current - guiding strip, 31c - P - type semiconductor, 31e - hot - end electrical insulation layer, 31d - cold - end electrical insulation layer;
[0040] Figure 4 It is an electrical control schematic diagram according to an embodiment of the present utility model. Detailed Embodiment
[0041] In order to make the purpose, technical solution and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts belong to the scope of protection of the present utility model.
[0042] The terms used in the embodiments of the present utility model are only for the purpose of describing specific embodiments, and are not intended to limit the present utility model. The singular forms of "a", "the" and "said" used in the embodiments of the present utility model and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. "Plural" generally includes at least two.
[0043] It should be understood that the term "and / or" used herein is merely a correlative relationship describing associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, the character " / " in this text generally indicates that the associated objects before and after are in an "or" relationship.
[0044] It should be understood that although terms such as first and second may be used to describe heating wires in the embodiments of the present utility model, these... should not be limited to these terms. These terms are only used to distinguish different heating wires. For example, without departing from the scope of the embodiments of the present utility model, the first heating wire can also be referred to as the second heating wire, and similarly, the second heating wire can also be referred to as the first heating wire.
[0045] Depending on the context, the words "if" and "when" as used herein can be interpreted as "when...", "when...", "in response to determining", or "in response to detecting". Similarly, depending on the context, the phrase "if determined" or "if detecting (stated condition or event)" can be interpreted as "when determined", "in response to determining", "when detecting (stated condition or event)", or "in response to detecting (stated condition or event)".
[0046] It should also be noted that the term "comprising", "including", or any other variant thereof is intended to cover non-exclusive inclusion, such that a commodity or device comprising a series of elements not only includes those elements but also includes other elements not explicitly listed, or elements inherent to such commodity or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the existence of additional identical elements in the commodity or device comprising the said element.
[0047] The optional embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.
[0048] Embodiment 1
[0049] The rapid thawing of the object to be thawed has always been a challenge in the field of cryogenic storage. Traditional thawing methods usually require a large amount of time, especially for large and deeply frozen objects to be thawed. This may lead to problems such as a decline in the quality of the object to be thawed and the growth of bacteria.
[0050] To solve this problem, existing thawing devices achieve the function of rapid thawing by setting heating wires at the upper part of the thawing chamber. However, when thawing, the object to be thawed is generally placed at the bottom of the thawing chamber, and this thawing device cannot effectively heat the bottom of the object to be thawed, resulting in uneven thawing.
[0051] In view of the problem that the thawing device in the prior art cannot effectively heat the bottom of the object to be thawed, resulting in uneven thawing, this embodiment provides a thawing device. Figure 1 As shown in the structure diagram of the thawing device according to an embodiment of the present invention, Figure 1 As shown, the above-mentioned thawing device includes: a thawing chamber 1; a first heating wire 2, arranged at the top of the thawing chamber 1, for heating the upper surface of the object to be thawed through the first heating wire 2; a semiconductor refrigeration plate 3, with its hot end arranged at the bottom of the thawing chamber 1 and its cold end arranged outside the thawing chamber 1; a circulating air duct 4, with its inlet arranged around the first heating wire 2 and its outlet arranged at the bottom of the thawing chamber 1; and a fan 5, arranged in the circulating air duct 4.
[0052] When the thawing device provided in the above embodiment is applied, the object to be thawed is generally placed at the bottom of the thawing chamber 1. Due to the characteristic that hot air rises, if a circulating device is not added, the hot air will always accumulate at the top of the thawing chamber 1 and will not spread downward, resulting in only the upper surface of the object to be thawed being heated and the heating being uneven. The setting of the circulating air duct and the fan 5 is to spread the heat generated by the first heating wire 2 to the entire internal space of the thawing chamber 1, so that the temperature in the internal space of the thawing chamber 1 is balanced. Further, the hot air is diffused downward to the bottom of the thawing chamber 1 to achieve comprehensive, balanced and uniform thawing of the object to be thawed. By driving the air flow in the circulating air duct 4 by the fan 5, the hot air around the first heating wire 2 is diffused to the bottom of the thawing chamber 1 to heat the side surface of the object to be thawed at the bottom of the thawing chamber, making the object to be thawed heated evenly and accelerating the thawing.
[0053] In addition, a semiconductor refrigeration plate 3 is arranged at the bottom of the thawing chamber 1, and the bottom surface of the object to be thawed is heated through the hot end of the semiconductor refrigeration plate 3 to further improve the uniformity of heating of the object to be thawed.
[0054] For the thawing device of this embodiment, a first heating wire 2 is arranged at the upper part of the thawing chamber to heat the upper surface of the object to be thawed; a circulating air duct 4 and a fan 5 are arranged, and the air flow in the circulating air duct 4 is driven by the fan 5 to spread the hot air around the first heating wire 2 to the bottom of the thawing chamber 1 to heat the side surface of the object to be thawed; the bottom surface of the object to be thawed is heated through the hot end of the semiconductor refrigeration plate 3. Through the above solutions, heating of all surfaces of the object to be thawed can be realized, the uniformity of heating of the object to be thawed can be improved, and thus the thawing efficiency and the overall thawing effect can be improved.
[0055] Figure 2 As shown in the structure diagram of the semiconductor refrigeration plate according to an embodiment of the present invention, Figure 2 As shown, the above-mentioned semiconductor refrigeration plate 3 includes: a plurality of semiconductor refrigeration chips 31, and the semiconductor refrigeration chips 31 are evenly distributed on the semiconductor refrigeration plate 3.
[0056] Figure 3 Internal structure diagram of a semiconductor refrigeration sheet according to an embodiment of the present utility model, as Figure 3 shown, the semiconductor refrigeration sheet includes:
[0057] A plurality of thermocouples connected in series, wherein each thermocouple includes an N-type semiconductor 31a, a current conducting bar 31b, and a P-type semiconductor 31c.
[0058] A cold end and a hot end. In order to achieve an insulating effect and avoid electric leakage, a cold end electrical insulation layer 31d is provided at the cold end, and a hot end electrical insulation layer 31e is provided at the hot end. Both the cold end electrical insulation layer 31d and the hot end electrical insulation layer 31e are made of a heat-conducting insulating material, which has a heat-conducting effect while achieving the insulating effect, facilitating the transfer of cold or heat.
[0059] A DC power supply 31f; its positive pole is connected to the N-type semiconductor 31a of the first thermocouple, and its negative pole is connected to the P-type semiconductor 31c of the last thermocouple, for supplying power to a plurality of thermocouples connected in series.
[0060] It should be noted that in other embodiments of the present utility model, the connection form of a plurality of thermocouples can also be in parallel.
[0061] In order to further improve the temperature uniformity and thawing efficiency, the inner wall of the thawing chamber is made of an alloy material. This alloy has excellent heat-conducting characteristics, which helps to quickly conduct temperature to ensure a uniform and efficient thawing process.
[0062] When heating a large-volume and heavy object to be thawed, the heat provided by one heating wire is often insufficient. In order to improve the heating effect, the above-mentioned thawing device further includes: a second heating wire 6, which is arranged at the top or side of the thawing chamber 1. In this embodiment, it is arranged at the top of the thawing chamber 1 for auxiliary heating. The heating power of the second heating wire 6 is less than that of the first heating wire 2, that is, the first heating wire 2 is the main heating wire and the second heating wire 6 is the auxiliary heating wire. In specific implementation, according to the weight range of the object to be thawed, the second heating wire 6 and the semiconductor refrigeration plate 3 can be controlled to be turned on simultaneously, the first heating wire 2 and the semiconductor refrigeration plate 3 can be controlled to be turned on simultaneously, or the first heating wire, the second heating wire 6 and the semiconductor refrigeration plate 3 can be controlled to be turned on simultaneously.
[0063] Since heating is required during the thawing process, it will cause water loss of the object to be thawed and the taste will deteriorate. In order to prevent the object to be thawed from being over-thawed and dehydrated, the thawing device further includes: a humidifier, which is arranged in the thawing chamber. The humidifier includes: a water storage box 7 for storing liquid water; a water delivery pipe 8, whose water inlet is connected to the water storage box 7 and whose water outlet is connected to an atomizing nozzle 9; the atomizing nozzle 9 is arranged at the upper part of the thawing chamber and is used to atomize the liquid water in the water storage box 7 and diffuse it into the thawing chamber 1. On the one hand, the humidity is controlled by the humidifier to ensure that the object to be thawed maintains an appropriate water content, thereby improving the quality of the object to be thawed; on the other hand, after the object to be thawed is taken out, the water output of the humidifier can be increased to flush and clean the blood in the thawing chamber.
[0064] In order to maintain the dryness and cleanliness in the thawing chamber 1 and avoid water accumulation and moisture retention, the above-mentioned thawing device further includes: a drain pipe 10, whose water inlet is arranged at the bottom of the thawing chamber 1 and whose water outlet is arranged outside the thawing chamber. The water generated during thawing and the water during the humidification process are quickly discharged from the thawing chamber through the drain pipe 10.
[0065] In order to detect the weight of the object to be thawed in the thawing chamber 1, the above-mentioned thawing device further includes: a weight sensor 11, which is arranged at the bottom of the thawing chamber 1. On the one hand, it helps the system determine whether an object to be thawed is placed in the thawing chamber so as to start the thawing device when needed; on the other hand, different thawing powers can be selected according to the size of the object to be thawed in order to achieve the purpose of energy saving.
[0066] In order to monitor the temperature at the bottom of the object to be thawed in real time and thus ensure that the temperature around the object to be thawed tends to be relatively uniform, the above-mentioned thawing device further includes: a temperature sensor 12, which is arranged at the bottom of the thawing chamber.
[0067] In order to detect the temperature and humidity data in the thawing chamber 1 in real time and thus determine whether it is necessary to replenish water through the humidifier, the above-mentioned thawing device further includes: a humidity sensor 13, which is arranged at any position inside the thawing chamber.
[0068] In order to facilitate opening and closing, a handle 14 is arranged on the thawing chamber.
[0069] Figure 4 For the electrical control schematic diagram according to the embodiment of the present invention, as Figure 4 shown, the controller 410 is respectively connected to the sensor module 420, the humidifier 430 and the heating module 440. Among them, the sensor module 420 includes a weight sensor 11, a temperature sensor 12 and a humidity sensor 13, and the heating module 430 includes a first heating wire 2, a semiconductor refrigeration plate 3 and a second heating wire 6.
[0070] The controller 410 controls the simultaneous activation of the second heating wire 6 and the semiconductor refrigeration plate 3, the simultaneous activation of the first heating wire 2 and the semiconductor refrigeration plate 3, or the simultaneous activation of the first heating wire, the second heating wire 6, and the semiconductor refrigeration plate 3 according to the weight data collected by the weight sensor 11.
[0071] The controller 410 controls the activation or deactivation of the humidifier 430 according to the humidity data collected by the humidity sensor 13.
[0072] The controller 410 controls the rotational speed of the blower 5 and the partial or full activation of the first heating wire 2 and the second heating wire 6 according to the temperature data collected by the temperature sensor 12.
[0073] This embodiment employs a series of key components to achieve an efficient thawing process. The following is a detailed description of these components:
[0074] Alloy thawing chamber with good thermal conductivity: The inner wall of the thawing chamber is made of an alloy with good thermal conductivity. This alloy has excellent heat conduction characteristics, which helps to quickly conduct temperature to ensure a uniform and efficient thawing process.
[0075] Humidity sensor: A temperature and humidity sensor is built into the inner wall of the thawing chamber to detect the humidity data inside the thawing chamber in real time. These sensors provide the necessary information for the system to make adjustments according to the needs of different items to be thawed.
[0076] Temperature sensor: A high-precision temperature sensor is configured at the bottom of the thawing chamber to monitor the temperature at the bottom of the item to be thawed in real time during thawing. The controller can compare the temperature data it feeds back with the temperature data transmitted by the temperature and humidity sensor, and by controlling the activation and stop of the semiconductor refrigeration plate, or regulating its voltage and current to dynamically adjust the heat generated by the semiconductor refrigeration plate, it can control the temperatures of both within a certain range, thereby making the temperature around the item to be thawed tend to be relatively uniform.
[0077] Weight sensor: A weight sensor is installed at the bottom of the thawing chamber to sense the item to be thawed. According to the detected weight information, the system will automatically select the corresponding thawing mode (low power consumption mode, normal power consumption mode, ultra power consumption mode). On the one hand, it helps the system determine the situation of the item to be thawed in the thawing chamber to initiate the thawing process when needed; on the other hand, it can select different thawing modes according to the size of the item to be thawed to achieve the purpose of energy conservation.
[0078] Humidifier: The humidifier located inside the thawing chamber is used to prevent the item to be thawed from being over-thawed and dehydrated. On the one hand, by controlling the humidity, the humidifier ensures that the item to be thawed maintains an appropriate moisture content, thereby improving the quality of the item to be thawed; on the other hand, after the item to be thawed is taken out, the water output of the humidifier can be increased to flush and clean the blood in the thawing chamber.
[0079] Thermoelectric cooler: It is composed of multiple thermocouples connected in series or parallel. When an electric current passes through a thermocouple, one end absorbs heat and the other end releases heat. Thermoelectric cooling utilizes this characteristic to achieve the purpose of refrigeration. The thermoelectric cooler includes a number of thermocouples connected in series. Each thermocouple includes an N-type semiconductor, a current-carrying bar, and a P-type semiconductor. The thermoelectric cooler also has a cold end and a hot end. To achieve insulation and prevent electric leakage, a cold-end electrical insulation layer is provided at the cold end, and a hot-end electrical insulation layer is provided at the hot end. The P-type semiconductor and the N-type semiconductor are welded to the current-carrying bar, and the current-carrying bar is fixed in the electrical insulation layer. When direct current is applied, the current at the upper end of the thermocouple flows from the N-type semiconductor to the P-type semiconductor, so the temperature at the upper end drops and becomes the cold end; the current at the lower end of the thermocouple flows from the P-type semiconductor to the N-type semiconductor, and the temperature at the lower end rises and becomes the hot end. In this proposal, a thermoelectric cooling plate composed of thermoelectric coolers is provided at the bottom of the thawing chamber. By controlling its start / stop or adjusting the voltage and current, the heat generated for thawing is regulated to provide temperature compensation for the bottom of the object to be thawed, avoiding insufficient heating at the bottom of the object to be thawed. On the other hand, during the thawing mode, the cold end can provide a part of the cooling capacity for the freezer for refrigeration.
[0080] Heating device: It includes a main heating wire and an auxiliary heating wire. The main heating wire and the auxiliary heating wire are responsible for controlling the temperature to meet the requirements of different objects to be thawed.
[0081] Circulation system: It includes a fan and an air duct. The fan is used to ensure uniform air circulation in the thawing chamber to promote the thawing process.
[0082] Drain pipe: The bottom of the thawing chamber is equipped with a drain pipe, which can quickly drain the water generated during thawing and the water during the humidification process from the thawing chamber. This helps to maintain the dryness and cleanliness in the thawing chamber, avoiding water accumulation and moisture retention.
[0083] First, when the user puts the item to be thawed into the thawing chamber, the weight sensor will sense the initial weight of the item to be thawed. Based on the weight information, the system will automatically select the thawing mode. When it is detected that 0 < the initial weight M0 of the item to be thawed < M1 (M1 is the weight value set by the system), it will enter the low-power mode for thawing; when it is detected that M1 < the initial weight M0 of the item to be thawed < M2 (M2 is the weight value set by the system), it will enter the normal-power mode for thawing; when it is detected that the initial weight M0 of the item to be thawed > M2, it will enter the high-power mode for thawing. Once the thawing mode is entered, the temperature and humidity sensors in the thawing chamber will immediately collect the initial temperature and humidity data in the thawing chamber, and prompt the user to set the preset thawing temperature, humidity, and time parameters according to the type and quantity of different items to be thawed. With the completion of the preset parameters, when entering the low-power mode, the system will automatically start the auxiliary heating wire, the semiconductor refrigeration chip group, and the fan at the top to start thawing the item to be thawed. During the thawing process, the temperature and humidity sensors will continuously and real-time collect the temperature and humidity data in the thawing chamber. If the collected temperature data is lower than the preset temperature value, the system will automatically increase the rotation speed of the fan to accelerate the temperature in the thawing chamber to reach the preset value. Similarly, when entering the normal-power mode, the main heating wire and the semiconductor refrigeration chip group will be turned on, and the fan will be used to accelerate the temperature in the thawing chamber to reach the preset value; in the high-power mode, the main and auxiliary heating wires and the semiconductor refrigeration chip group will be turned on, and the fan will be used to accelerate the temperature in the thawing chamber to reach the preset value. At the same time, the system will monitor the humidity in the thawing chamber to ensure that the humidity will not be too low, so as not to affect the quality of the item to be thawed. If the humidity does not reach the preset humidity value, the system will turn on the humidifier located inside the thawing chamber and continuously increase the humidity until it meets the preset humidity requirements. After both the temperature and humidity reach the preset values, the system will maintain the current power operation to maintain these conditions. At this time, the wastewater generated during the thawing process and the water sprayed by the humidifier will be quickly discharged through the drain pipe at the bottom of the thawing chamber to keep the thawing chamber dry and clean. When the entire system runs to the preset thawing time, the system will automatically exit the thawing mode and send a prompt to the user that the thawing is completed. After the item to be thawed is taken out, the water output of the humidifier can be increased to clean the blood in the thawing chamber. This automated thawing process ensures high-quality thawing of the item to be thawed, reduces user operation intervention, and improves the thawing efficiency.
[0084] The beneficial effects of the thawing device in this embodiment are as follows:
[0085] 1. Energy saving: The device includes three different modes, namely the low-power mode, the normal-power mode, and the high-power mode. These three thawing modes correspond to items to be thawed of different sizes, avoiding waste of energy.
[0086] 2. Uniform thawing: On the one hand, the hot end of the thermoelectric cooler is used to heat the bottom of the object to be thawed, ensuring that the temperature at the bottom of the object to be thawed is effectively increased; on the other hand, the device is designed with an efficient air duct system to ensure uniform air circulation. This helps to distribute heat more evenly, increase the thawing speed, and at the same time reduce the moisture loss on the surface of the object to be thawed. This also helps to maintain the quality of the object to be thawed.
[0087] 3. Prevention of over-thawing: A moisture replenishment system is introduced into the thawing chamber to adjust the humidity of the thawing chamber in real time, prevent the object to be thawed from over-thawing and dehydrating, ensure that the object to be thawed maintains an appropriate moisture content, and thus improve the taste of the object to be thawed.
[0088] In summary, the thawing device of this embodiment gives full play to the functions of each component to achieve the high efficiency and accuracy of thawing the object to be thawed.
[0089] Embodiment 2
[0090] This embodiment provides a cryogenic storage device, including the thawing device of the above embodiment.
[0091] In order to make full use of the cold and heat of the thermoelectric cooler, the cryogenic storage device of this embodiment further includes: a freezer compartment, the thermoelectric cooler is arranged in the freezer compartment, the heat at the hot end of the thermoelectric cooler is used to achieve heating and thawing, and the cold at the cold end of the thermoelectric cooler is used to achieve auxiliary refrigeration of the freezer compartment, realizing the full utilization of energy.
[0092] The cryogenic storage device of this embodiment includes at least one of the following: a refrigerator, a freezer, a cold storage.
[0093] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.
Claims
1. A thawing device, characterized in that, The thawing device includes: A thawing chamber; A first heating wire disposed at the top of the thawing chamber; A semiconductor refrigeration plate, the hot end of which is disposed at the bottom of the thawing chamber, and the cold end of which is disposed outside the thawing chamber; A circulation air duct, the inlet of which is disposed around the first heating wire, and the outlet of which is disposed at the bottom of the thawing chamber; A blower disposed in the circulation air duct.
2. The thawing device according to claim 1, wherein The semiconductor refrigeration plate includes: A plurality of semiconductor refrigeration chips, which are uniformly distributed on the semiconductor refrigeration plate.
3. The thawing device according to claim 1, characterized in that, The inner wall of the thawing chamber is made of an alloy material.
4. The thawing device according to claim 1, wherein The thawing device further includes: A second heating wire disposed at the top or side of the thawing chamber, and the heating power of the second heating wire is less than that of the first heating wire.
5. The thawing device according to claim 1, wherein The thawing device further includes: A humidifier disposed in the thawing chamber.
6. The thawing device according to claim 5, characterized in that, The humidifier includes: A water storage box for storing liquid water; A water delivery pipe, the inlet of which is connected to the water storage box, and the outlet of which is connected to an atomizing nozzle; The atomizing nozzle is disposed in the thawing chamber for atomizing the liquid water in the water storage box and diffusing it into the thawing chamber.
7. The thawing device according to claim 1, characterized in that, The thawing device further includes: A drain pipe, the inlet of which is disposed at the bottom of the thawing chamber, and the outlet of which is disposed outside the thawing chamber.
8. The thawing device according to claim 1, wherein The thawing device further includes: A weight sensor disposed at the bottom of the thawing chamber.
9. The thawing device according to claim 1, characterized in that, The thawing device further includes: A temperature sensor disposed at the bottom of the thawing chamber.
10. The thawing device according to claim 1, characterized in that, The thawing device further includes: A humidity sensor disposed at any position inside the thawing chamber.
11. A low-temperature storage device, characterized in that, Including the thawing device according to any one of claims 1 to 10.
12. The cryogenic storage device according to claim 11, characterized in that, The low-temperature storage device further includes: A freezer compartment, and the semiconductor refrigeration plate is disposed in the freezer compartment.
13. The cryogenic storage device according to claim 12, wherein The low-temperature storage device includes at least one of the following: A refrigerator, a freezer, a cold storage.