Laser machine pressing chipping cleaning device

Abstract

The utility model discloses a laser machine pressing chipping cleaning device which comprises a base, a stand column is arranged on the base, a sliding block fixed through a locking piece is connected to the stand column in a sliding mode, a transverse plate is connected to one side of the sliding block, an air knife is arranged below the transverse plate in the length direction of the transverse plate, a reinforcing rod is arranged on the transverse plate in an inclined mode, and the reinforcing rod is connected with the sliding block in a sliding mode. A vertical rod is arranged at the end, close to the sliding block, of the transverse plate, one end of the reinforcing rod is connected with the end, away from the sliding block, of the transverse plate, and the other end of the reinforcing rod is connected with the vertical rod. The chip removing device can be used for removing chips generated by pressing the probe row and the silicon wafer in a silicon wafer laser sintering process, so that the manpower consumption is reduced, and the removing strength is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cells, and particularly relates to a cleaning device for pressing debris of a laser machine. Background Art

[0002] When the existing photovoltaic silicon wafers are processed, high-temperature sintering is required. Sintering is to sinter the electrodes printed on the surface of the silicon wafers at high temperature, so that the electrodes and the silicon wafers themselves form an ohmic contact, improve the open-circuit voltage and fill factor of the silicon wafers, and make the contact of the electrodes have resistance characteristics to achieve a high conversion efficiency.

[0003] Currently, sintering is generally carried out by a laser machine. After the laser machine realizes electrical connection by pressing the probe row in its power input module with the silicon wafer, it then emits a laser beam to scan the silicon wafer. For example, the patent number is 202322179648.7, and the patent name is: A processing device for laser-induced sintering. This patent processes the whole silicon wafer by separating it into half wafers, which requires two processing steps. In such a laser machine that requires two sinterings, generally four wafer placement positions are set on the turntable. After the silicon wafers are placed into the placement positions by the manipulator at the feeding position, they rotate with the turntable, pass through two laser processing positions for processing, and finally are taken off from the material taking position.

[0004] In the actual production process, the pressing of the probe row and the silicon wafer will generate fine debris. The accumulated debris will cause the silicon wafers to have hidden cracks and fragments when being pressed by the probe row, resulting in defective products. Therefore, generally after sintering a certain number of wafers, it is necessary to regularly clean and maintain the wafer placement positions. The existing method is to clean the turntable with a hand-held brush, which consumes a large amount of manpower, and there is also the problem that the wafer placement positions may not be cleaned thoroughly due to worker negligence. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a cleaning device for pressing debris of a laser machine, which can clean the debris generated by the pressing of the probe row and the silicon wafer in the laser sintering process of the silicon wafer, reduce manpower consumption, and improve the cleaning strength.

[0006] To achieve the above purpose, the technical solution adopted by the utility model is: a cleaning device for pressing debris of a laser machine, including a base, a column is arranged on the base, a slider is slidably connected to the column and fixed by a locking member, a cross plate is connected to one side of the slider, an air knife is arranged below the cross plate along its length direction, a reinforcing rod is arranged obliquely on the cross plate, a vertical rod is arranged at one end of the cross plate close to the slider, one end of the reinforcing rod is connected to the end of the cross plate far from the slider, and the other end is connected to the vertical rod.

[0007] A further improvement scheme of the utility model is that a second slider is slidably connected to the column above the slider, and the vertical rod is connected to the second slider.

[0008] A further improvement of the present utility model is that a telescopic cylinder is fixedly provided on one side of the slider, the telescopic end of the telescopic cylinder is vertically upward, and the cross plate is arranged thereon.

[0009] A further improvement of the present utility model is that the slider is a clamping slider, the locking member is a bolt, and the clamping slider is fixed on the column by the bolt.

[0010] A further improvement of the present utility model is that a plurality of weight-reducing holes are provided through the cross plate.

[0011] A further improvement of the present utility model is that an obliquely blowing nozzle is provided at the air outlet of the air knife.

[0012] A further improvement of the present utility model is that the air knife is a plasma air knife.

[0013] The beneficial effects of the present utility model are as follows:

[0014] By setting the air knife, the present utility model can clean the debris generated by the pressing of the probe row and the silicon wafer during the silicon wafer laser sintering process, reduce the labor consumption, and improve the cleaning strength.

[0015] In the prior art, the placing position is cleaned by a brush. In order to reduce static electricity, an anti-static brush is used. The bristles are made of hard materials, and their frequent contact with the tabletop will cause wear to the tabletop and affect the service life of the tabletop. By using a plasma air knife, the present utility model cleans the tabletop through air flow, reduces wear, and extends the service life of the equipment.

[0016] By setting the reinforcing rod to form a triangular structure, the present utility model further improves the bearing capacity of the cross plate through the second slider, avoids the possibility of bending and breaking of the cross plate affected by the weight of the air knife when the cross plate is long, and improves the safety of use.

[0017] The present utility model fixes the position of the slider through the locking member, initially fixes it manually, and then can further adjust the height of the cross plate through the telescopic cylinder. The cylinder can be controlled by a controller to extend and retract, reducing the time spent on disassembling and fixing conditions and improving the adjustment efficiency. Description of the Drawings

[0018] Figure 1 It is the main view schematic diagram of the structure of the present utility model.

[0019] Figure 2 It is the side view sectional schematic diagram of the obliquely blowing nozzle structure of the present utility model.

[0020] In the figure, 1 - base, 2 - column, 3 - slider, 4 - cross plate, 5 - reinforcing rod, 6 - vertical rod, 7 - second slider, 8 - telescopic cylinder, 9 - obliquely blowing nozzle, 10 - air knife. Detailed implementation mode

[0021] The present utility model will be further clarified below in conjunction with the accompanying drawings and specific embodiments. Embodiment

[0022] Combined with Figures 1 - 2 As can be seen, a cleaning device for laser machine pressing debris includes a base 1, a column 2 is provided on the base 1, a slider 3 fixed by a locking member is slidably connected to the column 2, a cross plate 4 is connected to one side of the slider 3, an air knife 10 is provided below the cross plate 4 along its length direction, a reinforcing rod 5 is obliquely provided on the cross plate 4, a vertical rod 6 is provided at one end of the cross plate 4 close to the slider 3, one end of the reinforcing rod 5 is connected to the end of the cross plate 4 away from the slider 3, and the other end is connected to the vertical rod 6.

[0023] A second slider 7 is slidably connected to the column 2 above the slider 3, and the vertical rod 6 is connected to the second slider 7. The cross plate 4, the reinforcing rod 5 and the vertical rod 6 form a triangular structure to improve the bearing capacity of the cross plate.

[0024] A telescopic cylinder 8 is fixedly provided on one side of the slider 3, and the telescopic end of the telescopic cylinder 8 is vertically upward and the cross plate 4 is arranged thereon. By providing the second slider 7, it can also play a role in guiding the telescopic movement of the telescopic cylinder 8.

[0025] The slider 3 is a clamping type slider, and the locking member is a bolt. The clamping type slider is fixed on the column 2 by a bolt. A plurality of weight reduction holes are provided through the cross plate 4. The weight of the cross plate 4 is reduced.

[0026] Preferably, the air knife 10 is located between the material taking position and the material placing position. After the silicon wafer in a wafer placing position is sintered, it is taken from the material taking position. At this time, the wafer placing position is vacant, and it rotates with the turntable and is rotated to the material placing position again to place the silicon wafer. During this process, the vacant wafer placing position is cleaned by the air knife 10 to reduce the influence on sintering. Preferably, the air knife 10 is a plasma air knife. Preferably, an obliquely blowing air nozzle 9 is provided at the air outlet of the air knife 10. Further preferably, the obliquely blowing air nozzle 9 is magnetically fixed at the air outlet of the air knife 10, which can guide the vertically downward blowing air flow to blow obliquely, so as to better clean the wafer placing position.

[0027] The working principle of a cleaning device for laser machine pressing debris provided by the utility model is as follows: When in use, the base 1 is fixed on one side of the turntable, so that the air knife 10 is located above the turntable, preferably between the material taking position and the material placing position. The height of the air knife 10 is adjusted through the slider 3 and the telescopic cylinder 8 so that it can blow out a suitable air flow. The wafer placing position of the turntable is cleaned by the air knife 10 to avoid the situation that the silicon wafer appears hidden cracks or breaks during the pressing with the probe row due to the accumulation of debris.

[0028] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. Any equivalent structural or equivalent process transformation made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in other related technical fields, shall be equally included in the scope of patent protection of the present utility model.

Claims

1. A debris cleaning device for laser machine pressing, characterized in that: It includes a base (1), a column (2) is provided on the base (1), a slider (3) fixed by a locking member is slidably connected to the column (2), a cross plate (4) is connected to one side of the slider (3), an air knife (10) is provided below the cross plate (4) along its length direction, a reinforcing rod (5) is obliquely provided on the cross plate (4), a vertical rod (6) is provided at one end of the cross plate (4) close to the slider (3), one end of the reinforcing rod (5) is connected to the end of the cross plate (4) away from the slider (3), and the other end is connected to the vertical rod (6).

2. The debris cleaning device for laser machine pressing according to claim 1, wherein: A second slider (7) located above the slider (3) is slidably connected to the column (2), and the vertical rod (6) is connected to the second slider (7).

3. The debris cleaning device for laser machine pressing according to claim 1, wherein: A telescopic cylinder (8) is fixedly provided on one side of the slider (3), the telescopic end of the telescopic cylinder (8) is vertically upward and the cross plate (4) is arranged thereon.

4. A debris cleaning device for laser machine pressing according to claim 1, wherein: The slider (3) is a clamping type slider, the locking member is a bolt, and the clamping type slider is fixed on the column (2) by the bolt.

5. A debris cleaning device for laser machine pressing according to claim 1, wherein: A plurality of weight reduction holes are provided through the cross plate (4).

6. The debris cleaning device for laser machine pressing according to claim 1, wherein: An obliquely blowing nozzle (9) is provided at the air outlet of the air knife (10).

7. The debris cleaning device for laser machine pressing according to claim 1, characterized in that: The air knife (10) is a plasma air knife.

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