Dismounting device and testing equipment

Abstract

The utility model relates to a dismounting device and test equipment, the dismounting device comprises a bearing assembly and a separation assembly, and the bearing assembly comprises a bearing body and an avoiding groove recessed in the bearing body along a first direction. The bearing body is configured to bear the test board, the semiconductor device can be located in the avoiding groove, and the size of the avoiding groove in the first direction is larger than that of the semiconductor device in the first direction. The separating assembly comprises separating base bodies arranged on one side of the bearing body at intervals in the first direction, separating ejector pins extending in the first direction are arranged on the side faces, facing the bearing body, of the separating base bodies, and the separating ejector pins are located in the projection, in the first direction, of the receding grooves and can be correspondingly inserted into the testing holes. In the embodiment of the invention, the dismounting device and the test equipment can be used for conveniently and quickly dismounting and separating the semiconductor device from the test plate, and meanwhile, the damage to the semiconductor device is reduced.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor devices, and particularly to a disassembly device and a testing device. Background Art

[0002] Semiconductor devices are electronic devices made using the special properties of semiconductor materials and play an extremely important role in modern electronic technology. Semiconductor devices usually include various products such as diodes, transistors, thyristors, etc. A printed circuit board usually serves as the carrier of semiconductor devices and is mainly composed of an insulating substrate and conductor lines. By forming conductive patterns on the substrate, the electrical connections between various electronic components in the circuit are realized.

[0003] After the production of some semiconductor device products, they usually need to be connected to a printed circuit board for some tests. Exemplarily, when certain products are undergoing reliability tests such as high temperature and high humidity, temperature cycling, etc., the semiconductor devices need to be installed on the printed circuit board to simulate the reliability performance when working in cooperation with the circuit board under the actual working environment. After the test, how to disassemble the semiconductor device from the printed circuit board without damaging the semiconductor device is a problem worthy of research. Summary of the Utility Model

[0004] The disassembly device and the testing device provided by the embodiments of this application can conveniently and quickly disassemble and separate the semiconductor device from the test board while reducing damage to the semiconductor device.

[0005] In a first aspect, an embodiment of this application provides a disassembly device for disassembling a semiconductor device on a test board. The test board is provided with test holes penetrating in its thickness direction, and the pins on the semiconductor device can be correspondingly inserted into the test holes. The projected area of the test board in its thickness direction is larger than the projected area of the semiconductor device. The disassembly device includes:

[0006] A carrying component, including a carrying body and an avoidance groove recessed inside the carrying body along a first direction;

[0007] A separation component, including a separation base body arranged at one side of the carrying body at intervals along the first direction. A separation ejector pin extending along the first direction is arranged on the side surface of the separation base body facing the carrying body, and the separation ejector pin is inside the projection of the avoidance groove in the first direction;

[0008] Wherein, the carrying body is configured to carry the test board, the semiconductor device can be inside the avoidance groove, the size of the avoidance groove in the first direction is larger than the size of the semiconductor device in the first direction, and the separation ejector pin can be correspondingly inserted into the test hole.

[0009] In some embodiments, a plurality of mounting grooves are provided on a side surface of the separation substrate facing the carrying body. The plurality of mounting grooves are spaced apart on the separation substrate. The number of the mounting grooves is greater than the number of the separation ejector pins, and the separation ejector pins are detachably connected to the inside of the mounting grooves.

[0010] In some embodiments, the carrying body includes a carrying substrate, and a first carrier body, a second carrier body, a third carrier body, and a fourth carrier body that are connected to one side of the carrying substrate along a first direction and are connected to each other. The first carrier body, the second carrier body, the third carrier body, and the fourth carrier body enclose the avoidance groove along the first direction;

[0011] Side walls of a part of the first carrier body can contact the semiconductor device, side walls of a part of the second carrier body can contact the semiconductor device, side walls of a part of the third carrier body can contact the semiconductor device, and side walls of a part of the fourth carrier body can contact the semiconductor device.

[0012] In some embodiments, the first carrier body and the third carrier body are oppositely arranged along a second direction, and the second direction intersects the first direction;

[0013] A notch penetrating along the second direction is provided on the first carrier body. The notch communicates the avoidance groove with the external environment. A taking groove recessed along the second direction and communicating with the avoidance groove is provided on the third carrier body.

[0014] In some embodiments, the first carrier body and the third carrier body extend along a third direction, and the third direction, the second direction, and the first direction intersect pairwise;

[0015] The notch is located in the middle of the first carrier body along the third direction. The first carrier body includes a first part and a second part respectively on both sides of the notch along the third direction. The first part and the second part can contact the semiconductor device;

[0016] Two taking grooves are provided. The two taking grooves are respectively located at two ends of the third carrier body along the third direction. The third carrier body includes a convex part located between the two taking grooves along the third direction. The convex part can contact the semiconductor device.

[0017] In some embodiments, both the second carrier body and the fourth carrier body extend along the second direction and are oppositely arranged along the third direction. The third direction, the second direction, and the first direction intersect pairwise;

[0018] A first recessed space communicating with the avoidance groove is disposed in the middle of the second carrier along the second direction, and a second recessed space communicating with the avoidance groove is disposed in the middle of the fourth carrier along the second direction.

[0019] In some embodiments, a guide column is provided on the side of the separation base toward the carrier body along the first direction, and an end of the guide column facing away from the separation base protrudes from an end of the separation ejector pin facing away from the separation base;

[0020] The semiconductor device is provided with a guide groove, the test board is provided with a guide hole along its thickness direction, and the end of the guide column away from the separation substrate can pass through the guide hole and extend into the guide groove.

[0021] In some embodiments, the radial dimension of the guide column gradually decreases in a direction away from the separation base, and the radial dimension of an end of the guide column away from the separation base is smaller than the radial dimension of the guide hole.

[0022] In some embodiments, the separation substrate comprises a first substrate and a second substrate that are detachably connected, and the separation ejector pin is disposed on the second substrate;

[0023] The second matrix has a lower hardness than the first matrix.

[0024] In a second aspect, an embodiment of the present application provides a testing device, including the above-mentioned disassembly device.

[0025] According to the disassembly device provided by the present application, the carrying assembly is used to carry the semiconductor device and the printed circuit board, and the separation assembly is used to remove the semiconductor device from the printed circuit board. Specifically, the carrying body is used to carry the printed circuit board, and when the printed circuit board is in contact with a surface of one side of the carrying body, the semiconductor device is located inside the avoidance groove, and there is a gap between the semiconductor device and the bottom surface of the avoidance groove in the first direction. The existence of the gap allows the semiconductor device to be displaced to a certain extent with the printed circuit board in the first direction, providing a prerequisite for the disassembly and separation between the semiconductor device and the printed circuit board. When the semiconductor device and the printed circuit board are supported by the supporting body, the separation base approaches the supporting body along the first direction. During the approaching process, the separation pin is inserted into the test hole from the side of the printed circuit board away from the semiconductor device. When the separation pin contacts the pin, the force exerted by the separation pin on the pin will drive the pin to be further pressed onto the semiconductor device, and will not produce a tendency for the pin and the semiconductor device to separate from each other, and will not cause damage to the semiconductor device. At the same time, it will not cause the pin and the semiconductor device to fall off. Based on the force exerted by the separation pin on the pin, the semiconductor device will be driven to displace along the first direction inside the avoidance groove, thereby smoothly separating the semiconductor device and the printed circuit board. Brief Description of the Drawings

[0026] The features, advantages, and technical effects of exemplary embodiments of the present application will be described below with reference to the drawings.

[0027] Figure 1 A first perspective schematic diagram of the relative positional relationship of a disassembly device, a test board, and a semiconductor device provided for some embodiments of the present application;

[0028] Figure 2 A second perspective schematic diagram of the relative positional relationship of a disassembly device, a test board, and a semiconductor device provided for some embodiments of the present application;

[0029] Figure 3 A schematic diagram of the structure of a disassembly device provided for some embodiments of the present application;

[0030] Figure 4 A schematic diagram of the relative positional relationship between a carrier assembly and a semiconductor device in a disassembly device provided for some embodiments of the present application;

[0031] Figure 5 A schematic diagram of the structure of a carrier assembly in a disassembly device provided for some embodiments of the present application;

[0032] Figure 6 A schematic diagram of the structure of a separation assembly in a disassembly device provided for some embodiments of the present application.

[0033] Marking Explanation:

[0034] 100, disassembly device; 200, test board; 201, test hole; 202, guiding hole; 300, semiconductor device; 301, guiding groove;

[0035] 10, carrier assembly; 11, carrier body; 111, carrier base; 112, first carrier; 1121, notch; 1122, first part; 1123, second part; 113, second carrier; 1131, first concave space; 114, third carrier; 1141, taking groove; 1142, convex part; 115, fourth carrier; 1151, second concave space; 12, avoidance groove;

[0036] 20, separation assembly; 21, separation base; 211, first base; 212, second base; 22, separation ejector pin; 23, installation groove; 24, guiding column;

[0037] X, first direction; Y, second direction; Z, third direction.

[0038] In the drawings, the same components are denoted by the same reference numerals. The drawings are not drawn to actual scale. Detailed implementation manners

[0039] The features and exemplary embodiments of various aspects of the present application will be described in detail below. To make the objectives, technical solutions, and advantages of the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application and not to limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0040] It should be noted that in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, elements defined by the statement "comprising..." do not exclude the existence of additional identical elements in the process, method, article or device comprising the said elements.

[0041] Semiconductor devices are electronic devices made using the special properties of semiconductor materials and play an extremely important role in modern electronic technology. Semiconductor devices usually include various products such as diodes, transistors, thyristors, etc. Printed circuit boards are usually used as carriers for semiconductor devices and mainly consist of insulating substrates and conductor lines. Electrical connections between various electronic components in the circuit are achieved by forming conductive patterns on the substrates.

[0042] After the production of some semiconductor device products is completed, they usually need to be connected to a printed circuit board for some tests. Exemplarily, when certain products are undergoing reliability tests such as high temperature and high humidity, temperature cycling, etc., the semiconductor devices need to be installed on the printed circuit board to simulate the reliability performance when working in cooperation with the circuit board in the actual working environment. After the test is completed, how to disassemble the semiconductor device from the printed circuit board without damaging the semiconductor device is a problem worthy of research.

[0043] In the related art, technicians directly remove the semiconductor device from the printed circuit board by manual operation. During this process, it is inevitable to damage the pins on the semiconductor device. For some pins that are not very firmly connected, pin dropping may also occur, damaging the semiconductor device product.

[0044] In view of this, in a first aspect, please refer to Figures 1 to 3 , an embodiment of the present application provides a disassembly device 100 for disassembling a semiconductor device 300 on a test board 200. The test board 200 is provided with a test hole 201 penetrating in its thickness direction. The pins on the semiconductor device 300 can be correspondingly inserted into the test hole 201. The projected area of the test board 200 in its thickness direction is larger than the projected area of the semiconductor device 300. The disassembly device 100 includes a carrying component 10 and a separating component 20. Among them, the carrying component 10 includes a carrying body 11 and an avoidance groove 12 recessed into the carrying body 11 along a first direction X. The carrying body 11 is configured to carry the test board 200, and the semiconductor device 300 can be located inside the avoidance groove 12. The size of the avoidance groove 12 in the first direction X is larger than the size of the semiconductor device 300 in the first direction X. The separating component 20 includes a separating base body 21 arranged at one side of the carrying body 11 at intervals along the first direction X. A separating ejector pin 22 extending along the first direction X is arranged on the side surface of the separating base body 21 facing the carrying body 11. The separating ejector pin 22 is located inside the projection of the avoidance groove 12 in the first direction X, and the separating ejector pin 22 can be correspondingly inserted into the test hole 201.

[0045] During the testing process of the semiconductor device 300, the semiconductor device 300 needs to be connected to a specific test board 200. In practical applications, the test board 200 is usually a printed circuit board. In order to facilitate the connection of the pins on the semiconductor device 300, the printed circuit board is usually provided with test holes 201 along its thickness direction. The pins on the semiconductor device 300 can be correspondingly inserted into the test holes 201. The connection between the pins and the test holes 201 is achieved by means of plug-in connection to complete the subsequent testing work between the semiconductor device 300 and the printed circuit board. After the testing is completed, the semiconductor device 300 and the printed circuit board need to be separated. The disassembly device 100 provided by the embodiment of the present application can separate the semiconductor device 300 and the printed circuit board after the testing is completed.

[0046] Optionally, the printed circuit board can be provided with a connection sleeve at a corresponding position of the test hole 201, and when the pins on the semiconductor device 300 are inserted into the test hole 201, they are inside the connection sleeve, thereby improving the connection strength between the semiconductor device 300 and the printed circuit board. When there are multiple pins on the semiconductor device 300, correspondingly, the test holes 201 or the connection sleeves on the printed circuit board are also set to multiple. The disassembly device 100 provided in the embodiment of the present application is also applicable to the above scenario, and can separate the pins inside the connection sleeve to achieve the disassembly of the semiconductor device 300 and the printed circuit board. At the same time, in practical applications, considering the test efficiency of the semiconductor device 300, multiple semiconductor devices 300 are usually connected to different positions of a printed circuit board at the same time, and multiple semiconductor devices 300 are tested simultaneously. Therefore, the projection area of ​​the printed circuit board in its thickness direction is larger than the projection area of ​​the semiconductor device 300 in the thickness direction of the test board 200.

[0047] Specifically, the disassembly device 100 includes a carrying component 10 for carrying the semiconductor device 300 and the printed circuit board and a separation component 20 for removing the semiconductor device 300 from the printed circuit board. After the carrying component 10 forms a stable support for the semiconductor device 300 and the printed circuit board, the semiconductor device 300 is removed from the printed circuit board through the separation component 20.

[0048] The carrier assembly 10 includes a carrier body 11 and an avoidance groove 12 recessed inside the carrier body 11 along a first direction X. The carrier body 11 is configured to carry a printed circuit board, and the avoidance groove 12 is used to avoid and accommodate the semiconductor device 300. After the semiconductor device 300 is connected to the printed circuit board, the semiconductor device 300 is located on one side of the printed circuit board in the thickness direction, and part of the printed circuit board is located around the semiconductor device 300. The technician adjusts the thickness direction of the printed circuit board to be consistent with the first direction X, and the semiconductor device 300 faces the avoidance groove 12. When the printed circuit board contacts one side of the carrier body 11, the semiconductor device 300 is located inside the avoidance groove 12. The separation assembly 20 disassembles and separates the semiconductor device 300 from the side of the printed circuit board that is away from the semiconductor device 300.

[0049] The dimension of the avoidance groove 12 in the first direction X is greater than the dimension of the semiconductor device 300 in the first direction X, which means that when the semiconductor device 300 is inside the avoidance groove 12, there is a gap between the side surface of the semiconductor device 300 facing away from the printed circuit board along the first direction X and the bottom surface of the avoidance groove 12 in the first direction X. The existence of this gap allows the semiconductor device 300 to have a certain displacement in the first direction X with respect to the printed circuit board, realizing the disassembly and separation between the semiconductor device 300 and the printed circuit board. The separation assembly 20 provided in the embodiment of the present application is used to drive the semiconductor device 300 to have a certain displacement in the first direction X.

[0050] The separation assembly 20 includes a separation base 21 disposed at one side of the bearing body 11 at intervals along the first direction X. When the semiconductor device 300 and the printed circuit board are not carried by the bearing body 11, the separation base 21 and the bearing body 11 are spaced apart in the first direction X, providing a placement space for the semiconductor device 300 and the printed circuit board. A separation ejector pin 22 extending along the first direction X is provided on the side surface of the separation base 21 facing the bearing body 11. The separation ejector pin 22 is inside the projection of the avoidance groove 12 in the first direction X, and the separation ejector pin 22 can be correspondingly inserted into the test hole 201. When the semiconductor device 300 and the printed circuit board are carried by the bearing body 11, the separation base 21 approaches the bearing body 11 along the first direction X. During the approaching process, the separation ejector pin 22 is inserted into the test hole 201 and contacts the pins on the semiconductor device 300, thereby ejecting the pins from inside the test hole 201 and separating the semiconductor device 300 from the printed circuit board.

[0051] In the above separation process, first, the printed circuit board connected with the semiconductor device 300 is carried by the carrying body 11. After the carrying body 11 carries the printed circuit board, the semiconductor device 300 is located inside the avoidance groove 12. At the same time, there is a gap between the bottom wall of the avoidance groove 12 and the semiconductor device 300. In this case, when an external force acts on the semiconductor device 300 along the first direction X, the semiconductor device 300 can displace a certain distance along the first direction X inside the avoidance groove 12. However, due to the carrying of the carrying body 11, the printed circuit board cannot move with the semiconductor device 300, thus realizing the separation of the semiconductor device 300 from the printed circuit board. The separation assembly 20 is used to drive the semiconductor device 300 to displace inside the avoidance groove 12. Through the contact between the separation ejector pin 22 and the pin, a force is generated to eject the semiconductor device 300. Specifically, to avoid interference between the separation ejector pin 22 and the carrying body 11, the separation ejector pin 22 is located inside the projection of the avoidance groove 12 in the first direction X, ensuring the smooth movement of the separation ejector pin 22. At the same time, the separation ejector pin 22 is inserted into the test hole 201 from the side of the printed circuit board facing away from the semiconductor device 300. When the separation ejector pin 22 contacts the pin, the force exerted by the separation ejector pin 22 on the pin will drive the pin to further press on the semiconductor device 300, without generating a tendency of mutual separation between the pin and the semiconductor device 300, thus not causing damage to the semiconductor device 300 and not causing the pin to fall off from the semiconductor device 300. Due to the force exerted by the separation ejector pin 22 on the pin, the semiconductor device 300 will be driven to displace along the first direction X inside the avoidance groove 12, thereby smoothly separating the semiconductor device 300 from the printed circuit board.

[0052] When there are multiple pins on the semiconductor device 300, there are also multiple test holes 201 on the printed circuit board. Correspondingly, multiple separation ejector pins 22 are provided, and the separation ejector pins 22, the test holes 201, and the pins are correspondingly arranged in the first direction X. When multiple separation ejector pins 22 are provided, to avoid interference between the separation ejector pins 22 and the carrying body 11, the outer contour formed by the multiple separation ejector pins 22 in the first direction X is located inside the projection of the avoidance groove 12 in the first direction X.

[0053] In summary, in the embodiments of the present application, the carrier component 10 is used to carry the semiconductor device 300 and the printed circuit board, and the separation component 20 is used to disassemble the semiconductor device 300 from the printed circuit board. Specifically, the carrier body 11 is used to carry the printed circuit board. When the printed circuit board contacts one side surface of the carrier body 11, the semiconductor device 300 is located inside the avoidance groove 12, and there is a gap between the semiconductor device 300 and the groove bottom surface of the avoidance groove 12 in the first direction X. The existence of this gap allows the semiconductor device 300 to have a certain displacement in the first direction X relative to the printed circuit board, providing a prerequisite for the disassembly and separation between the semiconductor device 300 and the printed circuit board. When the semiconductor device 300 and the printed circuit board are carried by the carrier body 11, the separation base 21 approaches the carrier body 11 along the first direction X. During the approaching process, the separation ejector pin 22 is inserted into the test hole 201 from the side of the printed circuit board facing away from the semiconductor device 300. When the separation ejector pin 22 contacts the pin, the force exerted by the separation ejector pin 22 on the pin will drive the pin to further press against the semiconductor device 300, without generating a tendency of mutual separation between the pin and the semiconductor device 300, thus not causing damage to the semiconductor device 300, nor causing the pin to fall off from the semiconductor device 300. Based on the force exerted by the separation ejector pin 22 on the pin, the semiconductor device 300 will be driven to displace along the first direction X inside the avoidance groove 12, so that the semiconductor device 300 and the printed circuit board can be separated smoothly.

[0054] In some embodiments, please refer to Figures 1 to 5 , the carrier body 11 includes a carrier base 111 and a first carrier 112, a second carrier 113, a third carrier 114, and a fourth carrier 115 that are connected to one side of the carrier base 111 along the first direction X and are interconnected. The first carrier 112, the second carrier 113, the third carrier 114, and the fourth carrier 115 surround the first direction X to form the avoidance groove 12. The side walls of part of the first carrier 112 can contact the semiconductor device 300, the side walls of part of the second carrier 113 can contact the semiconductor device 300, the side walls of part of the third carrier 114 can contact the semiconductor device 300, and the side walls of part of the fourth carrier 115 can contact the semiconductor device 300.

[0055] In this embodiment, the avoidance groove 12 is formed by surrounding the first direction X by the interconnected first carrier 112, second carrier 113, third carrier 114, and fourth carrier 115. The spatial size of the avoidance groove 12 is adjusted by the spacing between the first carrier 112, the second carrier 113, the third carrier 114, and the fourth carrier 115.

[0056] The side walls of the avoidance groove 12 in this embodiment are not completely spaced from the semiconductor device 300. To ensure the smooth movement of the semiconductor device 300 along the first direction X inside the avoidance groove 12, partial side walls of the first carrier 112, the second carrier 113, the third carrier 114, and the fourth carrier 115 can all come into contact with the semiconductor device 300 to stably limit the semiconductor device 300 inside the avoidance groove 12. At the same time, the side walls of the first carrier 112 that do not contact the semiconductor device 300, the side walls of the second carrier 113 that do not contact the semiconductor device 300, the side walls of the third carrier 114 that do not contact the semiconductor device 300, and the side walls of the fourth carrier 115 that do not contact the semiconductor device 300 can be flexibly arranged.

[0057] In some embodiments, the first carrier 112 and the third carrier 114 are oppositely arranged along the second direction Y, and the second direction Y intersects the first direction X. A notch 1121 penetrating along the second direction Y is provided on the first carrier 112, and the notch 1121 communicates the avoidance groove 12 with the external environment. A taking groove 1141 recessed along the second direction Y and communicating with the avoidance groove 12 is provided on the third carrier 114.

[0058] It can be understood that the first carrier 112 and the third carrier 114 are two parts that enclose the avoidance groove 12 and are oppositely arranged along the second direction Y. When the semiconductor device 300 is separated from the printed circuit board, the semiconductor device 300 is inside the avoidance groove 12, and it is necessary to take out the semiconductor device 300 from inside the avoidance groove 12 for subsequent operations. In the embodiments of the present application, the notch 1121 and the taking groove 1141 are respectively on both sides of the avoidance groove 12 along the second direction Y. Technicians can take or pinch the semiconductor device 300 in the second direction Y, generate a clamping force on the semiconductor device 300 in the second direction Y, and smoothly take out the semiconductor device 300. The notch 1121 penetrates the first carrier 112 and communicates the avoidance groove 12 with the external environment, which can provide sufficient space for taking the semiconductor device 300 and facilitate the operation of technicians.

[0059] In some embodiments, the first carrier 112 and the third carrier 114 extend along the third direction Z, and the third direction Z, the second direction Y, and the first direction X intersect pairwise. The notch 1121 is located in the middle of the first carrier 112 along the third direction Z. The first carrier 112 includes a first part 1122 and a second part 1123 respectively located on both sides of the notch 1121 along the third direction Z, and the first part 1122 and the second part 1123 can contact the semiconductor device 300. There are two pickup slots 1141, and the two pickup slots 1141 are respectively located at both ends of the third carrier 114 along the third direction Z. The third carrier 114 includes a convex portion 1142 located between the two pickup slots 1141 along the third direction Z, and the convex portion 1142 can contact the semiconductor device 300.

[0060] In actual operation, technicians usually directly take out the semiconductor device 300 from the avoidance groove 12 by manual picking. Based on the picking action of the human body, the notch 1121 is located in the middle of the first carrier 112, which can correspond to the force exerted by the human thumb. At the same time, the first part 1122 and the second part 1123 on both sides of the notch 1121 contact the semiconductor device 300 to limit the semiconductor device 300; the two pickup slots 1141 are located at both ends of the third carrier 114, which can correspond to the force exerted by the index finger and middle finger of the human body. At the same time, the convex portion 1142 between the two pickup slots 1141 contacts the semiconductor device 300 to limit the semiconductor device 300.

[0061] In some embodiments, the second carrier 113 and the fourth carrier 115 both extend along the second direction Y and are arranged opposite to each other along the third direction Z. A first concave space 1131 communicating with the avoidance groove 12 is provided in the middle of the second carrier 113 along the second direction Y, and a second concave space 1151 communicating with the avoidance groove 12 is provided in the middle of the fourth carrier 115 along the second direction Y.

[0062] The second carrier 113 and the fourth carrier 115 are arranged opposite to each other in the third direction Z of the avoidance groove 12. In order to avoid the remaining structures connected to the semiconductor device 300, a first concave space 1131 is provided in the middle of the second carrier 113, or a second concave space 1151 is provided in the middle of the fourth carrier 115. Optionally, the first concave space 1131 and the second concave space 1151 are arranged opposite to each other to form a relatively large avoidance space.

[0063] In some embodiments, please refer to Figures 1 to 6A guide post 24 is provided on the side of the separation substrate 21 facing the carrier body 11 along the first direction X, and one end of the guide post 24 facing away from the separation substrate 21 protrudes from one end of the separation ejector pin 22 facing away from the separation substrate 21. A guide groove 301 is provided on the semiconductor device 300, and a guide hole 202 is provided through the test board 200 along the thickness direction, and one end of the guide post 24 facing away from the separation substrate 21 can pass through the guide hole 202 and extend to the inside of the guide groove 301.

[0064] In order to ensure that the plurality of separation ejector pins 22 can be smoothly inserted into the test hole 201, in the embodiment of the present application, the guide groove 301 on the semiconductor device 300, the guide hole 202 on the test board 200 and the guide column 24 are used for guidance to improve the correspondence between the separation ejector pins 22 and the test hole 201. Specifically, the guide groove 301 is provided on the semiconductor device 300, and the guide hole 202 is provided on the test board 200. The positions of the guide groove 301 and the guide hole 202 correspond to each other, and the position of the guide column 24 also corresponds to the positions of the guide groove 301 and the guide hole 202. In the process of the separation substrate 21 approaching the carrier body 11, since the end of the guide column 24 facing away from the separation substrate 21 protrudes from the end of the separation ejector pin 22 facing away from the separation substrate 21, the guide column 24 will first contact the test board 200. The guide column 24 is first inserted into the test hole 201 on the test board 200 to determine the relative position relationship between the separation substrate and the test board 200. Then, the separation ejector pin 22 is inserted into the corresponding test hole 201 and contacts the corresponding pin, thereby ejecting the semiconductor device 300 out of the test board 200 to achieve separation between the semiconductor device 300 and the test board 200.

[0065] In some embodiments, in order to ensure that the guide post 24 is smoothly inserted into the guide hole 202, the radial dimension of the guide post 24 gradually decreases in the direction away from the separation substrate 21, and the radial dimension of the end of the guide post 24 that is away from the separation substrate 21 is smaller than the radial dimension of the guide hole 202. Through the above configuration, the size change of the guide post 24 itself can play a certain guiding role. At the same time, since the radial dimension of the end of the guide post 24 that is away from the separation substrate 21 is smaller than the radial dimension of the guide hole 202, the contact between the guide post 24 and the test board 200 can be avoided as much as possible, and the guide post 24 can be prevented from causing damage to the test board 200.

[0066] In some embodiments, a plurality of mounting grooves 23 are provided on the side of the separation base 21 facing the carrier body 11 , and the plurality of mounting grooves 23 are spaced apart on the separation base 21 . The number of the mounting grooves 23 is greater than the number of the separation ejector pins 22 , and the separation ejector pins 22 are detachably connected to the inside of the mounting grooves 23 .

[0067] During actual use, the semiconductor device 300 usually has multiple pins. Therefore, the test holes 201 and the separating ejector pins 22 on the printed circuit board are also provided in multiple numbers. However, the pin positions and the number of pins on semiconductor devices 300 of different specifications are usually different. To improve the applicability of the disassembly device 100 provided in the embodiments of the present application, a plurality of mounting grooves 23 are provided on the side of the separating base 21 facing the carrying body 11. The mounting grooves 23 are used to connect and mount the separating ejector pins 22. The separating ejector pins 22 are detachably connected to the inside of the mounting grooves 23. By mounting the separating ejector pins 22 inside different mounting grooves 23, the pin positions and the number of pins on semiconductor devices 300 of different specifications can be corresponded to.

[0068] The number of the mounting grooves 23 is greater than the number of the separating ejector pins 22. Usually, the number and the setting positions of the mounting grooves 23 on the separating base 21 are arranged to make basic preparations for forming different shapes of the separating ejector pins 22. The plurality of mounting grooves 23 in the embodiments of the present application are spaced apart on the separating base 21. Technicians can determine whether the separating ejector pins 22 need to be correspondingly mounted inside each mounting groove 23 according to the pin positions on the semiconductor device 300. For the arrangement manner of the mounting grooves 23 on the separating base 21, in one embodiment, the mounting grooves 23 are first arranged at intervals along the second direction Y, and then arranged at intervals along the third direction Z. The plurality of mounting grooves 23 form a linear array distribution on the separating base 21. Alternatively, in another embodiment, the mounting grooves 23 are first arranged at intervals along a circumferential track with a preset diameter, and then arranged along circumferential tracks with different diameters. The plurality of mounting grooves 23 form a circumferential array distribution on the separating base 21.

[0069] In some embodiments, the separating base 21 includes a first base 211 and a second base 212 that are detachably connected. The separating ejector pins 22 are arranged on the second base 212. After adjusting the positions and the number of the corresponding separating ejector pins 22 for semiconductor devices 300 of the same specification, the separating ejector pins 22 and the second base 212 can be regarded as a whole and reused corresponding to semiconductor devices 300 of a certain specification. For semiconductor devices 300 of another specification, a new second base 212 and the separating ejector pins 22 connected to the second base 212 can be formed. By replacing the second base 212 and the separating ejector pins 22 arranged on the second base 212, semiconductor devices 300 of different specifications can be corresponded to.

[0070] Furthermore, since there is a probability that the second base 212 contacts the test board 200, in order to avoid damage to the test board 200 caused by the second base 212, the hardness of the second base 212 is set to be less than that of the first base 211. Exemplarily, the first base 211 can be set to be made of a metal material, and the second base 212 can be made of a wood or plastic material.

[0071] In a second aspect, an embodiment of the present application provides a testing device, which includes a disassembly device 100 provided in the first direction X of the embodiment of the present application and a test board 200. The testing device further includes a base, and the test board 200, the carrying assembly 10, and the separation assembly 20 are respectively connected to the base to form an integral device. The testing device provided by the embodiment of the present application has all the beneficial effects of the above-mentioned disassembly device 100, which will not be elaborated here.

[0072] Although the present invention has been described with reference to the preferred embodiments, various modifications can be made to it and components therein can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present invention is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A disassembly device for disassembling a semiconductor device on a test board. The test board is provided with test holes penetrating through it in the thickness direction, and the pins on the semiconductor device can be correspondingly inserted into the test holes. The projected area of the test board in its thickness direction is larger than the projected area of the semiconductor device. It is characterized in that, The disassembly device includes: a bearing component, including a bearing body and an avoidance groove recessed inside the bearing body along a first direction; a separation component, including a separation base body arranged at one side of the bearing body at intervals along the first direction, a separation ejector pin extending along the first direction is arranged on the side surface of the separation base body facing the bearing body, and the separation ejector pin is inside the projection of the avoidance groove in the first direction; wherein, the bearing body is configured to bear the test board, the semiconductor device can be inside the avoidance groove, the size of the avoidance groove in the first direction is larger than the size of the semiconductor device in the first direction, and the separation ejector pin can be correspondingly inserted into the test hole.

2. The disassembling device according to claim 1, wherein A plurality of installation grooves are arranged on the side surface of the separation base body facing the bearing body, the plurality of installation grooves are spaced apart on the separation base body, the number of the installation grooves is larger than the number of the separation ejector pins, and the separation ejector pins are detachably connected inside the installation grooves.

3. The disassembly device according to claim 1, wherein, The bearing body includes a bearing base body and a first carrier body, a second carrier body, a third carrier body and a fourth carrier body which are connected to one side of the bearing base body along the first direction and are connected to each other, and the first carrier body, the second carrier body, the third carrier body and the fourth carrier body enclose the avoidance groove along the first direction; The side walls of part of the first carrier body can contact the semiconductor device, the side walls of part of the second carrier body can contact the semiconductor device, the side walls of part of the third carrier body can contact the semiconductor device, and the side walls of part of the fourth carrier body can contact the semiconductor device.

4. The disassembling device according to claim 3, characterized in that, The first carrier body and the third carrier body are arranged opposite to each other along a second direction, and the second direction intersects with the first direction; A notch penetrating along the second direction is arranged on the first carrier body, the notch communicates the avoidance groove and the external environment, and a taking groove recessed along the second direction and communicating with the avoidance groove is arranged on the third carrier body.

5. The disassembling device according to claim 4, wherein, The first carrier body and the third carrier body extend along a third direction, and the third direction, the second direction and the first direction intersect pairwise; The notch is in the middle of the first carrier body along the third direction, the first carrier body includes a first part and a second part respectively on both sides of the notch along the third direction, and the first part and the second part can contact the semiconductor device; There are two taking grooves, the two taking grooves are respectively at both ends of the third carrier body along the third direction, and the third carrier body includes a convex part between the two taking grooves along the third direction, and the convex part can contact the semiconductor device.

6. The disassembling device according to claim 3, characterized in that, Both the second carrier body and the fourth carrier body extend along the second direction and are arranged opposite to each other along the third direction, and the third direction, the second direction and the first direction intersect pairwise; A first concave space communicating with the avoidance groove is arranged in the middle of the second carrier body along the second direction, and a second concave space communicating with the avoidance groove is arranged in the middle of the fourth carrier body along the second direction.

7. The disassembling device according to claim 1, wherein A guide column is provided on the side of the separation base body extending along the first direction toward the carrier body, and an end of the guide column facing away from the separation base body protrudes from an end of the separation ejector pin facing away from the separation base body; The semiconductor device is provided with a guide groove, the test board is provided with a guide hole along its thickness direction, and the end of the guide column away from the separation substrate can pass through the guide hole and extend into the guide groove.

8. The disassembling device according to claim 7, characterized in that, The radial dimension of the guide column gradually decreases in a direction away from the separation base, and the radial dimension of an end of the guide column away from the separation base is smaller than the radial dimension of the guide hole.

9. The disassembling device according to claim 1, wherein, The separation base comprises a first base and a second base that are detachably connected, and the separation ejector pin is arranged on the second base; The second matrix has a lower hardness than the first matrix.

10. A testing device, characterized in that, The invention comprises the disassembly device according to any one of claims 1 to 9.

Images