Optical device packaging structure with extinction function and MEMS detector
By setting an extinction layer on the inner side wall of the transition structure layer of the MEMS device package structure, the problem of stray light influence is solved, and high-performance optical imaging and vacuum packaging are achieved.
Patent Information
- Application Number
- CN202422353130.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-09-26
AI Technical Summary
Existing MEMS device package structures are susceptible to stray light during optical imaging, resulting in imaging abnormalities, especially when using high reflectivity materials.
An extinction layer is provided on the inner wall of the transition structure layer, and the reflected light is reduced through a rough surface, a light absorbing film or a step structure, thereby achieving a low reflectivity extinction treatment.
Effectively reduce stray light, improve the imaging quality and vacuum packaging performance of MEMS detectors.
Smart Images
Figure CN223060710U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor packaging, and particularly relates to an optical device packaging structure with an extinction function and a MEMS detector. Background Art
[0002] Due to the fragile structure of MEMS devices, they need to be packaged and protected to ensure the stability of the chip structure and reliable performance. For special devices such as MEMS infrared devices, they need to be packaged with protective gas or vacuum packaged.
[0003] In order to achieve the protection of gas packaging / vacuum packaging while improving the performance of infrared devices, a transition structure is added between the window and the chip during existing packaging, such as Figure 1 shown; however, in this current packaging method, the optical device is easily affected by stray light during imaging, resulting in abnormal imaging. Especially when using metal or other materials with higher reflectivity as the transition structure or packaging housing, the reflected light is likely to affect the imaging area of the chip. Summary of the Utility Model
[0004] The purpose of the utility model is to provide an optical device packaging structure with an extinction function, which can at least solve some defects existing in the prior art.
[0005] To achieve the above purpose, the utility model adopts the following technical solutions:
[0006] An optical device packaging structure with an extinction function, including a window, a chip, and a transition structure layer. The upper and lower surfaces of the transition structure layer are respectively bonded to the window and the chip. The transition structure layer is a hollow structure, and an extinction layer is provided on the inner side wall of the transition structure layer.
[0007] Further, the extinction layer is a rough surface formed by any one of machining, grinding, or etching on the inner side wall of the transition structure layer.
[0008] Further, the extinction layer is an absorbing film.
[0009] Further, the absorbing film is a super black nano-coating layer.
[0010] Further, the extinction layer is a stepped structure, and the stepped surface of the stepped structure faces the window.
[0011] Further, the surface of the stepped structure is a rough surface.
[0012] Further, an absorbing film is deposited on the surface of the stepped structure.
[0013] Further, the transition structure layer is made of ceramic material or kovar alloy material.
[0014] Furthermore, the transition structure layer is bonded to the window piece and the chip through a solder layer.
[0015] In addition, the present utility model also provides a MEMS detector, including the above-mentioned optical device packaging structure with an extinction function.
[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0017] For the optical device packaging structure with an extinction function provided by the present utility model, by providing an extinction layer on the inner sidewall of the transition structure layer, low-reflectivity extinction processing is achieved, thereby reducing stray light and realizing high-performance vacuum packaging of the MEMS detector.
[0018] The following will further elaborate on the present utility model in detail with reference to the accompanying drawings. Description of the Drawings
[0019] Figure 1 is a schematic diagram of an optical device packaging structure with an ordinary transition structure added in the prior art;
[0020] Figure 2 is a schematic diagram of an optical device packaging structure with a rough surface as the extinction layer in Embodiment 1 of the present utility model;
[0021] Figure 3 is a schematic diagram of an optical device packaging structure with an absorbing film as the extinction layer in Embodiment 2 of the present utility model;
[0022] Figure 4 is a schematic diagram of an optical device packaging structure with a stepped structure as the extinction layer in Embodiment 3 of the present utility model.
[0023] Description of the reference numerals: 1, window piece; 2, chip; 3, transition structure layer; 4, rough surface; 5, solder layer; 6, absorbing film; 7, stepped structure. Detailed Embodiments
[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0025] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.
[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, a conflicting connection or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0027] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; in the description of the present utility model, unless otherwise specified, "plurality" means two or more.
[0028] Embodiment 1:
[0029] like Figure 2 As shown, this embodiment provides an optical device packaging structure with an extinction function, including a window piece 1, a chip 2 and a transition structure layer 3, wherein the upper and lower surfaces of the transition structure layer 3 are bonded to the window piece 1 and the chip 2 respectively, and the transition structure layer 3 is a hollow structure, and an extinction layer is provided on the inner side wall of the transition structure layer 3; wherein the extinction layer is a rough surface 4 formed by roughening the inner side wall of the transition structure layer 3.
[0030] Specifically, the transition structure layer 3 can be made of, but not limited to, ceramic material or Kovar alloy material, and the transition structure layer 3 is bonded to the window sheet 1 and the chip 2 via a solder layer 5, and the material of the solder layer 5 can be selected from, but not limited to, gold-tin solder, indium-silver solder, and tin-silver-copper solder. Roughening treatment can be performed using, but not limited to, machining, grinding, etching and other process technologies.
[0031] In this embodiment, the inner wall of the transition structure layer 3 is roughened and the irregularity of the inner wall surface is utilized to cause the incident light irradiated to the inner wall of the transition structure layer 3 to be diffusely reflected or scattered, thereby weakening the intensity of the reflected light and achieving the purpose of extinction.
[0032] Embodiment 2:
[0033] As Figure 3 shown, this embodiment provides an optical device packaging structure with an extinction function, including a window 1, a chip 2, and a transition structure layer 3. The upper and lower surfaces of the transition structure layer 3 are respectively bonded to the window 1 and the chip 2. The transition structure layer 3 is a hollow structure, and an extinction layer is provided on the inner side wall of the transition structure layer 3. Among them, the extinction layer is formed by additionally plating an absorbing material on the surface of the inner side wall of the transition structure layer 3 to form an absorbing film 6, and the absorbing material is used to absorb the light incident on the surface of the absorbing material.
[0034] Preferably, the absorbing film 6 adopts an ultra-black nano-coating layer. The blacker the substance, the wider the light absorption range. The ultra-black nano-coating layer can absorb the light incident on the surface of the material, including ultraviolet light, visible light, near-infrared light, and light in the mid- and far-infrared bands. The absorption effect of the ultra-black nano-coating layer on light is used to reduce the adverse effects generated when the incident light irradiates the side wall of the transition structure layer 3.
[0035] Specifically, the transition structure layer 3 can be made of, but is not limited to, ceramic materials or kovar alloy materials. The transition structure layer 3 is bonded to the window 1 and the chip 2 through a solder layer 5, and the material of the solder layer 5 can be selected from, but is not limited to, gold-tin solder, indium-silver solder, and tin-silver-copper solder.
[0036] Embodiment 3:
[0037] As Figure 4 shown, this embodiment provides an optical device packaging structure with an extinction function, including a window 1, a chip 2, and a transition structure layer 3. The upper and lower surfaces of the transition structure layer 3 are respectively bonded to the window 1 and the chip 2. The transition structure layer 3 is a hollow structure, and an extinction layer is provided on the inner side wall of the transition structure layer 3. Among them, the extinction layer is a stepped structure 7, and the stepped surface of the stepped structure 7 faces the window 1. Specifically, the stepped structure 7 can be processed on the inner side wall of the transition structure layer 3 by laser etching, milling, or wet etching processes. In this embodiment, the light incident on the inner side wall of the transition structure layer 3 is reflected by the side wall to the horizontal stepped surface, so as to eliminate the influence of the reflected light generated by the incident light irradiating the inner side wall on the imaging area of the chip 2.
[0038] Optionally, the transition structure layer 3 can be made of, but is not limited to, ceramic materials or kovar alloy materials. The transition structure layer 3 is bonded to the window 1 and the chip 2 through a solder layer 5, and the material of the solder layer 5 can be selected from, but is not limited to, gold-tin solder, indium-silver solder, and tin-silver-copper solder.
[0039] In a further optimized implementation, the surface of the stepped structure 7 can be roughened to form a rough surface, further causing the incident light to undergo diffuse reflection or scattering and weakening the intensity of the reflected light.
[0040] In a further optimized implementation, an absorbing film can also be deposited on the surface of the stepped structure 7 to further absorb the light incident on the sidewalls of the steps and reduce the reflection of the incident light.
[0041] In summary, for the optical device packaging structure with an extinction function provided by the present utility model, by providing an extinction layer on the inner sidewall of the transition structure layer, low-reflectivity extinction treatment is achieved, thereby reducing stray light and realizing high-performance vacuum packaging of the MEMS detector. It can be widely used in other optical devices or semiconductor devices sensitive to light, such as optical systems, lenses, etc., reducing imaging ghosting and improving imaging quality.
[0042] The above examples are merely illustrative of the present utility model and do not constitute a limitation on the protection scope of the present utility model. Any design identical or similar to the present utility model falls within the protection scope of the present utility model.
Claims
1. An optical device packaging structure with a light extinction function, characterized in that: It includes a window piece, a chip and a transition structure layer. The upper and lower surfaces of the transition structure layer are respectively bonded to the window piece and the chip. The transition structure layer is a hollow structure, and an extinction layer is provided on the inner side wall of the transition structure layer.
2. The optical device packaging structure with a light extinction function as described in claim 1, characterized in that: The extinction layer is a rough surface formed by machining, polishing or etching the inner side wall of the transition structure layer in any one of these ways.
3. The optical device packaging structure with a light extinction function as described in claim 1, characterized in that: The extinction layer is an absorbing film.
4. The optical device packaging structure with a light extinction function according to claim 3, characterized in that: The absorbing film is an ultra-black nano-coating layer.
5. The optical device packaging structure with a light extinction function according to claim 1, characterized in that: The extinction layer is a stepped structure, and the step surface of the stepped structure faces the window piece.
6. The optical device packaging structure with a light extinction function according to claim 5, characterized in that: The surface of the stepped structure is a rough surface.
7. The optical device packaging structure with a light extinction function according to claim 5, characterized in that: An absorbing film is deposited on the surface of the stepped structure.
8. The optical device packaging structure with a light extinction function according to any one of claims 1-7, characterized in that: The transition structure layer is made of a ceramic material or a kovar alloy material.
9. The optical device packaging structure with a light extinction function according to claim 8, characterized in that: The transition structure layer is bonded to the window piece and the chip through a solder layer.
10. A MEMS detector, characterized in that: It includes the optical device packaging structure with an extinction function according to any one of claims 1-9.