Chip testing device
By designing the upper and lower pressure head components, and using elastic parts to adjust the extrusion pressure and heating functions, the problem of head impact in the die chip test is solved, flexible extrusion control is achieved, and scrap rate and production costs are reduced.
Patent Information
- Application Number
- CN202422112740.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-08-29
AI Technical Summary
During the test of the die chip, the impact and squeeze pressure of the pressure head are difficult to control, resulting in damage to the chip and increasing the scrap rate and cost.
Using the upper and lower pressure head components, the extrusion pressure is adjusted through the deformation of the first and second elastic parts, and combined with the heating part and the limiting structure, flexible extrusion control of the chip is realized.
Effectively control the extrusion pressure, reduce the impact damage of the chip, reduce the scrap rate and production costs.
Smart Images
Figure CN223065452U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip testing, in particular to a testing device for chips. Background Art
[0002] A die-type chip refers to a chip that has been produced and not yet encapsulated. There are only bonding pads for encapsulation on this kind of chip and it cannot be directly applied to an actual circuit. Die chips have the following characteristics: Since they do not include an encapsulation body and leads and are only composed of the chip itself, their volume and weight are very small; Since there is no encapsulation, die chips are more delicate, so more components can be obtained on the chip and they have a higher integration level.
[0003] However, die chips have no encapsulation and do not include any additional components, so the production cost is relatively low. However, die chips themselves have no encapsulation and their bearing pressure needs to be precisely controlled.
[0004] In the communication performance and stability testing of die chips, it is necessary to make the bearing pressure and heat of the die stable and precise. During the process of applying pressure to the die chip, due to the impact of the indenter and the inconvenience of controlling the extrusion force, the die chip is easily damaged, thus increasing the rejection rate and cost. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a pressure testing device for chips, which is used to solve the problem that the chip is damaged due to the inconvenience of controlling the impact and extrusion force during the testing process of die chips, and reduce the rejection rate and cost.
[0006] To achieve this purpose, the utility model adopts the following technical solutions:
[0007] A testing device for chips, comprising:
[0008] An upper indenter assembly, including a pressure seat, a first elastic member, a core shaft, a sleeve member, a second elastic member and an upper indenter. The core shaft is connected to the pressure seat through the first elastic member. One end of the first elastic member away from the pressure seat abuts against one end of the sleeve member. The sleeve member is sleeved on the core shaft. The sleeve member can move axially relative to the core shaft. The other end of the sleeve member is connected to the upper indenter through the second elastic member;
[0009] A lower indenter assembly, the lower indenter assembly includes a mounting seat and a heating member arranged on the mounting seat. The chip is placed on the mounting seat. The heating member is used to heat the chip;
[0010] When the pressure seat moves downward, the first elastic member and the second elastic member can be deformed, and the upper indenter abuts against the upper surface of the chip;
[0011] By adjusting the axial position of the sleeve relative to the mandrel, the deformation amounts of the first elastic member and the second elastic member can be changed, so as to change the pressing force of the upper pressing head on the chip.
[0012] As an alternative to the chip testing device, a plurality of pressing columns are provided on the upper pressing head, and the pressing columns press against the chip.
[0013] As an alternative to the chip testing device, a plurality of the pressing columns are arranged in a circumferential ring around the mandrel.
[0014] As an alternative to the chip testing device, a limiting hole is provided on the upper pressing head, and the pressing column passes through and is fixed in the limiting hole.
[0015] As an alternative to the chip testing device, a bearing block is provided on the lower pressing head assembly, the bearing block is connected to the mounting seat through a third elastic member, and the chip is arranged on the bearing block.
[0016] As an alternative to the chip testing device, a through hole is provided on the bearing block, one end of the heating element is fixed on the mounting seat, and the other end of the heating element passes through the through hole.
[0017] As an alternative to the chip testing device, a mounting groove is provided on the mounting seat, the third elastic member is arranged in the mounting groove, and one end of the third elastic member is connected to the bottom wall of the mounting groove, and the other end is connected to the bearing block.
[0018] As an alternative to the chip testing device, a plurality of the third elastic members are provided, and the plurality of third elastic members are arranged in a circumferential ring around the heating element.
[0019] As an alternative to the chip testing device, a limiting member is provided on the mounting seat, the limiting member passes through the bearing block, and when the bearing block is pressed down to a preset position, the limiting member abuts against the upper pressing head.
[0020] As an alternative to the chip testing device, the limiting member is a limiting screw, the limiting screw is screwed to the mounting seat, and the head of the limiting screw can abut against the upper pressing head.
[0021] Beneficial effects:
[0022] With the present utility model, by adjusting the moving position of the sleeve member in the axial direction, the deformation amounts of the first elastic member and the second elastic member can be adjusted, thereby controlling and changing the extrusion force of the upper pressing head on the chip, achieving the adjustment and control of the extrusion force. In addition, when the upper pressing head starts to extrude the chip, due to the deformation of the first elastic member and the second elastic member, the upper pressing head assembly has a certain flexibility, avoiding the rigid damage during the initial downward pressing, reducing the impact on the chip, solving the problem that the chip is damaged due to impact during the testing process of the bare chip, and reducing the rejection rate and cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 FIG. 6 is a schematic structural diagram of the first perspective of the upper pressing head assembly provided by an embodiment of the present utility model;
[0024] Figure 2 FIG. 7 is a schematic structural diagram of the second perspective of the upper pressing head assembly provided by an embodiment of the present utility model;
[0025] Figure 3 FIG. 8 is a schematic structural diagram of the lower pressing head assembly provided by an embodiment of the present utility model;
[0026] Figure 4 FIG. 9 is a schematic diagram of the lower pressing head assembly hiding the pressure-bearing block and some of the third elastic members.
[0027] In the figures:
[0028] 1. Upper pressing head assembly; 11. Pressing seat; 12. First elastic member; 13. Core shaft; 14. Sleeve member; 15. Second elastic member; 16. Upper pressing head; 161. Extrusion column; 162. Limiting hole;
[0029] 2. Lower pressing head assembly; 21. Mounting seat; 211. Mounting groove; 212. Limiting member; 22. Heating member; 23. Pressure-bearing block; 231. Through hole; 24. Third elastic member. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0030] The present utility model will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. In addition, it should be noted that for the sake of description, only parts related to the present utility model are shown in the drawings, rather than all the structures.
[0031] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0032] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath", and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0033] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0034] Please refer to the atta Figure 1 - atta Figure 4, this embodiment relates to a test device for a chip (hereinafter referred to as "device"). The device includes an upper pressing head assembly 1 and a lower pressing head assembly 2. Among them, the upper pressing head assembly 1 includes a pressing seat 11, a first elastic member 12, a core shaft 13, a sleeve member 14, a second elastic member 15 and an upper pressing head 16. The core shaft 13 is connected to the pressing seat 11 through the first elastic member 12. One end of the first elastic member 12 away from the pressing seat 11 abuts against one end of the sleeve member 14. The sleeve member 14 is sleeved on the core shaft 13. The sleeve member 14 can move axially relative to the core shaft 13. The other end of the sleeve member 14 is connected to the upper pressing head 16 through the second elastic member 15. The lower pressing head assembly 2 includes a mounting seat 21 and a heating member 22 provided on the mounting seat 21. The chip is placed on the mounting seat 21, and the heating member 22 is used to heat the chip. When the pressing seat 11 moves downward, the first elastic member 12 and the second elastic member 15 can be deformed, and the upper pressing head 16 abuts against the upper surface of the chip. By adjusting the axial position of the sleeve member 14 relative to the core shaft 13, the deformation amounts of the first elastic member 12 and the second elastic member 15 can be changed, so as to change the pressing force of the upper pressing head 16 on the chip.
[0035] This device is used to test the performance of bare die chips. Specifically, it can test the performance and stability of chips under different temperature conditions, verify the performance of chips in harsh environments, including testing the high-temperature resistance and low-temperature resistance of chips, and detecting whether problems will occur during temperature changes of chips.
[0036] In this embodiment, the upper pressing head assembly 1 and the lower pressing head assembly 2 are arranged oppositely to apply a certain pressing force to the chip. Among them, the pressing seat 11 is connected to the output end of the press, and the pressing seat 11 can move downward driven by the output end of the press. The sleeve member 14 is sleeved on the outer periphery of the core shaft 13, and the sleeve member 14 can move axially relative to the core shaft 13. Specifically, the sleeve member 14 and the core shaft 13 form a ball screw form fit. During the rotation of the sleeve member 14 relative to the core shaft 13, the sleeve member 14 can move axially. By adjusting the moving position of the sleeve member 14 in the axial direction, the deformation amounts of the first elastic member 12 and the second elastic member 15 are adjusted, so that the pressure difference generated by the elastic deformation of the first elastic member 12 and the second elastic member 15 can be used to control the pressing force of the upper pressing head 16 on the chip, realizing the adjustment and control of the pressing force. In addition, when the upper pressing head 16 starts to press the chip, due to the deformation of the first elastic member 12 and the second elastic member 15, the upper pressing head assembly 1 has a certain flexibility, avoiding the rigid damage of the initial downward pressure, reducing the impact on the chip, solving the problem that the chip is damaged by the impact during the test process of the bare die chip, and reducing the scrap rate and cost. In addition, the mounting seat 21 in the lower pressing head assembly 2 is used to carry the chip, and at the same time, by contacting the chip through the heating member 22, the test of the chip under different temperature environments can be realized.
[0037] Optionally, a plurality of extrusion columns 161 are provided on the upper pressing head 16, and the extrusion columns 161 press against the chip.
[0038] In this embodiment, the upper pressing head 16 is sleeved on the end of the mandrel 13. On one end face of the upper pressing head 16 close to the lower pressing head assembly 2, a plurality of extrusion columns 161 are convexly provided. Exemplarily, three extrusion columns 161 are provided, and the three extrusion columns 161 are circumferentially and evenly distributed. The contact surface of the extrusion column 161 with the chip is subjected to a smooth surface treatment. Those skilled in the art can make targeted selection and adjustment of the number of extrusion columns 161 according to requirements, and this embodiment does not make specific limitations.
[0039] Furthermore, the plurality of extrusion columns 161 are circumferentially arranged around the mandrel 13.
[0040] During the extrusion process of the chip, usually the edge of the chip bears a higher pressure, and it is necessary to apply force to the edge of the chip. The extrusion columns 161 are distributed along the circumference of the mandrel 13, so that the edge of the chip contacts the extrusion columns 161, ensuring that the extrusion pressure is dispersed to the edge of the chip.
[0041] Optionally, a limiting hole 162 is provided on the upper pressing head 16, and the extrusion column 161 passes through and is fixed in the limiting hole 162.
[0042] In this embodiment, the limiting hole 162 is a stepped hole. The extrusion column 161 passes through the limiting hole 162 and is fixed on the step of the stepped hole. The extrusion column 161 can be threadedly connected to the upper pressing head 16 through the limiting hole 162 for convenient disassembly.
[0043] Optionally, a bearing block 23 is provided on the lower pressing head assembly 2. The bearing block 23 is connected to the mounting seat 21 through a third elastic member 24, and the chip is arranged on the bearing block 23.
[0044] In this embodiment, the bearing block 23 is used to support the chip. The bearing block 23 is in a cubic shape. The bearing block 23 is floatingly connected to the mounting seat 21 through a third elastic member 24. The third elastic member 24 can adopt a standard spring. The third elastic member 24 enables the bearing block 23 to float relative to the mounting seat 21, providing a further buffering effect on the extrusion force of the chip and avoiding the impact force of extrusion from damaging the chip.
[0045] Furthermore, a through hole 231 is provided on the bearing block 23. One end of the heating element 22 is fixed on the mounting seat 21, and the other end of the heating element 22 passes through the through hole 231.
[0046] In this embodiment, a perforation 231 is formed at the center of the pressure-bearing block 23. The shape of the perforation 231 matches the shape of the heating element 22, and the size of the perforation 231 is slightly larger than the size of the pressure-bearing block 23, so that the pressure-bearing block 23 can pass through the perforation 231 smoothly. To prevent the heating element 22 from exerting too much squeezing force on the chip and damaging the chip, the surface of the heating element 22 in contact with the chip can be coated with an elastic film layer, which can transfer heat and also reduce the impact on the chip.
[0047] Optionally, the mounting base 21 is provided with a mounting groove 211, and the third elastic member 24 is disposed in the mounting groove 211. One end of the third elastic member 24 is connected to the bottom wall of the mounting groove 211, and the other end is connected to the pressure-bearing block 23.
[0048] In this embodiment, the mounting base 21 is used to support the pressure-bearing block 23. The mounting base 21 is provided with a plurality of circular mounting grooves 211. The third elastic member 24 can be a common spring. One end of the third elastic member 24 is disposed inside the mounting groove 211 and connected to the bottom wall of the mounting groove 211, and the other end of the third elastic member 24 is connected to the pressure-bearing block 23, realizing the floating of the pressure-bearing block 23 relative to the mounting base 21.
[0049] Further, a plurality of third elastic members 24 are provided, and the plurality of third elastic members 24 are arranged in a ring around the heating element 22.
[0050] In this embodiment, a plurality of third elastic members 24 are provided, which are arranged in a ring around the heating element 22 along the four sides of a rectangle, and one row or multiple rows can be distributed on each side. Specifically, the number of the third elastic members 24 can be reasonably selected according to the squeezing force and the stiffness of the third elastic members 24.
[0051] Optionally, the mounting base 21 is provided with a limiting member 212, and the limiting member 212 passes through the pressure-bearing block 23. When the pressure-bearing block 23 is pressed down to a preset position, the limiting member 212 abuts against the upper pressing head 16.
[0052] In this embodiment, during the process of the upper pressing head 16 squeezing the chip, the pressure-bearing block 23 initially moves downward and squeezes the third elastic member 24. When the pressure-bearing block 23 is pressed down to a preset position, which is the limit position of the downward movement of the upper pressing head 16, at this time, the limiting member 212 abuts against the upper pressing head 16 to prevent the upper pressing head 16 from further squeezing the chip. Those skilled in the art can adjust the abutting position of the limiting member 212 and the upper pressing head 16, thereby changing the limit position of the downward pressing of the upper pressing head 16.
[0053] Further, the limiting member 212 is a limiting screw, and the limiting screw is screwed to the mounting base 21, and the head of the limiting screw can abut against the upper pressing head 16.
[0054] In this embodiment, the limiting member 212 is a limiting screw, which is screwed to the mounting seat 21. When the pressure-bearing block 23 does not move downward, the head of the limiting screw is buried inside the pressure-bearing block 23. As the pressure-bearing block 23 is gradually squeezed and lowered, the head of the limiting screw gradually disengages from the inside of the pressure-bearing block 23 and abuts against the upper pressing head 16, indicating that the upper pressing head 16 has reached the limit position of downward pressing.
[0055] Furthermore, the limiting screw is screwed to the mounting seat 21. The operator can adjust the distance between the limiting screw and the mounting seat 21 by screwing the limiting screw, which can conveniently adjust the limit position of the downward pressing of the upper pressing head 16.
[0056] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.
Claims
1. A test device for a chip, characterized in that, Comprising: An upper punch assembly (1), including a punch seat (11), a first elastic member (12), a mandrel (13), a sleeve member (14), a second elastic member (15), and an upper punch (16). The mandrel (13) is connected to the punch seat (11) through the first elastic member (12). One end of the first elastic member (12) away from the punch seat (11) presses against one end of the sleeve member (14). The sleeve member (14) is sleeved on the mandrel (13), and the sleeve member (14) can axially move relative to the mandrel (13). The other end of the sleeve member (14) is connected to the upper punch (16) through the second elastic member (15); A lower punch assembly (2), which includes a mounting seat (21) and a heating member (22) provided on the mounting seat (21). The chip is placed on the mounting seat (21), and the heating member (22) is used to heat the chip; When the punch seat (11) moves downward, the first elastic member (12) and the second elastic member (15) can be deformed, and the upper punch (16) presses against the upper surface of the chip; By adjusting the axial position of the sleeve member (14) relative to the mandrel (13), the deformation amounts of the first elastic member (12) and the second elastic member (15) can be changed, so as to change the extrusion force of the upper punch (16) on the chip.
2. The test device for the chip according to claim 1, wherein A plurality of extrusion columns (161) are provided on the upper punch (16), and the extrusion columns (161) press against the chip.
3. The test device for the chip according to claim 2, wherein The plurality of extrusion columns (161) are circumferentially arranged around the mandrel (13).
4. The testing device for the chip according to claim 2, characterized in that, A limiting hole (162) is provided on the upper punch (16), and the extrusion column (161) passes through and is fixed in the limiting hole (162).
5. The test device for a chip according to claim 2, characterized in that, A bearing block (23) is provided on the lower punch assembly (2). The bearing block (23) is connected to the mounting seat (21) through a third elastic member (24), and the chip is provided on the bearing block (23).
6. The test device for the chip according to claim 5, characterized in that, A through hole (231) is provided on the bearing block (23). One end of the heating member (22) is fixed on the mounting seat (21), and the other end of the heating member (22) passes through the through hole (231).
7. The test device for the chip according to claim 6, characterized in that, A mounting groove (211) is provided on the mounting seat (21). The third elastic member (24) is arranged in the mounting groove (211), and one end of the third elastic member (24) is connected to the bottom wall of the mounting groove (211), and the other end is connected to the bearing block (23).
8. The test device for a chip according to claim 7, characterized in that, There are a plurality of the third elastic members (24), and the plurality of third elastic members (24) are circumferentially arranged around the heating member (22).
9. The test device for the chip according to claim 5, characterized in that, A limiting member (212) is provided on the mounting seat (21). The limiting member (212) passes through the bearing block (23). When the bearing block (23) is pressed down to a preset position, the limiting member (212) abuts against the upper punch (16).
10. The test device for the chip according to claim 9, characterized in that, The limiting member (212) is a limiting screw, and the limiting screw is screwed with the mounting seat (21), and the head of the limiting screw can abut against the upper punch (16).