Smart card adopting cold pressing process

Abstract

The utility model provides an intelligent card of a cold pressing process, which comprises a first sheet, a middle layer and a second sheet from top to bottom, the middle layer comprises a frame, the frame is formed by forming a mounting hole in the middle of a PVC plate, and a printing film is pasted on one surface corresponding to the mounting hole of the frame to form a mounting groove; the at least one electronic component is arranged in the mounting groove, the maximum thickness of the electronic component is smaller than or equal to the thickness of the frame, and the electronic component comprises one or more of a flexible circuit board, a battery, a screen, a key module and an IC chip; the supporting pieces are installed between the adjacent electronic components, the thickness of the supporting pieces is equal to the thickness of the frame, the supporting pieces are provided with first supporting pieces and / or second supporting pieces, and the surfaces of the first supporting pieces are provided with grooves so that the first supporting pieces can have flexibility; and the second supporting piece is a granular body. The yield in the production process of the intelligent card is improved, the failure rate of the card device caused by pressure in the hot pressing process is reduced, and therefore the cost is reduced.

Description

Technical Field

[0001] This application relates to the technical field of smart cards, and particularly to a smart card with a cold pressing process. Background Art

[0002] Traditional cards are made by welding a single chip to a coil and encapsulating them in multiple layers of engineering plastic sheets (such as PVC) through a hot pressing technology. The IC chip itself is relatively small, and appropriate grooves can be made inside the middle PVC to provide space for the IC chip, avoiding excessive stress on the entire card under strong pressure, thereby protecting the physical properties of the IC chip and the coil. Therefore, the card manufacturing difficulty is relatively low, and the product yield rate is relatively high. With the development of mobile payment technology, single-function cards can no longer meet people's needs. People expect to integrate more functions on the card, encapsulating components such as display screens, thin-film batteries, FPC flexible boards, ceramic inductors, and thin-film solar cells within a physical size of 0.84 mm thickness, and also need to ensure the overall rigidity and toughness.

[0003] The existing cold pressing technology involves cutting a relatively large hole in the middle of a thicker PVC material, forming a runway-shaped border around it, and bonding it to the back of a printing film about 0.1 mm thick with glue to form a groove. First, the circuit board is preliminarily fixed inside the groove, and then epoxy resin glue is poured. By controlling the amount and composition of the glue, the curing speed of the glue is controlled to form a card with a certain rigidity and toughness.

[0004] In order to control the thickness of the formed card, the existing technology often uses rollers to continuously roll and apply a large force to press out the air and excess glue inside the card. Since the plasticity of the PVC border is greater than its rigidity, the FPC (flexible printed circuit board) with the chip welded inside and other devices will be subjected to a relatively large pressure, resulting in the following impacts:

[0005] 1) The thickness of the formed card is uneven.

[0006] 2) Some devices are damaged.

[0007] 3) It is necessary to repeatedly press, and the processing time is long.

[0008] 4) There is more glue and the curing time is long.

[0009] 5) It is necessary to strictly control the pressure of the pressing machine.

[0010] 6) The finished product has excessive rigidity and insufficient toughness.

[0011] Therefore, the technical problem that needs to be solved urgently at present is: how to improve the yield rate in the production process of smart cards, reduce the failure rate of card devices caused by pressure during the hot pressing process, and thus reduce costs. Summary of the Utility Model

[0012] The purpose of this application is to provide an intelligent card with a cold pressing process, improve the yield rate in the production process of the intelligent card, reduce the failure rate of the card devices caused by pressure during the hot pressing process, and thus reduce costs.

[0013] To achieve the above object, this application provides an intelligent card with a cold pressing process. The intelligent card includes: a first sheet, an intermediate layer, and a second sheet from top to bottom. The intermediate layer includes:

[0014] A frame, which is formed by opening an installation hole in the middle of a PVC board, and a printing film is pasted on one side corresponding to the installation hole of the frame to form an installation groove;

[0015] At least one electronic component, which is arranged in the installation groove, and the maximum thickness of the electronic component is less than or equal to the thickness of the frame. The electronic component includes one or more of a flexible circuit board, a battery, a screen, a button module, and an IC chip;

[0016] A plurality of support members, which are installed between adjacent electronic components, and the thickness of the support member is equal to the thickness of the frame. The support member includes a first support member and / or a second support member. The surface of the first support member has grooves to make it flexible;

[0017] The second support member is a granular body.

[0018] For the intelligent card with the cold pressing process as described above, wherein the first support member is rod-shaped or strip-shaped.

[0019] For the intelligent card with the cold pressing process as described above, wherein the material of the second support member is a thermosetting resin material.

[0020] For the intelligent card with the cold pressing process as described above, wherein the rigidity of the first support member is greater than that of the frame. The first support member is an engineering plastic rod or an engineering plastic strip, and a plurality of grooves are opened on the surface of the engineering plastic strip or the engineering plastic rod.

[0021] For the intelligent card with the cold pressing process as described above, wherein a plurality of the grooves are arranged at intervals along the length direction of the engineering plastic rod or the engineering plastic strip, and a plurality of the grooves are arranged along the stress direction of the card twisting or bending.

[0022] For the intelligent card with the cold pressing process as described above, wherein the first support member is made of PC or PET material.

[0023] For the intelligent card with the cold pressing process as described above, wherein the granular body is a spherical particle.

[0024] The smart card of the cold pressing process as described above, wherein a plurality of the spherical particles are fixed in the gaps between the electronic components by an epoxy resin liquid glue.

[0025] The smart card of the cold pressing process as described above, wherein a plurality of the spherical particles are arranged along the width direction or the length direction of the intermediate layer and are uniformly arranged around the flexible circuit board and / or the chip.

[0026] The smart card of the cold pressing process as described above, wherein the first sheet and the second sheet are respectively bonded to the upper and lower surfaces of the intermediate layer by a cold pressing glue.

[0027] The beneficial effects achieved by this application are as follows:

[0028] (1) This application improves the yield rate in the production process of smart cards, reduces the failure rate of card devices caused by pressure during the hot pressing process, and thus reduces costs.

[0029] (2) Based on the pressure that the flexible engineering plastic PVC frame can withstand, a plastic bracket with stronger rigidity is added around the FPC (flexible circuit board). The plastic bracket can withstand part of the external pressure, strengthen the force borne by the frame during the curing process, and improve the resistance of the product during the pressing process. Description of the Drawings

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present application. For those skilled in the art, other drawings can also be obtained based on these drawings.

[0031] Figure 1 It is a schematic structural diagram of the intermediate layer of a smart card of a cold pressing process according to an embodiment of the present application.

[0032] Figure 2 It is a schematic structural diagram of the PVC frame according to an embodiment of the present application.

[0033] Figure 3 It is a schematic structural diagram of the first support according to an embodiment of the present application.

[0034] Figure 4 It is a schematic structural diagram of the second support according to an embodiment of the present application.

[0035] Reference numerals: 1 - intermediate layer; 2 - flexible circuit board; 3 - button module; 4 - battery; 5 - screen; 6 - frame; 71 - first support; 72 - second support; 711 - groove. Detailed Embodiments

[0036] Combined with the accompanying drawings in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present application.

[0037] As Figures 1-4 shown, the present application provides an intelligent card with a cold pressing process. The intelligent card includes: a first sheet, an intermediate layer 1, and a second sheet from top to bottom. The first sheet and the second sheet are respectively bonded to the upper and lower surfaces of the intermediate layer 1 through cold pressing glue. The intermediate layer 1 includes:

[0038] a frame 6, which is formed by opening an installation hole in the middle of a PVC board, and a printing film is pasted on one side corresponding to the installation hole of the frame 6 to form an installation groove; the installation groove is used to install electronic components.

[0039] At least one electronic component, which is arranged in the installation groove, and the maximum thickness of the electronic component is less than or equal to the thickness of the frame 6. The electronic component includes: a circuit board 2 (i.e., a flexible circuit board), a battery 4, a screen 5, a button module 3, and one or more of IC chips;

[0040] a plurality of support members, which are installed between adjacent electronic components and the thickness of the support member is equal to the thickness of the frame 6. The support member includes a first support member 71 and / or a second support member 72. In this embodiment, the intermediate layer is installed with the first support member and the second support member. In other embodiments, the intermediate layer only has the first support member or only the second support member. The surface of the first support member 71 has a groove 711 to make it flexible; when bending the hard wallet, the groove 711 is used to increase the flexibility of the first support member 71;

[0041] The second support member 72 is a granular body, and the second support member 72 is made of a material with pressure resistance and not easy to deform. Preferably, the material of the second support member 72 is a thermosetting resin material.

[0042] The flexible circuit board 2, the IC chip, and the battery 4 are installed inside the middle layer 1; the screen 5 is installed on the middle layer 1 and exposed outside the middle layer 1; the button module 3 is fixedly connected to the middle layer 1 and electrically linked to the flexible circuit board 2; the bracket is fixedly connected beside the flexible circuit board 2 and / or the IC chip. The IC chip is used to store encrypted keys and important digital asset information to ensure the security and integrity of data. The screen 5 is used to display data such as transaction information and balance. The battery 4 is used to provide power support for the operation of the smart card. The square frame, the first sheet, and the second sheet are used to protect the electronic components inside the smart card, such as waterproofing, dustproofing, and anti-drop. The bracket in the middle layer can withstand a part of the external pressure and protect the welding of the electronic components. The bracket can fix some of the electronic components inside the smart card to avoid being strained during the bending process.

[0043] As Figure 1 and 2 shown, the thickness of the border 6 is greater than or equal to the maximum thickness of the electronic components. Preferably, the border 6 is quadrilateral, surrounding the middle layer 1 on all sides, and the four corners of the border 6 are rounded. Here, the shape of the PVC border 6 is not limited, and the shape of the border 6 is set according to the edge shape of the middle layer 1. The border 6 is used to withstand pressure during the hot pressing process of the smart card, reduce the pressure on the electronic components inside the smart card, and prevent the electronic components inside the smart card from being damaged due to excessive pressure.

[0044] Based on the border 6 bearing pressure in this application, around the FPC (flexible circuit board 2), a more rigid support member such as a plastic bracket is added. The plastic bracket can withstand a part of the external pressure and protect the welding of the electronic components.

[0045] The first support member 71 is rod-shaped or strip-shaped. The rigidity of the first support member 71 is greater than that of the border 6. The first support member 71 is an engineering plastic rod or an engineering plastic strip. Multiple grooves 711 are provided on the surface of the engineering plastic strip or the engineering plastic rod. In order to protect each electronic component, the thickness of the first support member is greater than the minimum thickness of the electronic components. The structural form of the first support frame is not limited here, and the structure of the first support member can be combined into a cross structure, a multi-fork structure, etc.

[0046] As Figure 1 shown, the engineering plastic rod or the engineering plastic strip is arranged beside the flexible circuit board 2 and / or the IC chip. The plastic rod plays a role in supporting and fixing. Around the flexible circuit board 2 and the IC chip, it helps the IC chip resist a certain amount of pressure and prevents the IC chip from being damaged due to excessive force during the card pressing process. Preferably, the plastic rod uses existing plastic materials.

[0047] As Figure 3As shown in the figure, a plurality of grooves 711 are arranged at intervals along the length direction of the engineering plastic rod or engineering plastic strip, and the plurality of grooves 711 are arranged along the stress direction of the card twisting or bending. The grooves 711 penetrate the plastic rod along the width direction of the engineering plastic rod or engineering plastic strip. The grooves 711 can bend with the whole card, avoiding the problem of breaking through the surface protection printing layer when bending due to different materials.

[0048] As a specific embodiment of the present invention, the engineering plastic rod or engineering plastic strip is in the shape of a flat long strip, and the bottom shape of the groove 711 formed on the plastic rod can be rectangular, arc-shaped, diamond-shaped, etc. The bottom shape of the groove 711 is not limited here, as long as it can prevent the surface of the card from being broken through during the process of the card twisting or bending, so as to protect the printing layer on the surface of the card.

[0049] Preferably, the first support 71 is made of PC or PET material. The material of the first support 71 is not limited here, and other materials can also be used.

[0050] As Figure 1 and 4 shown in the figure, the granular bodies are spherical particles. The spherical particles are made of thermosetting materials. A plurality of the spherical particles are fixed in the gaps between the electronic components by epoxy resin liquid glue. During the heating and pressing process, they are not easy to deform, so they can be fixed in some relatively small spaces and support the space, avoiding damage to the electronic components caused by excessive pressing force, improving the yield rate in the production process of smart cards, reducing the failure rate of the card electronic components caused by pressure during the hot pressing process, and thus reducing costs.

[0051] As a specific embodiment of the present invention, the upper surface and the lower surface of the second support 72 are flat planes, and the side surface is an arc surface.

[0052] As other specific embodiments of the present invention, the second support 72 is in the shape of an ellipsoidal particle, a flat spherical particle, etc. The specific shape of the second support 72 is not limited here, and those skilled in the art can set it according to needs.

[0053] As other specific embodiments of the present invention, a plurality of spherical particles are mixed in the epoxy resin liquid glue and evenly applied around the flexible circuit board 2 and / or the IC chip. The epoxy resin glue is fully applied around the flexible circuit board 2. A roller is used to roll on the surface step by step repeatedly to squeeze out the excess epoxy resin glue, and the epoxy resin glue is cured by UV (ultraviolet) light.

[0054] The present application provides a new lamination method. During the card lamination process, some brackets with a hardness higher than that of the border 6 are added. The strength of the brackets is higher than that of the material of the border 6. It can be materials with higher strength such as PC and PET, or particles made of thermosetting resin. The particles are mixed in the epoxy resin liquid glue used for encapsulation and fixation, and are evenly applied around the flexible circuit board 2 by hand or with a glue gun to form brackets.

[0055] As other specific embodiments of the present utility model, a plurality of spherical particulate second support members 72 are arranged along the width direction or the length direction of the intermediate layer 1 and are evenly disposed around the flexible circuit board 2 and / or the IC chip. The second support members 72 bear pressure during the hot lamination process of the smart card, reduce the pressure borne by the electronic components in the smart card, and prevent the electronic components in the smart card from being damaged due to excessive pressure. Furthermore, the yield rate in the smart card production process is improved, the failure rate of the card electronic components caused by pressure during the hot lamination process is reduced, and thus the cost is reduced. The beneficial effects achieved by the present application are as follows:

[0056] (1) The present application improves the yield rate in the smart card production process, reduces the failure rate of the card electronic components caused by pressure during the hot lamination process, and thus reduces the cost.

[0057] (2) On the basis that the flexible engineering plastic PVC border bears pressure, a plastic bracket with stronger rigidity is added around the FPC (flexible circuit board). The plastic bracket can withstand a part of the external pressure, strengthen the force borne by the border during the curing process, and improve the resistance of the product during the lamination process.

[0058] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality of" means two or more, unless otherwise specifically defined.

[0059] In the description of the present application, the term "for example" is used to mean "serving as an example, illustration, or explanation". Any embodiment described as "for example" in the present application is not necessarily to be construed as more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use the present utility model. In the following description, details are set forth for purposes of explanation. It should be understood that those of ordinary skill in the art can recognize that the present utility model can be implemented without the use of these specific details. In other instances, well-known structures and processes are not elaborated in detail so as not to obscure the description of the present utility model with unnecessary details. Therefore, the present utility model is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed in the present application.

[0060] The above description is only for the embodiments of the present utility model and is not intended to limit the present utility model. For those skilled in the art, various modifications and variations can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the scope of the claims of the present utility model.

Claims

1. An intelligent card using a cold pressing process, the intelligent card comprising: The first sheet, the intermediate layer, and the second sheet from top to bottom, characterized in that the intermediate layer comprises: A frame, which is formed by opening an installation hole in the middle of a PVC sheet, and a printing film is adhered to one side corresponding to the installation hole of the frame to form an installation groove; At least one electronic component, which is arranged in the installation groove, and the maximum thickness of the electronic component is less than or equal to the thickness of the frame. The electronic component includes one or more of a flexible circuit board, a battery, a screen, a button module, and an IC chip; A plurality of support members, which are installed between adjacent electronic components, and the thickness of the support member is equal to the thickness of the frame. The support member includes a first support member and / or a second support member, and the surface of the first support member has a groove to make it flexible; The second support member is a granular body.

2. The smart card of the cold pressing process according to claim 1, wherein, The first support member is rod-shaped or strip-shaped.

3. The smart card of the cold pressing process according to claim 1, characterized in that, The material of the second support member is a thermosetting resin material.

4. The smart card of the cold pressing process according to claim 1, characterized in that, The rigidity of the first support member is greater than that of the frame. The first support member is an engineering plastic rod or an engineering plastic strip, and a plurality of grooves are opened on the surface of the engineering plastic strip or the engineering plastic rod.

5. The smart card of the cold pressing process according to claim 4, characterized in that, The plurality of grooves are spaced apart along the length direction of the engineering plastic rod or the engineering plastic strip, and the plurality of grooves are arranged along the stress direction of the card twisting or bending.

6. The smart card of the cold pressing process according to any one of claims 1-5, characterized in that, The first support member is made of PC or PET material.

7. The smart card of the cold pressing process according to claim 1, characterized in that, The second support member is a spherical particle.

8. The smart card of the cold pressing process according to claim 7, characterized in that, The plurality of spherical particles are fixed in the gap between the electronic components by an epoxy resin liquid glue.

9. The smart card of the cold pressing process according to claim 8, characterized in that, The plurality of spherical particles are arranged along the width direction or the length direction of the intermediate layer and are uniformly arranged around the flexible circuit board and / or the IC chip.

10. The smart card of the cold pressing process according to claim 1, characterized in that, The first sheet and the second sheet are respectively adhered to the upper and lower surfaces of the intermediate layer by cold-pressing glue.

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