Conveying device
By using the correction belt assembly in the silicon wafer conveying device for vertical correction, the problems of silicon wafer offset and pollution are solved, ensuring the cleaning of the silicon wafer and the smooth progress of subsequent processes.
Patent Information
- Application Number
- CN202421678965.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-07-16
AI Technical Summary
The existing silicon wafer conveying devices are prone to cause silicon wafer offset or contamination during the correction process, affecting the normal progress of subsequent processes.
The corrective belt assembly is adopted, including the corrective belt, the corrective frame and the support. The silicon wafer is corrected in the vertical direction through the corrective belt to avoid contact with hard or lubricating oil, and keep the silicon wafer clean.
Effectively correct the position of the silicon wafer to avoid contamination, and ensure the quality of the silicon wafer and the normal progress of subsequent processes.
Smart Images
Figure CN223066136U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of battery production and manufacturing, and in particular to a conveying device. Background Art
[0002] In the production process of silicon wafers, a conveying device is required to transport the silicon wafers to the basket. During the transportation of silicon wafers, the conveying device may cause the silicon wafers to shift due to jitter. After the silicon wafers shift, they cannot smoothly enter the basket. Therefore, a correction component needs to be set to correct the position of the silicon wafers to eliminate the shift so that the silicon wafers can be smoothly transported to the basket.
[0003] In the prior art, a correction wheel equipped with a bearing is usually used to correct the position of the silicon wafer. However, the lubricating oil in the bearing may seep onto the surface of the correction wheel, thereby contaminating the silicon wafer. Utility Model Content
[0004] The present application discloses a conveying device, which can correct the position of a silicon wafer while avoiding contamination of the silicon wafer.
[0005] In order to achieve the above objectives, the present application discloses a conveying device, comprising:
[0006] Conveyor rack;
[0007] A conveyor belt, which is disposed on the conveyor frame and is used to convey the silicon wafer along a first direction; and
[0008] Two groups of correction components are arranged on both sides of the conveyor frame along the second direction, each group of the correction components includes a correction belt, the belt surfaces of the correction belts of the two groups of the correction components are opposite to each other in the second direction, and the correction belts extend along the first direction to correct the silicon wafer when the silicon wafer passes between the two correction belts, and the second direction is perpendicular to the first direction.
[0009] Optionally, the correction component further comprises:
[0010] Orthotics; and
[0011] Two support members, both of which are arranged on the correction frame and spaced apart along the first direction, and the correction belt is sleeved on the two support members.
[0012] Optionally, the distance between the two support members is greater than the size of the silicon wafer.
[0013] Optionally, the correction assembly further includes two limit members, which are respectively arranged at one end of the two support members away from the correction frame to prevent the correction belt from falling off along the end of the support member away from the correction frame.
[0014] Optionally, one edge of the correction belt abuts against the limiting member, and the other edge abuts against the correction frame.
[0015] Optionally, the support member is cylindrical in shape, and the support member extends in a third direction perpendicular to the first direction and perpendicular to the second direction.
[0016] Optionally, the support member is fixedly arranged on the correction frame.
[0017] Optionally, the correction assembly further includes a screw, and the screw fixes the correction belt to the support member.
[0018] Optionally, the support member is rotatably arranged on the correction frame.
[0019] Optionally, the conveying device further includes a driving member, and the driving member is connected to the correction assembly to drive the correction assembly to move in the second direction.
[0020] Compared with the prior art, the beneficial effects of the present application are as follows:
[0021] The conveying device provided by the present application corrects the silicon wafer through the correction belts on both sides of the conveying frame, does not cause pollution such as oil stains to the silicon wafer, keeps the silicon wafer clean, and avoids affecting subsequent processes. Description of the Drawings
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0023] Figure 1 is a schematic structural diagram of the conveying device provided by the embodiment of the present application;
[0024] Figure 2 is a schematic structural diagram of the first embodiment of the correction assembly provided by the present application;
[0025] Figure 3 is Figure 2 the enlarged view of part A in
[0026] Figure 4 is a schematic structural diagram of the second embodiment of the correction assembly provided by the present application;
[0027] Figure 5 is Figure 4 the enlarged view of part B in
[0028] Main Reference Numerals Description
[0029] 1 - Conveying device;
[0030] 11 - Conveying frame;
[0031] 12 - Conveyor belt;
[0032] 13 - Rectifying assembly; 131 - Rectifying belt; 1311 - Belt surface; 132 - Rectifying frame; 133 - Support member; 134 - Limiting member. Detailed implementation manner
[0033] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
[0034] In the present application, the terms "installed", "set", "provided with", "connected", and "connected to" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is internal communication between two devices, components, or parts. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0035] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, components, or parts (the specific types and structures may be the same or different), and do not indicate or imply the relative importance and quantity of the indicated devices, components, or parts. Unless otherwise specified, the meaning of "a plurality" is two or more.
[0036] During the production process of silicon wafers, a conveying device is required to convey the silicon wafers to a receiving member, such as a flower basket or the like. The conveying devices in the prior art usually use a conveyor belt to convey silicon wafers. However, during the conveying process of the conveyor belt, the position of the silicon wafers may shift due to vibration. If there is no correction component for correction, the silicon wafers may not accurately enter the receiving space of the receiving member. To improve this problem, some conveying devices in the prior art usually set hard correction clips on both sides of the conveyor belt to correct the silicon wafers. However, since the texture of the correction clips is relatively hard, the silicon wafers may be cracked when contacting the correction clips, making the silicon wafers may become hidden cracked wafers (i.e., silicon wafers with cracks in some relatively hidden positions) or fragmented wafers (i.e., wafers with notches), etc. To improve this problem, some conveying devices in the prior art usually set correction wheels (where the correction wheels can be made of soft materials such as rubber) on both sides of the conveyor belt to correct the silicon wafers. However, since the correction wheels are coated with lubricating oil, the lubricating oil may contact the silicon wafers, thereby contaminating the silicon wafers. If the contaminated silicon wafers enter the liquid medicine tank in the subsequent process, it will cause the liquid medicine in the liquid medicine tank to be contaminated, thereby possibly causing greater losses. Based on this, the embodiments of the present application disclose a conveying device to solve the above problems. The technical solutions of the present application will be further described below in conjunction with specific embodiments and drawings.
[0037] Please refer to Figure 1 and Figure 2 , the present application discloses a conveying device 1, including a conveying frame 11, a conveyor belt 12, and two sets of correction components 13. The conveyor belt 12 is arranged on the conveying frame 11 and is used to convey silicon wafers in a first direction. The two sets of correction components 13 are arranged on both sides of the conveying frame 11 along a second direction. Each set of correction components 13 includes a correction belt 131. The belt surfaces 1311 of the correction belts 131 of the two sets of correction components 13 face each other in the second direction. The correction belt 131 extends along the first direction (such as Figure 1 the X direction in Figure 1 ) to correct the silicon wafers when the silicon wafers pass between the two correction belts 131. The second direction (such as the Y direction in ) is perpendicular to the first direction.
[0038] Among them, the silicon wafers are placed on the side of the conveyor belt 12 away from the conveying frame 11 and are conveyed by the conveyor belt 12 in the first direction to a receiving member with teeth, such as a flower basket or the like. Therefore, the position of the silicon wafers is particularly important.
[0039] The correction belt 131 can be made of rubber or other elastic materials, which is not limited herein.
[0040] The belt surface 1311 of the correction belt 131 refers to the plane determined by the length direction and width direction of the correction belt 131. That is to say, the belt surface 1311 of the correction belt 131 is perpendicular to the thickness direction of the correction belt 131. In this embodiment, the correction belt 131 extends along the first direction. That is to say, the length direction of the correction belt 131 is parallel to the first direction. At the same time, the thickness direction of the correction belt 131 is parallel to the second direction. That is to say, the belt surface 1311 of the correction belt 131 is perpendicular to the second direction.
[0041] In addition, the belt surfaces 1311 of the correction belts 131 of the two groups of correction components 13 are arranged opposite to each other in the second direction, and the distance between the two belt surfaces 1311 of the two correction belts 131 is approximately the same as the size of the silicon wafer in the second direction, so as to achieve the purpose of correcting the silicon wafer.
[0042] In this embodiment, when the conveyor belt 12 conveys the silicon wafer with a position offset through the correction area formed between the belt surfaces 1311 of the two correction belts 131, the silicon wafer with a position offset contacts the belt surfaces 1311 of the two correction belts 131 and is gradually corrected to a non-offset position.
[0043] Correcting the silicon wafer by the correction belt 131 will not cause pollution such as oil stains to the silicon wafer, keep the silicon wafer clean, and avoid affecting the subsequent processes.
[0044] Please refer to Figure 2 , in some embodiments, the correction component 13 further includes a correction frame 132 and two support members 133. The two support members 133 are both arranged on the correction frame 132 and are spaced along the first direction. The correction belt 131 is sleeved on the two support members 133.
[0045] It can be understood that, in order to ensure the service life of the correction frame 132, the correction frame 132 can be made of a material with a relatively high hardness such as steel or iron, which is not limited here.
[0046] Similarly, in order to ensure the stiffness of the support member 133, the support member 133 can also be made of a material with a relatively high hardness such as steel or iron, which is not limited here.
[0047] In this embodiment, in a set of correction components 13, two support members 133 are arranged at intervals in the first direction. The correction belt 131 is sleeved on the two support members 133, so that the correction belt 131 is tightened, and the correction belt 131 extends in the first direction, ensuring that the correction belt 131 can maintain a stable tension and shape during the transportation of the silicon wafer, avoiding the situation that the correction effect is affected due to relaxation or deformation, and enabling the silicon wafer to receive a more stable and uniform correction force when passing through the correction belt 131, improving the accuracy and reliability of the correction. At the same time, the axis of the support member 133 is perpendicular to the first direction and perpendicular to the second direction. When the correction belt 131 is tightened, the belt surface 1311 of the correction belt 131 can be perpendicular to the second direction. Even if the correction belt 131 deviates along the axis of the support member 133, the belt surface 1311 of the correction belt 131 still has the correction function due to being perpendicular to the second direction.
[0048] In some other embodiments, the correction component 13 may further include a plurality of support members 133 arranged in the first direction.
[0049] In some embodiments, the distance between the two support members 133 is greater than the size of the silicon wafer.
[0050] Wherein, the distance between the two support members 133 refers to the distance between the two support members 133 of a set of correction components 13 in the first direction.
[0051] In this embodiment, the distance between the two support members 133 is greater than the size of the silicon wafer, so that the silicon wafer will not directly contact the support member 133 when passing through the correction area between the two correction belts 131, avoiding the risk of surface damage or scratches on the silicon wafer caused by factors such as uneven surface or acute angles of the support member 133, and protecting the quality and integrity of the silicon wafer.
[0052] In addition, the distance between the two support members 133 in a set of correction components 13 is relatively large, enabling the conveying device 1 to correct silicon wafers with larger sizes, making the conveying device 1 have stronger adaptability, capable of correcting silicon wafers of various different sizes, and improving the versatility and flexibility of the device.
[0053] In addition, the spacing between the support members 133 is relatively large, so that the size of the correction space formed between the two corrections in the first direction is relatively large, and the silicon wafer can receive a more uniform correction force when passing through the correction space, improving the consistency of the silicon wafer.
[0054] In some other embodiments, the distance between the two support members 133 is equal to the size of the silicon wafer.
[0055] Please refer to Figure 2 and Figure 3In some more specific embodiments, the correction component 13 also includes two limit members 134, which are respectively arranged at one end of the two support members 133 away from the correction frame 132 to prevent the correction belt 131 from falling off along the end of the support member 133 away from the correction frame 132.
[0056] It is understandable that, since the conveyor belt 12 vibrates during the process of conveying silicon wafers, the conveying device 1 vibrates, thereby causing the correction assembly 13 to vibrate. The correction belt 131 may gradually deviate along the axial direction of the support member 133 during the long-term vibration, and eventually detach from the support member 133 from the end of the support member 133 that is away from the correction frame 132. In order to solve this problem, in this embodiment, a stopper 134 is provided at the end of the support member 133 that is away from the correction frame 132. Even if the correction belt 131 may deviate along the axial direction of the support member 133 toward the end of the support member 133 that is away from the correction frame 132 until it abuts against the stopper 134, the stopper 134 prevents the correction belt 131 from continuing to deviate and falling off from the end of the support member 133 that is away from the correction frame 132.
[0057] In some other more specific embodiments, the limiting member 134 may also be disposed on the side of the supporting member 133 .
[0058] Please also read Figure 4 and Figure 5 In some embodiments, one side edge of the correction belt 131 abuts against the limiting member 134 , and the other side edge abuts against the correction frame 132 .
[0059] It is understandable that if the width of the belt surface 1311 of the correction belt 131 is smaller than the axial dimension of the support member 133, then when the correction belt 131 is offset to abut against the stopper 134, the height of the edge of the correction belt 131 close to the correction frame 132 may be higher than the height of the silicon wafer, and when the silicon wafer is transported to the correction space, there may be a situation where there is no contact with the belt surface 1311 of the correction belt 131. In order to solve this problem, in the embodiment of the present application, one edge of the correction belt 131 can abut against the stopper 134, and the other edge can abut against the correction frame 132, that is, the correction belt 131 completely covers the side of the support member 133, so that the correction belt 131 will not move along the axial direction of the support frame during transportation, and ensure that the silicon wafer can contact with the belt surface 1311 of the correction belt 131, thereby ensuring that the silicon wafer can obtain a stable and consistent correction effect when passing through the correction belt 131.
[0060] In addition, the correction belt 131 will not move along the axial direction of the support member 133, which reduces the frequency of relative movement between the correction belt 131 and the support member 133, thereby reducing the friction loss of the correction belt 131 and extending the service life of the correction belt 131.
[0061] In some other embodiments, one edge of the correction belt 131 can abut against the limiting member 134, and a gap can be formed between the other edge and the correction frame 132.
[0062] Please refer to Figure 2 , in some more specific embodiments, the support member 133 is cylindrical in shape, and the support member 133 extends along the third direction (such as Figure 2 the Z direction in
[0063] In this embodiment, the support member 133 is cylindrical in shape, that is to say, the side surface of the support member 133 is a cylindrical surface. Since the correction belt 131 contacts the side surface of the support member 133, the cylindrical side surface can ensure that the contact area between the correction belt 131 and the support member 133 is small, but the acting force exerted by the support member 133 on the correction belt 131 is more evenly distributed, which helps to reduce the frictional wear between the support member 133 and the correction belt 131, extend the service life of the correction belt 131, and also helps to ensure that the correction belt 131 maintains a stable tension and shape during the transportation of the silicon wafer, so as to improve the correction effect of the correction belt 131 on the silicon wafer.
[0064] In some other more specific embodiments, the support member 133 can also be polygonal columnar in shape.
[0065] In some embodiments, the support member 133 is fixedly arranged on the correction frame 132.
[0066] In this embodiment, the support member 133 is fixedly arranged on the correction frame 132, so that the correction belt 131 can be more firmly supported, thereby ensuring that the correction belt 131 maintains a stable tension and shape during the transportation of the silicon wafer, so as to provide a more stable and reliable correction effect and improve the accuracy of correction.
[0067] In some more specific embodiments, the correction assembly 13 further includes a screw (not shown in the figure), and the screw fixes the correction belt 131 to the support member 133.
[0068] In the case where the support member 133 is fixedly arranged on the correction frame 132, in this embodiment, the correction belt 131 is fixed to the support member 133, ensuring that the correction belt 131 can provide a more stable correction force during transportation, preventing the correction belt 131 from generating large displacements or deformations when subjected to the pressure and frictional force when the silicon wafer passes through, so as to ensure that the silicon wafer can obtain a stable and uniform correction effect. At the same time, fixing the correction belt 131 to the support member 133 enhances the structural stability, can reduce the vibration and shaking of the correction belt 131 when correcting the silicon wafer, ensure that the correction belt 131 maintains a stable position and shape, and further improve the accuracy and reliability of correction.
[0069] In some other more specific embodiments, the correction belt 131 can also be tightened only on the support member 133.
[0070] In some embodiments, the support member 133 is rotatably arranged on the correction frame 132.
[0071] It can be understood that when the correction belt 131 corrects the silicon wafer, the silicon wafer will apply a frictional force in the first direction to the correction belt 131. When the correction belt 131 is stationary, a sliding friction is formed between the silicon wafer and the correction belt 131, which may cause relatively large wear of the silicon wafer. To solve this problem, in the embodiments of the present application, the support member 133 is rotatably arranged on the correction frame 132. Since the support member 133 can rotate, when the silicon wafer contacts the correction belt 131, the rotation of the support member 133 can reduce the friction between the silicon wafer and the correction belt 131, thereby reducing the wear of the silicon wafer and the correction belt 131, protecting the integrity of the silicon wafer, and extending the service life of the correction belt 131. In addition, reducing the friction between the silicon wafer and the correction belt 131 also helps to improve the conveying efficiency of the conveyor belt 12 and reduce the energy loss caused by friction.
[0072] In some embodiments, the conveying device 1 further includes a driving member (not shown in the figure), and the driving member is connected to the correction assembly 13 to drive the correction assembly 13 to move in the second direction.
[0073] In this embodiment, the driving member is connected to the correction assembly 13 and can drive the correction assembly 13 to move in the second direction. In other words, the driving member can drive the two correction assemblies 13 to move closer to or away from each other in the second direction to adjust the distance between the belt surfaces 1311 of the two correction belts 131, so as to correct silicon wafers of different sizes.
[0074] Exemplarily, when the size of the silicon wafer is relatively large, the driving member drives the two correction assemblies 13 to move away from each other in the second direction until the distance between the belt surfaces 1311 of the two correction belts 131 matches the silicon wafer; when the size of the silicon wafer is relatively small, the driving member drives the two correction assemblies 13 to move closer to each other in the second direction until the distance between the belt surfaces 1311 of the two correction belts 131 matches the silicon wafer.
[0075] In some other embodiments, the correction assembly 13 can also be fixedly arranged on both sides of the conveying frame 11.
[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A conveying device, characterized in that, include: Conveyor rack; A conveyor belt, which is disposed on the conveyor frame and is used to convey the silicon wafer along a first direction; and Two groups of correction components are arranged on both sides of the conveyor frame along the second direction, each group of the correction components includes a correction belt, the belt surfaces of the correction belts of the two groups of the correction components are opposite to each other in the second direction, and the correction belts extend along the first direction to correct the silicon wafer when the silicon wafer passes between the two correction belts, and the second direction is perpendicular to the first direction.
2. The conveying device according to claim 1, wherein, The correction assembly also includes: Orthotics; and Two support members, both of which are arranged on the correction frame and spaced apart along the first direction, and the correction belt is sleeved on the two support members.
3. The conveying device according to claim 2, characterized in that, The distance between the two support members is greater than the size of the silicon wafer.
4. The conveying device according to claim 2, wherein The correction assembly also includes two limiting members, which are respectively arranged at one end of the two support members away from the correction frame to prevent the correction belt from falling off along the end of the support member away from the correction frame.
5. The conveying device according to claim 4, characterized in that, One side edge of the correction belt abuts against the limiting component, and the other side edge abuts against the correction frame.
6. The conveying device according to any one of claims 2-5, characterized in that, The support member is cylindrical in shape and extends along a third direction, wherein the third direction is perpendicular to the first direction and perpendicular to the second direction.
7. The conveying device according to claim 6, characterized in that The support member is fixedly arranged on the correction frame.
8. The conveying device according to claim 7, wherein The correction assembly also includes a screw, which fixes the correction band to the support member.
9. The conveying device according to claim 6, characterized in that, The support member is rotatably arranged on the correction frame.
10. The conveying device according to any one of claims 1-5, characterized in that, The conveying device also includes a driving member, which is connected to the correction component to drive the correction component to move along the second direction.