High-precision alignment structure of DAM packaging substrate and processing device of high-precision alignment structure
By designing specific mark graphics and positioning holes on the DAM package substrate, and using optical alignment devices and coaxial punching technology, the problem of insufficient alignment accuracy is solved, high-precision alignment is achieved, and the market competitiveness of the product is enhanced.
Patent Information
- Application Number
- CN202422000387.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-08-16
AI Technical Summary
The alignment accuracy of existing DAM packaging substrates is insufficient and cannot meet the high-precision design requirements, resulting in easy collision between the chip and the DAM cavity when bonding the chip and the substrate, affecting product development and market competition.
采用高精度对位结构设计,包括基板和框板上的特定mark图形和定位孔,结合光学对位装置和同轴冲孔技术,实现框板与基板的高精度对位,减少对位误差。
The alignment accuracy is improved, from ±100μm to within ±50μm, reducing the frame plate offset problem and enhancing the competitiveness of the product.
Smart Images
Figure CN223066161U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a high-precision alignment structure and a processing device thereof for a DAM packaging substrate. Background Art
[0002] Currently, in the fields of millimeter-wave radar (MMW Radar), CIS (Camera), etc. in the market, DAM (frame board) design structures are required. The chip area corresponding to the DAM needs to be hollowed out. Due to substrate size, chip size, and front-end process factors, in order to obtain the space for bonding between the chip and the substrate after the chip is placed, higher requirements are put forward for the alignment accuracy between the DAM and the substrate.
[0003] Currently, the alignment method between the DAM and the substrate is to use the riveting holes on the upper edge of the DAM and the riveting holes on the substrate 0 for pin penetration for alignment, which is a relatively rough physical alignment method. However, the limit ability of this physical riveting method is ±100μm, and the accuracy cannot meet the high-precision design requirements. When the chip (the first solder joint) is placed and bonded to the substrate 10 Bondfinger (the second solder joint), the problem of the bonding tool colliding with the inner cavity of the DAM easily occurs, which is not conducive to the development of such projects and market competition. Summary of the Utility Model
[0004] Based on this, in view of the deficiencies in the prior art, it is necessary to provide a high-precision alignment structure and a processing device thereof for a DAM packaging substrate.
[0005] A high-precision alignment structure for a DAM packaging substrate includes a substrate, an adhesive sheet, a frame board, and pins. The frame board is pressed on the substrate, the adhesive sheet is arranged between the substrate and the frame board, and the pins penetrate through the substrate and the frame board at the same time. A pressing surface is provided on the substrate, and a plurality of substrate marks are provided on the pressing surface. The substrate marks are alignment rings. A DAM-mark corresponding to each substrate mark is provided on the frame board. The DAM-mark includes a hollowed-out area, a central plate, and two connecting ribs. The central plate is arranged in the middle of the hollowed-out area. One end of the connecting rib is connected to the central plate, and the other end is connected to the inner side surface of the hollowed-out area. The two connecting ribs are symmetrically arranged. The alignment ring is located between the central plate and the hollowed-out area. In addition, positioning holes are provided on both the substrate and the frame board, and the positioning holes of the two are in one-to-one correspondence and coaxially arranged.
[0006] Further, the alignment ring is circular, the central plate is circular, and the inner diameter of the alignment ring is larger than the outer diameter of the central plate.
[0007] Further, the diameter of the central plate is more than 2 times smaller than the outer diameter of the alignment ring.
[0008] Further, the hollowed-out area is square-shaped, and its minimum width is greater than the outer diameter of the alignment ring.
[0009] Further, the hollowed-out area is square-shaped, and the length of each side is more than 100 μm larger than the outer diameter of the alignment ring of the substrate.
[0010] Further, four positioning holes are provided on each plate. These positioning holes are arranged at the edge positions of the plate and are located at the corner positions of the plate.
[0011] A processing device for a high-precision alignment structure of a DAM packaging substrate, which is used to process a high-precision alignment structure of a DAM packaging substrate; it includes a pattern making device, a hole forming device, an alignment device, a punching device, and a lamination device arranged in sequence. The pattern making device respectively makes the substrate mark pattern and the DAM-mark pattern. The hole forming device hollows out the hollowed-out area on the DAM-mark pattern of the frame. The alignment device includes a frame, a workbench, an optical alignment device, and a suction cup device. The workbench is arranged on the frame, and the optical alignment device is arranged above the workbench. The alignment device includes a frame and a workbench, an optical alignment device, and a suction cup device arranged on the frame. The optical alignment device is arranged above the workbench, and the suction cup device is arranged above the workbench and can move up and down, left and right, and front and back. The punching thickness of the punching device is the sum of the thicknesses of the substrate and the frame board.
[0012] Further, the punching device is arranged on the frame of the alignment position.
[0013] Further, it further includes an edge sealing device.
[0014] Further, it further includes an alarm device, and the alarm device is connected to the optical alignment device.
[0015] In summary, the present utility model is designed for the alignment accuracy of the frame board and the substrate. It changes the traditional separate drilling and physical riveting alignment methods to a one-time coaxial punching and optical alignment processing method, reduces the alignment error, realizes the high-precision alignment of the frame board and the substrate, reduces the problem of frame board offset, improves the offset accuracy from the original ±100 μm to within ±50 μm, and improves the product competitiveness. The present utility model has strong practicability and has strong promotion significance. Description of the Drawings
[0016] Figure 1 It is a schematic structural diagram of a high-precision alignment and lamination packaging carrier board of the present utility model;
[0017] Figure 2 It is Figure 1 a schematic structural diagram of the substrate 10 in
[0018] Figure 3For Figure 1 Schematic diagram of the structure of the middle frame plate;
[0019] Figure 4 Schematic diagram of the processing flow of the alignment system. Specific implementation manners
[0020] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.
[0021] As Figures 1 to 3 shown, it is a high-precision alignment structure of a DAM packaging substrate provided by the present utility model. The high-precision alignment structure of a DAM packaging substrate includes a substrate 10, an adhesive sheet (not shown in the figure), a frame plate 20 and pins 30. The frame plate 20 is pressed on the substrate 10. The adhesive sheet is arranged between the substrate 10 and the frame plate 20. The pins 30 pass through the substrate 10 and the frame plate 20 at the same time to fix the two.
[0022] A pressing surface is arranged on the substrate 10. A plurality of substrate marks are arranged on the pressing surface. In this embodiment, the substrate marks are alignment rings 11. There are four alignment rings 11, which are respectively located at the four corner positions of the substrate 10. The alignment ring 11 is arranged in a circular ring shape. In addition, positioning holes 12 are also arranged on the substrate 10. The positioning holes 12 are arranged at the corner positions outside the alignment ring.
[0023] DAM-marks corresponding to the substrate marks one by one are arranged on the frame plate 20. The DAM-mark includes a hollowed-out area 21, a central plate 22 and two connecting ribs 23. The central plate 22 is arranged in the middle of the hollowed-out area 21. One end of the connecting rib 23 is connected to the central plate 22, and the other end is connected to the inner side surface of the hollowed-out area 21. The two connecting ribs 23 are symmetrically arranged. In this embodiment, the hollowed-out area 21 is arranged in a square shape. There are four hollowed-out areas 21, and they are respectively arranged in one-to-one correspondence with the alignment rings 11 on the substrate 10. The central plate 22 is arranged in a circular shape, and its diameter is smaller than the inner diameter of the alignment ring 11 on the substrate 10. More preferably, the diameter of the central plate 22 is more than 2 times smaller than the outer diameter of the alignment ring 11, and the length and width dimensions inside the hollowed-out area 21 are larger than the outer diameter of the circular ring of the substrate 10. More specifically, the single side of the hollowed-out area 21 is more than 100 μm larger than the circular ring of the substrate 10. In addition, four positioning holes 24 are also arranged on the frame plate 20. The positioning holes 24 are arranged at the corner positions outside the DAM-mark.
[0024] After the frame plate 20 is pressed onto the substrate 10, the alignment ring 11 of the substrate 10 is located between the central plate 22 and the hollowed-out area 21. More preferably, there is a gap between the alignment ring 11 and both the central plate 22 and the hollowed-out area 21.
[0025] As Figure 4 shown, the present invention provides a processing device for a high-precision alignment structure of a DAM package substrate; the processing device for a high-precision alignment structure of a DAM package substrate includes a substrate mark. In this embodiment, the graphics manufacturing device is an etching device, which is used to etch a substrate mark pattern and a DAM-mark alignment pattern on the pressing surfaces of the substrate 10 and the frame plate 20 respectively. Among them, the alignment pattern of the substrate 10 is an alignment ring 11, which is arranged in a circular ring shape. The alignment pattern of the frame plate 20 is the shape of the hollowed-out area 21.
[0026] The hole forming device is used to mill out the hollowed-out area 21 outside the central plate 22 on the frame plate 20. In this embodiment, the hole forming device can be a milling machine. The alignment device includes a frame and a workbench, an optical alignment device, and a chuck device arranged on the frame. The optical alignment device is arranged above the workbench, and the chuck device is arranged above the workbench and can move up and down, left and right, and back and forth.
[0027] During operation, first place the substrate 10 on the workbench. The optical alignment device grabs the information of the substrate-mark on the substrate 10, such as the graphic position, size and other information; and compares this information with the standard information. If the comparison fails, it means that the substrate 10 is a defective product, a signal alarm is issued and the product is taken out of the workbench. If the comparison passes, the center positions of the four alignment rings 11 of the substrate 10 grabbed by the optical alignment device are used as the reference. Then, use the chuck device to move the frame plate 20 above the substrate 10, translate the frame plate 20 until the DAM-mark and the substrate 10mark are in the same position, and then grab the center of the DAM-mark and the center of the substrate 10mark for matching. After the position is matched, place and bond them. Then, seal and fix the plate after alignment and bonding to avoid displacement.
[0028] The punching device performs punching processing on the aligned substrate and frame plate. The punching device can punch out the positioning holes 12 and the positioning holes 24 in one go, and can ensure that the upper and lower positioning holes are coaxial. In this embodiment, the punching device is arranged on the frame and is directly above the positioning seat.
[0029] In summary, the present utility model is designed for the alignment accuracy between the frame plate 20 and the substrate 10. It changes the traditional method of separately drilling and physically riveting for alignment to a one-time coaxial punching and optical alignment processing method, reducing the alignment error and achieving a high-precision alignment method between the frame plate 20 and the substrate 10. It reduces the problem of the frame plate 20 offset, improving the offset accuracy from the original ±100μm to within ±50μm, and enhancing the product competitiveness. The present utility model has strong practicability and has great significance for popularization.
[0030] The above-described embodiments merely represent one implementation mode of the present utility model, and the description thereof is relatively specific and detailed. However, it should not be construed as a limitation on the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model shall be subject to the appended claims.
Claims
1. A high-precision alignment structure for a DAM encapsulation substrate, characterized in that It includes a substrate, an adhesive sheet, a frame board and pins. The frame board is laminated on the substrate. The adhesive sheet is disposed between the substrate and the frame board. The pins penetrate through both the substrate and the frame board at the same time. There is a lamination surface on the substrate, and several substrate marks are arranged on the lamination surface. The substrate marks are alignment rings. There are DAM-marks corresponding to the substrate marks one by one on the frame board. The DAM-mark includes a hollowed-out area, a central board and two connecting ribs. The central board is arranged in the middle of the hollowed-out area. One end of the connecting rib is connected to the central board, and the other end is connected to the inner side surface of the hollowed-out area. The two connecting ribs are symmetrically arranged. The alignment ring is located between the central board and the hollowed-out area. In addition, positioning holes are arranged on both the substrate and the frame board, and the positioning holes of the two are in one-to-one correspondence and coaxially arranged.
2. The high-precision alignment structure of a DAM package substrate according to claim 1, wherein: The alignment ring is arranged in a circular shape, and the central board is arranged in a circular shape. The inner diameter of the alignment ring is larger than the outer diameter of the central board.
3. The high-precision alignment structure of a DAM encapsulation substrate according to claim 2, characterized in that: The diameter of the central board is more than 2 times smaller than the outer diameter of the alignment ring.
4. The high-precision alignment structure of a DAM packaging substrate according to claim 2, characterized in that: The hollowed-out area is arranged in a square shape, and its minimum width is larger than the outer diameter of the alignment ring.
5. The high-precision alignment structure of a DAM package substrate as described in claim 4, characterized in that: The hollowed-out area is arranged in a square shape, and its side length is more than 100 μm larger than the outer diameter of the alignment ring of the substrate.
6. The high-precision alignment structure of a DAM packaging substrate according to claim 1, characterized in that: Four positioning holes are arranged on each board. The positioning holes are arranged at the edge positions of the board and at the corner positions of the board.
7. A processing device for a high-precision alignment structure of a DAM packaging substrate, characterized in that: A high-precision alignment structure for processing a DAM packaging substrate as described in any one of claims 1 to 6. It includes a pattern making device, a hole forming device, an alignment device, a punching device and a lamination device arranged in sequence. The pattern making device respectively makes the substrate mark pattern and the DAM-mark pattern. The hole forming device hollows out the hollowed-out area on the DAM-mark pattern of the frame body. The alignment device includes a frame, a workbench, an optical alignment device and a chuck device. The workbench is arranged on the frame, and the optical alignment device is arranged above the workbench. The alignment device includes a frame and a workbench, an optical alignment device and a chuck device arranged on the frame. The optical alignment device is arranged above the workbench. The chuck device is arranged above the workbench and moves up and down, left and right, and front and back. The punching thickness of the punching device is the sum of the thicknesses of the substrate and the frame board.
8. The processing device for the high-precision alignment structure of a DAM packaging substrate according to claim 7, wherein: The punching device is arranged on the frame of the alignment position.
9. The processing device for the high-precision alignment structure of a DAM packaging substrate according to claim 7, characterized in that: It further includes an edge sealing device.
10. The processing device for the high-precision alignment structure of a DAM packaging substrate according to claim 7, characterized in that: It further includes an alarm device, and the alarm device is connected to the optical alignment device.