Multi-channel heat dissipation base based on integrated circuit chip
By designing a multi-channel heat dissipation base, using aluminum alloy plates to absorb heat and combined with a water pump fan system, the thermal stress problem in the integrated circuit chip caused by mismatch in the expansion coefficient is solved, and efficient cooling is achieved and chip damage is prevented.
Patent Information
- Application Number
- CN202421967666.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-08-14
AI Technical Summary
In integrated circuit chips, due to the mismatch of the thermal expansion coefficient of the material, thermal stress accumulation may lead to chip cracks or failure.
A multi-channel heat dissipation base is designed, including base assembly, heat absorption assembly and heat removal assembly. It uses aluminum alloy plate to absorb heat, transports cooling water to multiple channels through a small water pump, and air-cooling is combined with an electric fan to achieve heat dissipation and conversion.
It effectively prevents the accumulation of thermal stress, ensures that the chip is not damaged by thermal stress during continuous operation, and improves the reliability and stability of the system.
Smart Images
Figure CN223066163U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of bases, in particular to a multi-channel heat dissipation base based on an integrated circuit chip. Background Technique
[0002] The multi-channel heat dissipation base of an integrated circuit chip is an efficient heat dissipation technology. It realizes the thermal management of a high-density integrated micro-system by integrating multiple micro-scale channels in the chip substrate. These micro-channels are in direct contact with the chip, and by using the forced convection of the cooling medium in the channels, the heat generated by the chip is quickly taken away to achieve the purpose of efficient heat dissipation.
[0003] When the system is working, the generated heat will cause material expansion. If the thermal expansion coefficients of various materials in the system do not match, this expansion difference will generate thermal stress at the material interface. Especially in the packaging structure using materials with high thermal expansion coefficients such as copper and materials with low thermal expansion coefficients such as silicon, this difference will generate relatively large thermal stress under the action of thermal load, resulting in chip cracks or even complete failure. Therefore, in view of the above problems, a multi-channel heat dissipation base based on an integrated circuit chip is proposed. Content of the Utility Model
[0004] The purpose of the utility model is to provide a multi-channel heat dissipation base based on an integrated circuit chip to solve the problem that if the thermal expansion coefficients of various materials in the system do not match, this expansion difference will generate thermal stress at the material interface. Especially in the packaging structure using materials with high thermal expansion coefficients such as copper and materials with low thermal expansion coefficients such as silicon, this difference will generate relatively large thermal stress under the action of thermal load, resulting in chip cracks or even complete failure.
[0005] To achieve the above purpose, the utility model provides the following technical solutions:
[0006] Multi-channel heat dissipation base based on an integrated circuit chip, comprising a circuit chip body and a base component. The bottom end of the circuit chip body is fixedly connected to the base component by bolts. The top end of the base component is fixedly connected to a heat absorption component. The inner side of the lower end of the base component is fixedly connected to a heat removal component. One side of the lower end of the base component is fixedly connected to an electric fan. The base component includes a base plate. Wind holes are formed inside the base plate. A water inlet groove is formed inside the base plate. Multiple channels are formed inside the base plate. A water inlet is formed inside the base plate. An installation groove is formed inside the lower end of the water inlet. The heat absorption component includes an aluminum alloy plate. First water flow holes are formed inside the inner side of the rear end of the aluminum alloy plate. A heat exchange channel is formed inside the aluminum alloy plate. Second water flow holes are formed inside the inner side of the front end of the aluminum alloy plate. The heat removal component includes a small water pump. The water inlet of the small water pump is fixedly connected to a first multi-way pipe. One side of the first multi-way pipe is fixedly connected to an aluminum alloy pipe. Inner hole support plates are fixedly connected to the outside of the aluminum alloy pipe. The rear end of the aluminum alloy pipe is fixedly connected to a second multi-way pipe. The rear end of the second multi-way pipe is fixedly connected to a short pipe.
[0007] As a further optimized content of the present utility model, wherein: the top end of the base plate is fixedly connected to the bottom end of the circuit chip body, the top end of the base plate is fixedly connected to the bottom end of the aluminum alloy plate, the aluminum alloy plate is fixed above the wind holes, and a gap is provided between the bottom end of the circuit chip body and the top end of the base plate.
[0008] As a further optimized content of the present utility model, wherein: the wind holes are formed through the inside of the base plate, the wind holes are communicated with the installation groove formed in the base plate, and the wind holes are located between the aluminum alloy plates.
[0009] As a further optimized content of the present utility model, wherein: the water inlet grooves are formed in the inner sides of the front end and the rear end of the base plate, the water inlet grooves penetrate through the upper end of the base plate, the front water inlet groove is internally communicated with the second water flow holes, the rear water inlet groove is communicated with the first water flow holes, and the top end of the electric fan is fixedly connected to the upper end of the installation groove formed in the base plate.
[0010] As a further optimized content of the present utility model, wherein: the water inlet grooves are communicated with the multiple channels, the multiple channels are communicated with the water inlets, the number of the multiple channels corresponds to the number of the water inlets one by one, the water inlets are communicated with the water outlet of the small water pump, the aluminum alloy plate is located at the bottom end of the circuit chip body, the first water flow holes are communicated with the heat exchange channels, and the heat exchange channels are communicated with the second water flow holes.
[0011] As a further optimized content of the present utility model, wherein: the water outlet of the small water pump is communicated with the first multi-way pipe, and the inner sides of the first multi-way pipe, the second multi-way pipe, the short pipe and the aluminum alloy pipe are all hollow, and the inner sides of the first multi-way pipe, the inner side of the aluminum alloy pipe, the inner side of the second multi-way pipe and the inner side of the short pipe are communicated with each other.
[0012] As a further optimized content of the present utility model, wherein: the outer side of the inner hole support plate is fixedly connected to the inner side of the placement groove opened on the base plate, the inner side of the inner hole support plate is provided with mounting holes, the number of the inner hole support plates is two, and the inner hole support plates are fixedly connected to the outer sides of the front end and the rear end of the aluminum alloy pipe.
[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0014] In the present utility model, through the arranged base component, heat absorption component and heat removal component, the device not only realizes the efficient cooling of the chip body of the chip circuit, but also prevents the accumulation of thermal stress caused by the mismatch of the thermal expansion coefficients of materials by dispersing and converting heat;
[0015] Specifically, after the heat is absorbed by the aluminum alloy plate, the small water pump is used to deliver cooling water to the water inlet and the multi-channel, and then the heat is dispersed into multiple water inlet groove micro-channels. By utilizing the high specific heat capacity of water, the heat is taken away from the aluminum alloy plate. At the same time, the cooling water at the rear end flows through the first water flow hole, the water inlet groove at the rear end and the multi-channel, and finally converges to the short pipe, realizing the collection and recycling of hot water. In addition, the aluminum alloy pipe and aluminum alloy components absorb and transfer heat during the water flow process, and cooperate with the external air cooling system started by the electric fan, further enhancing the heat dissipation effect. This comprehensive heat dissipation solution ensures that the chip body of the chip circuit will not cause cracks or failures due to thermal stress during continuous operation, improving the reliability and stability of the system. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the overall structure of the present utility model;
[0017] Figure 2 It is a schematic diagram of the structure of the base plate of the present utility model;
[0018] Figure 3 It is a schematic diagram of the structure of the heat absorption component of the present utility model;
[0019] Figure 4 It is a schematic diagram of the structure of the heat removal component of the present utility model;
[0020] Figure 5 It is a schematic diagram of the structure of the multi-channel of the present utility model;
[0021] Figure 6 It is of the present utility model Figure 5 Schematic diagram of the structure at position A.
[0022] In the figure: 1. Circuit chip body;
[0023] 2. Base component; 21. Base plate; 22. Air hole; 23. Water inlet groove; 24. Multi-channel; 25. Water inlet; 26. Placement groove;
[0024] 3. Heat absorption component; 31. Aluminum alloy plate; 32. First water flow hole; 33. Heat exchange channel; 34. Second water flow hole;
[0025] 4. Heat removal component; 41. Small water pump; 42. First multi-pass pipeline; 43. Aluminum alloy pipeline; 44. Inner hole support plate; 45. Second multi-pass pipeline; 46. Short pipe;
[0026] 5. Electric fan. Specific embodiments
[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0028] It should be noted that the terms used here are only for describing specific embodiments, rather than intending to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form also intends to include the plural form. In addition, it should be understood that when the terms "include" and / or "comprise" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0029] Please refer to Figures 1-6 , the present invention provides a technical solution:
[0030] Multi-channel heat dissipation base based on an integrated circuit chip, comprising a circuit chip body 1 and a base component 2. The bottom end of the circuit chip body 1 is fixedly connected to the base component 2 by bolts. A heat absorption component 3 is fixedly connected to the top end of the base component 2. A heat removal component 4 is fixedly connected to the inner side of the lower end of the base component 2. An electric fan 5 is fixedly connected to one side of the lower end of the base component 2. The base component 2 includes a base plate 21. Wind holes 22 are formed in the inner side of the base plate 21. A water inlet groove 23 is formed in the inner side of the base plate 21. Multi-channels 24 are formed in the inner side of the base plate 21. A water inlet 25 is formed in the inner side of the base plate 21. An installation groove 26 is formed in the inner side of the lower end of the water inlet 25. The heat absorption component 3 includes an aluminum alloy plate 31. First water flow holes 32 are formed in the inner side of the rear end of the aluminum alloy plate 31. A heat exchange channel 33 is formed in the inner side of the aluminum alloy plate 31. Second water flow holes 34 are formed in the inner side of the front end of the aluminum alloy plate 31. The heat removal component 4 includes a small water pump 41. A first multi-way pipe 42 is fixedly connected to the water inlet of the small water pump 41. An aluminum alloy pipe 43 is fixedly connected to one side of the first multi-way pipe 42. Inner hole support plates 44 are fixedly connected to the outer side of the aluminum alloy pipe 43. A second multi-way pipe 45 is fixedly connected to the rear end of the aluminum alloy pipe 43. A short pipe 46 is fixedly connected to the rear end of the second multi-way pipe 45.
[0031] As a further implementation of this solution, the top end of the base plate 21 is fixedly connected to the bottom end of the circuit chip body 1, and the top end of the base plate 21 is fixedly connected to the bottom end of the aluminum alloy plate 31. The aluminum alloy plate 31 is fixed above the wind holes 22. A gap is provided between the bottom end of the circuit chip body 1 and the top end of the base plate 21 to facilitate the absorption of heat generated by the circuit chip body 1.
[0032] As a further implementation of this solution, the wind holes 22 are formed through the inner side of the base plate 21. The wind holes 22 are communicated with the installation groove 26 formed in the base plate 21. The wind holes 22 are located between the aluminum alloy plates 31, and do not prevent air from entering the interior of the installation groove 26 through the wind holes 22.
[0033] As a further implementation of this solution, the water inlet grooves 23 are opened on the inner sides of the front end and the rear end of the base plate 21. The water inlet grooves 23 penetrate through the upper end of the base plate 21. The front-end water inlet groove 23 is internally connected to the second water flow hole 34, and the rear-end water inlet groove 23 is connected to the first water flow hole 32. The top end of the electric fan 5 is fixedly connected to the upper end of the placement groove 26 opened on the base plate 21. The water inlet groove 23 is connected to the multi-channel 24, and the multi-channel 24 is connected to the water inlet 25. The number of the multi-channels 24 corresponds one-to-one to the number of the water inlets 25. The water inlet 25 is connected to the water outlet of the small water pump 41. The aluminum alloy plate 31 is located at the bottom end of the circuit chip body 1. The first water flow hole 32 is connected to the heat exchange channel 33, and the heat exchange channel 33 is connected to the second water flow hole 34. The small water pump 41 is used to transport the cooling water to the water inlet 25 and the multi-channel 24, and then it is dispersed into the micro-channels of the multiple water inlet grooves 23. By utilizing the characteristic of the high specific heat capacity of water, the heat is taken away from the aluminum alloy plate 31.
[0034] As a further implementation of this solution, the water outlet of the small water pump 41 is connected to the first multi-way pipe 42. The inner sides of the first multi-way pipe 42, the second multi-way pipe 45, the short pipe 46 and the aluminum alloy pipe 43 are all hollow. The inner sides of the first multi-way pipe 42, the aluminum alloy pipe 43, the second multi-way pipe 45 and the short pipe 46 are connected. The outer side of the inner hole support plate 44 is fixedly connected to the inner side of the placement groove 26 opened on the base plate 21. The inner side of the inner hole support plate 44 is provided with an installation hole. The number of the inner hole support plates 44 is two. The inner hole support plates 44 are fixedly connected to the outer sides of the front end and the rear end of the aluminum alloy pipe 43. The aluminum alloy component of the aluminum alloy pipe 43 absorbs and transfers heat during the water flow process. Cooperating with the external air cooling system started by the electric fan 5, the heat dissipation effect is further enhanced.
[0035] Workflow: To achieve efficient heat dissipation for the circuit chip body 1 and prevent damage to the circuit chip body 1 caused by thermal stress. When the circuit chip body 1 is running, it generates a certain amount of heat. The heat enters between the aluminum alloy plates 31 along with the hot air. The aluminum alloy plates 31 absorb the heat. The heat on the aluminum alloy plates 31 does not disappear. At this time, start the small water pump 41. The small water pump 41 conveys the water inside the first multi-pass pipe 42, and conveys it through the small water pump 41 into the inside of the water inlet 25, and enters the multi-channel 24 through the water inlet 25. The multi-channel 24 plays a role in dispersing the concentrated water. The water enters the inside of multiple water inlet grooves 23 from the multi-channel 24, flows upward from the water inlet grooves 23, enters the inside of the second water flow holes 34 opened at the front end of the aluminum alloy plate 31 from the water inlet grooves 23, and enters the inside of the heat exchange channel 33 from the second water flow holes 34. Under the action of specific heat capacity, the water converts the heat absorbed by the aluminum alloy plate 31. At this time, the effect of cooling the aluminum alloy plate 31 is achieved. In addition, the water enters the inside of the rear water inlet groove 23 from the first water flow hole 32, is concentrated into the rear multi-channel 24 from the rear water inlet groove 23, and enters the inside of the short pipe 46 from the multi-channel 24. The short pipe 46 plays a role in concentrating the hot water. It enters the inside of the second multi-pass pipe 45 from the short pipe 46. The second multi-pass pipe 45 plays a role in dispersing the hot water. It enters the inside of the aluminum alloy pipe 43 from the second multi-pass pipe 45 respectively. The aluminum alloy pipe 43 is made of aluminum alloy. When the water flows inside the aluminum alloy pipe 43, it transfers the heat to the aluminum alloy pipe 43. At the same time, start the electric fan 5. The external wind enters the placement groove 26 from the air holes 22 and blows towards the aluminum alloy pipe 43 from the placement groove 26, achieving the effect of dissipating heat from the aluminum alloy pipe 43. The device not only achieves efficient cooling of the circuit chip body 1, but also can cool the cooling medium, providing continuous cooling effect for the circuit chip body 1 to ensure that the circuit chip body 1 is not affected by thermal stress resulting in chip cracks or complete failure.
[0036] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A multi-channel heat dissipation base based on an integrated circuit chip, comprising a circuit chip body (1) and a base assembly (2), characterized in that: The bottom end of the circuit chip body (1) is fixedly connected to a base assembly (2) by means of bolts, the top end of the base assembly (2) is fixedly connected to a heat absorption assembly (3), the inner side of the lower end of the base assembly (2) is fixedly connected to a heat removal assembly (4), and one side of the lower end of the base assembly (2) is fixedly connected to an electric fan (5); The base assembly (2) comprises a base plate (21), an air hole (22) is provided on the inner side of the base plate (21), a water inlet groove (23) is provided on the inner side of the base plate (21), multiple channels (24) are provided on the inner side of the base plate (21), a water inlet (25) is provided on the inner side of the base plate (21), a placement groove (26) is provided on the inner side of the lower end of the water inlet (25), and the heat absorption assembly (3) comprises an aluminum alloy plate (31), a first water flow hole (32) is provided on the inner side of the rear end of the aluminum alloy plate (31), and a heat exchanger (26) is provided on the inner side of the aluminum alloy plate (31). The heat channel (33) is provided with a second water flow hole (34) on the inner side of the front end of the aluminum alloy plate (31), the heat removal component (4) comprises a small water pump (41), the water inlet of the small water pump (41) is fixedly connected to a first multi-way pipe (42), one side of the first multi-way pipe (42) is fixedly connected to an aluminum alloy pipe (43), the outer side of the aluminum alloy pipe (43) is fixedly connected to an inner hole support plate (44), the rear end of the aluminum alloy pipe (43) is fixedly connected to a second multi-way pipe (45), and the rear end of the second multi-way pipe (45) is fixedly connected to a short pipe (46).
2. The multi-channel heat dissipation base based on an integrated circuit chip according to claim 1, wherein: The top end of the base plate (21) is fixedly connected to the bottom end of the circuit chip body (1), the top end of the base plate (21) is fixedly connected to the bottom end of the aluminum alloy plate (31), the aluminum alloy plate (31) is fixed to the upper end of the air hole (22), and a spacing is provided between the bottom end of the circuit chip body (1) and the top end of the base plate (21).
3. The multi-channel heat dissipation base based on an integrated circuit chip according to claim 1, wherein: The air hole (22) is opened through the inner side of the base plate (21), the air hole (22) is communicated with a placement groove (26) opened in the base plate (21), and the air hole (22) is located between the aluminum alloy plates (31).
4. The multi-channel heat dissipation base based on an integrated circuit chip according to claim 1, wherein: The water inlet groove (23) is formed on the inner side of the front end and the inner side of the rear end of the base plate (21). The water inlet groove (23) passes through the upper end of the base plate (21). The front end of the water inlet groove (23) is connected to the inside of the second water flow hole (34), and the rear end of the water inlet groove (23) is connected to the first water flow hole (32). The top end of the electric fan (5) is fixedly connected to the upper end of the placement groove (26) formed on the base plate (21).
5. The multi-channel heat dissipation base based on an integrated circuit chip according to claim 1, wherein: The water inlet groove (23) is connected to the multi-channel (24), the multi-channel (24) is connected to the water inlet (25), the number of the multi-channel (24) corresponds to the number of the water inlet (25), the water inlet (25) is connected to the water outlet of the small water pump (41), the aluminum alloy plate (31) is located at the bottom end of the circuit chip body (1), the first water flow hole (32) is connected to the heat exchange channel (33), and the heat exchange channel (33) is connected to the second water flow hole (34).
6. The multi-channel heat dissipation base based on an integrated circuit chip according to claim 1, wherein: The water outlet of the small water pump (41) is communicated with the first multi-way pipe (42). The inner sides of the first multi-way pipe (42), the second multi-way pipe (45), the short pipe (46), and the aluminum alloy pipe (43) are all hollow, and the inner sides of the first multi-way pipe (42), the aluminum alloy pipe (43), the second multi-way pipe (45), and the short pipe (46) are communicated with each other.
7. The multi-channel heat dissipation base based on an integrated circuit chip according to claim 1, characterized in that: The outer side of the inner hole support plate (44) is fixedly connected to the inner side of the placement groove (26) opened on the base plate (21). An installation hole is opened on the inner side of the inner hole support plate (44). The number of the inner hole support plates (44) is two, and the inner hole support plates (44) are fixedly connected to the outer sides of the front end and the rear end of the aluminum alloy pipe (43).