Electronic component support and packaging product

Abstract

The utility model discloses an electronic component support and a packaging product. The electronic component support comprises a metal sheet assembly, an inner filling resin layer, a bottom resin layer and a top resin layer. The metal sheet assembly comprises a positive metal sheet and a negative metal sheet, and the side surfaces of the two metal sheets are provided with connecting rib sections. And the inner filling resin layer fills a gap between the positive electrode metal sheet and the negative electrode metal sheet. And the metal sheet assembly and the inner filling resin layer form an integral unit. The top resin layer comprises a barrel-shaped structure and protrusions which are integrally connected, and the protrusions are arranged on the outer edge of the bottom face of the barrel-shaped structure. The cylindrical structure wraps the outer edge of the top face of the whole unit, and the protrusions wrap the sections of the connecting ribs. The bottom resin layer is annularly arranged on the outer side of the overall unit in a sleeving mode, and the top face of the bottom resin layer is provided with containing grooves matched with the protrusions. And for the side surface of the whole unit, the part except the section of the connecting rib is coated by the inner side surface of the bottom resin layer. Compared with the prior art, the technical scheme of the utility model can improve the reliability of products.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to an electronic component bracket and a packaging product. Background Art

[0002] The structure of a packaging product before packaging can be called an electronic component bracket, which includes a positive metal sheet, a negative metal sheet, and resin. In the prior art, the processing technology of an electronic component bracket usually includes the following steps:

[0003] S1. After etching and electroplating a copper sheet, a lead frame is obtained. The lead frame includes a plurality of array units distributed in an array. Each array unit includes a positive metal sheet and a negative metal sheet, and the positive metal sheet and the negative metal sheet have the same thickness. The space between the positive metal sheet and the negative metal sheet in the same array unit is completely hollowed out. The positive metal sheets, the positive metal sheet and the negative metal sheet, and the negative metal sheets between adjacent two array units are all connected by connecting ribs, and the thickness of the connecting ribs is less than the thickness of the positive metal sheet and the negative metal sheet.

[0004] S2. Resin is formed on the lead frame, so that the resin not only completely fills the hollowed-out parts and grooves on the lead frame, but also forms a grid structure on the top surface of the lead frame, and the edges of the grid cover the connecting ribs.

[0005] S3. The connecting ribs and the middle part of the edges are simultaneously cut along the edges of the grid to obtain a plurality of electronic component brackets.

[0006] For the electronic component bracket processed by the above process, the ends of the connecting ribs can be seen on the cross-section, that is, the gaps between the connecting ribs and the resin are exposed. Light-sensitive or harmful substances are likely to invade through the gap between the lead frame and the resin, resulting in the discoloration of the lead frame coating or the deterioration and attenuation of the packaging material. Summary of the Utility Model

[0007] The purpose of the utility model is to provide an electronic component bracket and a packaging product to solve the problems existing in the above prior art and improve the reliability of the product.

[0008] To achieve the above purpose, the utility model provides the following scheme:

[0009] The utility model discloses an electronic component bracket, which includes a metal sheet assembly, an inner filling resin layer, a bottom resin layer, and a top resin layer; the inner filling resin layer is integrally connected with the bottom resin layer;

[0010] The metal sheet assembly includes at least one positive metal sheet and one negative metal sheet. Both the side surface of the positive metal sheet and the side surface of the negative metal sheet have connection rib cross-sections formed after removing the connection ribs. The inner filled resin layer fills the gap between the positive metal sheet and the negative metal sheet.

[0011] The overall structure composed of the metal sheet assembly and the inner filled resin layer is called the overall unit.

[0012] The top resin layer includes a cylindrical structure and a protrusion that are integrally connected. The protrusion is arranged at the outer edge of the bottom surface of the cylindrical structure. The cylindrical structure covers the outer edge of the top surface of the overall unit, and the protrusion covers the connection rib cross-section.

[0013] The bottom resin layer is annularly sleeved on the outside of the overall unit, and a receiving groove matching the protrusion is provided on the top surface of the bottom resin layer.

[0014] For the side surface of the overall unit, the part other than the connection rib cross-section is covered by the inner side surface of the bottom resin layer. The top resin layer covers the top surface of the bottom resin layer.

[0015] Preferably, the inner hole of the cylindrical structure is conical, and the smallest cross-sectional area end of the inner hole of the cylindrical structure is connected to the top surface of the overall unit.

[0016] Preferably, the electronic component support further includes an inner covering resin layer that covers the top surface of the inner filled resin layer.

[0017] Preferably, the top resin layer partially covers the top surfaces of the positive metal sheet and the negative metal sheet.

[0018] The present utility model also discloses a packaging product, which includes the above-mentioned electronic component support, and further includes a chip and a packaging layer. The chip is electrically connected to the positive metal sheet and the negative metal sheet respectively, and the packaging layer is used to package the chip. The chip and the packaging layer are both located inside the cylindrical structure.

[0019] Preferably, the chip is any one of an LED chip, a laser chip, and an IC chip.

[0020] The present utility model has achieved the following technical effects compared with the prior art:

[0021] Through the convex structure on the bottom surface of the top resin layer, the utility model fills the accommodation groove formed after removing the connecting ribs, and wraps the cross-section of the connecting ribs through the convex structure, achieving the effect that the cross-section of the connecting ribs is not exposed. Therefore, the utility model can completely wrap the side surface of the metal sheet assembly, avoiding the intrusion of light-sensitive or harmful substances through the gap between the connecting ribs and the resin, thereby improving the reliability of the electronic component bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0023] Figure 1 The side structure of the electronic component bracket obtained by the existing process;

[0024] Figure 2 The schematic diagram of the encapsulation product in the top view direction of the embodiment of the present utility model;

[0025] Figure 3 The schematic diagram of the encapsulation product in the side view direction of the embodiment of the present utility model;

[0026] Figure 4 The front view of the lead frame;

[0027] Figure 5 The side view of the lead frame.

[0028] In the figure: 1 - cross-section of the connecting rib; 2 - positive metal sheet; 3 - negative metal sheet; 4 - inner filling resin layer; 5 - bottom resin layer; 6 - inner covering resin layer; 7 - top resin layer; 8 - metal coating; 9 - chip; 10 - encapsulation layer; 11 - bonding wire; 12 - lead frame; 13 - array unit; 14 - connecting rib. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0030] Refer to Figure 2 、 Figure 3, this embodiment provides an electronic component bracket, which includes a metal sheet assembly, an inner filling resin layer 4, a bottom resin layer 5, and a top resin layer 7. The inner filling resin layer 4 is integrally connected to the bottom resin layer 5.

[0031] The metal sheet assembly includes at least one positive metal sheet 2 and one negative metal sheet 3. The sides of the positive metal sheet 2 and the negative metal sheet 3 both have a connecting rib cross-section 1 formed after removing the connecting rib 14. The inner filling resin layer 4 fills the gap between the positive metal sheet 2 and the negative metal sheet 3.

[0032] The overall structure formed by the metal sheet assembly and the inner filling resin layer 4 is called the overall unit.

[0033] The top resin layer 7 includes an integrally connected cylindrical structure and a protrusion. The protrusion is arranged on the outer edge of the bottom surface of the cylindrical structure. The cylindrical structure covers the outer edge of the top surface of the overall unit, and the protrusion covers the connecting rib cross-section 1.

[0034] The bottom resin layer 5 is annularly sleeved on the outside of the overall unit. The top surface of the bottom resin layer 5 is provided with a receiving groove matching the protrusion.

[0035] For the side surface of the overall unit, the part other than the connecting rib cross-section 1 is covered by the inner side surface of the bottom resin layer 5. The top resin layer 7 covers the top surface of the bottom resin layer 5.

[0036] The working principle of the electronic component bracket in this embodiment is as follows:

[0037] In the electronic component bracket in the prior art, referring to Figure 1 , the connecting rib cross-section 1 is exposed on the side surface of the electronic component bracket and is in direct contact with the outside air. As the resin ages and the metal on the surface of the connecting rib is corroded, the joint between the connecting rib 14 and the resin is likely to expand, and external impurities are also likely to invade through this joint.

[0038] In this embodiment, through the protrusion structure on the bottom surface of the top resin layer 7, the receiving groove formed after removing the connecting rib 14 is filled, and the connecting rib cross-section 1 is covered by this protrusion structure, achieving the effect that the connecting rib cross-section 1 is not exposed. Therefore, this embodiment can completely cover the side surface of the metal sheet assembly, avoiding the invasion of light-sensitive or harmful substances through the gap between the connecting rib 14 and the resin, thereby improving the reliability of the electronic component bracket.

[0039] As a possible example, in this embodiment, the top resin layer 7 partially covers the top surfaces of the positive metal sheet 2 and the negative metal sheet 3, and leaves an installation area for the chip 9.

[0040] As a possible example, in this embodiment, the inner hole of the cylindrical structure is conical, and the smallest cross-sectional area end of the inner hole of the cylindrical structure is connected to the top surface of the integral unit. The surface of the conical inner hole can play a role in reflecting light, so that after the light-emitting element is installed inside the cylindrical structure, more light is emitted to the side away from the metal sheet assembly, thereby improving the brightness.

[0041] In order to make the bonding property between the bottom resin layer 5 and the top resin layer 7 better, the two are preferably made of the same material.

[0042] As a possible example, in this embodiment, the electronic component bracket further includes an inner covering resin layer 6, and the inner covering resin layer 6 covers the top surface of the inner filling resin layer 4.

[0043] As a possible example, in this embodiment, the material of the metal sheet assembly is copper. According to different actual needs, those skilled in the art can also select other types of conductive metals, such as iron or other alloys (copper alloys, iron alloys).

[0044] This embodiment also provides a processing technology for an electronic component bracket for preparing the above-mentioned electronic component bracket, including the following steps:

[0045] S1. Refer to Figure 4 、 Figure 5 , etch the metal sheet to obtain a lead frame 12. The lead frame 12 includes a plurality of array units 13 distributed in an array. Each array unit 13 includes at least one positive metal sheet 2 and one negative metal sheet 3. In one array unit 13, the positive metal sheet 2 and the negative metal sheet 3 corresponding to the same electrical device (such as the chip 9 in the following text) are completely hollowed out (to avoid short circuit), and adjacent two array units 13 are connected by connecting ribs 14. The thickness of the connecting ribs 14 is less than the thickness of the array unit 13, and both ends of the connecting ribs 14 are connected to the bottom of the side surface of the array unit 13.

[0046] S2. Mold resin on the lead frame 12 so that the resin fills the hollow parts and grooves on the lead frame 12 to obtain a flat whole board.

[0047] S3. Remove all or the middle part of the connecting ribs 14 to disconnect the connection between adjacent two array units 13. At this time, adjacent two array units 13 are only connected by the resin filled in step S2. After removing the connecting ribs 14, a receiving groove is formed on the top surface of the flat whole board, and the cross-section 1 of the connecting ribs is located in the receiving groove.

[0048] S4. Mold resin on the structure obtained in step S3. The molded resin not only fills the receiving groove, but also forms a grid on the top surface of the structure obtained in step S3.

[0049] S5. Cut the middle part of the edge along the edge of the grid to obtain a plurality of independent electronic component brackets.

[0050] As a possible example, in this embodiment, in step S3, the way to remove the connecting rib 14 is cutting or etching.

[0051] As a possible example, in this embodiment, between step S1 and step S2, there is also a process of electroplating the lead frame 12.

[0052] As a possible example, in this embodiment, after step S5, there is also a process of electroplating the positive metal sheet 2 and the negative metal sheet 3.

[0053] Refer to Figure 2 、 Figure 3 , this embodiment also provides a packaged product, including the above-mentioned electronic component bracket, and further including a chip 9 and a packaging layer 10. The chip 9 is electrically connected to the positive metal sheet 2 and the negative metal sheet 3 respectively, and the packaging layer 10 is used to package the chip 9. The chip 9 and the packaging layer 10 are both located inside the cylindrical structure.

[0054] There are various ways of electrically connecting the chip 9, and those skilled in the art can select according to actual needs. When the chip 9 is in a horizontal direct mount or vertical structure, the chip 9 is electrically connected to the positive metal sheet 2 and the negative metal sheet 3 respectively by welding bonding wires 11. When the chip 9 is in a flip-chip structure, there is no need for welding bonding wires 11, and the positive electrode of the chip 9 is directly connected to the positive metal sheet 2, and the negative electrode of the chip 9 is directly connected to the negative metal sheet 3.

[0055] Since this packaged product includes the above-mentioned electronic component bracket, it also has the above-mentioned advantages of the above-mentioned electronic component bracket, which will not be elaborated here.

[0056] According to different actual needs, those skilled in the art can flexibly select the type of the chip 9. As a possible example, in this embodiment, the chip 9 is any one of an LED chip, a laser chip, and an IC chip.

[0057] As a possible example, in this embodiment, the material of the packaging layer 10 is any one of silicone, epoxy resin, silicon dioxide, and glass. According to different actual needs, other materials can also be mixed and added in the packaging layer 10. For example, the packaging layer 10 is also mixed with a light conversion material or a light diffusion material or a light reflection material. The above-mentioned mixed materials can specifically be at least one of phosphor powder, silicon dioxide particles, and titanium dioxide particles.

[0058] In this utility model, specific examples are used to elaborate on the principle and implementation mode of the utility model. The description of the above embodiments is only used to help understand the method and its core idea of the utility model; at the same time, for those of ordinary skill in the art, according to the idea of the utility model, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be construed as a limitation to the utility model.

Claims

1. An electronic component bracket, characterized in that, It includes a metal sheet assembly, an inner filled resin layer, a bottom resin layer and a top resin layer; the inner filled resin layer is integrally connected to the bottom resin layer; The metal sheet assembly includes at least one positive metal sheet and one negative metal sheet, and both the side surface of the positive metal sheet and the side surface of the negative metal sheet have connection rib cross-sections formed after removing the connection ribs; the inner filled resin layer fills the gap between the positive metal sheet and the negative metal sheet; The overall structure formed by the metal sheet assembly and the inner filled resin layer is called the overall unit; The top resin layer includes a cylindrical structure and a protrusion that are integrally connected, and the protrusion is arranged at the outer edge of the bottom surface of the cylindrical structure; the cylindrical structure covers the outer edge of the top surface of the overall unit, and the protrusion covers the connection rib cross-section; The bottom resin layer is annularly sleeved on the outside of the overall unit, and a receiving groove matching the protrusion is provided on the top surface of the bottom resin layer; For the side surface of the overall unit, the part other than the connection rib cross-section is covered by the inner side surface of the bottom resin layer; the top resin layer covers the top surface of the bottom resin layer.

2. The electronic component bracket according to claim 1, characterized in that: The inner hole of the cylindrical structure is conical, and the smallest cross-sectional area end of the inner hole of the cylindrical structure is connected to the top surface of the overall unit.

3. The electronic component bracket according to claim 1, wherein: The electronic component bracket further includes an inner covering resin layer, and the inner covering resin layer covers the top surface of the inner filled resin layer.

4. The electronic component bracket according to claim 1, wherein: The top resin layer partially covers the top surfaces of the positive metal sheet and the negative metal sheet.

5. An encapsulated product, characterized in that, It includes the electronic component bracket according to any one of claims 1 to 4, and further includes a chip and a packaging layer; the chip is electrically connected to the positive metal sheet and the negative metal sheet respectively, and the packaging layer is used to package the chip; the chip and the packaging layer are both located inside the cylindrical structure.

6. The encapsulated product according to claim 5, characterized in that: The chip is any one of an LED chip, a laser chip, and an IC chip.

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