Square wave-sine wave conversion module

Abstract

The embodiment of the utility model provides a square wave-sine wave conversion module, which relates to the technical field of circuit electronics, and specifically comprises a packaging shell, glass ceramics and a square wave-sine wave conversion circuit, and the glass ceramics and the square wave-sine wave conversion circuit are packaged and fixed in the packaging shell; the microcrystalline glass is fixed to the packaging shell through the adhesive film; the square wave-sine wave conversion circuit is fixed to the microcrystalline glass through a conductive adhesive; wherein the square wave-sine wave conversion circuit is integrated to the microcrystalline glass based on a thin film hybrid integrated circuit process. Therefore, the square wave-sine wave conversion circuit is integrally packaged through a thin film hybrid integrated circuit technology, and the square wave-sine wave conversion module with high integration level and miniaturization can be realized.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit electronics, in particular to a square wave-sine wave conversion module. Background Art

[0002] In recent years, microelectronics technology has been developing rapidly, and its importance in electronic equipment and daily industrial production has become increasingly important, and its scope of application has become increasingly wide. The function of the square wave-sine wave conversion circuit is to convert square wave signals into sine wave signals. It is mostly used in the isolation, collection and conversion of speed sensor signals, speed measurement and alarm, and signal distortion-free transmission and transmission.

[0003] At present, square wave-to-sine wave conversion circuits are mostly packaged using SMT plastic packaging technology, using molded plastics for packaging, resulting in defects such as low integration and large space occupation.

[0004] The industry has not yet proposed a better solution to the above problems. Utility Model Content

[0005] The utility model provides a square wave-sine wave conversion module, which is used to at least solve the problems of low integration and high distortion in the square wave-sine wave conversion circuit manufactured by SMT plastic packaging technology in the prior art.

[0006] Specifically, an embodiment of the utility model provides a square wave-to-sine wave conversion module, including a packaging shell, a microcrystalline glass and a square wave-to-sine wave conversion circuit, wherein the microcrystalline glass and the square wave-to-sine wave conversion circuit are packaged and fixed inside the packaging shell; the microcrystalline glass is fixed to the packaging shell by an adhesive film; the square wave-to-sine wave conversion circuit is fixed to the microcrystalline glass by a conductive adhesive; wherein the square wave-to-sine wave conversion circuit is integrated into the microcrystalline glass based on a thin-film hybrid integrated circuit process.

[0007] Optionally, the square wave-to-sine wave conversion module further includes: a shell lead, a first end of which is arranged outside the packaging shell, and a second end of which is arranged inside the packaging shell; a gold wire connected to the square wave-to-sine wave conversion circuit and the second end.

[0008] Optionally, the packaging shell is a metal shell, wherein the square wave-to-sine wave conversion module further includes: an insulating protection layer, which is arranged between the square wave-to-sine wave conversion circuit and the microcrystalline glass.

[0009] Optionally, the square wave-to-sine wave conversion circuit includes an operational amplifier chip, a frequency-to-voltage conversion chip, a chip-mounted resistor, and a chip-mounted capacitor.

[0010] Optionally, the square-wave to sine-wave conversion circuit includes: a square-wave shaping module connected to the signal input terminal for square-wave shaping of the signal input through the signal input terminal.

[0011] Optionally, the square-wave to sine-wave conversion circuit further includes: a sine-waveform conversion module connected to the output terminal of the waveform shaping module.

[0012] Optionally, the waveform conversion module includes a digital frequency divider device and a band-pass filter; wherein, the digital frequency divider device is connected to the output terminal of the waveform shaping module and is used for frequency division of the square-wave shaped signal; and, the band-pass filter is used for filtering the frequency-divided shaped signal.

[0013] Optionally, the square-wave to sine-wave conversion circuit further includes: a clutter filtering module connected to the output terminal of the waveform conversion module.

[0014] Optionally, the square-wave to sine-wave conversion circuit further includes: a feedback control module connected between the output terminal of the clutter filtering module and the input terminal of the waveform conversion module.

[0015] The beneficial effects of the embodiments of the present utility model are as follows:

[0016] By integrating the square-wave to sine-wave conversion circuit onto a small piece of glass-ceramics through thin-film hybrid integrated circuit technology, and then fixing the glass-ceramics to the inside of the packaging shell through an adhesive film, compared with using molded plastics in the SMT process, a square-wave to sine-wave conversion module with higher integration and more miniaturized design can be realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 Shows a schematic structural diagram of an example of a square-wave to sine-wave conversion module according to an embodiment of the present utility model;

[0019] Figure 2 Shows a schematic structural diagram of another example of a square-wave to sine-wave conversion module according to an embodiment of the present utility model;

[0020] Figure 3 Shows a schematic connection diagram of an example of a square-wave to sine-wave conversion circuit according to an embodiment of the present utility model;

[0021] Figure 4 The process flow diagram shows an example of manufacturing a square-wave to sine-wave conversion module based on thin-film hybrid integrated circuit technology according to an embodiment of the present invention. Detailed implementation manners

[0022] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0023] Unless otherwise defined, the technical terms or scientific terms used in the present invention shall have the ordinary meanings understood by those of ordinary skill in the art to which the present invention belongs. The "first", "second" and similar terms used in the present invention do not denote any order, quantity or importance, but are only used to distinguish different components. Similarly, the terms such as "a", "an" or "the" do not denote a quantity limitation, but mean that there is at least one. The terms such as "comprising" or "including" mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0024] It should be noted that the "upper", "lower", "left", "right", "front", "rear", etc. used in the present invention are only used to represent relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0025] It should be pointed out that in the current related technologies, the square-wave to sine-wave conversion circuit generally adopts the SMT plastic packaging process, resulting in defects such as poor assembly performance of discrete devices, low integration, low reliability, large volume, and low precision in the square-wave to sine-wave conversion circuit.

[0026] In view of this, Figure 1 The structural schematic diagram shows an example of a square-wave to sine-wave conversion module according to an embodiment of the present invention.

[0027] As Figure 1As shown in the figure, the square-wave to sine-wave conversion module 100 includes a packaging housing 110, a glass-ceramic 120, and a square-wave to sine-wave conversion circuit 130. The glass-ceramic 120 and the square-wave to sine-wave conversion circuit 130 are encapsulated and fixed inside the packaging housing 110. Specifically, the glass-ceramic 120 is fixed to the packaging housing 110 through an adhesive film 140, the square-wave to sine-wave conversion circuit 130 is fixed to the glass-ceramic 120 through a conductive adhesive 150, and the square-wave to sine-wave conversion circuit 130 is integrated onto the glass-ceramic based on thin-film hybrid integrated circuit technology.

[0028] Through the embodiment of the present utility model, by adopting thin-film hybrid integrated circuit technology, the square-wave to sine-wave conversion circuit is integrated on a small glass-ceramic substrate to achieve the conversion of square wave to sine wave, having the same functions as the square-wave to sine-wave conversion circuit of SMT plastic packaging technology. However, through the stacking of thin-film devices, a smaller device footprint can be achieved.

[0029] Figure 2 The structural schematic diagram of another example of the square-wave to sine-wave conversion module according to the embodiment of the present utility model is shown.

[0030] As Figure 2 As shown in the figure, by using the thin-film integrated circuit technology in hybrid integrated circuits, the devices are highly integrated to obtain a square-wave to sine-wave conversion module. The square-wave to sine-wave conversion module includes a packaging housing 201, a thin-film resistor 202, a housing lead 203, an adhesive film 204, a gold wire 205, a glass-ceramic 206, an integrated circuit chip 207, a chip-mounted resistor-capacitor 208, an insulating protective layer 209, and a conductive adhesive 210.

[0031] Specifically, the packaging housing 201 can adopt a metal housing. Through all-metal sealing, a wider temperature range can be achieved compared to plastic-packaged devices, with low temperature drift, high precision, and distortion far superior to similar products on the market.

[0032] The insulating protective layer 209 is disposed between the square-wave to sine-wave conversion circuit and the glass-ceramic 206.

[0033] The first end of the housing lead 203 is disposed outside the packaging housing 201, and its second end is disposed inside the packaging housing 201. In addition, the gold wire 202 is used to bridge the second end and the square-wave to sine-wave conversion circuit, for example, to connect to the integrated circuit chip 207 or other electronic components.

[0034] Through the embodiments of the present utility model, devices are highly integrated by using thin-film integrated circuit technology in hybrid integrated circuits. First, a conductive band, a resistor, and an insulating protective layer are coated on the glass-ceramics. The glass-ceramics are fixed on the package housing with an adhesive film. Then, an operational amplifier chip, a frequency-voltage conversion chip, chip-mounted resistors, and chip-mounted capacitors are integrated onto the glass-ceramics using conductive adhesive. Finally, each device is electrically connected to the housing using gold wire bonding technology, obtaining a high-integration square-wave to sine-wave conversion circuit.

[0035] Figure 3 FIG. 4 shows a structural connection diagram of an example of the square-wave to sine-wave conversion circuit according to the embodiments of the present utility model.

[0036] As Figure 3 shown, the square-wave to sine-wave conversion circuit includes a square-wave shaping module 310, a sine-waveform conversion module 320, a clutter filtering module 330, and a feedback control module 340.

[0037] Specifically, the square-wave shaping module 310 is connected to a signal input terminal (not shown) and is configured to perform square-wave shaping on the signal input from the signal input terminal. Here, the signal input terminal can be derived from various signal sources, such as sensors or switching devices, etc., and should not be limited herein.

[0038] Exemplarily, the output signal of the sensor should theoretically be a square-wave signal with a certain amplitude and a certain width. However, in actual applications, the output signal is often not a square wave and is often doped with many clutter waves such as sine waves and triangular waves. The square-wave shaping module 310 uses a frequency-voltage converter to form a waveform shaping circuit with a dual operational amplifier, converting the waveform output by the sensor into a relatively intact square wave.

[0039] The input terminal of the sine-waveform conversion module 320 is connected to the output terminal of the waveform shaping module to achieve waveform conversion of the square wave according to the sine-wave characteristics. In some embodiments, the waveform conversion module includes a digital frequency divider device and a band-pass filter. The digital frequency divider device is connected to the output terminal of the waveform shaping module and is configured to perform frequency division on the square-wave shaping signal, and the band-pass filter is configured to perform filtering processing on the frequency-divided shaping signal. Exemplarily, through the digital frequency divider device, the internal circuit can be adjusted to perform 2-4-6 frequency division, and the effective value of the output voltage is 5V-10V. Thus, a frequency-divisible square-wave to sine-wave conversion function is achieved.

[0040] The clutter filtering module 330 is connected to the output end of the sine wave conversion module 320 to perform clutter filtering on the waveform-converted signal. Thus, frequency division is performed by a digital frequency division device, waveform conversion is then performed by a band-pass filter, the influence of temperature on accuracy is reduced via the feedback control module, and finally clutter is filtered out by the output filter circuit, and the required sine wave signal is finally obtained.

[0041] Through the embodiments of the present utility model, by adopting the thin-film hybrid integrated circuit process, the waveform shaping module, the sine wave conversion module with digital frequency division function, and the feedback control module are integrated on a small piece of microcrystalline glass substrate to realize the conversion of frequency-divisible square wave / sine wave.

[0042] Figure 4 The process flow diagram showing an example of manufacturing a square wave-sine wave conversion module based on the thin-film hybrid integrated circuit process according to the embodiments of the present utility model is shown.

[0043] As Figure 4 shown, in step S410, a cleaning operation.

[0044] After all the component materials are prepared, since the square wave-sine wave conversion module uses microcrystalline glass as the substrate, the microcrystalline glass needs to be cleaned before production.

[0045] In step S420, a vacuum coating operation.

[0046] In some embodiments, coating is performed on the microcrystalline glass by using a vacuum magnetron sputtering table. This circuit uses nickel-chromium alloy as the resistor layer material, high-purity nickel, high-purity copper, and high-purity gold as the conductive layers, and silicon dioxide as the insulating protective layer.

[0047] Specifically, during operation, the sputtering table is first evacuated. When the vacuum degree reaches a certain level, argon gas is filled. After reaching the specified vacuum degree, sputtering of the nickel-chromium alloy material is first performed. The sputtering table uses the nickel-chromium alloy target as the cathode and the microcrystalline glass substrate as the anode. A certain voltage is applied to both of them. Under the action of the electric field force and the magnetic field force, the argon ions in the argon gas continuously bombard the surface of the target, and the nickel-chromium alloy ions splash out from the surface of the target and highly impact and precipitate on the surface of the substrate to form a nickel-chromium thin film. Similarly, the preparation of nickel, copper, and gold thin films is carried out. Finally, the preparation of the silicon dioxide thin film needs to be completed using a radio frequency power supply. Finally, a film-forming substrate with a bottom layer of nickel-chromium alloy, and successively upward of copper, nickel, gold, and silicon dioxide is obtained.

[0048] In step S430, a photolithography operation.

[0049] In some embodiments, a flood exposure process is adopted. A spin coater is used to uniformly coat a photoresist on a film-forming substrate. Then, the substrate is placed on an exposure machine, and a glass plate with a layout pattern is covered on it. The film-forming substrate coated with the photoresist is exposed, and the photoresist remains on the patterns that need to be retained, while there is no photoresist on the patterns that are not needed.

[0050] In step S440, a wet etching operation.

[0051] In some embodiments, chemical reagents are used on the film-forming substrate to perform wet etching on silicon dioxide, gold, nickel, copper, and nickel-chromium alloy respectively, etching away the unnecessary patterns and only leaving the useful patterns. Finally, deionized water is used for cleaning to obtain the final film-forming substrate.

[0052] In step S450, a chip bonding operation.

[0053] In some embodiments, the film-forming substrate is fixed inside a metal housing using an adhesive film and cured at a high temperature in a vacuum oven.

[0054] In step S460, a die bonding operation.

[0055] In some embodiments, discrete devices such as chips, chip capacitors, and chip resistors are bonded to the film-forming substrate using a conductive adhesive, and then reduced at a high temperature in a vacuum oven.

[0056] In step S470, a wire bonding operation.

[0057] In some embodiments, a wire bonding machine is used to electrically connect the bonding pads of the chip, the pins of the metal housing, and the conductive strips on the ceramic substrate.

[0058] In step S480, a capping operation.

[0059] In some embodiments, a vacuum capping machine is used to apply a voltage to the metal housing and the metal cover using a parallel seam welding process, causing the sealing part to melt and bond at a high temperature, and encapsulating the metal housing and the metal cover into one body.

[0060] Further, after completing the encapsulation of the above-mentioned integrated square-wave - sine-wave conversion module, an identification can be printed on the outside of the metal housing, and then the finished product quality inspection of the product can be carried out.

[0061] In the embodiment of the present utility model, an operational amplifier chip, a flip-flop chip, a diode chip, a voltage regulator tube, chip resistors, and chip capacitors are integrated onto a small piece of microcrystalline glass through thin-film hybrid integrated circuit technology, and then the microcrystalline glass is integrated into the housing. On the premise of realizing the function of the frequency-divisible square-wave - sine-wave conversion circuit, it has a device volume much smaller than that of the frequency-divisible square-wave - sine-wave conversion circuit determined by the SMT process and plastic encapsulation process.

[0062] Through the embodiments of the present utility model, the waveform shaping circuit, digital frequency division circuit, waveform conversion circuit, feedback control circuit and filtering output circuit are integrated by using the thin film hybrid integrated circuit process, achieving a high degree of integration of multiple devices and a small volume occupation, with high precision and a wide range of applications. In addition, the square wave-sine wave conversion module adopts a fully metal seal, has high reliability and a wide operating temperature range, realizes low temperature drift and high-precision signal output, and has the advantages of practical functions, strong automation, high integration and cost savings, and can also effectively improve production efficiency.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model and are not intended to limit them; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. A square wave - sine wave conversion module, characterized in that It includes a packaging housing, a glass-ceramics, and a square-wave to sine-wave conversion circuit. The glass-ceramics and the square-wave to sine-wave conversion circuit are encapsulated and fixed inside the packaging housing; The glass-ceramics is fixed to the packaging housing through an adhesive film; The square-wave to sine-wave conversion circuit is fixed to the glass-ceramics through a conductive adhesive. Among them, the square-wave to sine-wave conversion circuit is integrated onto the glass-ceramics based on a thin-film hybrid integrated circuit process.

2. The square wave - sine wave conversion module according to claim 1, wherein The square-wave to sine-wave conversion module further includes: A housing lead, with its first end disposed outside the packaging housing and its second end disposed inside the packaging housing; A gold wire, connected to the square-wave to sine-wave conversion circuit and the second end.

3. The square-wave to sine-wave conversion module according to claim 1 or 2, characterized in that The packaging housing is a metal housing. Among them, the square-wave to sine-wave conversion module further includes: An insulating protective layer, disposed between the square-wave to sine-wave conversion circuit and the glass-ceramics.

4. The square-wave to sine-wave conversion module according to claim 1, wherein The square-wave to sine-wave conversion circuit includes an operational amplifier chip, a frequency-to-voltage conversion chip, chip-mounted resistors, and chip-mounted capacitors.

5. The square wave - sine wave conversion module according to claim 1 or 4, characterized in that, The square-wave to sine-wave conversion circuit includes: A square-wave shaping module, connected to a signal input terminal, and configured to perform square-wave shaping on the signal input from the signal input terminal.

6. The square wave-sine wave conversion module according to claim 5, characterized in that, The square-wave to sine-wave conversion circuit further includes: A sine-waveform conversion module, connected to the output terminal of the square-wave shaping module.

7. The square-wave to sine-wave conversion module according to claim 6, wherein The sine-waveform conversion module includes a digital frequency divider device and a band-pass filter; Among them, the digital frequency divider device is connected to the output terminal of the square-wave shaping module and is configured to divide the frequency of the square-wave shaped signal; and the band-pass filter is configured to perform filtering processing on the frequency-divided shaped signal.

8. The square wave - sine wave conversion module according to claim 6, wherein The square-wave to sine-wave conversion circuit further includes: A clutter filtering module, connected to the output terminal of the sine-waveform conversion module.

9. The square-wave to sine-wave conversion module according to claim 8, wherein The square-wave to sine-wave conversion circuit further includes: A feedback control module, connected between the output terminal of the clutter filtering module and the input terminal of the sine-waveform conversion module.

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