Novel double-interface intelligent card module carrier tape structure

Abstract

The utility model discloses a novel double-interface intelligent card module carrier tape structure, which comprises a contact surface metal layer and a polymer fiber layer which are connected with each other, and the polymer fiber layer is used as a packaging surface and is provided with a packaging area I and a packaging area II corresponding to a block A and a block B on a double-interface intelligent card module respectively. The first packaging area and the second packaging area are each punched with a groove and at least one bonding wire hole with the contact face metal layer as the bottom, and a conductive paste layer is printed in each groove. According to the utility model, the contact surface metal layer is fully utilized to conduct the internal and external antenna welding spots of the dual-interface card module; a copper foil layer for conducting an antenna welding spot is not used any more, so that environmental pollution and resource waste caused by etching a large amount of copper are avoided; by printing the conductive paste layer, internal and external antenna welding spots can be quickly attached and filled on the polymer fiber layer; the unused and undistributed metal areas of the contact surface are fully utilized, so that the metal areas are not communicated with other pins any more, and the function of conducting an antenna bonding pad is achieved.

Description

Technical Field

[0001] The utility model relates to a novel dual-interface smart card module carrier tape structure, belonging to the technical field of chip packaging. Background Art

[0002] As Figure 1 shown, the carrier tape of the traditional dual-interface smart card module is a three-layer structure, including a metal layer on the contact surface, a middle polymer fiber layer, and a welding layer for antenna connection.

[0003] The pad for connecting the card base antenna, the metal line of the connection solder joint, and the antenna solder joint are all made of a whole metal copper foil etched and bonded on the fiber layer. The antenna solder joint on the chip is connected to the solder joint on the carrier tape through a bonding wire, and then connected to the pad for connecting the card base antenna through the etched metal wire to complete the conduction of the circuit. The conduction of the antenna is completed through the antenna metal layer on the encapsulation surface of the carrier tape.

[0004] Normally, the contacts of a 6-pin dual-interface smart card have 9 blocks, at least 6 of which are independent and not connected. For example, Figure 2 pin1 to pin6 in

[0005] Blocks A, B, and C are generally connected to pin5 and have no actual function. The encapsulation surface of block C is to arrange the position of the chip. Therefore, blocks A and B can be separated from pin5 and used as a carrier for connecting the antenna. Summary of the Utility Model

[0006] The technical problem to be solved by the utility model is how to reduce the material cost of the carrier tape of the dual-interface module.

[0007] To solve the above technical problem, the utility model provides a novel dual-interface smart card module carrier tape structure.

[0008] A novel dual-interface smart card module carrier tape structure includes a connected contact surface metal layer and polymer fiber layer. The polymer fiber layer, as the encapsulation surface, is respectively provided with an encapsulation area 1 and an encapsulation area 2 corresponding to block A and block B on the dual-interface smart card module. Grooves and at least one bonding wire hole corresponding to the contact pin on the dual-interface smart card module are punched on the encapsulation area 1 and the encapsulation area 2 with the contact surface metal layer as the bottom. A conductive paste layer is printed in the groove.

[0009] Preferably, both the first encapsulation area and the second encapsulation area are independently arranged and not connected to other contact pins on the dual-interface smart card module.

[0010] Preferably, there is one wire bonding hole in each of the first encapsulation area and the second encapsulation area, corresponding to the dual-interface smart card module with antenna solder joints arranged on different sides.

[0011] Preferably, the first encapsulation area and the second encapsulation area cover block A, block B and area C on the dual-interface smart card module, and there are two wire bonding holes in each of the first encapsulation area and the second encapsulation area, corresponding to the dual-interface smart card module with antenna solder joints located on one side.

[0012] Preferably, the groove is a rectangular slot.

[0013] A novel dual-interface smart card module carrier tape structure provided by the present utility model has the following advantages:

[0014] When the present utility model is in use, the contact surface metal layer is fully utilized to conduct the internal and external antenna solder joints of the dual-interface card module; the copper foil layer for conducting the antenna solder joints is no longer used, eliminating environmental pollution and resource waste caused by etching a large amount of copper; by printing the conductive paste, it can quickly adhere to and fill the internal and external antenna solder joints on the polymer fiber layer; the unused and unallocated metal areas on the contact surface are fully utilized, making them no longer connected to other pins and undertaking the function of conducting the antenna pads, and having no influence on the shape and function of other pins at the same time. Description of the Drawings

[0015] Figure 1 is a schematic structural diagram of the carrier tape of the dual-interface smart card module in the prior art;

[0016] Figure 2 is a pin distribution diagram of the contact surface of the existing 6-pin smart card module;

[0017] Figure 3 is a schematic structural diagram of the present utility model without the printed conductive paste layer;

[0018] Figure 4 is a detailed view of the encapsulation area of the present utility model;

[0019] Figure 5 is a schematic cross-sectional view of the encapsulation area of the present utility model;

[0020] Figure 6 is a schematic structural diagram of the present utility model after printing the conductive paste layer

[0021] Figure 7 is a schematic cross-sectional view of the encapsulation area of the present utility model after printing the conductive paste layer;

[0022] Figure 8 This is a schematic diagram of the contact surface and the encapsulation surface after printing the conductive paste layer in the first embodiment of the present utility model;

[0023] Figure 9 This is a schematic diagram of the contact surface and the encapsulation surface after printing the conductive paste layer in the second embodiment of the present utility model;

[0024] In the figure:

[0025] 1 - Contact surface metal layer; 2 - Polymer fiber layer; 21 - Encapsulation area one; 22 - Encapsulation area two; 3 - Groove; 4 - Wire bonding hole; 5 - Conductive paste layer. Specific implementation manners

[0026] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] Embodiment 1

[0028] Referring to Figures 3 - 8 , a novel double - interface smart card module carrier tape structure includes a connected contact surface metal layer 1 and a polymer fiber layer 2. The polymer fiber layer 2, as the encapsulation surface, is respectively provided with an encapsulation area one 21 and an encapsulation area two 22 corresponding to block A and block B on the double - interface smart card module. Grooves 3 and at least one wire bonding hole 4 corresponding to the contact pin feet on the double - interface smart card module are punched on the encapsulation area one 21 and the encapsulation area two 22 with the contact surface metal layer 1 as the bottom. A conductive paste layer 5 is printed in the grooves 3. In a feasible embodiment, the groove 3 can be of any shape. In this embodiment, the groove 3 is preferably a rectangular slot.

[0029] Furthermore, the encapsulation area one 21 and the encapsulation area one 21 are independently set and not connected to other contact pin feet on the double - interface smart card module.

[0030] Furthermore, there is one wire bonding hole 4 in each of the encapsulation area one 21 and the encapsulation area two 22. Corresponding to the double - interface smart card module with antenna solder joints arranged on both sides, when welding, there are two wire bonds connected to the wire bonding holes 4 of the carrier tape, and they are respectively located on two sides of the chip on the chip.

[0031] Embodiment 2

[0032] Referring to Figure 9, the difference between this embodiment and the first embodiment is that the encapsulation area one 21 and the encapsulation area two 22 cover the blocks A, B and the area C on the dual-interface smart card module. Two wire bonding holes 4 are respectively formed in the encapsulation area one 21 and the encapsulation area two 22, corresponding to the dual-interface smart card module with the antenna solder joints arranged on one side, which solves the problem of connecting the carrier tape wire bonding holes 4 with the antenna solder joints arranged on one side of the chip. By means of a metal area that is not connected to one of the contact surfaces and other pin feet, the metal wire bonding and the conductive paste are connected, and the conduction between the chip solder joints and the external antenna is completed, realizing the non-contact function of the dual-interface module.

[0033] The above are only the preferred embodiments of the present invention, and do not impose any formal or substantial limitations on the present invention. It should be pointed out that for those of ordinary skill in the art in this technical field, without departing from the premise of the present invention, several improvements and supplements can still be made, and these improvements and supplements should also be regarded as the protection scope of the present invention. For those skilled in the art, without departing from the spirit and scope of the present invention, any equivalent changes made by using the technical content disclosed above, such as slight changes, modifications and evolutions, are equivalent embodiments of the present invention; at the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A novel dual-interface smart card module carrier tape structure, characterized in that It includes a connected contact surface metal layer (1) and a polymer fiber layer (2). As the encapsulation surface, the polymer fiber layer (2) is respectively provided with a first encapsulation area (21) and a second encapsulation area (22) corresponding to block A and block B on the dual-interface smart card module. Grooves (3) and at least one wire bonding hole (4) corresponding to the contact pin on the dual-interface smart card module are punched with the contact surface metal layer (1) as the bottom on both the first encapsulation area (21) and the second encapsulation area (22). A conductive paste layer (5) is printed in the groove (3).

2. The novel dual-interface smart card module carrier tape structure according to claim 1, wherein The first encapsulation area (21) and the first encapsulation area (21) are both independently arranged and not connected to other contact pins on the dual-interface smart card module.

3. A novel dual-interface smart card module carrier tape structure as described in claim 1, characterized in that, One wire bonding hole (4) is provided in both the first encapsulation area (21) and the second encapsulation area (22), corresponding to the dual-interface smart card module with antenna solder joints arranged on different sides.

4. A novel dual-interface smart card module carrier tape structure as described in claim 1, characterized in that, The first encapsulation area (21) and the second encapsulation area (22) cover block A, block B and area C on the dual-interface smart card module. Two wire bonding holes (4) are provided in each of the first encapsulation area (21) and the second encapsulation area (22), corresponding to the dual-interface smart card module with antenna solder joints located on one side.

5. A novel dual-interface smart card module carrier tape structure as described in claim 1, characterized in that, The groove (3) is a rectangular slot.

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