Heat dissipation device of electronic equipment

Abstract

The utility model relates to a heat dissipation device of electronic equipment, which comprises a heat dissipation shell provided with an internal space with a front opening; a plurality of types of heating elements arranged in a plurality of regions in the vertical direction on the inner side surface corresponding to the inner space of the heat dissipation case; and a plurality of heat sink fins which are arranged on the back surface portion of the heat sink housing so as to be elongated in the vertical direction, are detachably coupled to each other so as to be spaced apart from each other by a predetermined distance in the horizontal direction, and are arranged so as to be discontinuous in the vertical direction in the vicinity of the boundaries of the plurality of regions. Therefore, the heat dissipation performance is greatly improved.

Description

Technical Field

[0001] The utility model relates to a heat dissipation device for an electronic device, and more specifically, to a heat dissipation device for an electronic device that can correspond to multiple heat generating elements with different heat generation amounts and heat generation positions and has higher heat dissipation performance. Background Art

[0002] In various industrial fields such as communication, electronics, and electrics, related technologies are in a continuous high-level development trend to be applicable to more advanced industries. High-level technology development requires high-power energy, and devices using high-power energy inevitably face the problem of high heat generation. Therefore, it is necessary to develop a heat dissipation system suitable for this level at the same time.

[0003] Heat dissipation systems are used in various industries such as air conditioners, mobile communications, data centers, aviation mobiles, electric vehicles, energy storage devices, displays, etc. Such heat dissipation systems are one of the main reasons for power consumption, and with the development of the industry, power consumption shows a gradually increasing trend.

[0004] Generally, heat dissipation devices are roughly divided into an active cooling device and a passive cooling device. The active cooling device mainly utilizes forced convection generated by a fan, while the passive cooling device can be classified as a technology that utilizes natural convection without using a fan.

[0005] However, existing heat dissipation systems have limitations in dissipating the high heat generated by continuously developing advanced technologies. Therefore, in related industrial fields, innovative technologies that can solve these problems are needed. As one link for solving these problems, a heat dissipation mechanism using a phase change material is being developed.

[0006] In addition, various heat generating elements with different heat generation amounts during electrical operation are equipped in an electronic device. Depending on the use and usage conditions of the electronic device, it is inevitable that there are cases where multiple heat generating elements can only dissipate heat through any one surface.

[0007] At this time, in order to smoothly dissipate heat from the internal space of the electronic device to the outside (external air), a heat dissipation housing made of a heat conductive material for covering any one surface for heat dissipation can be provided, and a plurality of radiator fins for increasing the heat exchange area with the external air are provided on the outer surface of the heat dissipation housing in an integrated or detachable manner.

[0008] However, if multiple radiator fins are vertically arranged in a long and slender manner at the same specifications and intervals on the outer surface of the heat dissipation housing without considering various heating elements and the arrangement positions of each heating element to prevent interference from the upward airflow, when the heat inside the electronic device is biased upward due to the upward airflow, the heat dissipation requirements in the vertical direction are different, so there is a problem that it is difficult to achieve uniform heat dissipation.

[0009] In addition, even if the length of each individual radiator fin that makes up multiple radiator fins is large enough to span the entire vertical direction of the outer surface of the heat dissipation housing, during the process of moving the heat conducted from the lower side inside the electronic device upward, since it will affect the heat-sensitive heating elements mounted on its upper side, it may cause a problem of reduced performance of specific heating elements.

[0010] As an example, when the substance used as the heat transfer medium is a phase-changeable refrigerant, different from the case that depends on the thermal conductivity of the metal material itself, since its heat dissipation performance is very excellent, the high temperature of the condensation heat generated when the gaseous refrigerant condenses into a liquid refrigerant may cause a reduction in the function of heat-sensitive heating elements. SUMMARY OF THE UTILITY MODEL

[0011] The present utility model is proposed to solve the above technical problems, and its purpose is to provide a heat dissipation device for an electronic device that divides specific heat dissipation areas according to the vertical positions on the back surface of the heat dissipation housing, and thus installs multiple radiator fins equipped on the back surface of the heat dissipation housing, so that the internal heat is dissipated with uniform heat dissipation performance as a whole.

[0012] Moreover, another purpose of the present utility model is to provide a heat dissipation device for an electronic device that can prevent the reverse conduction phenomenon of the heat inside the heat dissipation housing that occurs when the heat dissipation performance of multiple radiator fins is significantly improved.

[0013] In addition, another purpose of the present utility model is to provide a heat dissipation device for an electronic device that can quickly dissipate heat in the left-right horizontal direction relative to some high-heat-generating heating elements.

[0014] In addition, another purpose of the present utility model is to provide a heat dissipation device for an electronic device that not only utilizes the heat conduction of its inherent material but also utilizes the phase change of the refrigerant according to the installation positions of multiple radiator fins.

[0015] In addition, another purpose of the present utility model is to provide a heat dissipation device for an electronic device that, when multiple radiator fins utilize the phase change of the refrigerant, separately designs the heat dissipation area range in the vertical direction to minimize the function decline of the heating elements caused by the condensation heat as much as possible.

[0016] The technical problems of the present utility model are not limited to the above-mentioned technical problems, and those of ordinary skill in the technical field to which the present utility model pertains can clearly understand other technical problems not mentioned through the following description.

[0017] A heat dissipation device for an electronic device according to an embodiment of the present utility model includes: a heat dissipation housing having an internal space with an opening at the front; a plurality of heat generating bodies arranged in a plurality of regions in the vertical direction on the inner side surface corresponding to the internal space of the heat dissipation housing; and a plurality of radiator fins arranged longitudinally in the vertical direction on the back surface of the heat dissipation housing and detachably coupled to each other at a predetermined distance in the horizontal direction left and right, wherein the plurality of radiator fins are separately arranged in a discontinuous manner in the vertical direction near the boundary of the plurality of regions.

[0018] Wherein, the plurality of radiator fins can be separately arranged so that heat transfer of conducting heat is blocked in the vertical direction with respect to the back surface of the heat dissipation housing.

[0019] In addition, when the plurality of radiator fins are divided into an upper region located on the relatively upper side in the back surface of the heat dissipation housing, a middle region located in the middle, and a lower region located on the lower side, it is arranged on the back surface of the heat dissipation housing in such a way that after independently receiving the heat of the heat generating bodies located in each of the upper region, the middle region, and the lower region, heat dissipation is performed through independent heat transfer paths.

[0020] In addition, when the plurality of regions can be divided into an upper region located on the relatively upper side of the back surface of the heat dissipation housing, a middle region located in the middle, and a lower region located on the lower side, the plurality of radiator fins may include: upper radiator fins coupled to the upper region to dissipate heat of the upper heat generating bodies among the plurality of heat generating bodies located in the upper region; middle radiator fins coupled to the middle region to dissipate heat of the middle heat generating bodies among the plurality of heat generating bodies located in the middle region; and lower radiator fins coupled to the lower region to dissipate heat of the lower heat generating bodies among the plurality of heat generating bodies located in the lower region.

[0021] In addition, the upper radiator fins, the middle radiator fins, and the lower radiator fins may be arranged on a vertical line that is a straight line in the vertical direction.

[0022] In addition, the upper radiator fins and the intermediate radiator fins have a first thermal conductivity, and the lower radiator fins have a second thermal conductivity that is relatively lower than the first thermal conductivity. The upper heating element and the intermediate heating element located in the upper region and the intermediate region dissipate heat at a temperature higher than that of the lower heating element located in the lower region.

[0023] In addition, a phase-changeable refrigerant is filled inside the upper radiator fins and the intermediate radiator fins, and the first thermal conductivity can be achieved through the flow generated by the phase change of the refrigerant.

[0024] In addition, the lower radiator fins can have the second thermal conductivity by the thermal conductivity of the material itself.

[0025] In addition, the upper radiator fins can be further integrally formed with an extended heat dissipation plate portion such that a part of the upper end portion extends further forward than the back surface of the heat dissipation housing and at least covers a part of the upper surface of the heat dissipation housing.

[0026] In addition, the extended heat dissipation plate portion can be formed in a shape that expands the refrigerant flow space filled with the refrigerant inside the upper radiator fins.

[0027] In addition, in the intermediate region, in addition to the intermediate heating element, a high-heating element with a heat generation amount greater than that of the intermediate heating element is provided. The intermediate region can be divided into an upper intermediate region including the part where the high-heating element is provided and a lower intermediate region including the part where the high-heating element is not provided.

[0028] In addition, a plurality of heat pipes for dispersing the heat generated from the high-heating element in the left and right horizontal directions of the heat dissipation housing can be arranged on the inner side surface of the inner space of the heat dissipation housing corresponding to the upper intermediate region.

[0029] In addition, a press-in portion for setting the plurality of radiator fins can be further provided on the back surface of the heat dissipation housing. When the press-in portion can include an upper press-in portion for coupling the upper radiator fins among the plurality of radiator fins, an intermediate press-in portion for coupling the intermediate radiator fins among the plurality of radiator fins, and a lower press-in portion for coupling the lower radiator fins among the plurality of radiator fins, the back surface forming the intermediate press-in portion in the heat dissipation housing is formed to be separated by a stepped surface.

[0030] In addition, the front end portion of the intermediate radiator fins located in the upper intermediate region can be formed to be recessed more rearward than the front end portion of the intermediate radiator fins located in the lower intermediate region in a stepped manner.

[0031] In addition, the upper radiator fins and the middle radiator fins may include: a heat conducting plate body having a refrigerant flow space, the refrigerant flow space providing a space for gas-liquid circulation to release heat while causing a phase change of the refrigerant within a space filled with the refrigerant and enclosed therein.

[0032] In addition, the refrigerant flow space may include: a first refrigerant flow path, which is an evaporation region at one end in the width direction, supplying heat from the upper heating element and the middle heating element to be cooled to the heat conducting plate body; and a second refrigerant flow path, which is formed in a plurality in a condensation region other than the first refrigerant flow path, allowing the liquid refrigerant that has condensed from a gaseous state to a liquid state in the refrigerant to act as a flow path to the first refrigerant flow path side through surface tension or gravity from the other end in the width direction of the heat conducting plate body.

[0033] In addition, the heat conducting plate body of the upper radiator fins and the middle radiator fins may be provided in the form of a plate made of SUS material, and the lower radiator fins may be provided in the form of a plate made of aluminum material with a higher thermal conductivity than the heat conducting plate body.

[0034] In addition, the heat conducting plate body of the upper radiator fins and the middle radiator fins may be provided in the form of a plate made of SUS material forming the refrigerant flow space, and the lower radiator fins may be provided in the form of a plate made of SUS material without the refrigerant flow space.

[0035] The heat dissipation device of the electronic device according to the present utility model can prevent the heat imbalance phenomenon caused by various heating elements inside the heat dissipation housing formed elongated in the vertical direction and achieve heat dissipation with uniform heat dissipation performance as a whole, thereby having the effect of significantly improving the heat dissipation performance.

[0036] Moreover, the heat dissipation device of the electronic device according to the present utility model can protect the heating elements inside that are vulnerable to high temperatures by preventing the reverse heat conduction phenomenon that may occur due to the high heat dissipation performance of the multiple radiator fins, thereby having the effect of improving the product reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 are front and rear perspective views showing a heat dissipation device of an electronic device according to an embodiment of the present utility model.

[0038] Figure 2a and Figure 2b are Figure 1 front exploded perspective view and rear exploded perspective view of

[0039] Figure 3It is a partial exploded perspective view of the rear part showing the bonding relationship of multiple radiator fins in the structure for Figure 1 .

[0040] Figure 4 It is a perspective view (a, b, c) of multiple radiator fins in the structure of Figure 1 and cross-sectional views (d, e) taken along lines A-A and B-B.

[0041] Figure 5 It is a projected perspective view of the upper radiator fin among the multiple radiator fins of Figure 1 .

[0042] Figure 6 It is an Figure 5 exploded perspective view.

[0043] Figure 7 It is a partially cut-away perspective view (a), a partially enlarged view (b), and a cross-sectional view (c) of Figure 5 .

[0044] Figure 8 It is an exploded perspective view for explaining the functional relationship of multiple radiator fins according to the type and mounting position of the heating element in the structure of Figure 1 .

[0045] Figure 9 It is the rear view (a) and side view (b) of Figure 8 .

[0046] Figure 10a And Figure 10b It is a partially cut-away perspective view showing the bonding relationship of heat pipes for dispersing heat horizontally in the left-right direction inside the heat dissipation housing in the structure of Figure 1 .

[0047] Description of reference numerals

[0048] 1: Antenna device 10: Heat dissipation housing

[0049] 20: Main board 21: Upper heating element

[0050] 22C: High heating element 22: Intermediate heating element

[0051] 30: PSU board

[0052] 40: RF module 41: MBF component

[0053] 42: Antenna element 50: Antenna cover panel

[0054] 60: Finger guard plate assembly 60h-1, 60h-2: Vent holes

[0055] 70: External mounting component 100: Multiple radiator fins

[0056] 110: Upper radiator fin 120: Middle radiator fin

[0057] 130: Lower radiator fin Detailed implementation mode

[0058] Hereinafter, with reference to the accompanying drawings, a heat dissipation device of an electronic device according to an embodiment of the present invention will be described in detail.

[0059] It should be noted that when assigning reference numerals to the components of each drawing, for the same components, even if shown in different drawings, the same reference numerals are assigned as much as possible. In addition, in the process of describing the embodiments of the present invention, if it is determined that the specific description of the related well-known structure or function hinders the understanding of the embodiments of the present invention, the detailed description thereof will be omitted.

[0060] When describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish one component from other components, and the nature, order or sequence of the corresponding components are not limited by these terms. In addition, unless otherwise defined, all terms used here, including technical terms or scientific terms, have the same meaning as the ordinary understanding of those with ordinary knowledge in the technical field to which the present invention belongs. Terms that are the same as those defined in the commonly used dictionary should be interpreted as having the same meaning as the meaning in the context of the related technology, and should not be interpreted as ideal or overly formal meanings unless clearly defined in this application.

[0061] Figure 1 is a front and rear perspective view showing a heat dissipation device of an electronic device according to an embodiment of the present invention, Figure 2a and Figure 2b is Figure 1 a front exploded perspective view and a rear exploded perspective view thereof.

[0062] Generally, heat generating devices (electronic devices) are manufactured in various forms throughout the industry, but the applicant of the present invention is an enterprise engaged in the manufacturing of other wireless communication devices. Hereinafter, when describing a heat dissipation device of an electronic device according to an embodiment of the present invention, the antenna device 1 of a representative heat generating device (electronic device) that is the object of heat dissipation of the heat dissipation device will be taken as a specific example for description.

[0063] However, the electronic device to which the heat dissipation device according to an embodiment of the present invention described below is applied is not limited to the antenna device 1. It should be noted that the specific terms "antenna device 1" and "components related thereto" used below should be interpreted to include the concepts of all similar electronic devices and their components.

[0064] First, the antenna device 1, which is an example of a representative electronic device, will be described as follows.

[0065] As Figures 1 to 2b shown, the antenna device 1 to which the heat dissipation device according to an embodiment of the present invention is applied includes: a heat dissipation housing 10 that forms an internal space 10S opening forward and is formed in a rectangular parallelepiped shape having a generally elongated and thin front-rear accommodation width in the vertical direction.

[0066] Among them, the heat dissipation housing 10 provides a setting place (internal space 10S) for various internal structures described below and is made of a strong material so as to be able to protect the internal structures from external impacts. In particular, among the internal structures, it is preferably made of a metal material with excellent thermal conductivity so as to be able to dissipate the heat generated during system operation to the outside by utilizing the thermal conductivity property of its own material.

[0067] Inside the internal space 10S of the heat dissipation housing 10, as a substrate for a digital transceiving unit (DTU: Digital Transceiving Unit), an RF module 40 composed of a combination of a plurality of micro bellows filter (MBF: Micro Bellows Filter) elements 41 and antenna elements 42 is arranged on the front surface through a clamshell, and a main board 20 with a heat generating body attached to the back surface can be stacked and arranged.

[0068] Among them, components such as radio frequency integrated circuit (RFIC) elements, radio frequency power amplifier (PA) elements, and field programmable gate array (FPGA) elements, which are defined as heat generating bodies that generate a large amount of heat during operation, can be mounted on the main board 20 (see reference numerals 21, 22, 22C in the drawings described below). Figure 8

[0069] However, it should be noted that in the embodiment of the present invention, only the electronic device is described as the antenna device 1, and the heat generating bodies 21, 22, 22C are not limited to the above structure. For example, the heat generating bodies 21, 22, 22C can also use semiconductors as representative heat generating elements.

[0070] Also, at the lower part of the internal space 10S of the heat dissipation housing 10, a power supply unit (PSU: Power Supply Unit Board) board 30 to which electrical components related to a power amplifier unit (PAU) are mounted can be stacked and arranged to have the same layer as the main board 20.

[0071] However, the PSU board 30 does not need to be arranged on the internal space 10S of the heat dissipation housing 10 to have the same layer as the main board 20. Considering the shape or the protruding length backward of the mounting components mounted on the back surface of the main board 20 and the back surface of the PSU board 30, it can also be arranged in different layers.

[0072] For reference, as described below (refer to Figure 8 ), the above-mentioned main board 20 is stacked and arranged in the upper region Ⅰ and the middle region Ⅱ in the internal space 10S of the heat dissipation housing 10, and compared with the heat generating body of the electrical components of the PSU board 30 arranged in the lower region Ⅲ corresponding to its lower part, it can generate heat with a relatively high calorific value.

[0073] In addition, a radome panel 50 is provided on the front surface of the internal space 10S of the heat dissipation housing 10, so as to protect the radiation element composed of the antenna element 42 from external influences and at the same time play a role in enabling the radiation element to radiate smoothly.

[0074] Among them, the radome panel 50 is formed of a material through which the radiation beam of the radiation element easily passes, and can be classified as a component that hinders the system operation heat generated in the internal space 10S of the heat dissipation housing 10 from dissipating heat forward. Therefore, in order to increase the heat dissipation surface area for concentrating heat dissipation to the rear side of the heat dissipation housing 10, the heat dissipation housing 10 itself is also designed to be longer in the vertical direction.

[0075] A heat dissipation device according to an embodiment of the present invention can be provided on the back surface of such a heat dissipation housing 10. Among them, the heat dissipation device according to an embodiment of the present invention can be equipped with a plurality of radiator fins 100 protruding backward from the back surface of the heat dissipation housing 10 by a predetermined distance. Specific descriptions of the plurality of radiator fins 100 will be given later.

[0076] In addition, as Figure 2a and Figure 2b shown, the heat dissipation device of the electronic device according to an embodiment of the present invention may further include: a finger guard plate assembly 60, which is configured to surround a part of the back side and the upper side of the heat dissipation housing 10, so as to prevent an external object (or person) from approaching the plurality of radiator fins 100.

[0077] The finger protection plate assembly 60 may include: a rear finger protection panel 61, configured to be vertically up and down to cover the entire rear end of a plurality of radiator fins 100; an upper upper surface finger protection panel 62, configured such that its rear end is coupled to the upper end of the rear finger protection panel 61 and its front end extends horizontally forward; a right finger protection panel 63, with its front end coupled to the right rear end of the heat dissipation housing 10, its rear end coupled to the right end of the rear finger protection panel 61, and arranged to cover the rear right part of the heat dissipation housing 10; a left finger protection panel 64, with its front end coupled to the left rear end of the heat dissipation housing 10, its rear end coupled to the left end of the rear finger protection panel 61, and arranged to cover the rear left part of the heat dissipation housing 10; and an upper front surface finger protection panel 65, arranged to cover the area between the front end of the upper upper surface finger protection panel 62 and the front upper end of the heat dissipation housing 10.

[0078] Among them, the right finger protection panel 63 and the left finger protection panel 64 may include: upper side surface protection panels 63-1, 64-1, which are provided on the upper side with reference to the clamping bracket 5 hereinafter described; and lower side surface protection panels 63-2, 64-2, which are provided on the lower side with reference to the clamping bracket 5.

[0079] Therefore, the upper side surface protection panels 63-1, 64-1 can be divided into a right upper side surface protection panel 63-1 corresponding to the right finger protection panel 63 provided on the upper side with reference to the clamping bracket 5, and a left upper side surface protection panel 64-1 corresponding to the left finger protection panel 64 provided on the upper side with reference to the clamping bracket 5. The lower side surface protection panels 63-2, 64-2 can be divided into a right lower side surface protection panel 63-2 corresponding to the right finger protection panel 63 provided on the lower side with reference to the clamping bracket 5, and a left lower side surface protection panel 64-2 corresponding to the left finger protection panel 64 provided on the lower side with reference to the clamping bracket 5.

[0080] In addition, the finger protection plate assembly 60 may further include: protection mounting rods 66, 67, 68, which provide predetermined screw fastening holes 69 for threaded coupling at each edge portion while strengthening the rigidity of the edge portion.

[0081] Among them, the above-mentioned rear finger protection panel 61 to the front surface finger protection panel 65 may be made of plastic material to reduce the weight of the overall antenna device 1, and the above-mentioned protection mounting rods 66, 67, 68 may be manufactured in the form of aluminum extrusion rods to strengthen the rigidity.

[0082] The protective mounting rods 66, 67, 68 may further include: a front protective mounting rod 66, arranged between the upper surface finger protection panel 62 and the upper front surface finger protection panel 65 and provided with a plurality of screw fastening holes 69; a rear protective mounting rod 67, arranged between the upper surface finger protection panel 62 and the rear finger protection panel 61 and provided with a plurality of screw fastening holes 69; a lower protective mounting rod 68, arranged at the lower end of the rear finger protection panel 61 and formed with a plurality of screw fastening holes 69.

[0083] Moreover, the finger protection plate assembly 60 should allow air (external air) in the external space to flow in for heat exchange with the multiple radiator fins 100 provided inside it. Therefore, a plurality of ventilation holes 60h-1, 60h-2 in a mesh (or grid) form may be formed.

[0084] As Figures 1 to 2b shown, the finger protection plate assembly 60 having the above-described structure may be arranged to surround all except the lower end portions of the multiple radiator fins 100 joined to the back surface of the heat dissipation housing 10.

[0085] In addition, clamping brackets 5 for mediating the installation of a support rod (not shown) may be provided at the left and right end portions of the heat dissipation housing 10 to surround the outer surface of the rear finger protection panel 61 in the structure of the above-described finger protection plate assembly 60.

[0086] As described above, the clamping bracket 5 can not only mediate the installation of the support rod but also perform the function of allowing on-site workers to grasp and move the antenna device 1 by hand. And handle holes 6 in the form of holes may be formed at the left and right end portions for easy gripping.

[0087] In addition, heat contact portions 11, 12, 13 that match the shapes of the heat generating bodies 21, 22, 22C or the back surface of the PSU board 30 mounted on the back surface of the main board 20 may be formed on the inner side surface of the internal space 10S of the heat dissipation housing 10.

[0088] Among them, the heat contact portions 11, 12, 13 may include: heat generating body contact portions 11, 12, provided in a protruding or recessed form in a state of making surface thermal contact with the heat generating surfaces of the heat generating bodies 21, 22, 22C mounted on the back surface of the main board 20; a heat pipe contact portion 13, provided in a groove form to insert and set a plurality of heat pipes 140 (refer to Figure 8 ) described later.

[0089] In addition, an external mounting component 70 for electrically connecting or signal-connecting to the main board 20 in the internal space 10S may be provided at the lower end of the heat dissipation housing 10. The external mounting component 70 can be understood as a component that performs the connection terminals of all connection lines in a normal electronic device, and includes a power supply cable or wire for connecting and supplying power or signals, etc.

[0090] Figure 3 is for explaining Figure 1 a partial exploded perspective view of the rear portion showing the combination relationship of multiple radiator fins in the structure of Figure 4 is a perspective view (a, b, c) showing Figure 1 the structure of multiple radiator fins in Figure 5 is a perspective view showing Figure 1 the projected perspective view of the upper radiator fin among the multiple radiator fins of Figure 6 is Figure 5 an exploded perspective view of Figure 7 is Figure 5 a partially cut-away perspective view (a), a partially enlarged view (b), and a cross-sectional view (c) of Figure 8 is for explaining Figure 1 the exploded perspective view of the functional relationship of multiple radiator fins showing the type and mounting position of the heating element in the structure of Figure 9 is Figure 8 the rear view (a) and side view (b) of Figure 10a and Figure 10b is for explaining Figure 1 a partially cut-away perspective view of the combination relationship of heat pipes for dissipating heat horizontally in the left and right directions inside the heat dissipation housing in the structure of

[0091] As Figure 3 shown, the heat dissipation device of an electronic device according to an embodiment of the present invention may include: a plurality of radiator fins 100 provided in the press-in portions 16, 17, 18 formed on the back surface of the heat dissipation housing 10.

[0092] Among them, the press-in portions 16, 17, 18 may include: an upper press-in portion 17 for combining the upper radiator fins 110 among the plurality of radiator fins 100; a middle press-in portion 16 for combining the middle radiator fins 120 among the plurality of radiator fins 100; and a lower press-in portion 18 for combining the lower radiator fins 130 among the plurality of radiator fins 100.

[0093] The press-in portions 16, 17, 18 as described above are formed integrally on the back surface of the heat dissipation housing 10 and may be provided in a slender slot shape along the up and down direction, so that a part of the front end portions of the plurality of radiator fins 100 can be inserted in a forced insertion form.

[0094] However, the pressing portions 16, 17, and 18 may be recessed forward with respect to the back surface of the heat dissipation housing 10 to form the above-mentioned elongated slots, or may be formed to protrude rearward with respect to the back surface of the heat dissipation housing 10 so that a pair of slot ribs (not shown in the drawings) form the above-mentioned elongated slots.

[0095] Among them, the middle pressing portion 16 of the pressing portions 16, 17, and 18 may be divided into a middle lower pressing portion 16a into which the lower end portion of the middle heat sink fin 120 among the following multiple heat sink fins 100 is inserted and disposed, and a middle upper pressing portion 16b into which the upper end portion of the middle heat sink fin 120 is inserted and disposed.

[0096] On the inner side surface of the internal space 10S of the heat dissipation housing 10 where the middle upper pressing portion 16b is formed, in order to form a heat pipe contact portion 13 provided with the following multiple heat pipes 140, it may be formed to protrude slightly rearward.

[0097] Among them, the depths of the slots forming the middle upper pressing portion 16b and the middle lower pressing portion 16a or the protruding lengths of the pair of slot ribs are the same, and in the back surface of the heat dissipation housing 10 serving as the formation reference thereof, the respective portions forming the middle upper pressing portion 16b and the middle lower pressing portion 16a may be formed to be separated by a stepped surface. A more detailed description of this will be given later.

[0098] In addition, as Figures 1 to 3 shown, in the heat dissipation device of an electronic device according to an embodiment of the present invention, the multiple heat sink fins 100 may include an upper heat sink fin 110 and a middle heat sink fin 120 that actively dissipate the heat generated from the heat generating bodies 21, 22, and 22C to the outside by using a phase change material, and a lower heat sink fin 130 that dissipates the heat generated from the heat generating bodies 21, 22, and 22C to the outside by a heat conduction method according to the thermal conductivity of its inherent material (rather than a phase change material).

[0099] Among them, the multiple heat sink fins 100 may be arranged in a long and slender manner in the vertical direction along the back surface portion of the heat dissipation housing 10, and may be detachably coupled in a manner of being separated by a predetermined distance in the horizontal direction. In order to individually press and dispose the multiple heat sink fins 100, the multiple pressing portions 16, 17, and 18 formed on the back surface portion of the heat dissipation housing 10 are also correspondingly arranged in a long and slender manner in the vertical direction, and may be formed to be separated by a predetermined distance in the horizontal direction.

[0100] At this time, the multiple heat sink fins 100 may be separately arranged discontinuously in the vertical direction near the boundaries of the multiple regions I, II, and III.

[0101] A plurality of radiator fins 100 are discontinuously and separately arranged in the vertical direction, which means that the phase change flow range of the refrigerant filled into the enclosed refrigerant flow spaces 111 and 112 inside each of the plurality of radiator fins 100 to be described later is separated into a plurality of regions in the vertical direction on the back surface of the heat dissipation housing 10, or means physically separating the heat transfer regions.

[0102] More specifically, as Figure 8 and Figure 9 shown, the above-mentioned plurality of regions I, II, and III are divided into an upper region I located on the relatively upper side in the back surface of the heat dissipation housing 10, an intermediate region II located in the middle, and a lower region III located on the lower side.

[0103] In this case, the plurality of radiator fins 100 may include: an upper radiator fin 110, which is coupled to the back surface of the heat dissipation housing 10 corresponding to the upper region I to dissipate heat from the upper heating element 21 located in the upper region I among the various heating elements 21, 22, and 22C; an intermediate radiator fin 120, which is coupled to the back surface of the heat dissipation housing 10 corresponding to the intermediate region II to dissipate heat from the intermediate heating elements 22 and 22C located in the intermediate region II among the various heating elements 21, 22, and 22C; and a lower radiator fin (not shown, for example, a PSU electrical component) located in the lower region III among the various heating elements 21, 22, and 22C, which is coupled to the back surface of the heat dissipation housing 10 corresponding to the lower region III to dissipate heat.

[0104] As described above, the plurality of radiator fins 100, which are provided in different types across three regions in the vertical direction, may arrange the upper radiator fin 110, the intermediate radiator fin 120, and the lower radiator fin 130 on a vertical line that is a straight line in the vertical direction, so that the hot air generated by heat dissipation in the vertical direction is not interfered with when forming an upward air flow and is easily discharged upward.

[0105] The plurality of radiator fins 100 configured as described above may be press-fitted and coupled to the press-fitting portions 16, 17, and 18 formed on the back surface of the heat dissipation housing 10 by press-fitting, respectively.

[0106] At this time, although not shown, preferably, after performing thermal epoxy treatment on the press-fitting portions 16, 17, and 18, the plurality of radiator fins 100 are press-fitted and inserted respectively to improve the heat transfer efficiency.

[0107] The upper radiator fin 110 and the intermediate radiator fin 120 among the plurality of radiator fins 100 may have a first thermal conductivity, and the lower radiator fin 130 may be provided with a second thermal conductivity that is relatively lower than the first thermal conductivity.

[0108] As described later, the upper radiator fins 110 and the intermediate radiator fins 120 are provided with a heat conduction plate body made of a SUS material (stainless steel) plate, and it is known that the SUS material has a lower heat conductivity than metals such as aluminum (Al). However, the upper radiator fins 110 and the intermediate radiator fins 120 can dissipate heat smoothly through the phase change of the refrigerant in the refrigerant flow spaces 111 and 112 filled with the refrigerant inside. Thus, the upper radiator fins 110 and the intermediate radiator fins 120 have a higher heat conductivity than the lower radiator fins 130.

[0109] Therefore, the upper radiator fins 110 and the intermediate radiator fins 120 are located in the upper region I and the intermediate region II, and can be adopted as being relatively suitable for dissipating heat from the high-heat-generating bodies 21, 22, and 22C. The lower radiator fins 130 are located in the lower region III, and can be adopted as being relatively suitable for dissipating heat from low-heat-generating bodies (for example, electrical components of the PSU board).

[0110] However, the position definitions of the upper region I to the lower region III are only limited matters used to help understand the heat dissipation device of the electronic device according to an embodiment of the present invention, and it is not necessary to arrange the high-heat-generating bodies 21, 22, and 22C in the upper region I and the intermediate region II and the low-heat-generating bodies in the lower region III. Their arrangement positions can also be mixed.

[0111] Among them, the upper radiator fins 110 can be further integrally formed with an extended heat dissipation plate portion 105, and a part of the upper end portion thereof extends further forward than the press-fitting portion (for example, the upper press-fitting portion 17) with respect to the back surface portion of the heat dissipation housing 10 to cover at least a part of the upper rear end of the heat dissipation housing 10.

[0112] The case where the extended heat dissipation plate portion 105 is further integrally formed with respect to the upper radiator fins 110 means that the phase change flow range of the refrigerant filled in the internal refrigerant flow spaces 111 and 112 increases to a larger area.

[0113] That is, the extended heat dissipation plate portion 105 can be formed in a shape that expands the refrigerant flow spaces 111 and 112 inside the upper radiator fins 110 where the refrigerant is filled.

[0114] Therefore, it can be said that this is consistent with the increase in the heat dissipation area generated by the heat exchange between the single upper radiator fins 110 and the external air.

[0115] Therefore, the extended heat dissipation plate portion 105 formed on the upper side of the upper radiator fins 110 functions to guide and conduct the heat transferred from the upper heat-generating body 21 in the upper region I to the external air space side on the upper side of the heat dissipation housing 10 and dissipate heat with higher heat dissipation performance.

[0116] In addition, in the middle region II, in addition to the middle heating element 22, a high heating element 22C with a calorific value greater than that of the middle heating element 22 may be provided. In an embodiment of the present invention, on the premise that the electronic device is used as the antenna device 1, the upper heating element 21 and the middle heating element 22 may be defined as RFIC elements or PA elements with a relatively high calorific value during their electrical operations, while the high heating element 22C may be defined as an FPGA element.

[0117] In this case, the middle region II can be divided into an upper middle region II-U including the part where the high heating element 22C is located, and a lower middle region II-D including only the part where the middle heating element 22 is located without including the high heating element 22C.

[0118] Among them, on the inner side surface of the internal space 10S of the heat dissipation housing 10 corresponding to the upper middle region II-U, a plurality of heat pipes 140 for dispersing the heat generated from the high heating element 22C to the left and right horizontal directions of the heat dissipation housing 10 can be arranged.

[0119] In particular, the front end portion of the middle radiator fin 120 located in the upper middle region II-U can be recessed more rearward than the front end portion of the middle radiator fin 120 located in the lower middle region II-D in a stepped manner.

[0120] As described above, this is because each part of the back surface of the heat dissipation housing 10 formed by the middle upper press-in portion 16b and the middle lower press-in portion 16a is formed to be distinguished by a stepped surface, so as to change the shape design to ensure the installation space for the plurality of heat pipes 140 arranged in the upper middle region II-U, so as to accommodate the middle upper press-in portion 16b that protrudes relatively more rearward on the back surface of the heat dissipation housing 10.

[0121] In addition, as Figures 4 to 7 shown, the upper radiator fin 110 and the middle radiator fin 120 among the plurality of radiator fins 100 include heat conduction plate bodies 110A, 110B, which have refrigerant flow spaces 111, 112 for the gas-liquid circulation space, so that the refrigerant dissipates heat while undergoing a phase change in the space filled with the refrigerant and sealed inside.

[0122] However, except for the difference in the extended heat dissipation plate portion 105 formed above, the upper radiator fin 110 and the middle radiator fin 120 both have refrigerant flow spaces 111, 112 for the refrigerant to flow inside the heat conduction plate bodies 110A, 110B. Therefore, only the drawings of the upper radiator fin 110 are used for description below, but their detailed functions and structures can be understood to be the same.

[0123] Among them, although the heat conduction plate bodies 110A and 110B are not shown, the heat conduction plate bodies 110A and 110B each composed of a single metal plate member can be processed in a predetermined bending manner and formed by being sealed by joining along their edge ends, so as to form the refrigerant flow spaces 111 and 112 described above.

[0124] However, the method of forming the refrigerant flow spaces 111 and 112 is not limited to the processing method applying the above single metal plate member type and bending manner. For example, Figures 4 to 7 as shown, of course, the entire edge ends of the two metal plate members 110A and 110B can also be joined by a predetermined joining method, so as to form the refrigerant flow spaces 111 and 112 inside.

[0125] Among them, as Figures 4 to 7 shown, the refrigerant flow spaces 111 and 112 may include: a first refrigerant flow path 111, which corresponds to the evaporation region where the liquid refrigerant filled inside evaporates due to the heat transferred from the heating bodies 21, 22, and 22C and is formed elongated in the vertical direction; a second refrigerant flow path 112 as the flow path of the liquid refrigerant, which is formed in the condensation region outside the evaporation region, one end of which communicates with the first refrigerant flow path 111, and the other end of which is inclined obliquely backward in a direction higher than the above-mentioned one end along the gravity direction, so as to guide the liquid refrigerant condensed in the condensation region to flow toward the first refrigerant flow path 111 side.

[0126] The shape of the second refrigerant flow path 112 can actually be defined by a plurality of inclined guiding members 112a protruding toward the refrigerant flow spaces 111 and 112, so as to prevent the condensed liquid refrigerant from directly dropping along the gravity direction and guide the inclined flow toward the first refrigerant flow path 111 side by the property of the surface tension of the liquid.

[0127] In the heat conduction plate bodies 110A and 110B corresponding to the condensation region, a plurality of strength reinforcing portions 113 can be symmetrically formed protruding into the refrigerant flow spaces 111 and 112 respectively.

[0128] When the heat conduction plate bodies 110A and 110B are joined to each other in a bending or joining manner, the plurality of strength reinforcing portions 113 are joined to the opposing parts inside the refrigerant flow spaces 111 and 112 by various joining methods such as laser welding, so as to play a role in strengthening the strength of the heat conduction plate bodies 110A and 110B as a whole.

[0129] In addition, multiple strength reinforcement parts 113 can also play a role in achieving active condensation by providing more interference areas in the condensation region for the colliding of the vaporized gaseous refrigerant to dissipate heat.

[0130] Moreover, the multiple strength reinforcement parts 113 are recessed and formed on the outer surfaces of the heat-conducting plate bodies 110A and 110B having a planar shape toward the refrigerant flow spaces 111 and 112, so as to form more contact areas with the external air, and further play a role in performing active heat exchange.

[0131] In addition, an absorber 116 can be provided at the evaporation region corresponding to the first refrigerant flow path 111, so that after absorbing the liquid refrigerant, the absorbed liquid refrigerant can be actively vaporized by the heat provided from the heating bodies 21, 22, and 22C.

[0132] The absorber 116 itself can be made of a fibrous material such as non-woven fabric formed with a plurality of pores. Moreover, considering its arrangement in the first refrigerant flow path 111 formed elongated in the vertical direction, preferably, it is made of a material that can at least overcome the gravity in the vertical direction of a predetermined height (i.e., in the direction opposite to gravity) and disperse and move the liquid refrigerant through capillary action (or its own absorption force).

[0133] However, similar to the upper radiator fins 110, when an extended heat dissipation plate part 105 is also provided on the upper side, auxiliary absorbers 117 and 118 can be further provided in any part of the second refrigerant flow path 112 that forms a boundary with the extended heat dissipation plate part 105.

[0134] The auxiliary absorbers 117 and 118 can be arranged in auxiliary absorber setting parts 114 and 115 formed by deforming and processing a part of the second refrigerant flow path 112 to have a larger width.

[0135] The auxiliary absorbers 117 and 118 can include a first auxiliary absorber 117 provided at the middle part of the upper radiator fins 110 and a second auxiliary absorber 118 provided at the boundary part of the extended heat dissipation plate part 105.

[0136] Moreover, in order to separately provide the first auxiliary absorber 117 and the second auxiliary absorber 118, the auxiliary absorber setting parts 114 and 115 can also be provided at two positions respectively.

[0137] In particular, the auxiliary absorbers 117 and 118 are provided to be inserted and combined when the heat-conducting plate bodies 110A and 110B are joined and formed together, so as to prevent one-side auxiliary absorbers 117A and 118A from flowing between the multiple fixing ribs 119 and the other-side auxiliary absorbers 117B and 118B.

[0138] In addition, although not shown, a spacer protrusion may be provided to stably fix the absorber 116 disposed inside the first refrigerant flow path 111 formed in an elongated shape in the vertical direction. The plurality of fixing ribs 119 described above are the same as the spacer protrusion for fixing the absorber 116, and both serve to stably fix the auxiliary absorbers 117 and 118.

[0139] Such fixing ribs 119 may be integrally formed when the pair of heat conducting plate bodies 110A and 110B are molded.

[0140] Preferably, the lower ends of the auxiliary absorbers 117 and 118 are joined to the absorber 116 in a connected state. This is to enable the condensed refrigerant (liquid refrigerant) absorbed by the auxiliary absorbers 117 and 118 to easily permeate naturally toward the side of the absorber 116 (or the first refrigerant flow path 111 side) closest to the heating elements 21, 22, and 22C.

[0141] In addition, the heat conducting plate bodies 110A and 110B of the upper radiator fins 110 and the intermediate radiator fins 120 may be made of SUS material (stainless steel), and the lower radiator fins 130 may be made in the form of a plate made of an aluminum material (Al material) having a higher heat conductivity than the heat conducting plate bodies 110A and 110B of the upper radiator fins 110 and the intermediate radiator fins 120.

[0142] In the case where the heat dissipation effect of the lower radiator fins 130 made of an aluminum material depends on the heat conductivity of the material itself, higher heat dissipation performance is expected compared to the heat conductivity of the materials of the upper radiator fins 110 and the intermediate radiator fins 120 themselves. However, like the upper radiator fins 110 and the intermediate radiator fins 120, in the case of using the heat transfer method of the phase change material, from the perspective of having a significant heat dissipation performance improvement effect, the lower radiator fins 130 can be used as a heat dissipation structure suitable for the heating elements (such as the electrical components of the PSU) having a slightly lower heat generation amount among the heating elements in the internal space 10S of the heat dissipation housing 10.

[0143] However, the lower radiator fins 130 do not necessarily have to be formed of a metal material different from that of the upper radiator fins 110 and the intermediate radiator fins 120, and may also be made in the form of a plate made of the same SUS material as the upper radiator fins 110 and the intermediate radiator fins 120.

[0144] That is, the heat-conducting plate bodies 110A and 110B that constitute the upper radiator fins 110 and the intermediate radiator fins 120 are provided in the form of SUS plates that form refrigerant flow spaces 111 and 112 inside. The lower radiator fins 130 are also provided in the form of SUS plates and do not have the refrigerant flow spaces 111 and 112, and heat can be transferred only through the heat conductivity of the SUS material itself.

[0145] In addition, for the high-heat-generating body 22C located in the upper middle region II-U, due to the relatively high heat conductivity of the intermediate radiator fins 120 using the phase change material, there may be a problem of negative influence on heat reception.

[0146] More specifically, as Figure 8 and Figure 9 shown, for high-heat-generating bodies 21C such as FPGA components located in the upper middle region II-U, there is a concern about the problem of thermal damage due to the high temperature at the front end of the intermediate radiator fins 120.

[0147] To solve this problem, a plurality of heat pipes 140 for dispersing the heat generated from the high-heat-generating body 21C in the left and right horizontal directions of the heat dissipation housing 10 can be arranged on the inner side surface of the inner space 10S of the heat dissipation housing 10 corresponding to the upper middle region II-U.

[0148] Among them, the heat pipes 140 are also filled with a phase-changeable refrigerant in the closed interior. The refrigerant is phase-changed into a gaseous refrigerant by the heat provided from the high-heat-generating body 21C, and the gaseous refrigerant diffused through the core (wick) structure (not shown) with a plurality of pores inside exchanges heat through the inner side surface of the heat dissipation housing 10 (especially the heat pipe contact portion 13) and condenses, so that it can be phase-changed into a liquid refrigerant.

[0149] In particular, the plurality of heat pipes 140 are arranged such that at least one end surface is in thermal contact with the heat-generating surface of the high-heat-generating body 21C, and the other end extends toward the left end or the right end side of the heat dissipation housing 10, so as to evenly disperse and supply the concentrated high-temperature heat supplied from the high-heat-generating body 21C to a plurality of intermediate radiator fins 120 spaced apart by a predetermined distance in the left and right horizontal directions on the back surface of the heat dissipation housing 10.

[0150] As described above, the advantage of the heat dissipation device of the electronic device according to an embodiment of the present invention is that, compared with the case of uniformly using a plurality of radiator fins arranged vertically up and down to dissipate heat generated from various heat sources 21, 22, and 22C, by providing a specific area (for example, an upper area, a middle area, a lower area, etc.) suitable for the calorific value of each heat source 21, 22, and 22C and being configured to dissipate heat by being distinguished along the vertical up and down direction, higher heat dissipation performance can be ensured.

[0151] In particular, the heat dissipation device of the electronic device according to an embodiment of the present invention takes the "antenna device 1" and its attached components, which are very familiar to the applicant of the present invention, as a representative example of an electronic device. However, when it comes to the heat dissipation of heat sources with different calorific values in multiple fields, it is described that it has technical features applicable to all named machines.

[0152] As described above, an embodiment of the heat dissipation device of the electronic device according to the present invention has been described in detail with reference to the accompanying drawings. However, the embodiments of the present invention are not limited to the above-described one embodiment, and it is natural that those skilled in the art having ordinary knowledge in the technical field to which the present invention pertains can make various modifications and implement them within the equivalent scope. Therefore, the true scope of the rights of the present invention should be determined by the claims.

Claims

1. A heat dissipation device for an electronic device, characterized in that, Comprising: A heat dissipation housing having an interior space with an opening at the front; A plurality of heating elements arranged in a plurality of regions in the vertical direction on the inner side surface corresponding to the interior space of the heat dissipation housing; And A plurality of radiator fins arranged longitudinally in the vertical direction on the back surface of the heat dissipation housing and detachably coupled to each other at a predetermined distance in the horizontal direction from left to right, wherein the plurality of radiator fins are separately arranged in a discontinuous manner in the vertical direction near the boundaries of the plurality of regions.

2. The heat dissipation device of an electronic device according to claim 1, characterized in that The plurality of radiator fins are separately arranged such that heat transfer of conducting heat is blocked in the vertical direction with respect to the back surface of the heat dissipation housing.

3. The heat dissipation device of an electronic device according to claim 1, characterized in that When the plurality of radiator fins are divided into an upper region located on the relatively upper side in the back surface of the heat dissipation housing, an intermediate region located in the middle, and a lower region located on the lower side, it is arranged on the back surface of the heat dissipation housing in such a way that after independently receiving the heat of the heating elements located in each of the upper region, the intermediate region, and the lower region, heat dissipation is performed through independent heat transfer paths.

4. The heat dissipation device of an electronic device according to claim 1, characterized in that When the plurality of regions can be divided into an upper region located on the relatively upper side of the back surface of the heat dissipation housing, an intermediate region located in the middle, and a lower region located on the lower side, the plurality of radiator fins include: Upper radiator fins coupled to the upper region to dissipate heat from the upper heating elements among the plurality of heating elements located in the upper region; Intermediate radiator fins coupled to the intermediate region to dissipate heat from the intermediate heating elements among the plurality of heating elements located in the intermediate region; and Lower radiator fins coupled to the lower region to dissipate heat from the lower heating elements among the plurality of heating elements located in the lower region.

5. The heat dissipation device of an electronic device according to claim 4, characterized in that The upper radiator fins, the intermediate radiator fins, and the lower radiator fins are arranged on a vertical line that is a straight line in the vertical direction.

6. The heat dissipation device of an electronic device according to claim 4, characterized in that The upper radiator fins and the intermediate radiator fins have a first thermal conductivity, The lower radiator fins have a second thermal conductivity that is relatively lower than the first thermal conductivity, The upper heating elements and the intermediate heating elements located in the upper region and the intermediate region dissipate heat at a higher temperature than the lower heating elements located in the lower region.

7. The heat dissipation device of an electronic device according to claim 6, characterized in that A refrigerant capable of phase change is filled inside the upper radiator fins and the intermediate radiator fins, and has the first thermal conductivity through the flow generated by the phase change of the refrigerant.

8. The heat dissipation device of an electronic device according to claim 6, characterized in that The lower radiator fins have the second thermal conductivity by the thermal conductivity of the material itself.

9. The heat dissipation device of an electronic device according to claim 6, wherein the upper radiator fins are further integrally formed with an extended heat dissipation plate portion such that a part of the upper end portion extends further forward than the back surface of the heat dissipation housing and at least covers a part of the upper surface of the heat dissipation housing.

10. The heat dissipation device of an electronic device according to claim 9, wherein the extended heat dissipation plate portion is formed in a shape in which a refrigerant flow space filled with a refrigerant inside the upper radiator fins expands.

11. The heat dissipation device of an electronic device according to claim 6, wherein in the middle region, in addition to the middle heat generating body, a high heat generating body having a greater calorific value than the middle heat generating body is provided, wherein the middle region is divided into an upper middle region including a portion where the high heat generating body is provided and a lower middle region including a portion where the high heat generating body is not provided.

12. The heat dissipation device of an electronic device according to claim 11, wherein a plurality of heat pipes for dispersing heat generated from the high heat generating body in the left and right horizontal directions of the heat dissipation housing are arranged on the inner side surface of the inner space of the heat dissipation housing corresponding to the upper middle region.

13. The heat dissipation device of an electronic device according to claim 12, wherein a press-in portion for setting the plurality of radiator fins is further provided on the back surface of the heat dissipation housing, when the press-in portion includes an upper press-in portion for coupling the upper radiator fins among the plurality of radiator fins, a middle press-in portion for coupling the middle radiator fins among the plurality of radiator fins, and a lower press-in portion for coupling the lower radiator fins among the plurality of radiator fins, the back surface of the heat dissipation housing where the middle press-in portion is formed is formed to be separated by a stepped surface.

14. The heat dissipation device of an electronic device according to claim 12, wherein the front end portion of the middle radiator fins located in the upper middle region is formed to be recessed more rearward than the front end portion of the middle radiator fins located in the lower middle region in a stepped manner.

15. The heat dissipation device of an electronic device according to claim 4, wherein the upper radiator fins and the middle radiator fins include: a heat conduction plate main body having a refrigerant flow space that provides a space for gas-liquid circulation to release heat while the refrigerant undergoes a phase change in a space filled with the refrigerant and closed inside.

16. The heat dissipation device of an electronic device according to claim 15, wherein the refrigerant flow space includes: a first refrigerant flow path, which is an evaporation region at one end in the width direction, and supplies heat from the upper heat generating body and the middle heat generating body to be cooled to the heat conduction plate main body; and The second refrigerant flow path is formed in a plurality in the condensation region other than the first refrigerant flow path, and the liquid refrigerant that is condensed from the gas state to the liquid state in the refrigerant passes through surface tension or gravity from the other end in the width direction of the heat conducting plate body to serve as a flow path to the first refrigerant flow path side.

17. The heat dissipation device for an electronic device according to claim 15, wherein the heat conducting plate bodies of the upper radiator fins and the intermediate radiator fins are provided in the form of a plate made of SUS material, the lower radiator fins are provided in the form of a plate made of aluminum material having a higher thermal conductivity than the heat conducting plate body.

18. The heat dissipation device for an electronic device according to claim 15, wherein the heat conducting plate bodies of the upper radiator fins and the intermediate radiator fins are provided in the form of a plate made of SUS material that forms the refrigerant flow space, the lower radiator fins are provided in the form of a plate made of SUS material that does not have the refrigerant flow space.

Images