Display module, display panel and display device

Abstract

The utility model discloses a display module, a display panel and a display device. According to one embodiment, the display module comprises a display screen, and the display screen comprises a driving substrate and an opposite substrate arranged opposite to the driving substrate in the thickness direction of the display module. The display module further comprises a driving chip electrically connected with the driving substrate, a flexible circuit board bound with the driving chip and a rigid circuit board bound with the flexible circuit board, the display module further comprises a first heat dissipation piece, and the first heat dissipation piece comprises a first heat dissipation part covering the driving chip and a second heat dissipation part covering the rigid circuit board. The second heat dissipation part covers the flexible circuit board; and the third heat dissipation part has an overlapping area with the rigid circuit board. The first heat dissipation pieces are arranged on the driving chip, the flexible circuit board and the rigid circuit board, the heat of the heating element is transmitted to the air through heat conduction by means of the first heat dissipation pieces, and the temperature rise speed of the display module is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the field of display technology. More specifically, it relates to a display module, a display panel and a display device. Background Art

[0002] With the popularization of displays with integrated touch functions, users will touch the touch screen during use. Therefore, the temperature rise value on the surface of the display screen needs to be focused on. For some high-brightness and high-power-consuming products, at a room temperature of 25°C, the temperature on the surface of the module cover can reach up to 50°C at most. If no heat dissipation treatment is done, the high temperature on the surface of the display screen will lead to a poor user experience. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a display module, a display panel and a display device to solve at least one of the problems existing in the prior art.

[0004] To achieve the above purpose, the utility model adopts the following technical solutions:

[0005] In a first aspect of the utility model, a display module is provided, including: a display screen, the display screen includes a driving substrate and a counter substrate oppositely arranged with the driving substrate in the thickness direction of the display module, and the display module further includes: a driving chip electrically connected to the driving substrate, a flexible circuit board bonded to the driving chip, and a rigid circuit board bonded to the flexible circuit board.

[0006] The display module further includes a first heat dissipation member, and the first heat dissipation member includes:

[0007] A first heat dissipation portion covering the driving chip;

[0008] A second heat dissipation portion covering the flexible circuit board; and

[0009] A third heat dissipation portion having an overlapping area with the rigid circuit board.

[0010] In an optional embodiment, the driving chip is disposed on the surface of the driving substrate close to the display screen, the first heat dissipation portion is disposed on the surface of the driving substrate away from the display screen, the second heat dissipation portion is located on the surface of the flexible circuit board facing away from the driving chip, and the third heat dissipation portion is located on the surface of the rigid circuit board facing away from the driving chip.

[0011] In an optional embodiment, the display module further includes a first polarizing plate disposed on the side of the driving substrate away from the display screen and a second polarizing plate disposed on the side of the driving substrate close to the display screen.

[0012] The distance between the boundaries of the first heat dissipation part close to the first polarizer is a first distance, and the distance between the boundaries of the driving chip close to the first polarizer is a second distance, and the first distance is less than the second distance.

[0013] In an optional embodiment, taking the length direction of the display module as the second direction and the width direction of the display module as the first direction,

[0014] The left part of the second heat dissipation part parallel to the first direction overlaps with the left part of the flexible circuit board parallel to the first direction, and the right part of the second heat dissipation part parallel to the first direction overlaps with the right part of the flexible circuit board parallel to the first direction.

[0015] In an optional embodiment, the display module further includes a backplane having a groove, a backlight source disposed in the groove, and a frame. The frame includes a clamping portion clamped to the backplane and a bearing portion for bearing the display screen. The surface of the bearing portion away from the backplane is fixed to the surface of the driving substrate away from the display screen.

[0016] In an optional embodiment, the flexible circuit board and the rigid circuit board are folded and fixed to the side of the backplane away from the light source. The orthographic projection of the light source on the side wall of the backlight source on the clamping portion falls within the orthographic projection of the folded second heat dissipation part on the clamping portion. The third heat dissipation part is located between the rigid circuit board and the backplane.

[0017] The display module further includes a second heat dissipation member, and the orthographic projection of the second heat dissipation member on the backplane covers the orthographic projections of the folded flexible circuit board and the rigid circuit board on the backplane.

[0018] In an optional embodiment, the second heat dissipation member includes an avoidance opening for avoiding the connecting member on the side of the backplane away from the backlight source.

[0019] In an optional embodiment, both the first heat dissipation member and the second heat dissipation member include:

[0020] A base material layer, a heat dissipation layer disposed on one surface of the base material layer, a heat spreading layer disposed on the other surface of the base material layer, and a thermal conductive adhesive layer disposed on the surface of the heat spreading layer away from the base material layer.

[0021] The surface of the thermal conductive adhesive layer away from the base material layer is fixed to the surface of the driving substrate facing away from the driving chip, the surface of the flexible circuit board facing away from the driving chip, and the surface of the rigid circuit board facing away from the driving chip;

[0022] Or

[0023] The surface of the heat-conducting adhesive layer away from the substrate layer is fixed to the surface of the back plate away from the backlight source.

[0024] In an alternative embodiment, the heat homogenizing layer comprises a metallic material.

[0025] In an alternative embodiment, the side of the rigid circuit board close to the back plate comprises a copper leakage area, and a conductive layer is arranged between the copper leakage area and the back plate.

[0026] The second aspect of the present utility model provides a display panel, comprising the display module described in the first aspect of the present utility model.

[0027] The third aspect of the present utility model provides a display device, comprising the display module described in the first aspect of the present utility model.

[0028] The beneficial effects of the present utility model are as follows:

[0029] In this embodiment, a first heat dissipation member is provided on the driving chip, the flexible circuit board and the rigid circuit board, and the heat of the heat-generating element is transferred to the air through heat conduction by the first heat dissipation member, effectively reducing the temperature rise rate of the display module. Description of the Drawings

[0030] The following further describes in detail the specific embodiments of the present utility model with reference to the drawings.

[0031] Figure 1 A schematic structural diagram showing a top view state of the display module according to an embodiment of the present utility model;

[0032] Figure 2 A schematic structural diagram showing a side vertical state of the display module according to an embodiment of the present utility model;

[0033] Figure 3 A schematic cross-sectional diagram showing the display module after being folded according to an embodiment of the present utility model;

[0034] Figure 4 A schematic assembly diagram of the components of the display module according to an embodiment of the present utility model;

[0035] Figure 5 A schematic structural diagram showing the non-bonding side of the display module according to an embodiment of the present utility model;

[0036] Figure 6 A schematic structural diagram showing a top view state of the non-light-emitting side of the display module according to an embodiment of the present utility model. Detailed Description of the Embodiments

[0037] To more clearly illustrate the present utility model, the present utility model will be further described below in conjunction with embodiments and the accompanying drawings. Similar components in the drawings are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not be used to limit the protection scope of the present utility model.

[0038] Generally, the heat sources of a display module are mainly the driving chip, the light source, and the rigid circuit board. Among them, the heat generated by the rigid circuit board is relatively low, and the rigid circuit board is on the non-light-emitting side of the display module, which does not affect the user's use of the touch surface of the display screen. However, the driving chip and the light source are distributed on the front and side of the display screen, and these two components generate a large amount of heat, and the temperature transmitted to the screen surface during normal operation is also relatively high.

[0039] In view of this, the present embodiment discloses a display module, a display panel, and a display device to solve one or more of the above problems.

[0040] The first embodiment of the present utility model provides a display module, including a display screen, the display screen includes a driving substrate 10 and an opposing substrate 20 disposed opposite to the driving substrate 10 in the thickness direction of the display module. The display module further includes: a driving chip 30 electrically connected to the driving substrate 10, a flexible circuit board 40 bonded to the driving chip 30, and a rigid circuit board 50 bonded to the flexible circuit board 40.

[0041] The display module further includes a first heat dissipation member 60, and the first heat dissipation member 60 includes:

[0042] A first heat dissipation portion 61 covering the driving chip 30;

[0043] A second heat dissipation portion 62 covering the flexible circuit board 40; and

[0044] A third heat dissipation portion 63 having an overlapping area with the rigid circuit board 50.

[0045] In this embodiment, a first heat dissipation member 60 is provided on the driving chip 30, the flexible circuit board 40, and the rigid circuit board 50. The heat of the driving chip 30 is radiated into the air for heat dissipation by using the first heat dissipation portion 61. Moreover, the first heat dissipation portion 61, the second heat dissipation portion 62, and the third heat dissipation portion 63 can conduct the heat of the driving chip 30 to the rigid circuit board with a larger area, thereby reducing the temperature rise rate of the display module.

[0046] In an alternative embodiment, as Figure 2As shown, the driving chip 30 is disposed on the surface of the driving substrate 10 close to the counter substrate 20, the first heat dissipation portion 61 is disposed on the surface of the driving substrate 10 away from the counter substrate 20, the second heat dissipation portion 62 is located on the surface of the flexible circuit board 40 facing away from the driving chip 30, and the third heat dissipation portion 63 is located on the surface of the rigid circuit board 50 facing away from the driving chip 30.

[0047] Taking the light-emitting side of the display module as the front side and the non-light-emitting side facing away from the light-emitting side as the back side, through testing, it is found that setting the first heat dissipation portion 61 on the front side of the driving chip 30 will affect the heat dissipation on the surface of the driving chip 30. The effect of attaching the first heat dissipation portion 61 to the back side of the driving chip 30 is better. Therefore, in this embodiment, the entire first heat dissipation member 60 is disposed on the back side of the counter substrate 20, that is, on the surface of the driving substrate 10 away from the counter substrate 20 or on a component on the same side as the surface of the driving substrate 10 away from the counter substrate 20. For example, the second heat dissipation portion 62 is located on the back side of the flexible circuit board 40, and the third heat dissipation portion 63 is located on the back side of the rigid circuit board 50 to improve the heat dissipation effect.

[0048] In an alternative embodiment, as Figure 2 shown, the display module further includes a first polarizing plate 71 disposed on the side of the driving substrate 10 away from the counter substrate 20 and a second polarizing plate 72 disposed on the side of the driving substrate 10 close to the counter substrate 20. Exemplarily, the first polarizing plate 71 and the second polarizing plate 72 have different polarization directions for light. Exemplarily, the first polarizing plate 71 is a lower polarizing plate that allows light with a polarization direction perpendicular to the plane to pass through; the second polarizing plate 72 is an upper polarizing plate that allows light with a polarization direction perpendicular to the surface to pass through, thereby achieving the purpose of controlling the propagation direction of light for display.

[0049] In this embodiment, the distance between the boundary of the first heat dissipation portion 61 close to the first polarizing plate 71 is a first distance, and the distance between the boundary of the driving chip 30 close to the first polarizing plate 71 is a second distance. The first distance is less than the second distance. That is to say, in this embodiment, the orthographic projection of the first heat dissipation portion 61 on the driving substrate 10 covers the orthographic projection of the driving chip 30 on the driving substrate 10, thereby achieving the purpose of completely dissipating heat from the driving chip 30.

[0050] In a specific example, based on the design of the first distance and the second distance, the edge of the first heat dissipation part 61 of this embodiment close to the display area can be arranged along the lower edge of the first polarizing plate 71 close to the driving chip 30, that is, the first distance is 0 mm. In another example, on the basis that the first distance is less than the second distance, a certain distance can be set between the edge of the first heat dissipation part 61 close to the display area and the lower edge of the first polarizing plate 71 close to the driving chip 30. For example, the first distance A is 1.2 - 2.0 mm, which can not only achieve the optimal heat dissipation effect of the driving chip 30, but also ensure the cost of the first heat dissipation part 60.

[0051] In an alternative embodiment, the driving chip 30 is arranged to extend along the second direction, the length of the first heat dissipation part 61 along the second direction is greater than the length of the driving chip 30 along the second direction, and the length of the first heat dissipation part 61 along the second direction is less than the length of the counter substrate 20 in the second direction. That is to say, on the basis that the first heat dissipation part 61 completely covers the driving chip 30, the first heat dissipation part 61 can be partially attached to the boundary area formed by the first polarizing plate 71 and the counter substrate 20 to reduce the cost of the first heat dissipation part 61.

[0052] In a specific example, in the second direction, the left edge of the first heat dissipation part 61 is closer to the left edge of the counter substrate 20 than the left edge of the driving chip 30, and the right edge of the first heat dissipation part 61 is closer to the right edge of the counter substrate 20 than the right edge of the driving chip 30. Exemplarily, the distance B between the left edge of the first heat dissipation part 61 and the left edge of the driving chip 30 is 5 - 20 mm. Similarly, the distance between the right edge of the first heat dissipation part 61 and the right edge of the driving chip 30 can adopt the same numerical range.

[0053] In an alternative embodiment, taking the length direction of the display module as the second direction and the width direction of the display module as the first direction, or in other words, taking the extension direction of the driving chip 30 as the second direction, the first direction is perpendicular to the second direction. Exemplarily, in Figure 6 the top view state shown, the vertical direction is the first direction and the horizontal direction is the second direction. For another example, taking Figure 1 the setting direction of the display module, the driving chip 30, the flexible circuit board 40 and the rigid circuit board 50 shown in the unfolded state as the first direction, the extension direction of the driving chip 30 is the second direction perpendicular to the first direction.

[0054] Based on the above direction definition, the left side of the second heat dissipation part 62 parallel to the first direction overlaps with the left side of the flexible circuit board 40 parallel to the first direction, and the right side of the second heat dissipation part 62 parallel to the first direction overlaps with the right side of the flexible circuit board 40 parallel to the first direction. In other words, the left and right edges of the second heat dissipation part 62 are attached along the left and right edges of the flexible circuit board 40, and the upper and lower edges cover the entire flexible circuit board 40. The heat conducted by the first heat dissipation part 61 is transferred to the second heat dissipation part 62 with a larger area, achieving heat dissipation with the largest area.

[0055] As Figure 1 shown, the orthographic projection of the second heat dissipation part 62 is a rectangular projection, which includes a wide side projection parallel to the first direction and a long side projection parallel to the second direction. In this embodiment, the "left side of the second heat dissipation part 62 parallel to the first direction" is the wide side projection on the left side in the rectangular projection of the second heat dissipation part 62, and the "right side of the second heat dissipation part 62 parallel to the first direction" is the wide side projection on the right side in the rectangular projection of the second heat dissipation part 62.

[0056] Based on the same definition, the orthographic projection of the flexible circuit board 40 is a rectangular projection, which also includes a wide side projection parallel to the first direction and a long side projection parallel to the second direction. In this embodiment, the "left side of the flexible circuit board 40 parallel to the first direction" is the wide side projection on the left side in the rectangular projection of the flexible circuit board 40, and the "right side of the flexible circuit board 40 parallel to the first direction" is the wide side projection on the right side in the rectangular projection of the flexible circuit board 40.

[0057] The third heat dissipation part 63 of this embodiment is adjacent to the second heat dissipation part 62, and the third heat dissipation part 63 extends to the rigid circuit board 50 and overlaps with the back surface of the rigid circuit board 50. Since the area of the rigid circuit board 50 is large and it is arranged on the non-light-emitting side of the display module, the third heat dissipation part 63 may not completely cover the rigid circuit board 50 to ensure cost.

[0058] In a specific example, the length C of the overlapping area between the third heat dissipation part 63 and the rigid circuit board 50 in the second direction is 2 - 4 mm, and those skilled in the art can design according to actual applications.

[0059] In an alternative embodiment, as Figure 3 shown, the display module further includes a backplane 81 with a groove, a backlight 82 arranged in the groove, and a frame 83. The frame 83 includes a clamping part 831 clamped with the backplane 81 and a bearing part 832 for bearing the counter substrate 20. The surface of the bearing part 832 away from the backplane 81 is fixed with an adhesive layer 833 on the surface of the driving substrate 10 away from the counter substrate 20.

[0060] As Figure 3 shown, the backlight 82 of this embodiment is a side - entry backlight, that is, the light source 821 is arranged on the vertical inner side wall of the back plate 81. The frame 83 is fixedly clamped with the back plate 81, so as to fix the light - emitting film material 822 and components of the backlight 82 in the back plate 81. The bearing part 832 of the frame 83 is a convex structure with a flat surface extending horizontally from the side wall of the back plate 81 towards the display center, and is used to fix the counter substrate 20 and the back plate 81 or the cover plate and the back plate 81.

[0061] In an alternative embodiment, as Figure 4 and Figure 5 shown, the display module further includes a cover plate 92 located on the side of the counter substrate 20 away from the backlight 82. The display module further includes an optical adhesive 91, which is arranged between the cover plate 92 and the counter substrate 20 to fix the two. Exemplarily, as Figure 4 and Figure 5 shown, the orthographic projection of the optical adhesive 91 on the counter substrate 20 falls within the counter substrate 20, and the orthographic projection of the cover plate 92 on the counter substrate 20 covers the counter substrate 20, that is, the area of the cover plate 92 is the largest to completely cover the counter substrate 20, so as to protect the counter substrate 20.

[0062] In an alternative embodiment, as Figure 5 shown, at the three - side edge positions of the non - flexible circuit board 40 of the display module, the top surface of the vertical side wall of the back plate 81 and the surface of the cover plate 92 facing the back plate 81 are fixed by using an adhesive material 93; at the edge position where the flexible circuit board 40 of the display module is located, at the position corresponding to the flexible circuit board 40 on this edge, the back plate 81 and the counter substrate 20 are fixed by using the adhesive layer 833 on the bearing part 832, and at the position on this edge avoiding the flexible circuit board 40, the top surface of the vertical side wall of the back plate 81 and the surface of the cover plate 92 facing the back plate 81 are fixed by using an adhesive material 93, so as to ensure the fixation of all edges of the back plate 81 and the cover plate 92. Exemplarily, the adhesive material can be double - sided tape or glue.

[0063] As Figure 4 shown, the first heat - dissipating member 60 of this embodiment is arranged on the surface of the counter substrate 20 close to the backlight 82, that is, the back surface of the counter substrate 20, to ensure the optimal heat - dissipating effect.

[0064] In an alternative embodiment, as Figure 3 and Figure 6As shown, the light source 821 is electrically connected to the rigid circuit board 50. The flexible circuit board 40 and the rigid circuit board 50 are folded to the side of the backplane 81 away from the light source 821 and fixed. The orthographic projection of the light source 821 on the side wall of the backlight 82 on the clamping portion 831 falls within the orthographic projection of the folded second heat dissipation portion 62 on the clamping portion 831. That is to say, the folded first heat dissipation member 60 wraps the light source 821. Based on the foregoing discussion, during use, the heat generated by the light source 821 of the backlight 82 is also relatively high. After the first heat dissipation member 60 of this embodiment is folded, through this setting, the folded first heat dissipation member 60 can conduct and dissipate the heat generated by the light source 821, thereby improving the problem that the heat generated by the light source 821 affects the touch function.

[0065] In this embodiment, after the flexible circuit board 40 and the rigid circuit board 50 are folded, the third heat dissipation portion 63 is located between the rigid circuit board 50 and the backplane 81. That is, after the front surface of the rigid circuit board 50 is folded, it is farther from the backplane 81 than the third heat dissipation portion 63. The front surface of the rigid circuit board 50 is arranged on the outer side for easy connection of various connecting devices.

[0066] In an alternative embodiment, as Figure 3 、 Figure 4 and Figure 6 shown, the display module further includes a second heat dissipation member 100. The orthographic projection of the second heat dissipation member 100 on the backplane 81 covers the orthographic projections of the folded flexible circuit board 40 and the rigid circuit board 50 on the backplane 81.

[0067] The second heat dissipation member 100 of this embodiment is arranged outside the folded flexible circuit board 40 and the rigid circuit board 50. That is, as Figure 3 、 Figure 4 and Figure 6 shown, after the backlight 82, the cover plate 92, and the counter substrate 20 are assembled, the second heat dissipation member 100 is attached to the side of the flexible circuit board 40 away from the backplane 81 and the side of the rigid circuit board 50 away from the backplane 81. The second heat dissipation member 100 covers the flexible circuit board 40 and the rigid circuit board 50 that fall within the orthographic projection on the backplane 81 after folding to achieve heat dissipation with the maximum area.

[0068] After the display module is assembled, for the first heat sink 60 located on the back side of the driving chip 30, the first heat dissipation part 61 can dissipate the heat of the driving chip 30 and radiate the heat into the air; on the other hand, the heat generated by the light source 821 of the backlight 82 is transferred to the side wall on the backplane 81 side, and the folded second heat dissipation part 62 and the third heat dissipation part 63 are in contact with the backplane 81 to transfer the heat to the backplane 81; moreover, the first heat sink 60 and the second heat sink 100 are respectively arranged on both side surfaces of the flexible circuit board 40 and the rigid circuit board 50 and have overlapping projections, and the heat of the first heat sink 60 can be transferred to the second heat sink 100 with a larger area, and further transfer the heat to other areas of the backplane 81, so as to achieve the purpose of using the first heat sink 60 and the second heat sink 100 to dissipate heat from the driving chip 30 and the light source 821, and effectively control the temperature rise performance of the product.

[0069] In an alternative embodiment, as Figure 6 shown, the second heat sink includes an avoidance opening for avoiding the connecting member on the side of the backplane 81 away from the backlight 82, so as to prevent the second heat sink 100 from affecting the connection effect of the rigid circuit board 50 of the connecting device.

[0070] In an alternative embodiment, both the first heat sink 60 and the second heat sink 100 include:

[0071] a substrate layer, a heat dissipation layer provided on one side surface of the substrate layer, a heat spreading layer provided on the other side surface of the substrate layer, and a thermal conductive adhesive layer provided on the side surface of the heat spreading layer away from the substrate layer.

[0072] That is to say, the film layer structures and materials of the first heat sink 60 and the second heat sink 100 in this embodiment are the same, but the application positions are different.

[0073] For the first heat sink 60, the surface of the thermal conductive adhesive layer away from the substrate layer is fixed to the surface of the driving substrate 10 away from the driving chip 30, the surface of the flexible circuit board 40 away from the driving chip 30, and the surface of the rigid circuit board 50 away from the driving chip 30. For the second heat sink 100, the surface of the thermal conductive adhesive layer away from the substrate layer is fixed to the surface of the backplane 81 away from the backlight 82.

[0074] In an alternative embodiment, the heat spreading layer includes a metal material, so as to play a role in shielding charges and ensure the electrical performance of the display module.

[0075] In an alternative embodiment, the side of the rigid circuit board 50 close to the backplane 81 includes a copper leakage area 51, and a conductive layer 52 is disposed between the copper leakage area 51 and the backplane 81, serving the purpose of grounding the copper leakage area 51 and further ensuring the electrical performance of the display module.

[0076] Another embodiment of the present invention provides a display panel, which includes the display module described in the above embodiment of the present invention.

[0077] Another embodiment of the present invention provides a display device, which includes the display module of the embodiment of the present invention. Among them, the display device can be any product or component with a display function such as an electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc., and this embodiment does not make any limitations in this regard. In a specific example, the display device of this embodiment is a vehicle-mounted display device, which can have good heat dissipation and temperature rise effects in the limited heat dissipation environment inside the vehicle.

[0078] In the description of the present invention, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variation thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device including a series of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device including the element.

[0079] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation manners here. Any obvious changes or modifications derived from the technical solutions of the present invention still fall within the protection scope of the present invention.

Claims

1. A display module, comprising a display screen, the display screen including a driving substrate and a counter substrate disposed opposite to the driving substrate in the thickness direction of the display module, characterized in that, The display module further includes: a driving chip electrically connected to the driving substrate, a flexible circuit board bonded to the driving chip, and a rigid circuit board bonded to the flexible circuit board. The display module further includes a first heat dissipation member, and the first heat dissipation member includes: a first heat dissipation portion covering the driving chip; a second heat dissipation portion covering the flexible circuit board; and a third heat dissipation portion having an overlapping area with the rigid circuit board.

2. The display module according to claim 1, wherein The driving chip is disposed on the surface of the driving substrate close to the opposing substrate side, the first heat dissipation portion is disposed on the surface of the driving substrate away from the opposing substrate side, the second heat dissipation portion is located on the surface of the flexible circuit board facing away from the driving chip side, and the third heat dissipation portion is located on the surface of the rigid circuit board facing away from the driving chip side.

3. The display module according to claim 1, wherein The display module further includes a first polarizing plate disposed on the side of the driving substrate away from the opposing substrate and a second polarizing plate disposed on the side of the driving substrate close to the opposing substrate. The distance between the boundaries of the first heat dissipation portion close to the first polarizing plate is a first distance, and the distance between the boundaries of the driving chip close to the first polarizing plate is a second distance, and the first distance is less than the second distance.

4. The display module according to claim 1, wherein Taking the length direction of the display module as the second direction and the width direction of the display module as the first direction, The left side portion of the second heat dissipation portion parallel to the first direction overlaps with the left side portion of the flexible circuit board parallel to the first direction, and the right side portion of the second heat dissipation portion parallel to the first direction overlaps with the right side portion of the flexible circuit board parallel to the first direction.

5. The display module according to claim 1, characterized in that, The display module further includes a back plate having a groove, a backlight disposed in the groove, and a frame. The frame includes a clamping portion clamped to the back plate and a carrying portion for carrying the opposing substrate. The surface of the carrying portion away from the back plate side is fixed to the surface of the driving substrate away from the opposing substrate side.

6. The display module according to claim 5, wherein The flexible circuit board and the rigid circuit board are folded and fixed to the side of the back plate away from the light source. The orthographic projection of the light source on the side wall of the backlight on the clamping portion falls on the orthographic projection of the folded second heat dissipation portion on the clamping portion. The third heat dissipation portion is located between the rigid circuit board and the back plate. The display module further includes a second heat dissipation member, and the orthographic projection of the second heat dissipation member on the back plate covers the orthographic projections of the folded flexible circuit board and the rigid circuit board on the back plate.

7. The display module according to claim 6, wherein The second heat dissipation member includes an avoidance opening for avoiding the connecting member on the side of the back plate away from the backlight.

8. The display module according to claim 6, wherein Both the first heat dissipation member and the second heat dissipation member include: a base material layer, a heat dissipation layer disposed on one side surface of the base material layer, a heat conduction uniform layer disposed on the other side surface of the base material layer, and a thermal conductive adhesive layer disposed on the surface of the heat conduction uniform layer away from the base material layer. The surface of the thermal conductive adhesive layer away from the base material layer is fixed to the surface of the driving substrate facing away from the driving chip side, the surface of the flexible circuit board facing away from the driving chip side, and the surface of the rigid circuit board facing away from the driving chip side. Or The surface of the heat-conducting adhesive layer away from the substrate layer is fixed to the surface of the back plate away from the backlight source.

9. The display module according to claim 8, wherein The heat-smoothing layer comprises a metallic material.

10. The display module according to claim 6, wherein, The side of the rigid circuit board close to the back plate includes a copper leakage area, and a conductive layer is provided between the copper leakage area and the back plate.

11. A display panel, characterized in that, The display panel comprises the display module according to any one of claims 1 to 10.

12. A display device, characterized in that, The display device comprises the display panel according to claim 11.

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