Heat dissipation module, heat dissipation device comprising same, radio frequency module for antenna, antenna device and lighting device

By using a heat dissipation module filled with refrigerant in the main body of the heat conducting plate in the electronic device, the problem of heat dissipation difficulties in miniaturized electronic devices is solved, and the diversified arrangement of functional elements and the expansion of vertical beam range are achieved. It is suitable for Massive MIMO for 5G to 6G communication.

CN223067409UActive Publication Date: 2025-07-04KMW INC
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Patent Information

Application Number
CN202422063661.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Priority Date
2024-08-13
Filing Date
2024-08-23
Publication Date
2025-07-04
Estimated Expiration
2034-08-23

AI Technical Summary

Technical Problem

In the prior art, the heat dissipation design of electronic devices is difficult to dissipate heat in functional elements under the trend of miniaturization and compactness. Especially in antenna devices, the inclination range of the vertical beam is limited and the heat generation increases, which affects performance.

Method used

A heat dissipation module filled with refrigerant is adopted to achieve rapid heat dissipation through gas-liquid circulation, including the inner and outer heat dissipation parts, respectively, and the refrigerant flow space flowing through surface tension and gravity, combined with the heating element to improve heat dissipation efficiency.

Benefits of technology

The diversified layout design of functional components is realized to prevent performance degradation, and the tilt range of the vertical beam is expanded, suitable for enhanced version of Massive MIMO for 5G to 6G communication.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a heat dissipation module, a heat dissipation device comprising the heat dissipation module, a radio frequency module for an antenna, an antenna device and a lighting device, in particular to a heat conduction plate main body which is provided with a refrigerant flowing space which is filled with a refrigerant and performs gas-liquid circulation so as to enable the refrigerant to be subjected to phase change in a closed space and release heat, the refrigerant flow space includes: a first section that is an evaporation region in which heat is received from a heat-generating body to be radiated; and a second section that is a path through which a liquid refrigerant, among the refrigerants, condensed from a gas state to a liquid state flows to the first section by means of surface tension or gravity. The heat generating body is coupled to an outer side of the heat transfer plate body corresponding to the first section in one of an insertion manner and a joining manner, thereby providing an advantage of being capable of securing diversity of arrangement designs of functional elements and preventing deterioration of performance of the functional elements.
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Description

Technical Field

[0001] The utility model relates to a heat dissipation module, a heat dissipation device including the same, a radio frequency module for an antenna, an antenna device and a lighting device. More specifically, it relates to a heat dissipation module, a heat dissipation device including the same, a radio frequency module for an antenna, an antenna device and a lighting device which can quickly discharge the system operation heat from the installation space to the outside when the limited installation space of a heat generating body operated by electricity needs to be dispersed and arranged, so as to further improve the performance of the device. Background Art

[0002] Generally, an electronic device (electronic equipment) is a device or equipment driven by electric energy.

[0003] Inside the above-mentioned electronic device (electronic equipment), there are functional elements which are the main system operation components and are driven by the supplied electric energy to generate predetermined driving heat.

[0004] However, as is well known, the main performance of an electronic device (electronic equipment) depends on discharging the driving heat generated by the above-mentioned functional elements as quickly and effectively as possible. However, recently, the design trend of electronic devices (electronic equipment) is miniaturization and compactness, and since the main heat dissipation parts of each electronic device (electronic equipment) are different in their inherent functions, there is a trend that it has to be designed to use a part of the electronic device (electronic equipment) for centralized heat dissipation, thus there is a problem of greatly limiting the diversity in product design.

[0005] As a representative electronic device (electronic equipment) having the above-mentioned functional elements and components that need heat dissipation, a wireless communication device (for example, an antenna device) manufactured by the applicant of the present utility model can be cited.

[0006] In particular, in an antenna device which is one of the representative electronic devices (electronic equipment), beamforming is a signal processing technology that concentrates a directional signal to a specific position or receiver. Generally, in order to achieve a sharp beam pattern formed by a plurality of radiating elements, an array antenna (Array Antenna) arranged with a plurality of radiating elements is used. Here, in order to make the beam narrower, the antenna elements are arranged in the form of a sub-array, and each sub-array is equipped with a radio frequency (RF: Radio Frequency) chain.

[0007] In addition, if low-orbit satellite communication services for drones or urban air mobility (UAM) etc. emerge in the future, a living circle about 200 - 300 m above the ground will be formed. To cope with this, the antenna also needs to cover an area higher than its installation position.

[0008] However, in the case where the antenna elements are configured as a sub-array, the tilting range (tilting range or steering range) of the vertical beam is very limited (64TRx reference), about ±10 degrees, and there is a problem of sidelobe and scan loss phenomena occurring when forced to tilt.

[0009] To solve this problem, there is a trend to convert to a digital control method of controlling each antenna unit at the digital end. In this case, the heat generation of individual functional elements (such as heating elements) further increases. Thus, the current heat dissipation problem for preventing the performance degradation of functional elements is more urgent.

[0010] This is also one of the main problems in lighting devices that perform the main function of directly converting electrical energy into light energy. SUMMARY OF THE UTILITY MODEL

[0011] The present utility model is proposed to solve the above technical problems, and its purpose is to provide a heat dissipation module capable of providing diversity in the layout design of the main functional elements inside an electronic device (electronic equipment), a heat dissipation device including the heat dissipation module, an RF module for an antenna, an antenna device, and a lighting device.

[0012] Moreover, another purpose of the present utility model is to provide a heat dissipation module capable of preventing the performance degradation of functional elements by quickly and effectively releasing the system operation heat generated by the functional elements disposed in a closed installation space to the outside, a heat dissipation device including the heat dissipation module, an RF module for an antenna, an antenna device, and a lighting device.

[0013] In addition, yet another purpose of the present utility model is to provide an RF module for an antenna and an antenna device including the same. When the electronic device is implemented as an antenna device, the signals of each radiation element are individually controlled at the digital end by making the RF chain correspond to the signals of each radiation element, thereby being able to expand the tilting range of the vertical beam, and being able to achieve Massive MIMO for next-generation communication from enhanced 5G (5G-Advanced) to 6G by improving and applying a heat dissipation structure that effectively releases the heat generated by the heating surface of the antenna unit.

[0014] The technical problems of the present utility model are not limited to the above-mentioned technical problems, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the technical field to which the present utility model belongs from the following description.

[0015] The heat dissipation module according to an embodiment of the present utility model includes: a heat conducting plate body having a refrigerant flow space which is a space for filling a refrigerant therein and performing a gas-liquid cycle to cause the refrigerant to undergo a phase change in a closed space to release heat. Wherein, the refrigerant flow space includes: a first section which is an evaporation area for receiving heat from a heating element to be cooled; and a second section which is a path for the liquid refrigerant, which is condensed from a gaseous state to a liquid state in the refrigerant, to flow toward the first section by surface tension or gravity. The heating element is combined with the outer side of the heat conducting plate body corresponding to the first section in one of an insertion manner and a bonding manner.

[0016] Wherein, the first section in the refrigerant flow space can be arranged in the inner space where the heating element is arranged, and the second section in the refrigerant flow space can be arranged such that at least a part thereof is physically exposed to the outer space partitioned from the inner space.

[0017] In addition, in the case where the inner space and the outer space are physically partitioned by a housing body, the first section in the refrigerant flow space can be relatively located at the lower part with respect to the gravity direction and arranged in the inner space of the housing body, and the second section in the refrigerant flow space can be relatively located at the upper part with respect to the gravity direction and arranged to be exposed to the outer space which is the outside of the housing body.

[0018] In addition, in the refrigerant flow space, the first section and the second section can be formed to communicate with each other so that the refrigerant undergoes a phase change while performing a gas-liquid cycle to flow to the lower end of the first section and the upper end of the second section.

[0019] In addition, when a part of the heat conducting plate body corresponding to the first section is defined as an inner heat dissipation part, the inner heat dissipation part can be equipped with one of a heat pipe and a first phase change fin which fills a refrigerant therein and causes the filled refrigerant to undergo a phase change to perform a gas-liquid cycle.

[0020] In addition, one surface of the first phase change fin can be equipped with SUS material and the other surface can be equipped with Cu material.

[0021] In addition, when a part of the heat conducting plate body corresponding to the second section is defined as an outer heat dissipation part, the outer heat dissipation part can be equipped with a second phase change fin which communicates with the first section and exchanges heat between the refrigerant which has changed from the first section to a gaseous state and external air to be condensed into a liquid state refrigerant.

[0022] In addition, one surface of the second phase change fin can be equipped with SUS material and the other surface can be equipped with Cu material.

[0023] A heat dissipation device according to an embodiment of the present invention may include: a functional element that is electrically driven and performs a predetermined function; a plurality of device modules configured to control the functional element by module; and a heat dissipation module coupled in a vertical or horizontal direction with respect to the device module to discharge heat generated by a heat generating surface of a heat generating body provided in the device module according to function, wherein the heat dissipation module may include: a heat conducting plate body having a refrigerant flow space that is a space in which a refrigerant is filled and undergoes gas-liquid circulation to cause the refrigerant to change phase in a closed space to release heat, wherein the refrigerant flow space may include: a first section that is an evaporation area for receiving heat from a heat generating body to be dissipated; and a second section that is a path for the liquid refrigerant in the refrigerant, which condenses from a gas state to a liquid state, to flow toward the first section by surface tension or gravity, wherein the heat generating body may be coupled to an outer side of the heat conducting plate body corresponding to the first section in one of an insertion manner and a bonding manner.

[0024] Wherein, the first section in the refrigerant flow space may be disposed in an inner space where the heat generating body is disposed, and the second section in the refrigerant flow space may be arranged such that at least a part thereof is physically exposed to an outer space partitioned from the inner space.

[0025] In addition, in a case where the inner space and the outer space are physically partitioned by a housing body, the first section in the refrigerant flow space may be relatively located at a lower portion with respect to the direction of gravity and disposed in an inner space of the housing body, and the second section in the refrigerant flow space may be relatively located at an upper portion with respect to the direction of gravity and arranged to be exposed to an outer space that is an outside of the housing body.

[0026] In addition, in the refrigerant flow space, the first section and the second section may be formed to communicate with each other such that the refrigerant undergoes gas-liquid circulation while changing phase to flow to a lower end of the first section and an upper end of the second section.

[0027] In addition, when a part of the heat conducting plate body corresponding to the first section is defined as an inner heat dissipation part, the inner heat dissipation part may be configured as one of a heat pipe and a first phase change fin that fills a refrigerant therein and causes the filled refrigerant to change phase to perform gas-liquid circulation.

[0028] In addition, one surface of the first phase change fin may be made of SUS material and the other surface may be made of Cu material.

[0029] In addition, when a part of the heat conducting plate body corresponding to the second interval is defined as an outer heat dissipation part, the outer heat dissipation part can be provided with a second phase change fin which communicates with the first interval and enables the refrigerant that has changed from a gas state in the first interval to exchange heat with the external air and be condensed into a liquid state refrigerant.

[0030] In addition, one side of the second phase change fin can be made of SUS material and the other side can be made of Cu material.

[0031] An RF module for an antenna according to an embodiment of the present invention includes: a radiation element having at least one polarization; a plurality of antenna units including RF chains corresponding to each polarization of the radiation element to independently control the polarization of the radiation element; and a heat dissipation module coupled in a vertical or horizontal direction with respect to the antenna unit to discharge heat generated by a heat generating surface of a heat generating body of the antenna units of each polarization provided in the adjacent plurality of antenna units, wherein the heat dissipation module includes: a heat conducting plate body having a refrigerant flow space which is a space for filling a refrigerant inside and performing gas-liquid circulation to cause the refrigerant to change phase in a closed space to release heat, wherein the refrigerant flow space includes: a first interval which is an evaporation region for receiving heat from a heat generating body to be dissipated; and a second interval which is a path for the liquid refrigerant in the refrigerant that has condensed from a gas state to a liquid state to flow toward the first interval by surface tension or gravity, wherein the heat generating body is coupled to the outside of the heat conducting plate body corresponding to the first interval in one of an insertion manner and a bonding manner.

[0032] An RF module for an antenna according to another embodiment of the present invention includes: a radiation element having a plurality of polarizations; a plurality of antenna units stacked on each other and including RF chains corresponding to each polarization of the radiation element; and a heat dissipation module for discharging heat generated by a plurality of vertically arranged heat generating bodies, such that the heat generating surfaces of the plurality of heat generating bodies and one side surfaces of a plurality of RF filters related to one polarization in the adjacent plurality of antenna units face left and right respectively, wherein the heat dissipation module includes: a heat conducting plate body having a refrigerant flow space which is a space for filling a refrigerant inside and performing gas-liquid circulation to cause the refrigerant to change phase in a closed space to release heat, wherein the refrigerant flow space includes: a first interval which is an evaporation region for receiving heat from a heat generating body to be dissipated; and a second interval which is a path for the liquid refrigerant in the refrigerant that has condensed from a gas state to a liquid state to flow toward the first interval by surface tension or gravity, wherein the heat generating body is coupled to the outside of the heat conducting plate body corresponding to the first interval in one of an insertion manner and a bonding manner.

[0033] Each of the plurality of antenna units may include: a first polarization antenna unit associated with one polarization of the radiation element configured to radiate a dual-polarization beam; and a second polarization antenna unit associated with the other polarization of the radiation element configured to radiate a dual-polarization beam.

[0034] In addition, the first polarization antenna unit may include: a plurality of one-side RF filters stacked in a column in the vertical direction and vertically stacked in a tiled structure such that both ends in the longitudinal direction are located at the front and rear, respectively, and the second polarization antenna unit may include: a plurality of the other-side RF filters stacked in a column in the vertical direction and vertically stacked in a tiled structure such that both ends in the longitudinal direction are located at the front and rear, respectively, and stacked in the left-right direction with respect to one of the left and right side surfaces of the plurality of one-side RF filters, wherein filters stacked in a tiled structure at the same position in the vertical direction among the plurality of one-side RF filters and the plurality of the other-side RF filters may constitute two RF channels.

[0035] In addition, each of the plurality of antenna units may further include: a one-side feeder and a the other-side feeder for supplying a predetermined electrical signal to the plurality of one-side RF filters and the plurality of the other-side RF filters constituting the two RF channels; and a PA board having a heating element associated with one of the two RF channels mounted on one of two surfaces, wherein the PA board may be stacked and arranged in the tiled structure on one of the left and right side surfaces of the plurality of one-side RF filters and the plurality of the other-side RF filters.

[0036] In addition, the plurality of heating elements mounted on the PA board include at least one of a power amplifier (PA), a low noise amplifier (LNA), and an RFIC.

[0037] In addition, the heat dissipation module may be stacked and arranged in surface thermal contact with the outer surfaces of the PA boards of the first polarization antenna unit and the second polarization antenna unit, respectively, to receive and release heat generated by the plurality of heating elements.

[0038] In addition, the heat dissipation module may include: an inner heat dissipation part in surface thermal contact with the side surface of the PA board on which the plurality of heating elements are mounted; and an outer heat dissipation part for exchanging heat with external air to release the heat transferred from the inner heat dissipation part.

[0039] In addition, the inner heat dissipation part and the outer heat dissipation part may be formed to communicate with each other to fill a refrigerant therein and circulate the filled refrigerant in a gas-liquid cycle.

[0040] In addition, the inner heat dissipation part can be equipped with one of a plurality of heat pipes filled with a refrigerant inside and performing gas-liquid circulation by phase-changing the filled refrigerant and a plate-type heat exchange type first phase-change fin.

[0041] In addition, the inner heat dissipation part and the outer heat dissipation part can be equipped with a plate-type heat exchange type second phase-change fin formed to communicate with each other and filled with a refrigerant inside, and the filled refrigerant performs gas-liquid circulation from the inner heat dissipation part to the outer heat dissipation part.

[0042] In addition, one side of the inner heat dissipation part equipped with the plate-type heat exchange type first phase-change fin that makes surface thermal contact with one side surface of the PA plate can be made of Cu material, and the other side that does not make surface thermal contact with one side surface of the PA plate can be made of SUS material.

[0043] In addition, both sides of the outer heat dissipation part and the inner heat dissipation part equipped with the plate-type heat exchange type second phase-change fin can be made of SUS material.

[0044] In addition, both sides of the outer heat dissipation part equipped with the plate-type heat exchange type second phase-change fin can be made of SUS material. One side of the inner heat dissipation part equipped with the plate-type heat exchange type second phase-change fin that makes surface thermal contact with one side surface of the PA plate can be made of Cu material, and the other side that does not make surface thermal contact with one side surface of the PA plate can be made of SUS material.

[0045] In addition, the inner heat dissipation part and the outer heat dissipation part can be manufactured by joining the edges of two metal plate components manufactured by a die-casting process to form a refrigerant flow space filled with the refrigerant inside. In the two metal plate components, a plurality of strength reinforcement parts can be formed by die-casting process to strengthen their own rigidity and be joined to each other at least inside the refrigerant flow space.

[0046] In addition, when the two metal plate components are made of Cu material or SUS material, water can be used as the refrigerant.

[0047] In addition, the radiation element can include: a first polarization element arranged to be connected to a signal transmitted along the one-side feeder and connected to the plurality of one-side RF filters; and a second polarization element arranged to be connected to a signal transmitted along the other-side feeder and connected to the plurality of the other-side RF filters. Among them, the first polarization element and the second polarization element can cross each other and be arranged at the front ends of the plurality of one-side RF filters and the plurality of the other-side RF filters.

[0048] In addition, the front faces of the plurality of one-side RF filters and the plurality of the other-side RF filters can function as reflectors that reflect the beam radiated from the radiation element forward.

[0049] In addition, the radiation element may further include: a base panel, arranged to divide between the plurality of one-side RF filters and the plurality of the other-side RF filters and the first polarization element and the second polarization element, and support the first polarization element and the second polarization element, wherein the base panel may have a front protruding height that cuts off the radiation of the radiation beam radiated from the first polarization element and the second polarization element to an adjacent radiation element.

[0050] In addition, the base panel may be supported forward by the PA board.

[0051] An RF module for an antenna according to another embodiment of the present invention includes: a radiation element having dual polarization; a first polarization antenna unit and a second polarization antenna unit, including RF chains corresponding to the respective polarizations of the radiation element to separately control the dual polarization of the radiation element; and a heat dissipation module that discharges heat generated by the heat generating surfaces of the respective heat generating bodies provided in the first polarization antenna unit and the second polarization antenna unit, wherein the heat dissipation module is of a plate-type heat exchange type, and the respective heat generating bodies of the first polarization antenna unit and the second polarization antenna unit are arranged in surface thermal contact on one surface and the other surface thereof, respectively.

[0052] Among them, the first polarization antenna unit may include: a plurality of one-side RF filters, stacked in a column in a stack-up manner in the vertical direction, and vertically stacked and arranged in a tiled structure with both ends in the length direction located in the front and rear, respectively, and the second polarization antenna unit may include: a plurality of the other-side RF filters, stacked in a column in a stack-up manner in the vertical direction, and vertically stacked and arranged in a tiled structure with both ends in the length direction located in the front and rear, respectively, and stacked in the left-right direction with respect to one of the left and right side surfaces of the plurality of one-side RF filters, wherein the filters stacked and arranged in a tiled structure at the same position in the vertical direction among the plurality of one-side RF filters and the plurality of the other-side RF filters may constitute two RF channels.

[0053] In addition, each of the plurality of antenna units may further include: a side feeder and an opposite-side feeder for supplying a predetermined electrical signal to the plurality of one-side RF filters and the plurality of opposite-side RF filters constituting the two RF channels; and a PA board, on one of the two surfaces of which a heating element related to one of the two RF channels is mounted. The PA board may be stacked and arranged in a tiled structure on one of the left and right side surfaces of the plurality of one-side RF filters and the plurality of opposite-side RF filters.

[0054] In addition, a single heat dissipation module may include: an inner heat dissipation part in surface thermal contact with one surface of the PA board on which the plurality of heating elements are mounted; and an outer heat dissipation part for releasing the heat transferred from the inner heat dissipation part through heat exchange with external air.

[0055] In addition, the length of the front-to-back width of the one-side RF filter and the opposite-side RF filter may be greater than the length of the front-to-back width of the inner heat dissipation part in the heat dissipation module. The first polarization antenna unit and the second polarization antenna unit may be respectively coupled to one surface and the other surface of a single heat dissipation module with a PA board related to the two RF channels therebetween by fixing screws fastened through a front coupling flange and a rear coupling flange formed at the front end and the rear end of the one-side RF filter and the opposite-side RF filter.

[0056] An antenna device according to an embodiment of the present invention includes: an antenna housing body in a box shape with an open front and a setting space formed therein; a digital board stacked and coupled to the setting space in a close-contact manner on its back surface, and having a heating element mounted on at least one of the two surfaces; and an antenna RF module electrically connected to the digital board and vertically arranged in the up-down direction so that its two surfaces face the left and right directions in the setting space respectively. The antenna RF module includes: a radiation element having at least one polarization; a plurality of antenna units including RF chains corresponding to each polarization of the radiation element for individually controlling the polarization of the radiation element; and a heat dissipation module coupled to the antenna unit in the vertical or horizontal direction to discharge heat generated by the heating surfaces of the heating elements of the antenna units of each polarization provided in the adjacent plurality of antenna units. The heat dissipation module includes: an inner heat dissipation part extending into the setting space to receive and conduct heat from the heating element; and an outer heat dissipation part extending outside the setting space to exchange heat of the heat transferred from the inner heat dissipation part with air in the external space (external air).

[0057] Each of the plurality of antenna units may include: a first polarization antenna unit associated with one polarization of the radiation element configured to radiate a dual-polarization beam; and a second polarization antenna unit associated with the other polarization of the radiation element configured to radiate a dual-polarization beam.

[0058] In addition, the first polarization antenna unit may include: a plurality of one-side RF filters stacked in a column in the up-down direction and vertically stacked in a tiled structure such that both ends in the length direction are located in the front and back, respectively. The second polarization antenna unit may include: a plurality of the other-side RF filters stacked in a column in the up-down direction and vertically stacked in a tiled structure such that both ends in the length direction are located in the front and back, respectively, and stacked in the left-right direction with respect to one of the left and right side surfaces of the plurality of one-side RF filters. Among them, the filters stacked in a tiled structure at the same position in the up-down direction among the plurality of one-side RF filters and the plurality of the other-side RF filters may constitute two RF channels.

[0059] In addition, each of the plurality of antenna units may further include: a one-side feeder and a the other-side feeder for supplying a predetermined electrical signal to the plurality of one-side RF filters and the plurality of the other-side RF filters constituting the two RF channels; and a PA board with a heating element related to one of the two RF channels mounted on one of the two surfaces. The PA board may be stacked and arranged in the tiled structure on one of the left and right side surfaces of the plurality of one-side RF filters and the plurality of the other-side RF filters, and the inner heat dissipation part in the heat dissipation module may be stacked and arranged in the tiled structure in surface thermal contact with the outer surface of the PA board.

[0060] In addition, a plug head for electrically plugging and connecting with the digital board may be provided at the rear end of both ends in the front-back width direction of the PA board, and a socket part for plugging and connecting the plug head of the PA board may be provided on the digital board.

[0061] In addition, the outer heat dissipation part in the heat dissipation module may be exposed to the external space through the upper end of the antenna housing body, and a guide groove for guiding the insertion connection when plugging and connecting the PA board and the digital board may be formed along the front-back direction for a relatively long length at the upper end of the antenna housing body.

[0062] In addition, the outer heat dissipation part in the heat dissipation module can be exposed to the external space through the upper end part of the antenna housing body. Among them, the antenna device can further include: a finger protection panel assembly, which is combined with the antenna housing body in a manner that does not contact and surround the outer heat dissipation part exposed to the external space through the upper end part of the antenna housing body.

[0063] In addition, the finger protection panel assembly can be configured to cover all the remaining parts except the front part of the outer heat dissipation part exposed to the upper end part of the antenna housing body. Among them, the antenna device can further include: an antenna cover panel, which covers the front of the opening of the antenna housing body and is made of a material that allows the beam radiated from the radiation element to pass through. Among them, an antenna cover extension panel that covers the front part of the outer heat dissipation part not covered by the finger protection panel assembly can be integrally formed on the upper part of the antenna cover panel.

[0064] In addition, a plurality of ventilation holes through which the air in the external space passes can be formed in at least a part of the finger protection panel assembly and the antenna cover extension panel.

[0065] An antenna device according to another embodiment of the present invention includes: an antenna housing body, which is in the shape of a box with an opening in the front and a setting space formed inside; a digital board, the back surface of which is laminated and combined in a close contact manner with the setting space, and at least one of the two surfaces is mounted and arranged with a heating element; and an antenna RF module, which is electrically connected to the digital board and is vertically arranged in the up-down direction so that its two surfaces face the left-right direction in the setting space respectively. Among them, the antenna RF module includes: a radiation element with dual polarization; a first polarization antenna unit and a second polarization antenna unit, which include RF chains corresponding to the polarizations of the radiation element respectively to independently control the dual polarization of the radiation element; and a heat dissipation module, which discharges the heat generated by the heat generating surfaces of the heating elements respectively provided in the first polarization antenna unit and the second polarization antenna unit. Among them, the heat dissipation module is of a plate-type heat exchange type, and the heat generating surfaces of the first polarization antenna unit and the second polarization antenna unit are respectively arranged in surface thermal contact on one surface and the other surface thereof.

[0066] A lighting device according to an embodiment of the present invention includes: a lighting main body in the shape of a box, having one side open to emit light and having a setting space formed inside; an LED substrate disposed in the setting space of the lighting main body, with LED elements mounted on at least one of two sides; and an LED module electrically connected to the LED substrate and vertically arranged in the up-down direction in the setting space, wherein the LED module includes a heat dissipation module coupled to one or the other side of the LED substrate in the vertical or horizontal direction to discharge heat generated by the heat generating surface of the LED elements mounted on the LED substrate, wherein the heat dissipation module includes: an inner heat dissipation part extending into the setting space to receive heat from the LED elements and conduct it; and an outer heat dissipation part extending outside the setting space to exchange heat of the heat transferred from the inner heat dissipation part with air (external air) in the external space.

[0067] The heat dissipation module according to an embodiment of the present invention, a heat dissipation device including the heat dissipation module, an antenna RF module, an antenna device, and a lighting device have the effect of ensuring diversity in the layout design of the main functional elements inside an electronic device (electronic equipment).

[0068] In addition, the present invention has the effect of preventing performance degradation of functional elements by quickly and effectively releasing the system operation heat generated by the functional elements disposed in the enclosed setting space to the outside.

[0069] Moreover, the present invention has the effect that even without constructing the radiation elements as a sub-array, signals of each radiation element can be individually controlled at the digital end, thereby greatly increasing the tilt range of the vertical beam.

[0070] In addition, the present invention has the following effects: the heat generated by the heat generating surface of the antenna unit can be effectively released, and by stacking a large number of antenna units in a stacked (stack-up) and tiled structure, the effect of Massive MIMO for next-generation communication from enhanced 5G (5G-Advanced) to 6G can be achieved without increasing the size of the antenna device. BRIEF DESCRIPTION OF THE DRAWINGS

[0071] Figure 1a and Figure 1b are perspective views showing the front appearance and the rear appearance of an antenna device according to an embodiment of the present invention.

[0072] Figure 2a and Figure 2b are respectively Figure 1a and Figure 1b exploded perspective views of

[0073] Figure 3 It is a perspective view showing the state of the radome panel and the finger guard panel assembly in the configuration of removing Figure 1a .

[0074] Figure 4 As Figure 3 a disassembled perspective view of Figure 3 , it is a disassembled perspective view showing the combined state of the unit RF chain unit and the antenna housing body in the configuration of

[0075] Figure 5 It is a rear part perspective view of the plug part of the unit RF chain unit showing Figure 4 .

[0076] Figure 6 It is a left and right perspective view of the unit RF chain unit showing Figure 4 .

[0077] Figure 7a And Figure 7b are Figure 6 the disassembled perspective views of (a) and (b) of

[0078] Figure 8 It is a perspective view showing each polarization antenna unit of the radiation element.

[0079] Figure 9a And Figure 9b are Figure 8 the disassembled perspective views of (a) and (b) of

[0080] Figure 10 It is Figure 3 the front view of

[0081] Figure 11 It is a sectional view taken along the A-A line of Figure 10 .

[0082] Figure 12 It is a cutaway perspective view taken along the A-A line of Figure 10 .

[0083] Figure 13 For (a) of Figure 8 , it is a side view of (a) of Figure 13 , and for (b) of Figure 13 , it is a sectional view taken along the B-B line of (a) of

[0084] Figure 14 It is a perspective view showing another embodiment of the antenna unit in the configuration of the antenna RF module 100 according to an embodiment of the present invention.

[0085] Figure 15 It is Figure 14Exploded perspective view.

[0086] Figure 16 is a cross-sectional view taken along the Figure 14 C-C line of

[0087] Figure 17 is a partially cut-away perspective view and a partially enlarged perspective view from another angle of a lighting device 1a including a heat dissipation module 150 showing an embodiment of the present utility model.

[0088] Description of reference numerals

[0089] 1: Antenna device 10: Antenna housing body

[0090] 10S: Installation space 15: Digital board

[0091] 16: Socket part 17: Guide groove

[0092] 20: Antenna cover panel 25: Antenna cover extension panel

[0093] 26, 36: Vent holes 30: Finger protection panel assembly

[0094] 100: Antenna RF module 110: Antenna unit

[0095] 120: Radiation element 130: RF filter

[0096] 135: Flip cover 140: PA board

[0097] 145: Heating element (PA element) 150: Heat dissipation module

[0098] 151: Inner heat dissipation part 152: Outer heat dissipation part

[0099] 153, 154: Strength reinforcement parts 155: Edge Detailed description of the embodiments

[0100] Hereinafter, a heat dissipation module, a heat dissipation device including the same, an antenna RF module, an antenna device, and a lighting device according to an embodiment of the present utility model will be described in detail with reference to the drawings.

[0101] It should be noted that when assigning reference numerals to the components of each drawing, the same reference numerals are assigned to the same components as much as possible even if they are shown in different drawings. In addition, in the process of describing the embodiments of the present utility model, when it is determined that the detailed description of related well-known components or functions hinders the understanding of the embodiments of the present utility model, the detailed description thereof is omitted.

[0102] When describing the components of the embodiments of the present utility model, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish one component from another, and the nature, order or sequence of the corresponding components is not limited by these terms. In addition, unless otherwise defined, all terms used herein (including technical terms and scientific terms) have the same meaning as those commonly understood by persons of ordinary skill in the technical field to which the present utility model belongs. Terms that are the same as those defined in a commonly used dictionary should be interpreted as having the same meaning as the meaning in the context of the related art, and should not be interpreted as having an ideal or excessive formal meaning unless clearly defined in this application.

[0103] For example, since it is difficult to show all kinds of electronic devices (electronic equipment) in the following Figures 1a to 16 referred to for explaining the specific embodiments of the present utility model, only the antenna device in the representative products manufactured by the applicant of the present utility model and the lighting device in the representative products manufactured by the subsidiary company of the applicant of the present utility model are illustrated as examples, and their meanings and scope of rights should not be construed as being limited thereto.

[0104] Figure 1a and Figure 1b are perspective views showing the front appearance and the rear appearance of the antenna device according to an embodiment of the present utility model, Figure 2a and Figure 2b are respectively Figure 1a and Figure 1b exploded perspective views, Figure 3 is a perspective view showing the state of removing the radome panel and the finger guard panel assembly in the configuration of Figure 1a .

[0105] An embodiment of the present utility model relates to a heat dissipation module 150 for releasing heat generated by functional elements (for example, referring to the PA element 145 and the LED element 145a described later) of an electronic device (electronic equipment) to the outside.

[0106] More specifically, as Figures 1a to 3 shown, the heat dissipation module 150 according to an embodiment of the present utility model may include a heat conducting plate body (not marked with reference numerals) having a refrigerant flow space (referring to the reference numeral "158" in the following Figure 13 ), and the refrigerant flow space is a space in which refrigerant is filled and undergoes gas-liquid circulation to cause the refrigerant to phase change in a closed space and release heat.

[0107] Here, the refrigerant flow space 158 may include: a first section (not labeled with a reference numeral), which is an evaporation area that receives heat from a heating element (refer to the PA element 145 and the LED element 145a described later) that is the object to be cooled; and a second section (not labeled with a reference numeral), which is a path for the liquid refrigerant in the refrigerant that condenses from a gaseous state to a liquid state to flow toward the first section by surface tension or gravity.

[0108] More specifically, the first section in the refrigerant flow space 158 is located at the position closest to the heating elements 145, 145a, and as a part where the heating elements 145, 145a are directly or formed through a predetermined medium and combined, it can be given the function of a part that performs a kind of combined end function. The second section, as the remaining part of the refrigerant flow space 158 other than the first section, can be given the function of a space for the refrigerant to flow in an overall enclosed space to perform gas-liquid circulation.

[0109] The heating elements 145, 145a may be combined with the outer side of the heat conducting plate body corresponding to the first section in one of an insertion method and a joining method.

[0110] For example, as described later Figure 17 As shown, the insertion method for the first section is to be combined by inserting the combined end corresponding to the first section into the support housing body 170 that forms the combined medium of the heat conducting plate body. At this time, the first section is preferably set to the part closest to the heating elements 145, 145a.

[0111] The above-described insertion combination method of the first section and the heating elements 145, 145a will be described in more detail below.

[0112] In addition, the first section in the refrigerant flow space 158 may be arranged in the inner space (corresponding to the installation space 10S of the antenna housing body 10 described later) where the heating elements 145, 145a are arranged.

[0113] In addition, at least a part of the second section in the refrigerant flow space 158 may be arranged to be physically exposed to the outer space divided from the inner space (installation space 10S).

[0114] Here, the inner space, as a space that directly releases the heat generated by the functional elements (heating elements (constitutions corresponding to the reference numerals "145" and "145a")) of the driving electronic device (electronic equipment), can generally be interpreted as an enclosed space such as the installation space 10S of the antenna housing body 10 described later.

[0115] In addition, the outer space, as a space physically separated from the installation space 10S of the antenna housing body 10, can be a concept prepared as a space for the free flow of outside air (external air).

[0116] Here, when the inner space and the outer space are physically separated by the housing body 10 (the same configuration as the antenna housing body 10), the first section in the refrigerant flow space 158 can be relatively located in the lower part with respect to the gravitational direction and arranged in the inner space of the housing body 10, and the second section in the refrigerant flow space 158 can be relatively located in the upper part with respect to the gravitational direction and arranged to be exposed to the outer space which is the outside of the housing body 10.

[0117] However, as described above, the refrigerant is filled in the interior of the refrigerant flow space 158. Thus, the first section and the second section can be formed to communicate with each other so that the refrigerant undergoes gas-liquid circulation while undergoing a phase change and flows to the lower end of the first section and the upper end of the second section.

[0118] As described above, since the refrigerant needs to undergo gas-liquid circulation between the first section and the second section of the refrigerant flow space 158, the heat conducting plate body is preferably formed integrally, but the heat conducting plate body does not necessarily have to be formed integrally from the first section to the second section.

[0119] For example, when a part of the heat conducting plate body corresponding to the first section is defined as the inner heat dissipation part 151, the inner heat dissipation part 151 can be equipped with one of a heat pipe and a first phase change fin which are filled with a refrigerant inside and cause the filled refrigerant to undergo a phase change to perform gas-liquid circulation. In this case, the refrigerant in the first section and the refrigerant in the second section may be connected separately.

[0120] However, even when the first section and the second section are connected, the heat conducting plate body does not have to be formed integrally. In this case, when a part of the heat conducting plate body corresponding to the second section is defined as the outer heat dissipation part 152, the outer heat dissipation part 152 can be equipped in a form combined with a separately manufactured second phase change fin. The second phase change fin communicates with the first section and causes the refrigerant which has changed to a gaseous state from the first section to exchange heat with the outside air and be condensed into a liquid state refrigerant.

[0121] In addition, one surface of the first phase change fin and the second phase change fin can be equipped with SUS material, and the other surface can be equipped with Cu material.

[0122] In particular, in the case where the heat generating surface of the heat generating body 145 for the first section of the heat conducting plate body is joined in a surface thermal contact manner, the surface (the other surface) directly contacting the heat generating surface of the heat generating body 145 is preferably equipped with Cu material having a relatively high thermal conductivity, and its opposite surface (one surface) is preferably equipped with SUS material.

[0123] Next, a heat dissipation device according to an embodiment of the present invention will be described in detail.

[0124] like Figures 1a to 3 As shown, a heat dissipation device (not marked with a reference numeral) according to an embodiment of the present invention includes: a functional element (referring to the following Figures 1a to 13 The antenna device 1 includes a radiation element 120 and a heating element (PA element 145) for beamforming radiation and the like, and the following Figure 17 The heating element (LED element 145a) of the lighting device 1a is electrically driven to perform a predetermined function; a plurality of device modules (refer to Figures 1a to 13 The antenna unit 110 and the later described Figure 17 The device module 110a is equipped with a functional element 145, 145a for module control; and a heat dissipation module 150, which is combined in a vertical direction or a horizontal direction relative to the device module 110, 110a to discharge the heat generated by the heating surface of the heating element 145, 145a equipped in the device module 110, 110a according to the function.

[0125] The heat dissipation module 150 here has been fully described above, so the detailed description of the repeated parts will be omitted. Below, as a representative electronic device (electronic device) that can directly apply the heat dissipation module 150 according to an embodiment of the utility model, the antenna device 1 and the lighting device 1a, which are representative manufacturing products of the applicant of the utility model, will be described.

[0126] like Figures 1a to 3 As shown, in the antenna device 1 according to an embodiment of the present invention, a plurality of radiation elements 120 may be arranged in the form of an array antenna in the vertical direction and the horizontal direction in front of the installation space 10S of the antenna housing body 10 .

[0127] An array antenna is an antenna that arranges a plurality of radiating elements 120 at predetermined positions according to a predetermined pattern, and adjusts the phase and size of each radiating element 120 according to the arrangement position to radiate a beam in a predetermined direction.

[0128] The individual radiating elements 120 may be configured as dual polarization elements that are arranged in an X-shape in a diagonal direction using feed points (not shown) and form polarization beams of ±45 degrees.

[0129] The individual radiating elements 120 described above are respectively associated with the 2T2R transceiver signals, such as Figures 2a to 3As shown, 8 are arranged in the vertical direction on the front of the antenna housing body 10 and 8 are arranged in the horizontal direction on the front, so that an enhanced version of 5G (5G-Advanced) to 6G next-generation communication Massive MIMO with 128 TRx transmission channels can be achieved overall.

[0130] As an antenna device in a similar form, an AESA radar mounted on the core equipment of the KF-X can be cited. It is a fighter radar developed under the supervision of the Agency for Defense Development since 2016.

[0131] AESA is an abbreviation for Active Electronically Scanned Array, which refers to an active electronically scanned phased array. The TR module (TRM) including antenna elements can be a Brix type and a Tile type phased array.

[0132] Generally, a brick-type phased array can include a power amplifier (PA: Power Amplifier) element, an LNA element, a phase / gain regulator, and a digital transceiver control unit.

[0133] Here, the brick-type phased array arranges the above-mentioned elements related to the PA element, LNA, phase / gain regulator, and digital transceiver control unit on one board in a planar two-dimensional structure so that the transmitted and received signals are sent in parallel in the same plane as the system module.

[0134] In addition, the tile-type phased array is a form similar to a general type of phased array applied to the Massive MIMO technology manufactured by the applicant of the present utility model. The antenna RF module and antenna device to be described below mean within the scope of the claims equivalent in terms of the heat dissipation function of the AESA radar.

[0135] Generally, beamforming can be divided into digital beamforming and analog beamforming. Analog beamforming (Analog Beam forming) is a method of branching an analog signal that has completed digital signal processing into multiple paths and forming a beam by setting a phase shift and power amplification in each path, and is formed by a transmission and reception system structure composed of multiple phase shifts and signal attenuators together with one RF chain.

[0136] Analog beamforming forms the direction and shape of a beam by separately changing the phase and amplitude values of the phase shifters and signal attenuators connected to each individual antenna. Due to the limited resolution of phase shifts and the high cost of components, this analog beamforming technology is weak in terms of system performance and economy, and is not structurally compatible with the spatial multiplexing transmission technology for high capacity.

[0137] In contrast, digital beamforming is a technology that forms a beam at the digital level by using the baseband processing of a base station to maximize diversity and multiplexing gains. In addition, in digital beamforming, RF chains are connected to each individual antenna and RF circuits such as phase shifters or signal attenuators are not used, and based on this system structure, the digital beamforming technology can change the phase and amplitude of a signal through digital signal processing at the baseband, thereby changing the angle of the beam, rather than changing the phase and amplitude of the signal at the RF end.

[0138] In particular, the RF chain performs the function of adjusting a signal to be suitable for transmission using a radio frequency antenna or converting a signal received through an antenna element (radiating element) into a signal suitable for sampling and baseband processing.

[0139] However, in order to construct each RF chain, components such as filters, power amplifiers (PA), low noise amplifiers (LNA), and radio frequency integrated circuits (RFIC) must be equipped (in particular, RFIC includes digital-to-analog converters (DAC) / analog-to-digital converters (ADC), mixers, etc.). In order to implement a 128TRx device that can be applied to massive MIMO for next-generation communications from enhanced 5G (5G-Advanced) to 6G beyond 64TRx devices, the number of RF chains will increase sharply, thereby causing problems related to heat dissipation and size.

[0140] That is, the size of the antenna device is determined according to each frequency band. If each component for a large number of RF chains increased to match this size is mounted on a flat board such as a main board, there are problems such as substantially increasing the size of the antenna device due to the excessive number of mounted components or having to mount them concentratedly and densely within a limited size.

[0141] In particular, in the case of constructing an array antenna with a large number of RF chains, there are the following problems in the prior art: In order to make the antenna beam narrow, it is implemented with sub-arrays, and the number of radiating elements increases by the same amount as the additionally implemented sub-arrays. Moreover, the design of the feeder lines accordingly becomes complex, and a phase shifter with an analog adjustment method must be provided to adjust the phase between the existing array antenna and the sub-array.

[0142] As a reference, the additionally implemented antenna device of the sub-array also has aspects that are beneficial for improving the formation of a narrow beam desired by the designer and the gain for measuring the performance of the antenna device. And the steering angle of the horizontal beam of the 64TRx standard is preferably ±45 degrees. However, since the tilt angle of the vertical beam is limited to a very small range of about ±10 degrees, there is a problem that it is not suitable for low-orbit satellite communication services such as the latest drones or urban air mobility (UAM) that form a living circle about 200 to 300 m above the ground.

[0143] Moreover, the increase in the number of the above components ultimately leads to a problem of heat dissipation of the system inside the antenna housing body 10. Generally, since there is a problem that it is difficult to construct a heat dissipation structure in the front for beam radiation, a heat dissipation structure is constructed in which most of the heat generated by the heating elements is dissipated to the rear side through a plurality of heat sinks 11 integrally formed on the back side of the antenna housing body 10.

[0144] Therefore, the limitation of the rear-side concentrated heat dissipation structure ultimately leads to a limitation in the application of technologies such as enhanced 5G (5G-Advanced) with 128TRx transmission channels to massive MIMO for 6G next-generation communication, which poses a relatively large difficulty in product manufacturing and design in reality.

[0145] The antenna device 1 according to an embodiment of the present embodiment proposes a new technical configuration that can form a narrow beam desired by the designer corresponding to the number of RF channels implemented based on 128TRx even without constructing the above-mentioned sub-array and can construct an effective heat dissipation system.

[0146] As Figures 1a to 3As shown, an antenna device 1 according to an embodiment of the present utility model includes: an antenna housing body 10, which is in the shape of a rectangular parallelepiped box with an opening at the front and a setting space 10S formed inside; a digital board 15, the back surface of which is laminated and combined with the setting space 10S of the antenna housing body 10 in a close contact manner, and heating elements are mounted and arranged on at least one of the two surfaces; and an antenna RF module 100, which is electrically connected to the digital board 15 and is vertically arranged in the up-down direction so that its two surfaces face the left and right directions in the setting space 10S respectively.

[0147] Here, the setting space 10S formed in the antenna housing body 10 can be formed to be relatively long in the up-down direction, and can be formed such that the widths of the left and right ends are greater than the thickness in the front-back direction. The front of the setting space 10S can be open, and the front of the antenna housing body 10 can be combined with an antenna cover panel 20 described later to shield the setting space 10S.

[0148] In addition, the digital board 15 laminated and combined with the setting space 10S of the antenna housing body 10, regardless of its name, can be understood to generally include the concepts of a PCB and a PBA. However, it should be noted that in an embodiment of the present utility model, this name is given in consideration of the aspect that the heating elements that perform analog functions in the antenna RF module 100 are separately mounted from the heating elements mounted on the digital board 15.

[0149] Although not shown, the heating elements mounted on the digital board 15 can be dispersedly mounted on the back surface of the two surfaces of the digital board 15 so as to smoothly perform rear heat dissipation through a plurality of heat sinks 11 formed integrally with the back surface portion of the antenna housing body 10. These heating elements can typically include FPGA elements and the like.

[0150] The antenna housing body 10 can be made of a metal material with excellent thermal conductivity so that the system heat inside the setting space 10S can be easily transferred to the outside, and a plurality of heat sinks 11 can be integrally formed on the back surface of the antenna housing body 10 in a predetermined pattern shape. The plurality of heat sinks 11 are provided to receive the system heat including the heating elements of the digital board 15 and increase the area of heat exchange with the outside air at the rear part.

[0151] As Figures 1a to 3 shown, an antenna RF module 100 according to an embodiment of the present utility model can include a plurality of antenna units (refer to the reference numeral "110" in Figure 5 the attached drawings), and the plurality of antenna units include radiation elements 120 having at least one polarization and RF chains (not marked with reference numerals) corresponding to the polarizations of the respective radiation elements 120 to separately control the polarization of the radiation elements 120.

[0152] A plurality of antenna units 110 may be configured with 8 radiating elements 120 arranged in a 2TRx manner for each implementation. For the 8 radiating elements 120, a first polarization antenna unit related to one polarization (refer to the reference numeral “110A” in the attached drawing described later Figure 8 ), and a second polarization antenna unit related to another polarization (refer to the reference numeral “110B” in the attached drawing described later Figure 8 ) are provided to achieve a large number of RF channels corresponding to the 128TRx standard and prevent more beam radiations from interfering with each other.

[0153] The specific configurations and functions of the first polarization antenna unit 110A and the second polarization antenna unit 110B will be described in more detail later.

[0154] In addition, as Figures 1a to 3 shown, the antenna RF module 100 according to an embodiment of the present invention may further include a heat dissipation module 150 coupled to the antenna unit 110 in a vertical or horizontal direction to discharge the heat generated from the heat generating surfaces of the heating elements (e.g., refer to the PA element 145 described later) of each polarization antenna unit 110A, 110B provided in a plurality of adjacent antenna units 110.

[0155] Here, as described above, the heat dissipation module 150 may include a heat conducting plate body having a refrigerant flow space 158, which is a space filled with a refrigerant inside and undergoes gas-liquid circulation to cause the refrigerant to phase change in a closed space and release heat.

[0156] In addition, the refrigerant flow space 158 may include: a first section, which is an evaporation area that receives heat from the heating element 145 to be dissipated; and a second section, which is a path for the liquid refrigerant in the refrigerant, which condenses from a gaseous state to a liquid state, to flow toward the first section by surface tension or gravity.

[0157] In addition, as Figures 1a to 3 shown, the heat dissipation module 150 may include: an inner heat dissipation part 151, which extends into the installation space 10S of the antenna housing body 10, receives heat from the heating element 145, and conducts it; and an outer heat dissipation part 152, which extends to the outside of the installation space 10S and exchanges heat between the heat transferred from the inner heat dissipation part 151 and the air (external air) in the external space.

[0158] Here, the inner heat dissipation part 151 may be defined as a concept including the above-mentioned first section and at least a part of the second section, and the outer heat dissipation part 152 may be defined as a concept including only the second section.

[0159] Figure 4 As Figure 3Exploded perspective view, showing Figure 3 An exploded perspective view showing the combined state of the unit RF chain unit and the antenna housing body in the structure of Figure 3 , Figure 5 showing Figure 4 A rear perspective view of the plug portion of the unit RF chain unit of Figure 4 .

[0160] As Figure 4 and Figure 5 shown, a plurality of antenna units 110 are combined with a digital board 15 that is stacked in a module unit in the installation space 10S of the antenna housing body 10 in an electrically connected manner, and the inner heat dissipation portion 151 in the heat dissipation module 150 can be located inside the installation space 10S. At the same time, the outer heat dissipation portion 152 can be arranged to be exposed to the outside of the antenna housing body 10 (more specifically, the upper outer space of the antenna housing body 10).

[0161] For this purpose, a guide groove 17 for setting a plurality of antenna units 110 in modules can be formed along the front-rear direction at the upper end of the antenna housing body 10. The process of setting the plurality of antenna units 110 into the antenna housing body 10 through the guide groove 17 will be described in more detail later.

[0162] In addition, as Figures 1a to 5 (especially, Figure 2a and Figure 2b ) shown, the antenna device 1 according to an embodiment of the present invention may further include a finger protection panel assembly 30. When the outer heat dissipation portion 152 in the heat dissipation module 150 is arranged to be exposed to the external space through the upper end of the antenna housing body 10, the finger protection panel assembly 30 is combined with the antenna housing body 10 in a manner that does not contact and surround the outer heat dissipation portion 152 exposed to the external space through the upper end of the antenna housing body 10.

[0163] The finger protection panel assembly 30 can be configured to shield all remaining parts except the front portion of the outer heat dissipation portion 152 exposed at the upper end of the antenna housing body 10.

[0164] More specifically, as Figure 2a and Figure 2bAs shown, the finger protection panel assembly 30 may include: a rear portion shielding panel 31, which is erected to shield the outer heat dissipation portion 152; an upper shielding panel 32, which is connected to the upper end portion of the rear portion shielding panel 31 and is horizontally arranged to shield the upper portion of the outer heat dissipation portion 152; and a left shielding panel 33 and a right shielding panel 34, the rear end and the upper end of which are respectively connected to the rear portion shielding panel 31 and the upper shielding panel 32, and which are erected to shield the side portions of the outer heat dissipation portions 152 of the heat dissipation modules 150 arranged at the leftmost and rightmost sides of the antenna housing body 10 among the plurality of heat dissipation modules 150.

[0165] In addition, the finger protection panel assembly 30 may further include: a rear lower mounting rod 35a, which serves as a medium for realizing the connection between the lower end of the rear portion shielding panel 31 and the rear end of the upper surface of the antenna housing body 10; a rear upper mounting rod 35b, which serves as a medium for realizing the connection between the upper end of the rear portion shielding panel 31 and the rear end of the upper shielding panel 32; a front upper mounting rod 35c, which serves as a medium for realizing the connection between the front end of the upper shielding panel 32 and the upper end of the antenna cover panel 20 described later; and a front lower mounting rod 35d, which serves as a medium for realizing the connection between the antenna cover extension panel 25, which performs a function similar to that of the finger protection panel assembly 30 in the antenna cover panel 20, and the front end of the upper surface of the antenna housing body 10.

[0166] In at least a part of the finger protection panel assembly 30 (in an embodiment of the present invention, the rear portion shielding panel 31 and the upper shielding panel 32), a plurality of ventilation holes 36 through which air (external air) in the external space passes may be formed.

[0167] In addition, as Figures 1a to 3 shown, the installation space 10S of the front opening antenna housing body 10 may be provided to be shielded by the antenna cover panel 20.

[0168] The antenna cover panel 20 protects various components arranged inside the installation space 10S from the external environment, and may be provided with a material that allows the beam radiated from the radiation element 120 to transmit smoothly.

[0169] In addition, an antenna cover extension panel 25 that shields the front portion of the outer heat dissipation portion 152 not shielded by the finger protection panel assembly 30 may be integrally formed at the upper portion of the antenna cover panel 20.

[0170] Here, obviously, the antenna cover extension panel 25 may also be formed with a plurality of ventilation holes 26 through which air in the external space passes to facilitate heat exchange with the outer heat dissipation portion 152.

[0171] However, although the portion where the outer heat dissipation part 152 is located is a space shielded by the finger protection panel assembly 30 and the radome extension panel 25, external air can still freely flow into and out of the interior through the above-mentioned plurality of ventilation holes 36 and 26, and thus can be defined as an "external space".

[0172] Figure 6 is a left and right perspective view of a unit RF chain unit showing Figure 4 and Figure 7a and Figure 7b is Figure 6 an exploded perspective view of (a) and (b) of Figure 8 is a perspective view showing each polarization antenna unit of a radiation element, Figure 9a and Figure 9b is Figure 8 an exploded perspective view of (a) and (b) of

[0173] Hereinafter, the antenna RF module 100 combined with the digital board 15 in the installation space 10S of the antenna housing body 10 will be specifically described as follows.

[0174] As Figures 6 to 10 shown, the antenna RF module 100 according to an embodiment of the present invention includes: a radiation element 120 having at least one polarization; a plurality of antenna units 110 including RF chains corresponding to the respective polarizations of the radiation element 120 to individually control the polarization of the radiation element 120; and a heat dissipation module 150 combined with the antenna units 110 in a vertical or horizontal direction to discharge heat generated from the heat generating surfaces of the heating elements (for example, the PA element with reference numeral "140") provided in each polarization antenna unit 110A or 110B of the adjacent plurality of antenna units 110.

[0175] Here, the plurality of antenna units 110 can be stacked and arranged in the installation space 10S of the antenna housing body 10 to have 8 columns in the left and right horizontal directions.

[0176] The term "stacked" used hereinafter is defined and described as being divisible into the following two types.

[0177] For example, assuming that the radiation direction of the radiation element 120 is forward, and assuming that the installation space 10S of the antenna housing body 10 has an open front and is configured as a rectangular parallelepiped box shape that is longer in the up and down directions and shorter in the width in the left and right directions, the continuous arrangement in the up and down directions is defined as "stack-up stacking", and the continuous arrangement in the left and right directions is defined as "tile-type structure stacking".

[0178] However, the term "stacked" used when describing an embodiment of the present invention is only a term used to more clearly understand the present invention, and the scope of rights of the present invention should not be construed as being limited by the described term.

[0179] As Figures 1a to 9b shown, an RF module 100 for an antenna according to an embodiment of the present invention may include: a first polarization antenna unit 110A, associated with one polarization of a radiation element 120 configured to radiate a dual-polarization beam; and a second polarization antenna unit 110B, associated with the other polarization of the radiation element 120 configured to radiate a dual-polarization beam.

[0180] Here, the first polarization antenna unit 110A may include: a plurality of one-side RF filters 130A, stacked in a column in the vertical direction and vertically stacked in a tiled structure such that both ends in the length direction are located in the front and rear, respectively; the second polarization antenna unit 110B may include: a plurality of other-side RF filters 130B, stacked in a column in the vertical direction and vertically stacked in a tiled structure such that both ends in the length direction are located in the front and rear, respectively, and stacked in the left-right direction with respect to one of the left and right side surfaces of the plurality of one-side RF filters 130A.

[0181] In addition, a clamshell cover 135 for cutting off external signal interference with an adjacent power amplifier board (PA board) 140 and RF filter 130 may be disposed on the outer side surfaces of the one-side RF filter 130A and the other-side RF filter 130B.

[0182] Furthermore, the radiation element 120 may include: a first polarization element 120a, disposed to be connected to a signal transmitted along one feeder and connected to the plurality of one-side RF filters 130A; and a second polarization element 120b, disposed to be connected to a signal transmitted along the other feeder and connected to the plurality of other-side RF filters 130B.

[0183] Here, the first polarization element 120a and the second polarization element 120b may cross each other and be disposed at the front end portions of the plurality of one-side RF filters 130A and the plurality of other-side RF filters 130B.

[0184] In addition, the front end surfaces of the plurality of one-side RF filters 130A and the plurality of other-side RF filters 130B may function as reflectors that reflect the beam radiated from the radiation element 120 forward. That is, although not shown, a predetermined metal coating is integrally formed by coating on the front end surfaces of the plurality of one-side RF filters 130A and the plurality of other-side RF filters 130B, so that they themselves may function as reflectors.

[0185] In addition, the radiation element 120 may further include a base panel 125 disposed to divide between the plurality of one-side RF filters 130A and the plurality of the other-side RF filters 130B and the first polarization element 120a and the second polarization element 120b and to support the first polarization element 120a and the second polarization element 120b.

[0186] Here, the base panel 125 may have a front protruding height that cuts off the radiation of the radiation beams radiated from the first polarization element 120a and the second polarization element 120b to the adjacent radiation element 120.

[0187] In particular, the base panel 125 may be provided to be supported forward by the PA board 140 in the configuration of the plurality of antenna units 110.

[0188] As described above, the filters (elements) of the plurality of one-side RF filters 130A and the plurality of the other-side RF filters 130B that are stacked and arranged in a tiled structure at the same positions in the vertical direction constitute two RF channels.

[0189] More specifically, the antenna unit 110 is composed of a plurality of (refer to the reference numerals "101 to 108" in the Figures 2a to 4 accompanying drawings) combinations of one-side RF filters 130A and the other-side RF filters 130B that are equipped to implement the transmission paths of 2T2R, and are stacked and arranged in a superimposed and tiled structure, so that a total of 128TRx transmission paths can be realized.

[0190] Each of the plurality of antenna units 110 as described above may further include: an unillustrated one-side feeder and the other-side feeder that supply a predetermined electrical signal to the plurality of one-side RF filters 130A and the plurality of the other-side RF filters 130B that constitute two RF channels; and a PA board 140, on one of the two surfaces of which a heating element related to one of the two RF channels is mounted.

[0191] In particular, a plurality of PA elements (Power Amplifier) 145, which are one of the power amplification elements, may be mounted and arranged on at least one surface of the PA board 140, and the heat generated by the PA elements 145 can be released to the outside of the antenna housing body 10 through the heat dissipation module 150.

[0192] However, the heating element mounted on the PA board 140 is not necessarily limited to the PA element 145, and obviously may also include one of a low noise amplifier (LNA: Low Noise Amplifier) and a radio frequency integrated circuit (RFIC).

[0193] In addition, a plug head portion 146 for electrical plug connection with the digital board 15 may be provided at the rear end of the two ends in the front-rear width direction of the PA board 140. The plug head portion 146 may be formed in a shape that protrudes more backward than the rear end of the PA board 140.

[0194] And, a socket portion 16 for plug connection of the plug head portion 146 of the PA board 140 may be provided on the front surface of the digital board 15.

[0195] Among the plurality of antenna units 110, the outer heat dissipation portion 152 in the heat dissipation module 150 is exposed to the external space through the upper end portion of the antenna housing body 10. Thus, when the PA board 140 is plug-connected to the digital board 15, it can be received and guided by the guide groove 17 provided at the upper end of the antenna housing body 10 to guide the insertion connection and perform module connection.

[0196] As described above, in the case of the antenna device 1 according to an embodiment of the present invention, different from the case where digital components and analog components are concentrated and mounted on a single board of the digital board 15 arranged in the installation space 10S of the antenna housing body 10 without separation, a part of the heat generating bodies (for example, PA element 145) is dispersed in the PA boards 140 of each polarization antenna unit (the first polarization antenna unit 110A and the second polarization antenna unit 110B) related to each RF channel, and is arranged in a stacked manner of superimposed stacking and laying type structure. Thus, even without implementing a sub-array, an advantage can be created that enables individual control of beamforming for a large number of RF chains.

[0197] In addition, the heat dissipation module 150 described later is designed and manufactured to have a structure suitable for effectively dissipating heat from the heat generating body 145 of the PA board 140 arranged in a stacked manner of superimposed stacking and laying type structure to the outside. Thus, individual control of beamforming for a large number of RF chains and narrow design of each beam can be perfectly achieved.

[0198] More specifically, as Figures 6 to 9b shown, the heat dissipation module 150 is arranged in surface thermal contact with the outer surfaces of the PA boards 140 of the first polarization antenna unit 110A and the second polarization antenna unit 110B respectively, thereby performing the function of receiving and releasing the heat generated by the plurality of heat generating bodies 145.

[0199] That is, the heat dissipation module 150 may include: a first heat dissipation portion 150-1, which is arranged in surface thermal contact with the surface of the heat generating body 145 of the PA board 140 mounted on the first polarization antenna unit 110A; and a second heat dissipation portion 150-2, which is arranged in surface thermal contact with the surface of the heat generating body 145 of the PA board 140 mounted on the second polarization antenna unit 110B.

[0200] Therefore, between the first heat dissipation unit 150-1 and the second heat dissipation unit 150-2, although it varies according to the direction, one of the plurality of one-side RF filters 130A and the other-side RF filters 130B can be stacked and arranged.

[0201] For example, on the inner surface of the first heat dissipation unit 150-1 facing the second heat dissipation unit 150-2, a plurality of one-side RF filters 130A related to one polarization in dual polarization can be stacked and arranged, and a one-side PA board 140-1 related to one polarization in dual polarization can be arranged between the first heat dissipation unit 150-1 and the plurality of one-side RF filters 130A.

[0202] Similarly, on the outer surface of the second heat dissipation unit 150-2, a plurality of the other-side RF filters 130B related to the other polarization in dual polarization can be stacked and arranged, and the other-side PA board 140-2 related to the other polarization in dual polarization can be arranged between the second heat dissipation unit 150-2 and the plurality of the other-side RF filters 130B.

[0203] As described above, as Figures 6 to 9b shown, the RF module 100 for an antenna according to an embodiment of the present invention can be configured to separately release the heat generated by the heating elements 145 of the one-side PA board 140-1 and the other-side PA board 140-2 of each polarization by the first heat dissipation unit 150-1 and the second heat dissipation unit 150-2.

[0204] In particular, although not shown in the drawings, the bonding method for realizing the surface thermal contact between the one-side PA board 140-1 and the other-side PA board 140-2 and the outer surfaces of the first heat dissipation unit 150-1 and the second heat dissipation unit 150-2 can apply the surface mounting technology of electronic components in the package on board (POB) method.

[0205] However, in the case of the POB method, in order to realize the bonding between the outer surfaces of the first heat dissipation unit 150-1 or the second heat dissipation unit 150-2 and the one-side PA board 140-1 or the other-side PA board 140-2 made of PCB material, a welding material (not shown) must be coated. And considering the inevitable heat transfer resistance generated by the coated welding material, the bonding method that directly makes the heating element 145 mounted on the one-side PA board 140-1 or the other-side PA board 140-2 in surface thermal contact with the outer surface of the first heat dissipation unit 150-1 or the second heat dissipation unit 150-2 may be more advantageous.

[0206] Hereinafter, the antenna unit 110 that is implemented to release the heat generated by the heating elements 145 of the one-side PA plate 140-1 and the other-side PA plate 140-2 of each polarization through the two heat dissipation parts 150-1 and 150-2 as described above is defined as the antenna unit 110 according to an embodiment, and the embodiment described with reference to Figures 14 to 16 will be defined as the antenna unit 1110 according to another embodiment and will be described.

[0207] That is, in the antenna RF module 100 of the present utility model, the antenna unit does not necessarily need to be equipped with two heat dissipation parts 150-1 and 150-2 to perform heat dissipation for each polarization as in the above-described embodiment, and may also be arranged such that the heating elements 145 of the one-side PA plate 140-1 and the other-side PA plate 140-2 are in surface thermal contact with the left surface and the right surface of a single heat dissipation module 1150 at the same time. This will be described in more detail later.

[0208] In particular, it has been described in detail that the heat dissipation module 150 includes an inner heat dissipation part 151 that is in surface thermal contact with one surface of the PA plate 140 on which a plurality of heating elements 145 are mounted, and an outer heat dissipation part 152 that exchanges heat between the heat transferred from the inner heat dissipation part and the external air and releases it.

[0209] Figure 10 is Figure 3 the front view of Figure 11 is the cross-sectional view taken along the A-A line of Figure 10 and Figure 12 is the cutaway perspective view taken along the A-A line of Figure 10 and Figure 13 The (a) of Figure 8 is the side view of the (a) of Figure 13 The (b) of Figure 13 is the cross-sectional view taken along the B-B line of the (a) of

[0210] As Figures 10 to 13 shown, the inner heat dissipation part 151 and the outer heat dissipation part 152 forming the heat dissipation module 150 can be formed to communicate with each other so as to fill the refrigerant inside and cause the filled refrigerant to perform gas-liquid circulation.

[0211] Here, although not shown in the drawings, the inner heat dissipation part 151 may be equipped with a plurality of heat pipes that fill the refrigerant inside and cause the filled refrigerant to undergo a phase change to perform gas-liquid circulation.

[0212] However, the inner heat dissipation part 151 does not necessarily need to be equipped with heat pipes, as Figures 10 to 13As shown, a first phase change fin (not individually denoted by a reference numeral) of a plate type heat exchanger (PTX: Panel Type heat eXchanger) may be provided in which a refrigerant is filled inside and the filled refrigerant undergoes a phase change to perform a gas-liquid cycle.

[0213] In addition, if Figures 10 to 13 As shown, the inner heat dissipation part 151 and the outer heat dissipation part 152 can be equipped with a second phase change fin (not marked with a separate figure mark) that is interconnected to form a plate-type heat exchange type second phase change fin that is filled with refrigerant inside and allows the filled refrigerant to circulate from the inner heat dissipation part 151 to the outer heat dissipation part 152 in gas-liquid circulation.

[0214] Here, the inner heat dissipation portion 151 and the outer heat dissipation portion 152 may be manufactured by joining edges 155 of two metal plate members 151A and 151B manufactured by a die-casting process (see Figures 8 to 9b ) to form a refrigerant flow space 158 filled with refrigerant.

[0215] In particular, the two metal plate members 151A and 151B may be formed with a plurality of strength reinforcement portions 153 and 154 (see FIG. 1 ) which are formed by die-casting to enhance their own rigidity and are mutually joined at least in the refrigerant flow space 158. Figures 8 to 9b ).

[0216] In more detail, a plurality of strength reinforcement portions 153, 154 may be formed on one surface of two metal plate parts 151A, 151B constituting the inner heat dissipation portion 151 and the outer heat dissipation portion 152, respectively, by a die-casting process to protrude in a circular or elliptical shape toward the refrigerant flow space 158 by a predetermined length.

[0217] Here, the inner heat dissipation part 151 of the first phase change fin configured as a plate-type heat exchange type may be configured with a Cu material on one side of the surface in thermal contact with the PA board 140, and the other side not in thermal contact with the PA board 140 may be configured with a SUS material. This is because, when the inner heat dissipation part 151 is configured only with a SUS material, it is difficult to bond the surface of the SUS material to the surface of the PA board 140, and therefore, a Cu material that is easily bonded to the surface of the PA board 140 may be used.

[0218] However, the outer heat dissipation portion 152 is not intended to be surface-bonded (surface thermal contact) with the PA board 140, and on the premise that the above-mentioned disadvantages of surface bonding can be overcome, both surfaces of the outer heat dissipation portion 152 and the inner heat dissipation portion 151 of the second phase change fin equipped with a plate-type heat exchange type can obviously be made of SUS material.

[0219] For example, both surfaces of the outer heat dissipation part 152 of the second phase change fin configured as a plate-type heat exchanger may be made of SUS material. One surface of the inner heat dissipation part 151 of the second phase change fin configured as a plate-type heat exchanger that makes surface thermal contact with one surface of the PA plate 140 may be made of Cu material, and the other surface that does not make surface thermal contact with one surface of the PA plate 140 may be made of SUS material.

[0220] In addition, the refrigerant filled in the refrigerant flow space 158 of the heat dissipation module 150 may be water that does not chemically react with the metal materials forming the two metal plate components 151A and 151B. For reference, when water is used as the refrigerant, it is preferable to exclude aluminum (Al) material from the metal materials constituting the heat dissipation module 150. This is because aluminum (Al) undergoes an oxidation reaction when in contact with water in terms of material properties to generate a predetermined amount of hydrogen gas, thus causing a problem of increasing the internal pressure of the refrigerant flow space 158.

[0221] As described above, the inner heat dissipation part 151 of the heat dissipation module 150, in which the two metal plate components 151A and 151B are formed by a die-casting process and have a refrigerant flow space 158 filled with refrigerant inside and enabling the gas-liquid circulation of the phase-changed refrigerant, is configured to make surface thermal contact with one surface on which the heat-generating body 145 separated from the digital board 15 is mounted, thereby inducing the quickly transformation of the filled liquid refrigerant into gaseous refrigerant and causing the evaporated gaseous refrigerant to disperse and flow toward the outer heat dissipation part 152. Thus, the system heat of the 128TRx standard can be effectively dissipated.

[0222] In addition, an absorber (not shown) may also be included in the refrigerant flow space 158 of the inner heat dissipation part 151 that makes surface thermal contact with one surface of the PA plate 140. The absorber collects the liquid refrigerant and evaporates the collected liquid refrigerant into gaseous refrigerant by the heat transferred from the heat-generating body 145.

[0223] Here, the absorber is preferably arranged to occupy only half of the thickness of the refrigerant flow space 158 of the inner heat dissipation part 151 adjacent to the PA plate 140.

[0224] This is to actively vaporize the liquid refrigerant in half of the thickness of the refrigerant flow space 158 of the inner heat dissipation part 151 equipped with the absorber, and then the remaining half is for the free flow of the gaseous refrigerant to ensure the flow path of the gaseous refrigerant toward the outer heat dissipation part 152.

[0225] More preferably, when the inner heat dissipation part 151 is configured as a first phase change fin of a plate-type heat exchanger, the absorber may be located only in half of the part made of Cu corresponding to one surface that makes surface thermal contact with one surface of the PA plate 140.

[0226] Figure 14 is a perspective view showing another embodiment of the antenna unit in the configuration of the RF module 100 for an antenna according to an embodiment of the present invention, Figure 15 is Figure 14 an exploded perspective view of, Figure 16 is a cross-sectional view taken along the Figure 14 C-C line of.

[0227] Referring to Figures 14 to 16 , the antenna unit 1110 according to another embodiment of the present invention may include: a single heat dissipation module 1150, configured as a plate-type heat exchanger; a first side PA board 140-1, adhered to one side surface of the heat dissipation module 1150; and a second side PA board 140-2, adhered to the other side surface of the heat dissipation module 1150.

[0228] And, the antenna unit 1110 according to another embodiment of the present invention may further include: a first side RF filter 130-1, stacked on the outer surface of the first side PA board 140-1, and providing an adhesive force between the first side PA board 140-1 and the single heat dissipation module 1150; and a second side RF filter 130-2, stacked on the outer surface of the second side PA board 140-2, and providing an adhesive force between the second side PA board 140-2 and the single heat dissipation module 1150.

[0229] Here, the first side PA board 140-1 and the first side RF filter 130-1 stacked on one side surface of the single heat dissipation module 1150 may perform the function of the first polarization antenna unit 110A related to one polarization of the radiation element 120 configured to radiate dual-polarization beams, and the second side PA board 140-2 and the second side RF filter 130-2 stacked on the other side surface of the single heat dissipation module 1150 may perform the function of the second polarization antenna unit 110B related to the other polarization wave of the radiation element 120 configured to radiate dual-polarization beams.

[0230] Different from the antenna unit 110 of an embodiment of the present invention in which the heat dissipation modules 150 corresponding to each polarization are provided as two, namely the first heat dissipation part 150-1 and the second heat dissipation part 150-2, the difference of the antenna unit 1110 according to another embodiment of the present invention as described above is that it is configured to simultaneously dissipate the heat generated by the heating elements 145 of the first side PA board 140-1 on the first polarization antenna unit 110A side and the second side PA board 140-2 on the second polarization antenna unit 110B side, which are respectively mounted on the two opposite surfaces of the single heat dissipation module 1150, through one heat dissipation path.

[0231] Here, the adhesion force between each heating element 145 of one-side PA board 140-1 and the other-side PA board 140-2 and one surface and the other surface of a single heat dissipation module 1150 can be provided by the bonding force between the one-side RF filter 130-1 and the other-side RF filter 130-2 as described above.

[0232] More specifically, as Figure 15 and Figure 16 shown, the length of the front-to-back width of the one-side RF filter 130-1 and the other-side RF filter 130-2 can be formed to be greater than the length of the front-to-back width of the inner heat dissipation part 1151 in the heat dissipation module 1150.

[0233] Here, at the front end part and the rear end part of the one-side RF filter 130-1 and at the front end part and the rear end part of the other-side RF filter 130-2, there can be respectively formed a front bonding flange 131F-a, 131F-b that protrudes forward from the front end of the inner heat dissipation part 1151 and a rear bonding flange 131R-a, 131R-b that protrudes backward from the rear end of the inner heat dissipation part 1151.

[0234] As Figure 16 shown, screw fastening holes 132 for screw-fixing the one-side RF filter 130-1 and the other-side RF filter 130-2 to each other using fixing screws 133 can be formed in the front bonding flanges 131F-a, 131F-b and the rear bonding flanges 131R-a, 131R-b in the form of through holes or fastening holes.

[0235] According to the antenna unit 1110 of another embodiment of the present utility model formed by the above-described configuration, at least one surface and the other surface of the single heat dissipation module 1150 corresponding to the inner heat dissipation part 1151 can be firmly supported relative to the outside by the one-side PA board 140-1 and the other-side PA board 140-2 supported by the one-side RF filter 130-1 and the other-side RF filter 130-2.

[0236] Therefore, even when an internal pressure change occurs during the phase change of the refrigerant in the refrigerant flow space 1158 provided inside the inner heat dissipation part 1151, the rigidity of the one surface and the other surface itself formed by the metal plate members 151A, 151B can be further strengthened.

[0237] And, the surface thermal contact with the heating elements 145 of the one-side PA board 140-1 and the other-side PA board 140-2 can be more stably achieved by the fastening force when fastening with the fixing screws 133 as described above.

[0238] In addition, not only can the heat generated by the heating elements 145 of the first polarization antenna unit 110A and the second polarization antenna unit 110B, which are both related to dual polarization, be effectively released by a single heat dissipation module 1150, but also the number of heat dissipation modules 1150 can be reduced compared to the antenna unit 110 according to an embodiment of the present invention. Therefore, the advantage of reducing the manufacturing cost of the product is provided.

[0239] According to the antenna RF module 100 of an embodiment of the present invention configured as described above and the antenna device 1 including the same, not only can the beamforming of the radiation elements 120 of a single polarization unit implemented by the RF channels of 128T / Rx be controlled individually. Moreover, even without adding additional components such as sub-arrays, the narrow design of the radiation beam is very simple, and it is equipped with a heat dissipation module 150 having a heat dissipation structure that improves the system heat imbalance phenomenon of the heating elements previously concentratedly mounted on a single flat plate (main board, etc.) to effectively dissipate heat, thereby having the effect of enabling enhanced 5G (5G-Advanced) to 6G next-generation communication with Massive MIMO.

[0240] However, in the antenna RF module 100 of an embodiment of the present invention and the antenna device 1 including the same, even when multiple antenna units 110 are arranged in a stacked manner of a stacked and tiled structure, the narrow design of the beam may be difficult to achieve depending on the density between the respective radiation elements 120. Therefore, in this case, the interference between the beams radiated through adjacent RF channels can be minimized by slightly further increasing the distance of 0.5λ, which is the ideal distance between the radiation elements 120 (for example, 0.75λ).

[0241] More specifically, the spacing distance between radiation elements having the same polarization characteristics is generally 0.5λ (here, λ refers to the wavelength of the center frequency point of the frequency band of the antenna array). To ensure a weaker correlation, the larger the spacing distance, the better. The spacing distance between the columns (refer to 101 to 108) between adjacent radiation elements 120 can be adjusted within the range of 0.5λ to 1.0λ.

[0242] In addition, on the premise that the above-mentioned heat dissipation problem caused by the geometric progression growth of the RF chain can be effectively solved by the heat dissipation module 150, theoretically, a method of further reducing the angle of the radiation beam by increasing the number of radiation elements 120 in the vertical direction to manufacture a Pencil beam is also feasible, but it can also be another solution.

[0243] In this case, in the antenna RF module 100 according to an embodiment of the present utility model and the antenna device 1 including the same, a situation is shown where 8 radiation elements 120 are arranged in the vertical direction to construct an RF channel based on 128TRx. However, when the number of arrangements of the radiation elements 120 in the vertical direction is further increased by 8, the total is 16. Thus, not only can an RF channel based on 256TRx be constructed, but also when arranged in twice that amount (the number of arrangements of the radiation elements 120 is 32), the total is 32, and obviously an RF channel based on 512TRx can also be constructed.

[0244] Figure 17 It is a partial cross-sectional perspective view and a partial enlarged perspective view from another angle of a lighting device 1a including a heat dissipation module 150 according to an embodiment of the present utility model.

[0245] As Figure 17 shown, the lighting device 1a including the heat dissipation module 150 according to an embodiment of the present utility model may include: a lighting main body 10 in a box shape, having one side open to emit light and having a setting space (not marked with a reference numeral) formed inside; an LED substrate 140a, disposed in the setting space of the lighting main body 10, and having LED elements mounted and arranged on at least one of the two sides; and an LED module 110a, electrically connected to the LED substrate 140a and vertically arranged in the setting space in the vertical direction.

[0246] Here, the LED module 110a may include a heat dissipation module 150 coupled to one side or the other side of the LED substrate 140a in the vertical or horizontal direction to discharge the heat generated from the heat generating surface of the LED element 145a (heat generating body) mounted on the LED substrate 140a.

[0247] As described above, the heat dissipation module 150 at this time may further include: an inner heat dissipation part 151, extending into the setting space, receiving heat from the LED element 145a (heat generating body) and conducting it; and an outer heat dissipation part 152, extending to the outside of the setting space and causing the heat transferred from the inner heat dissipation part 151 to exchange heat with the air (external air) in the external space.

[0248] In addition, the refrigerant flow space 158 may include: a first section, which is an evaporation area that receives heat from the LED element 145a to be dissipated; and a second section, which is a path for the liquid refrigerant in the refrigerant, which condenses from a gas state to a liquid state, to flow toward the first section by surface tension or gravity.

[0249] At this time, obviously, the inner heat dissipation part 151 can be a concept including the above-mentioned first interval and at least a part of the second interval, and the outer heat dissipation part 152 can be defined as a concept including only the second interval.

[0250] In particular, in the case of the lighting device 1a including the heat dissipation module 150 according to an embodiment of the present invention, the inner heat dissipation part 151 corresponding to the coupling end part can be coupled in an insertion manner with a configuration such as the support housing body 170 as a coupling medium configuration.

[0251] Here, the support housing body 170 forms a cross-sectional groove in a substantially "C" shape. When the LED substrate 140a is inserted and stacked toward the cross-sectional groove side, the coupling end part corresponding to the first interval of the heat conduction plate body is coupled in an insertion manner by an operation of being inserted between the gaps of a pair of installation brackets 190 that are media for fixing the cross-sectional groove side.

[0252] According to the heat dissipation module 150 of an embodiment of the present invention configured as described above, the heat dissipation device including the heat dissipation module 150, the antenna RF module 100, the antenna device 1, and the lighting device 1a, the following advantages are provided: In the case where functional elements are arranged relatively long in the vertical direction, even when they are dispersedly arranged in the internal space (installation space 10S) of the housing body (antenna housing body 10), it is possible to ensure the diversity of the layout design of each functional element through the heat dissipation module 150 including a heat conduction plate body divided into a first interval and a second interval to clearly distinguish their individual functions, and it is possible to maximize the system performance of the electronic device (electronic equipment) by maximizing the heat dissipation performance.

[0253] As described above, the heat dissipation module, the heat dissipation device including the heat dissipation module, the antenna RF module, the antenna device, and the lighting device according to an embodiment of the present invention have been described in detail with reference to the drawings. However, the embodiments of the present invention are not limited to the above-described embodiments, and it is natural that those of ordinary skill in the technical field to which the present invention pertains can make various modifications and implement them within an equivalent range. Therefore, the true scope of the rights of the present invention should be determined by the claims.

Claims

1. A heat dissipation module, characterized in that, Comprising: A heat conducting plate body having a refrigerant flow space which is a space for filling a refrigerant therein and performing a gas-liquid cycle to cause the refrigerant to phase change within a closed space to release heat, wherein the refrigerant flow space includes: A first section which is an evaporation area for receiving heat from a heating element to be cooled; and A second section which is a path for the liquid refrigerant in the refrigerant, which is condensed from a gas state to a liquid state, to flow towards the first section by surface tension or gravity, The heating element is coupled to the outer side of the heat conducting plate body corresponding to the first section in one of an insertion manner and a bonding manner.

2. The heat dissipation module according to claim 1, wherein The first section in the refrigerant flow space is arranged in the inner space where the heating element is arranged, and the second section in the refrigerant flow space is arranged such that at least a part thereof is physically exposed to the outer space partitioned from the inner space.

3. The heat dissipation module according to claim 2, wherein When the inner space and the outer space are physically partitioned by a housing body, The first section in the refrigerant flow space is relatively located at the lower part with respect to the gravity direction and is arranged in the inner space of the housing body, The second section in the refrigerant flow space is relatively located at the upper part with respect to the gravity direction and is arranged to be exposed to the outer space which is the outside of the housing body.

4. The heat dissipation module according to claim 3, wherein In the refrigerant flow space, the first section and the second section are formed to be in communication with each other so that the refrigerant performs a gas-liquid cycle while undergoing a phase change to flow to the lower end of the first section and the upper end of the second section.

5. The heat dissipation module according to any one of claims 1 to 4, wherein When a part of the heat conducting plate body corresponding to the first section is defined as an inner heat dissipation part, The inner heat dissipation part is equipped with one of a heat pipe and a first phase change fin which fills a refrigerant therein and causes the filled refrigerant to undergo a phase change to perform a gas-liquid cycle.

6. The heat dissipation module according to claim 5, wherein One surface of the first phase change fin is equipped with SUS material and the other surface is equipped with Cu material.

7. The heat dissipation module according to any one of claims 1 to 4, wherein When a part of the heat conducting plate body corresponding to the second section is defined as an outer heat dissipation part, The outer heat dissipation part is equipped with a second phase change fin which is in communication with the first section and exchanges heat between the refrigerant which has changed to a gas state from the first section and external air to be condensed into a liquid state.

8. The heat dissipation module according to claim 7, wherein One surface of the second phase change fin is equipped with SUS material and the other surface is equipped with Cu material.

9. A heat dissipation device, characterized in that, Comprising: Functional elements which are electrically driven and perform a predetermined function; A plurality of device modules which are equipped to control the functional elements in modules; And A heat dissipation module is combined with the device module in a vertical or horizontal direction to discharge the heat generated by the heat generating surface of the heat generating body equipped in the device module according to functions. Among them, the heat dissipation module includes: A heat conduction plate body having a refrigerant flow space which is a space for filling a refrigerant inside and performing a gas-liquid cycle to cause the refrigerant to change phase in a closed space to release heat. Among them, the refrigerant flow space includes: A first section which is an evaporation area for receiving heat from the heat generating body to be dissipated; and A second section which is a path for the liquid refrigerant in the refrigerant, which condenses from a gas state to a liquid state, to flow to the first section by surface tension or gravity. Among them, the heat generating body is combined with the outer side of the heat conduction plate body corresponding to the first section in one of an insertion manner and a bonding manner.

10. The heat dissipation device according to claim 9, wherein: The first section in the refrigerant flow space is arranged in the inner space where the heat generating body is arranged, and the second section in the refrigerant flow space is arranged such that at least a part thereof is physically exposed to the outer space partitioned from the inner space.

11. The heat dissipation device according to claim 10, wherein: In the case where the inner space and the outer space are physically partitioned by a housing body, The first section in the refrigerant flow space is relatively located at the lower part with respect to the gravity direction and is arranged in the inner space of the housing body, The second section in the refrigerant flow space is relatively located at the upper part with respect to the gravity direction and is arranged to be exposed to the outer space which is the outside of the housing body.

12. The heat dissipation device according to claim 11, wherein: In the refrigerant flow space, the first section and the second section are formed to communicate with each other so that the refrigerant undergoes a gas-liquid cycle while changing phase to flow to the lower end of the first section and the upper end of the second section.

13. The heat dissipation device according to any one of claims 9 to 12, wherein: When a part of the heat conduction plate body corresponding to the first section is defined as an inner heat dissipation part, The inner heat dissipation part is equipped with one of a heat pipe and a first phase change fin which fills a refrigerant inside and causes the filled refrigerant to change phase to perform a gas-liquid cycle.

14. The heat dissipation device according to claim 13, wherein: One surface of the first phase change fin is equipped with SUS material and the other surface is equipped with Cu material.

15. The heat dissipation device according to any one of claims 9 to 12, wherein: When a part of the heat conduction plate body corresponding to the second section is defined as an outer heat dissipation part, The outer heat dissipation part is equipped with a second phase change fin which communicates with the first section and causes the refrigerant which changes from the first section to a gas state to exchange heat with the external air and be condensed into a liquid state refrigerant.

16. The heat dissipation device according to claim 15, wherein: One side of the second phase change fin is equipped with SUS material and the other side is equipped with Cu material.

17. A radio frequency module for an antenna, characterized in that, Comprising: A radiation element having at least one polarization; A plurality of antenna units including radio frequency chains corresponding to each polarization of the radiation element to individually control the polarization of the radiation element; And A heat dissipation module coupled in a vertical or horizontal direction with respect to the antenna unit to discharge heat generated by a heating surface of a heating body of the antenna units of each polarization disposed adjacent to each other among the plurality of antenna units, Wherein, the heat dissipation module includes: A heat conducting plate body having a refrigerant flow space which is a space for filling a refrigerant therein and performing gas-liquid circulation to cause the refrigerant to phase change in a closed space to release heat, Wherein, the refrigerant flow space includes: A first section which is an evaporation area for receiving heat from a heating body to be dissipated; and A second section which is a path for the liquid refrigerant in the refrigerant that condenses from a gaseous state to a liquid state to flow toward the first section by surface tension or gravity, Wherein, the heating body is coupled to an outer side of the heat conducting plate body corresponding to the first section in one of an insertion manner and a joining manner.

18. A radio frequency module for an antenna, characterized in that, Comprising: A radiation element having a plurality of polarizations; A plurality of antenna units stacked on top of each other and including radio frequency chains corresponding to each polarization of the radiation element; And A heat dissipation module for discharging heat generated by a plurality of vertically arranged heating bodies, such that the heating surfaces of the plurality of heating bodies and one side surface of a plurality of radio frequency filters related to one polarization among the adjacent plurality of antenna units face left and right respectively, Wherein, the heat dissipation module includes: A heat conducting plate body having a refrigerant flow space which is a space for filling a refrigerant therein and performing gas-liquid circulation to cause the refrigerant to phase change in a closed space to release heat, Wherein, the refrigerant flow space includes: A first section which is an evaporation area for receiving heat from a heating body to be dissipated; and A second section which is a path for the liquid refrigerant in the refrigerant that condenses from a gaseous state to a liquid state to flow toward the first section by surface tension or gravity, Wherein, the heating body is coupled to an outer side of the heat conducting plate body corresponding to the first section in one of an insertion manner and a joining manner.

19. The radio frequency module for an antenna according to claim 17 or 18, wherein Each of the plurality of antenna units includes: A first polarization antenna unit related to one polarization of the radiation element configured to radiate a dual-polarization beam; and A second polarization antenna unit related to the other polarization of the radiation element configured to radiate a dual-polarization beam.

20. The radio frequency module for an antenna according to claim 19, wherein The first polarization antenna unit includes: A plurality of one-side radio frequency filters stacked and arranged in a column in the up-down direction and vertically stacked and arranged in a tiled structure with both ends in the length direction located front and back respectively, The second polarization antenna unit includes: A plurality of other-side radio frequency filters are stacked and arranged in a column in the up-down direction, and are vertically stacked and arranged in a tiled structure in such a way that both ends in the length direction are respectively located in the front and the back, and are stacked in the left-right direction with respect to one of the left and right side surfaces of the plurality of one-side radio frequency filters. Among them, the filters stacked and arranged in a tiled structure at the same position in the up-down direction among the plurality of one-side radio frequency filters and the plurality of other-side radio frequency filters constitute two radio frequency channels.

21. The radio frequency module for an antenna according to claim 20, wherein each of the plurality of antenna units further includes: a one-side feeder and an other-side feeder for supplying a predetermined electrical signal to the plurality of one-side radio frequency filters and the plurality of other-side radio frequency filters constituting the two radio frequency channels; and a power board, on one of the two surfaces of which a heating element related to one of the two radio frequency channels is mounted. Among them, the power board is stacked and arranged in the tiled structure on one of the left and right side surfaces of the plurality of one-side radio frequency filters and the plurality of other-side radio frequency filters.

22. The radio frequency module for an antenna according to claim 21, wherein the plurality of heating elements mounted on the power board include at least one of a power amplifier, a low-noise amplifier, and a radio frequency integrated circuit.

23. The radio frequency module for an antenna according to claim 21, wherein the heat dissipation module is stacked and arranged to be in surface thermal contact with the outer surfaces of the power boards of the first polarization antenna unit and the second polarization antenna unit respectively, so as to receive and release the heat generated by the plurality of heating elements.

24. The radio frequency module for an antenna according to claim 23, wherein the heat dissipation module includes: an inner heat dissipation part in surface thermal contact with the side surface of the power board on which the plurality of heating elements are mounted; and an outer heat dissipation part for exchanging heat between the heat transferred from the inner heat dissipation part and the external air and releasing it.

25. The radio frequency module for an antenna according to claim 24, wherein the inner heat dissipation part and the outer heat dissipation part are formed to be connected to each other and filled with a refrigerant inside, and the filled refrigerant is circulated in a gas-liquid state.

26. The radio frequency module for an antenna according to claim 24, wherein the inner heat dissipation part is equipped with one of a plurality of heat pipes filled with a refrigerant inside and causing the filled refrigerant to undergo a phase change and circulate in a gas-liquid state, and a plate-type heat exchange type first phase change fin.

27. The radio frequency module for an antenna according to claim 24, wherein the inner heat dissipation part and the outer heat dissipation part are equipped with a plate-type heat exchange type second phase change fin formed to be connected to each other and filled with a refrigerant inside, and causing the filled refrigerant to circulate in a gas-liquid state from the inner heat dissipation part to the outer heat dissipation part.

28. The radio frequency module for an antenna according to claim 26, wherein One side of the inner heat dissipation part of the first phase change fin configured as the plate-type heat exchanger that makes surface thermal contact with one side surface of the power board is made of Cu material, and the other side that does not make surface thermal contact with one side surface of the power board is made of SUS material.

29. The radio frequency module for antenna according to claim 27, wherein Both sides of the outer heat dissipation part and the inner heat dissipation part of the second phase change fin configured as the plate-type heat exchanger are made of SUS material.

30. The radio frequency module for antenna according to claim 27, wherein Both sides of the outer heat dissipation part of the second phase change fin configured as the plate-type heat exchanger are made of SUS material, One side of the inner heat dissipation part of the second phase change fin configured as the plate-type heat exchanger that makes surface thermal contact with one side surface of the power board is made of Cu material, and the other side that does not make surface thermal contact with one side surface of the power board is made of SUS material.

31. The radio frequency module for antenna according to claim 25, wherein The inner heat dissipation part and the outer heat dissipation part are manufactured to form a refrigerant flow space filled with the refrigerant inside by joining the edges of two metal plate components manufactured by a die-casting process, In the two metal plate components, a plurality of strength reinforcement parts are formed by a die-casting process to strengthen their own rigidity and are joined to each other at least inside the refrigerant flow space.

32. The radio frequency module for antenna according to claim 31, wherein When the two metal plate components are made of Cu material or SUS material, water is used as the refrigerant.

33. The radio frequency module for antenna according to claim 21, wherein The radiating element includes: A first polarization element arranged to be connected to a signal transmitted along the one-side feeder and connected to the plurality of one-side radio frequency filters; and A second polarization element arranged to be connected to a signal transmitted along the other-side feeder and connected to the plurality of other-side radio frequency filters, Wherein, the first polarization element and the second polarization element cross each other and are arranged at the front ends of the plurality of one-side radio frequency filters and the plurality of other-side radio frequency filters.

34. The radio frequency module for antenna according to claim 21, wherein The front end faces of the plurality of one-side radio frequency filters and the plurality of other-side radio frequency filters perform the function of a reflector that reflects the beam radiated from the radiating element forward.

35. The radio frequency module for antenna according to claim 33, wherein The radiating element further includes: A base panel arranged to divide between the plurality of one-side radio frequency filters and the plurality of other-side radio frequency filters and the first polarization element and the second polarization element, and support the first polarization element and the second polarization element, Wherein, the base panel has a front protruding height that cuts off the radiation of the radiation beam radiated from the first polarization element and the second polarization element to an adjacent radiating element.

36. The radio frequency module for antenna according to claim 35, wherein The base panel is supported forward by the power board.

37. A radio frequency module for an antenna, characterized in that, Comprising: A radiation element with dual polarization; A first polarization antenna unit and a second polarization antenna unit, including radio frequency chains corresponding to the respective polarizations of the radiation element to separately control the dual polarization of the radiation element; And A heat dissipation module that discharges the heat generated by the heat generating surfaces of the respective heating elements provided in the first polarization antenna unit and the second polarization antenna unit, wherein the heat dissipation module is of a plate-type heat exchange type, and the respective heating elements of the first polarization antenna unit and the second polarization antenna unit are arranged in surface thermal contact on one surface and the other surface respectively.

38. The radio frequency module for an antenna according to claim 37, wherein The first polarization antenna unit includes: A plurality of one-side radio frequency filters, stacked in a column in the up-down direction and vertically stacked in a tiled structure with both ends in the length direction located front and back respectively; The second polarization antenna unit includes: A plurality of the other-side radio frequency filters, stacked in a column in the up-down direction and vertically stacked in a tiled structure with both ends in the length direction located front and back respectively, and stacked in the left-right direction with respect to one of the left and right side surfaces of the plurality of one-side radio frequency filters; wherein the filters stacked in a tiled structure at the same position in the up-down direction among the plurality of one-side radio frequency filters and the plurality of the other-side radio frequency filters form two radio frequency channels.

39. The radio frequency module for an antenna according to claim 38, wherein Each of the plurality of antenna units further includes: One-side feeder and the other-side feeder for supplying a predetermined electrical signal to the plurality of one-side radio frequency filters and the plurality of the other-side radio frequency filters constituting the two radio frequency channels; and A power board, with a heating element related to one of the two radio frequency channels mounted on one of the two surfaces, wherein the power board is stacked and arranged in the tiled structure on one of the left and right side surfaces of the plurality of one-side radio frequency filters and the plurality of the other-side radio frequency filters.

40. The radio frequency module for an antenna according to claim 39, wherein A single heat dissipation module includes: An inner heat dissipation part in surface thermal contact with the side surface of the power board where the plurality of heating elements are mounted; and An outer heat dissipation part for exchanging heat between the heat transferred from the inner heat dissipation part and the external air and releasing it.

41. The radio frequency module for an antenna according to claim 40, wherein The length of the front-to-back width of the one-side radio frequency filter and the other-side radio frequency filter is greater than the length of the front-to-back width of the inner heat dissipation part in the heat dissipation module, The first polarization antenna unit and the second polarization antenna unit are respectively combined with one surface and the other surface of a single heat dissipation module through fixing screws fastened to the front combining flange and the rear combining flange formed at the front end part and the rear end part of the one-side radio frequency filter and the other-side radio frequency filter across the power board related to the two radio frequency channels.

42. An antenna device, characterized in that, Comprising: The antenna housing body is in the shape of a box with an opening at the front and a setting space formed inside; A digital board is laminated and combined with the setting space in a close - fitting manner on the back surface, and heating elements are mounted and arranged on at least one of the two surfaces; and An antenna radio - frequency module is electrically connected to the digital board and is vertically arranged in the up - and - down direction so that the two surfaces of the antenna radio - frequency module face the left - and - right directions in the setting space respectively, wherein, the antenna radio - frequency module includes: A radiation element having at least one polarization; A plurality of antenna units including radio - frequency chains corresponding to each polarization of the radiation element to individually control the polarization of the radiation element; and A heat - dissipation module is combined with the antenna units in the vertical or horizontal direction to discharge the heat generated by the heat - generating surfaces of the heating elements of the antenna units of each polarization among the adjacent plurality of antenna units. wherein, the heat - dissipation module includes: An inner heat - dissipation part extends into the setting space, receives heat from the heating element and conducts it; and An outer heat - dissipation part extends to the outside of the setting space and exchanges heat between the heat transferred from the inner heat - dissipation part and the air in the external space.

43. The antenna device according to claim 42, characterized in that Each of the plurality of antenna units includes: A first - polarization antenna unit associated with one polarization of the radiation element configured to radiate a dual - polarization beam; and A second - polarization antenna unit associated with the other polarization of the radiation element configured to radiate a dual - polarization beam.

44. The antenna device according to claim 43, characterized in that The first - polarization antenna unit includes: A plurality of one - side radio - frequency filters are stacked and arranged in a column in the up - and - down direction and are vertically stacked and arranged in a flat - laying structure with both ends in the length direction located at the front and back respectively, The second - polarization antenna unit includes: A plurality of the other - side radio - frequency filters are stacked and arranged in a column in the up - and - down direction and are vertically stacked and arranged in a flat - laying structure with both ends in the length direction located at the front and back respectively, and are stacked in the left - and - right direction with respect to one of the left - and - right side surfaces of the plurality of one - side radio - frequency filters. wherein, the filters stacked and arranged in a flat - laying structure at the same position in the up - and - down direction among the plurality of one - side radio - frequency filters and the plurality of the other - side radio - frequency filters constitute two radio - frequency channels.

45. The antenna device according to claim 44, characterized in that Each of the plurality of antenna units further includes: One - side feeder and the other - side feeder supply a predetermined electrical signal to the plurality of one - side radio - frequency filters and the plurality of the other - side radio - frequency filters constituting the two radio - frequency channels; and A power board has a heating element related to one of the two radio - frequency channels mounted on one of the two surfaces, wherein, the power board is stacked and arranged in the flat - laying structure on one of the left - and - right side surfaces of the plurality of one - side radio - frequency filters and the plurality of the other - side radio - frequency filters.

46. The antenna device according to claim 45, characterized in that At the rear end of both ends in the front-rear width direction of the power board, there is a plug head for electrical plug connection with the digital board. On the digital board, there is a socket part for plug connection of the plug head of the power board.

47. The antenna device according to claim 46, characterized in that The outer heat dissipation part in the heat dissipation module is exposed to the external space through the upper end part of the antenna housing body. On the upper end part of the antenna housing body, a guiding groove for guiding the insertion connection when the power board and the digital board are plug-connected is formed to be long in the front-rear direction.

48. The antenna device according to claim 43, characterized in that The outer heat dissipation part in the heat dissipation module is exposed to the external space through the upper end part of the antenna housing body. The antenna device further includes: A finger protection panel assembly, which is combined with the antenna housing body in a manner that does not contact and surround the outer heat dissipation part exposed to the external space through the upper end part of the antenna housing body.

49. The antenna device according to claim 48, characterized in that The finger protection panel assembly is configured to shield all remaining parts except the front part of the outer heat dissipation part exposed to the upper end part of the antenna housing body. The antenna device further includes: An antenna cover panel, which shields the front surface of the opening of the antenna housing body and is made of a material that transmits the beam radiated from the radiation element. Wherein, on the upper part of the antenna cover panel, an antenna cover extension panel for shielding the front part of the outer heat dissipation part not shielded by the finger protection panel assembly is integrally formed.

50. The antenna device according to claim 49, characterized in that In at least a part of the finger protection panel assembly and the antenna cover extension panel, a plurality of ventilation holes for the air in the external space to pass through are formed.

51. An antenna device, characterized in that, Including: An antenna housing body, which is in the shape of a box with an opening in the front and a setting space formed inside; A digital board, which is laminated and combined with the setting space in a close-contact manner on the back surface, and at least one of the two surfaces is mounted with a heating body; and An antenna radio frequency module, which is electrically connected to the digital board and is vertically arranged in the up-down direction so that both surfaces of the antenna radio frequency module face the left and right directions in the setting space respectively. Wherein, the antenna radio frequency module includes: A radiation element, which has dual polarization; A first polarization antenna unit and a second polarization antenna unit, including radio frequency chains corresponding to the respective polarizations of the radiation element to separately control the dual polarization of the radiation element; and A heat dissipation module, which discharges the heat generated by the heat dissipation surfaces of the heating bodies respectively provided in the first polarization antenna unit and the second polarization antenna unit. Wherein, the heat dissipation module is of a plate-type heat exchange type, and the heating bodies of the first polarization antenna unit and the second polarization antenna unit are respectively arranged in surface thermal contact on one surface and the other surface of the heat dissipation module.

52. A lighting device, characterized in that, Including: A lighting main body in the shape of a box, with one surface open for irradiating light and a setting space formed inside. An LED substrate is provided within the installation space of the lighting body, and LED elements are mounted and arranged on at least one of the two sides. And An LED module is electrically connected to the LED substrate and is vertically arranged in the up-down direction within the installation space. Wherein, the LED module includes a heat dissipation module combined with one side or the other side of the LED substrate in the vertical direction or the horizontal direction to discharge the heat generated by the heat generating surface of the LED elements mounted on the LED substrate. Wherein, the heat dissipation module includes: An inner heat dissipation part that extends into the installation space, receives heat from the LED elements and conducts it; and An outer heat dissipation part that extends to the outside of the installation space and exchanges heat between the heat transferred from the inner heat dissipation part and the air in the external space.