Thermal management device and mobile power supply thereof

Abstract

The utility model belongs to the technical field of heat dissipation, and particularly relates to a heat management device and a mobile power supply thereof. The heat dissipation module comprises a heat conduction piece, different heating units are attached to the two faces of the heat conduction piece respectively, a TEC refrigeration piece is attached to one end of the heat conduction piece, a heat dissipation piece is arranged on the TEC refrigeration piece, and a miniature fan is arranged beside the heat dissipation piece. Heat of the heating unit in the mobile power supply can be conducted to the TEC refrigeration sheet for cooling by arranging the heat conduction piece, then the TEC refrigeration sheet is connected with the heat dissipation piece for heat dissipation, and the heat in the heat dissipation piece can be blown to the outside by arranging the micro fan. And in a low-temperature scene, the TEC refrigeration sheet and the micro fan form a heat pump, so that the battery can be efficiently heated, and low-temperature failure is prevented.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation, and particularly relates to a thermal management device and a mobile power supply thereof. Background Art

[0002] With the development of technology and the increasing use of electronic products, mobile power supplies such as power banks have become increasingly popular. With the development of wireless charging wearable devices, many power banks support wireless charging. In wireless power banks, the main components that require thermal management are the battery, power management chip, housing, and charging coil module. There are various existing heat dissipation solutions. For example, the power bank heat dissipation device with the application number CN216673652U dissipates heat externally, with low heat dissipation efficiency and inconvenient portability.

[0003] Another method is to make improvements internally, adding a heat insulation film inside to relieve the temperature on the housing, or adding a fan inside to blow air internally. However, these methods only improve a single heat generating unit, and the heat of other heat generating units still cannot be solved, resulting in poor heat dissipation effect and poor consumer experience. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a thermal management device and a mobile power supply thereof, aiming to solve the technical problem of poor heat dissipation of the mobile power supply in the above-mentioned existing technology.

[0005] To achieve the above purpose, a thermal management device provided by an embodiment of the utility model includes a heat dissipation module; the heat dissipation module includes a heat conducting member, both sides of the heat conducting member are respectively attached to different heat generating units, one end of the heat conducting member is attached with a TEC refrigeration chip, a heat dissipation member is provided on the TEC refrigeration chip, and a micro fan is provided beside the heat dissipation member.

[0006] Optionally, a heat insulation plate is provided on the heat conducting member, the TEC refrigeration chip is provided on the heat insulation plate and one side thereof is attached to the heat conducting member, and the TEC refrigeration chip is attached to the heat dissipation member.

[0007] Optionally, both the heat dissipation member and the micro fan are provided on the heat insulation plate, and the micro fan is arranged close to the heat dissipation member.

[0008] Optionally, a plurality of heat dissipation fins are provided on the heat dissipation member, there is a gap between two adjacent heat dissipation fins, and the plurality of heat dissipation fins are perpendicular to the micro fan.

[0009] Optionally, it includes a housing, and the heat dissipation module is arranged inside the housing, one side of the heat conducting member is attached to the battery, and the other side is attached to the charging coil module.

[0010] Optionally, a main board is further arranged inside the housing, and the main board is attached and arranged on the heat dissipation member.

[0011] Optionally, a plurality of heat dissipation holes are provided on the housing.

[0012] Optionally, a plurality of the heat dissipation holes are located on both sides of the micro fan and are oppositely arranged on the housing.

[0013] Optionally, a magnetic induction ring is sleeved on the charging coil module, and the magnetic induction ring is used for magnetic absorption wireless charging.

[0014] Optionally, the heat conducting member is any one or a combination of graphite, graphene, copper foil, aluminum foil, boron nitride, heat pipe, and heat spreader.

[0015] Compared with the prior art, at least one of the above one or more technical solutions provided by the heat management device and the mobile power supply in the embodiments of the present invention has the following technical effects:

[0016] By providing the heat conducting member, the heat of the heat generating unit in the mobile power supply can be conducted to the TEC refrigeration chip for cooling, and then the TEC refrigeration chip is connected to the heat dissipating member for heat dissipation. The micro fan is provided to blow the heat in the heat dissipating member to the outside. At the same time, in a low temperature scenario, the TEC refrigeration chip and the micro fan form a heat pump, which can efficiently heat the battery to prevent low temperature failure. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a schematic structural diagram of a heat dissipation module.

[0019] Figure 2 It is a schematic structural diagram of the heat dissipation module from another angle.

[0020] Figure 3 It is a schematic structural diagram of a mobile power supply.

[0021] Among them, the reference numerals in the drawings:

[0022] 100, heat dissipation module; 110, heat conducting member; 120, TEC refrigeration chip; 130, heat dissipating member; 131, heat dissipation fins; 140, micro fan; 150, heat insulation board;

[0023] 200, housing; 210, battery; 220, charging coil module; 230, main board; 240, heat dissipation holes; 250, magnetic induction ring. Detailed Description of the Embodiments

[0024] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the embodiments of the present utility model, and should not be construed as a limitation to the present utility model.

[0025] In the description of the embodiments of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0026] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present utility model, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0027] In the embodiments of the present utility model, unless otherwise clearly specified and limited, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0028] In one of the embodiments, according to Figures 1-3 As shown, a thermal management device includes a heat dissipation module 100; the heat dissipation module 100 includes a heat conducting member 110, and different heat generating units are respectively attached to both sides of the heat conducting member 110. One end of the heat conducting member 110 is attached with a TEC refrigeration chip 120, a heat dissipation member 130 is provided on the TEC refrigeration chip 120, and a micro fan 140 is provided beside the heat dissipation member 130. It further includes a housing 200, the heat dissipation module 100 is provided in the housing 200, one side of the heat conducting member 110 is attached to a battery 210, and the other side is attached to a charging coil module 220.

[0029] Specifically, a heat dissipation module 100 is provided inside the outer shell 200. The heat dissipation module 100 includes a heat conducting member 110, a TEC refrigeration chip 120, a heat dissipating member 130, and a micro fan 140. The heat conducting member 110 is connected to the heat generating unit to conduct heat to the TEC refrigeration chip 120. The refrigerating side of the TEC refrigeration chip 120 is attached to the heat conducting member 110 to cool the heat conducting member 110. At the same time, the heating side is attached to the heat dissipating member 130, and the micro fan 140 blows air on the heat dissipating member 130 to dissipate heat, completing the cooling process. This heat dissipation module 100 can be set in other devices that need heat dissipation, such as mobile phones, tablets, laptops, smart wearable devices, etc.

[0030] In the wireless mobile power supply, one side of the heat conducting member 110 is attached to the battery 210, and the other side is attached to the charging coil module 220. The heat conducting member 110 transfers the heat of the battery 210 and the charging coil module 220 to the TEC refrigeration chip 120 for cooling.

[0031] Specifically, by setting the heat conducting member 110, the heat of the heat generating unit in the mobile power supply can be conducted to the TEC refrigeration chip 120 for cooling. Then, the TEC refrigeration chip 120 is connected to the heat dissipating member 130, and the micro fan 140 is set to blow the heat in the heat dissipating member 130 to the outside.

[0032] Furthermore, in a low-temperature scenario, the TEC refrigeration chip 120 can reverse the positive and negative poles and form a heat pump with the micro fan 140, which can absorb ambient heat, efficiently heat the battery 210, and prevent the battery 210 from failing at low temperatures. Maintaining a reasonable temperature of the battery 210 can avoid a too rapid decline in the battery 210's lifespan when the temperature is too low. It can be understood that when using the TEC refrigeration chip 120 to heat the battery 210, compared with ordinary heating films, for the same heating effect, the energy consumption is low and the efficiency is high.

[0033] In another embodiment, according to Figure 1 and 2 As shown, a heat insulation plate 150 is provided on the heat conducting member 110. The TEC refrigeration chip 120 is provided on the heat insulation plate 150 and one side is attached to the heat conducting member 110. The TEC refrigeration chip 120 is attached to the heat dissipating member 130. Both the heat dissipating member 130 and the micro fan 140 are provided on the heat insulation plate 150, and the micro fan 140 is arranged close to the heat dissipating member 130.

[0034] Specifically, the heat insulation plate 150 is set to allow all the heat conducted by the heat conducting member 110 from the heat generating unit to be conducted to the TEC refrigeration chip 120 for cooling, and will not be conducted to other components, avoiding other components from generating heat.

[0035] In another embodiment, according to Figure 1As shown, the heat sink 130 is provided with a plurality of heat dissipation fins 131. There is a gap between two adjacent heat dissipation fins 131, and the plurality of heat dissipation fins 131 are vertically arranged with respect to the micro fan 140.

[0036] Specifically, in order to increase the heat dissipation area, the heat dissipation fins 131 are vertically arranged with respect to the micro fan 140. The micro fan 140 can blow air into the gap to take away the heat, thereby increasing the heat dissipation efficiency.

[0037] In another embodiment, according to Figures 1-3 As shown, a main board 230 is further provided inside the housing 200, and the main board 230 is attached to the heat sink 130.

[0038] Specifically, in a wireless power bank, the main components that mainly require thermal management are the battery 210, the main board 230, the housing 200, and the charging coil module 220. Among them, the battery 210 and the charging coil module 220 are attached to the heat conducting member 110 for heat dissipation, the main board 230 can be attached to the heat sink 130 for heat dissipation, and the housing 200 mainly conducts the heat of the internal battery 210, the main board 230, and the charging coil module 220. This heat dissipation module 100 can dissipate heat from all the heat generating units in the mobile power supply, and has good heat dissipation and temperature control effects.

[0039] In another embodiment, according to Figure 3 As shown, the housing 200 is provided with a plurality of heat dissipation holes 240. The plurality of heat dissipation holes 240 are located on both sides of the micro fan 140 and are oppositely arranged on the housing 200.

[0040] Specifically, an air convection is formed, which can enable the air blown by the micro fan 140 to quickly take away the heat on the heat sink 130.

[0041] In another embodiment, according to Figure 3 As shown, a magnetic attracting ring 250 is sleeved on the charging coil module 220, and the magnetic attracting ring 250 is used for magnetic attraction wireless charging.

[0042] In another embodiment, according to Figure 1 and 2 As shown, the heat conducting member 110 is any one or a combination of graphite, graphene, copper foil, aluminum foil, boron nitride, heat pipes, and vapor chambers. Specifically, the above materials can all achieve heat conduction. Considering lightweight and heat conductivity, graphene is preferably selected.

[0043] The above content is a further detailed description of the present utility model in combination with specific preferred embodiments. It cannot be determined that the specific implementation of the present utility model is only limited to these descriptions. For those of ordinary skill in the technical field to which the present utility model pertains, without departing from the concept of the present utility model, its architecture form can be flexible and variable, and a series of products can be derived. Just making several simple deductions or substitutions should be regarded as belonging to the scope of patent protection determined by the claims submitted for the present utility model.

Claims

1. A thermal management device, characterized in that, It includes a heat dissipation module; the heat dissipation module includes a heat conducting member, both sides of the heat conducting member are respectively attached to different heat generating units, one end of the heat conducting member is attached with a TEC refrigeration chip, a heat dissipating member is provided on the TEC refrigeration chip, and a micro fan is provided beside the heat dissipating member.

2. The thermal management device according to claim 1, wherein An insulating plate is provided on the heat conducting member, the TEC refrigeration chip is arranged on the insulating plate and one side thereof is attached to the heat conducting member, and the TEC refrigeration chip is attached to the heat dissipating member.

3. The thermal management device according to claim 2, characterized in that, Both the heat dissipating member and the micro fan are arranged on the insulating plate, and the micro fan is arranged close to the heat dissipating member.

4. The thermal management device according to claim 3, characterized in that, A plurality of heat dissipation fins are provided on the heat dissipating member, there is a gap between two adjacent heat dissipation fins, and the plurality of heat dissipation fins are perpendicular to the micro fan.

5. A mobile power supply, having the thermal management device described in any one of claims 1-4, characterized in that, It includes a housing; a heat dissipation module is arranged inside the housing, one side of the heat conducting member is attached to the battery, and the other side is attached to the charging coil module.

6. The mobile power supply according to claim 5, wherein A main board is further arranged inside the housing, and the main board is attached and arranged on the heat dissipating member.

7. The mobile power supply according to claim 5, characterized in that A plurality of heat dissipation holes are provided on the housing.

8. The mobile power supply according to claim 7, characterized in that, The plurality of heat dissipation holes are located on both sides of the micro fan and are arranged oppositely on the housing.

9. The mobile power supply according to claim 5, wherein, A magnetic induction ring is sleeved on the charging coil module, and the magnetic induction ring is used for magnetic absorption wireless charging.

10. The mobile power supply according to claim 5, characterized in that, The heat conducting member is any one or a combination of graphite, graphene, copper foil, aluminum foil, boron nitride, heat pipe and heat spreader.

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