PCBA (printed circuit board assembly) heat dissipation glue dispensing structure

Abstract

The utility model discloses a PCBA (printed circuit board assembly) heat dissipation glue dispensing structure which comprises a PCBA board and a metal bottom shell located below the PCBA board, a plurality of components needing heat dissipation are arranged on the PCBA board, a plurality of heat dissipation holes are formed in the positions, corresponding to the components needing heat dissipation, of the PCBA board, the heat dissipation holes in all the positions are arranged in a square shape, and the heat dissipation holes in all the positions are communicated with the metal bottom shell. The PCBA board is provided with heat dissipation holes, so that square patterns used for positioning are formed on the back of the PCBA board, heat dissipation glue is arranged at the positions of the square patterns and covers the heat dissipation holes, a metal heat dissipation board is arranged on the front of the metal bottom shell, and the heat dissipation glue is bonded between the PCBA board and the metal heat dissipation board. According to the utility model, the heat dissipation effect can be effectively ensured, and the square pattern formed on the back surface of the PCBA can play a role in identification and positioning during dispensing, so that large-area dispensing is avoided, the unnecessary consumption of heat dissipation glue is reduced, the cost is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic control units, and particularly relates to a PCBA heat dissipation glue dispensing structure. Background Art

[0002] The traditional PCBA heat dissipation glue dispensing method is to dispense heat dissipation glue over a large area, and fill the heat dissipation area of the metal part corresponding to the PCBA with heat dissipation glue. Since the heat dissipation area of the metal part corresponding to the PCBA is multiple components, some of which do not require the use of heat dissipation glue. At the same time, too much heat dissipation glue will cause glue overflow when the metal part, the heat dissipation glue and the PCBA are pressed. This dispensing method has high cost, low efficiency, and the formed dispensing structure may affect the functions of the product, such as the conduction between the PCBA and the metal part. Content of the Utility Model

[0003] Aiming at the problems existing in the above-mentioned prior art, the utility model aims to provide a PCBA heat dissipation glue dispensing structure, which can improve the heat dissipation effect and reduce the dispensing cost at the same time.

[0004] To achieve the above object, the utility model provides a PCBA heat dissipation glue dispensing structure, which includes a PCBA board and a metal bottom case located below the PCBA board. A plurality of components that need heat dissipation are provided on the PCBA board. A plurality of heat dissipation holes are provided at the positions corresponding to each component that needs heat dissipation on the PCBA board. The heat dissipation holes at each position are arranged in a square pattern, so as to form a square pattern for positioning on the back of the PCBA board. Heat dissipation glue is provided at each position of the square pattern. The heat dissipation glue covers the heat dissipation holes. A metal heat dissipation plate is provided on the front surface of the metal bottom case. The heat dissipation glue is bonded between the PCBA board and the metal heat dissipation plate.

[0005] In the above solution: each heat dissipation glue completely covers the heat dissipation holes at the corresponding position to ensure the heat dissipation effect.

[0006] In the above solution: the heat dissipation holes at each position are arranged in a "field" shape or a "day" shape, that is, a square pattern in the shape of a "field" or a "day" is formed, which can effectively ensure the heat dissipation effect while playing the role of identification and positioning.

[0007] In the above solution: The components that need heat dissipation are distributed on the left and right sides of the PCBA board. Among them, the components that need heat dissipation on the left side are distributed obliquely, and the components that need heat dissipation on the right side are distributed longitudinally. A metal heat sink is provided on the metal bottom case corresponding to each of the components that need heat dissipation on the left side, and another metal heat sink is provided on the metal bottom case corresponding to each of the components that need heat dissipation on the right side. Among them, the metal heat sink on the left side is in an "L" shape, and the metal heat sink on the right side is in a rectangular shape. Both metal heat sinks cover all the square patterns on the corresponding side. The setting of the "L" - shaped metal heat sink is to reduce the occupied space and play an avoidance role. Sharing one metal heat sink for the left - hand heat dissipation area and one metal heat sink for the right - hand heat dissipation area is beneficial to simplifying the structure and improving the processing efficiency.

[0008] In the above solution: The metal heat sink is integrally formed with the metal bottom case. Heat dissipation fins are provided on the back of the metal bottom case to increase the heat dissipation area of the metal bottom case and improve the heat exchange efficiency.

[0009] The beneficial effects of the present utility model are as follows: 1. Multiple square - arranged heat dissipation holes are provided at the corresponding positions of each component that needs heat dissipation, which can effectively ensure the heat dissipation effect; 2. The heat dissipation holes form square patterns on the back of the PCBA board, which can play a role of marking and positioning during dispensing, facilitating the precise dispensing of the dispenser, avoiding large - area scattering, reducing the unnecessary consumption of heat - dissipation glue, being beneficial to cost reduction and production efficiency improvement; 3. The metal heat sink plays the role of an intermediate connecting part, which can effectively ensure the contact area between the heat - dissipation glue and the metal shell and ensure the heat - dissipation effect. Description of the Drawings

[0010] Figure 1 is the exploded schematic diagram of the present utility model.

[0011] Figure 2 is the back - side schematic diagram of the PCBA board.

[0012] Figure 3 is Figure 2 the enlarged schematic diagram of part A in Detailed Embodiments

[0013] As Figure 1 shown in FIG. - 3, a PCBA heat - dissipation glue dispensing structure mainly consists of a PCBA board 1 and a metal bottom case 2 located below the PCBA board 1.

[0014] A plurality of components 6 that need heat dissipation are provided on the PCBA board 1. A number of heat dissipation holes 3 are provided at the positions corresponding to each component 6 that needs heat dissipation on the PCBA board 1. The heat dissipation holes 3 at each position are arranged in a square shape, thereby forming a square pattern for positioning on the back of the PCBA board 1.

[0015] A heat dissipation adhesive 4 is provided at each square pattern position, and the heat dissipation adhesive 4 covers the heat dissipation holes 3; a metal heat dissipation plate 5 is provided on the front surface of the metal bottom case 2, and the heat dissipation adhesive 4 is bonded between the PCBA board 1 and the metal heat dissipation plate 5.

[0016] The square pattern can play a role in marking and positioning during dispensing, facilitating precise dispensing by the dispenser, avoiding large-area scattering, reducing the unnecessary amount of heat dissipation adhesive, and thus preventing glue overflow during the pressing of the metal heat dissipation plate 5, the heat dissipation adhesive 3 and the PCBA board 1, which may cause non-conduction between the PCBA board 1 and the metal housing 2.

[0017] Preferably, each heat dissipation adhesive 4 completely covers the heat dissipation holes 3 at the corresponding position to ensure the heat dissipation effect.

[0018] Preferably, the heat dissipation holes 3 at each position are arranged in a "field" shape or a "day" shape, that is, a square pattern in the shape of a "field" or a "day" is formed, which can effectively ensure the heat dissipation effect while playing a role in marking and positioning.

[0019] Preferably, the components 6 that need heat dissipation are distributed on the left and right sides of the PCBA board 1. Among them, the components 6 that need heat dissipation on the left side are distributed obliquely, and the components 6 that need heat dissipation on the right side are distributed longitudinally; a metal heat dissipation plate 5 is jointly provided on the metal bottom case 2 corresponding to the components 6 that need heat dissipation on the left side, and another metal heat dissipation plate 5 is jointly provided on the metal bottom case 2 corresponding to the components 6 that need heat dissipation on the right side. Among them, the metal heat dissipation plate 5 on the left side is in an "L" shape, and the metal heat dissipation plate 5 on the right side is in a rectangular shape. Both metal heat dissipation plates 5 cover all the square patterns on the corresponding side. The setting of the "L"-shaped metal heat dissipation plate 5 is to reduce the occupied space and play an avoidance role.

[0020] The left heat dissipation area shares a metal heat dissipation plate 5, and the right heat dissipation area also shares a metal heat dissipation plate 5, which is beneficial to simplifying the structure and improving the processing efficiency.

[0021] Preferably, the metal heat dissipation plate 5 and the metal bottom case 2 are integrally formed, and heat dissipation fins are provided on the back surface of the metal bottom case 2 to increase the heat dissipation area of the metal bottom case 2 and improve the heat exchange efficiency.

Claims

1. A PCBA heat dissipation glue dispensing structure, comprising a PCBA board (1) and a metal bottom case (2) located below the PCBA board (1). A plurality of components (6) that need to dissipate heat are provided on the PCBA board (1), and it is characterized in that: At the positions corresponding to each component (6) that needs heat dissipation on the PCBA board (1), a number of heat dissipation holes (3) are provided. The heat dissipation holes (3) at each position are arranged in a square pattern, thereby forming a square pattern for positioning on the back of the PCBA board (1). At the positions of each of the square patterns, a heat dissipation adhesive (4) is provided. The heat dissipation adhesive (4) covers the heat dissipation holes (3). On the front surface of the metal bottom case (2), a metal heat dissipation plate (5) is provided. The heat dissipation adhesive (4) is bonded between the PCBA board (1) and the metal heat dissipation plate (5).

2. The PCBA heat dissipation glue dispensing structure according to claim 1, wherein: Each heat dissipation adhesive (4) completely covers the heat dissipation holes (3) at the corresponding position.

3. The PCBA heat dissipation glue dispensing structure according to claim 1, wherein: The heat dissipation holes (3) at each position are arranged in a "field" shape or a "day" shape.

4. The PCBA heat dissipation glue dispensing structure according to claim 1, characterized in that: The components (6) that need heat dissipation are distributed on the left and right sides of the PCBA board (1). Among them, the components (6) that need heat dissipation on the left side are distributed obliquely, and the components (6) that need heat dissipation on the right side are distributed longitudinally. A common metal heat dissipation plate (5) is provided on the metal bottom case (2) corresponding to the components (6) that need heat dissipation on the left side, and another metal heat dissipation plate (5) is provided on the metal bottom case (2) corresponding to the components (6) that need heat dissipation on the right side. Among them, the metal heat dissipation plate (5) on the left side is in an "L" shape, and the metal heat dissipation plate (5) on the right side is in a rectangular shape. Both metal heat dissipation plates (5) cover all the square patterns on the corresponding side.

5. The PCBA heat dissipation glue dispensing structure according to claim 4, characterized in that: The metal heat dissipation plate (5) and the metal bottom case (2) are integrally formed. Heat dissipation fins are provided on the back surface of the metal bottom case (2).

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