Battery string welding equipment

Abstract

The utility model discloses a battery string welding device, a tandem welding machine is arranged on the right side of a feeding and gluing machine, a discharging mechanism is arranged on the right side of the tandem welding machine, and the feeding and gluing machine, the tandem welding machine and the discharging mechanism are combined and connected to form the device. By cooperation of various different mechanisms, gluing, detecting, welding and blanking operations can be performed on silicon wafers at the same time, so that the efficiency of string welding processing of the silicon wafers is improved; a turnover transmission mechanism, a camera detection mechanism, a welding strip wire guiding mechanism, a clamp module mechanism, a guide groove supporting plate mechanism, a welding strip net pressing mechanism and a guide groove moving mechanism are arranged in the tandem welding machine, silicon wafers subjected to gluing can be detected, so that unqualified silicon wafers are removed, welding strips can be guided, positioned and smoothened, and the production efficiency is improved. Therefore, the welding strip can be placed on the silicon wafer more precisely and smoothly, and the welding precision and the yield are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of battery chip processing equipment, in particular to a battery string welding device. Background Technique

[0002] In the process of manufacturing solar cells, it is necessary to string together the made crystalline silicon battery chips one by one. This stringing process is mostly realized by a string welding machine. Most of the existing battery chip string welding machines are composed of an automatic feeding mechanism, a solder tape feeding mechanism, a welding mechanism and an automatic discharging mechanism connected in sequence. Generally, before connecting multiple silicon wafers together, a layer of glue needs to be set on the surface of the silicon wafers. In the existing equipment, glue application and string welding are separately set, that is, after glue application, the glued silicon wafers need to be manually placed in the string welding machine for welding. Moreover, in the existing string welding machine, there is no good limiting effect on the solder tape, and the positions of multiple silicon wafers will shift during stringing, resulting in low yield. Therefore, we have designed a battery string welding device. Content of the Utility Model

[0003] A battery string welding device proposed by the utility model solves the problem that the positions of multiple silicon wafers shift during stringing, resulting in low yield.

[0004] In order to achieve the above object, the utility model adopts the following technical scheme:

[0005] A battery string welding device includes a loading and glue applying machine. A stringing and welding machine is arranged on the right side of the loading and glue applying machine, and a blanking mechanism is arranged on the right side of the stringing and welding machine. The loading and glue applying machine is used for loading silicon wafers, and the blanking mechanism is used for unloading silicon wafers. The stringing and welding machine includes a silicon wafer transmission assembly, a solder tape loading assembly and a welding assembly. During the transmission of silicon wafers, the silicon wafer transmission assembly detects the silicon wafers through a detection assembly, accurately guides and transmits the solder tape through the solder tape loading assembly, and the welding assembly welds the solder tape and the battery chips together in series to complete the welding operation. A string cutting assembly is installed at the rear end of the welding assembly to cut off the redundant positions after welding.

[0006] Further, the loading and glue applying machine includes a material box lifting mechanism for storing silicon wafers and lifting and feeding multiple stacked silicon wafers upward;

[0007] A positioning and translation mechanism for grasping the silicon wafers above the material box lifting mechanism to the positioning table for positioning and transferring them to the next mechanism;

[0008] A glue applying mechanism for receiving the translated silicon wafers and injecting glue under a certain pressure in cooperation with a piezoelectric valve;

[0009] The silicon wafer transfer mechanism a is used to convey the silicon wafers after gluing into the series welding machine for welding operations;

[0010] The silicon wafer grasping mechanism is used to grasp the silicon wafers on the top of the cassette lifting mechanism and place them on the positioning and translation mechanism, and grasp and place the silicon wafers after gluing on the silicon wafer transfer mechanism a. The silicon wafer grasping mechanism includes a moving module that moves left and right, and a suction cup for grasping the silicon wafers is also provided on the slider below the moving module;

[0011] The cassette lifting mechanism includes a cassette and a lifting device placed below the cassette, and a photoelectric sensor for detecting the silicon wafers is also provided above the cassette. Multiple silicon wafers are manually stacked and placed in the cassette, and the silicon wafers are pushed upward by the lifting device below. The silicon wafer at the top is grasped by the suction cup in the silicon wafer grasping mechanism and placed on the positioning table in the positioning and translation mechanism for positioning. At this time, after the photoelectric sensor above detects that the silicon wafer above is missing, the lifting device will move the entire stack of silicon wafers upward by the thickness of one silicon wafer, so as to facilitate the grasping of the next silicon wafer.

[0012] Further, the silicon wafer transfer assembly includes a silicon wafer transfer mechanism b, which connects to the silicon wafer transfer mechanism a in the feeding and gluing machine and conveys the silicon wafers to this mechanism;

[0013] The flipping transfer mechanism is used to convey the silicon wafers on the silicon wafer transfer mechanism b and flip them 180 degrees, and convey them to the next mechanism;

[0014] A moving platform for placing the silicon wafers after flipping is also provided on the left side of the flipping transfer mechanism. After the silicon wafers placed on the silicon wafer transfer mechanism b are conveyed to the end, the suction cup in the flipping transfer mechanism will grasp the silicon wafers and flip them 180 degrees and place them on the moving platform. The moving platform will move below the detection component and perform corresponding detections;

[0015] The manipulator mechanism 24 grasps the silicon wafers after detection, rejects the unqualified silicon wafers into the NG box, and conveys the qualified silicon wafers to the next mechanism;

[0016] The wafer transfer mechanism b is located directly to the right of the wafer transfer mechanism a and is designed to be flush with it. On both the front and back sides of the end of the wafer transfer mechanism b close to the wafer transfer mechanism a, there are wafer positioning structures. Both the wafer transfer mechanism b and the wafer transfer mechanism a are composed of two conveyor belts. In the wafer transfer mechanism b, there is also a wafer front alignment structure between the two conveyor belts. The wafer front alignment structure includes a rotary cylinder installed between the two conveyor belts, and a positioning plate is arranged on the rotary cylinder. The wafer positioning structure includes a cylinder and a push plate, which is used to align the wafer transported above the wafer transfer mechanism b. The positioning plate can position the wafer so that it cannot move forward any further. Then, the cylinder pushes the push plate to move inward, and the inner side of the push plate contacts the wafer, thus aligning it.

[0017] Further, the detection component includes a camera detection mechanism. The camera detection mechanism includes a CCD camera. Below the CCD camera, there is an acrylic plate. The CCD camera can take pictures and detect the glue application position of the wafer. The non-compliant wafers enter the NG box, and the qualified wafers enter the next process.

[0018] Further, the solder tape feeding component includes a solder tape unwinding mechanism, which unwinds the solder tape and transports it into the next mechanism;

[0019] A solder tape guiding mechanism, which is a mechanism composed of guide wheels to provide guidance for the solder tape;

[0020] A shearing combination mechanism. When the solder tape is transmitted here, it dips into the flux pool to pick up flux, is introduced, fixed, and then the solder tape is sheared;

[0021] A clip module mechanism, which picks up the sheared solder tape and transports it to the next mechanism;

[0022] A transfer adsorption mechanism, on which the sheared solder tape is placed, and is used to receive the qualified wafers, and the wafers are placed on the solder tape.

[0023] Further, the shearing combination mechanism also includes a flux supply device. The flux supply device includes a flux pool and a flux supply liquid device connected to the flux pool, which can leave flux on the surface of the solder tape, thus facilitating subsequent welding operations;

[0024] At the discharge end of the clip module mechanism, there is a guide groove support plate mechanism, and there is a solder tape groove on the guide groove support plate mechanism, which is used to hold the solder tape, introduce the solder tape, and position and guide it, improving the movement accuracy of the solder tape;

[0025] Above the guide groove support plate mechanism, there is also a solder tape pressing net mechanism. The solder tape pressing net mechanism includes a transverse movement cylinder. The transverse movement cylinder is installed with a pressing cylinder through a sliding seat. There is a pressing plate on the pressing cylinder, and there is a pressing strip below the pressing plate that matches the solder tape groove, which can be used to press the solder tape, accurately position it, and prevent it from shifting;

[0026] Above the side of the transmission adsorption mechanism close to the solder tape pressing net mechanism, a guide groove moving mechanism is movably arranged. The guide groove moving mechanism includes a moving plate and a moving module for pushing the moving plate to move. The air cylinder is installed on the side of the transmission adsorption mechanism, and the moving plate is placed above it. The moving plate is driven to move by the moving module, and the moving direction is opposite to the conveying direction of the conveying adsorption mechanism, which can reverse the smoothness of the solder tape placed on the conveying adsorption mechanism and make it flat.

[0027] Furthermore, the welding assembly includes a lamp cover welding mechanism, which is placed above the transmission adsorption mechanism and welds and fuses the transmitted solder tape and silicon wafers together in series at a specified position.

[0028] Furthermore, the string cutting assembly includes a string cutting knife mechanism. The string cutting knife mechanism is installed at the end of the transmission adsorption mechanism. The transmission adsorption mechanism transports the welded and fused solder tape and silicon wafers on it to the lower part of the string cutting knife mechanism. The redundant positions are cut off by the string cutting knife mechanism. After cutting, the silicon wafers are introduced into the next mechanism through the string cutting knife mechanism. The string cutting knife mechanism includes two parts: a conveyor belt and a cutting knife structure. The cutting knife structure is installed above the conveyor belt. The solder tape and silicon wafers on the transmission adsorption mechanism are transported to the conveyor belt and placed under the cutting knife structure. After being cut by the cutting knife structure, they are transported to the blanking mechanism through the conveyor belt.

[0029] Furthermore, an adsorption heating device is also arranged inside the transmission adsorption mechanism, and the silicon wafers can be transported in this structure and be in a constant temperature state.

[0030] Furthermore, the blanking mechanism includes a silicon wafer transmission device and a translation device. Below the translation device, there are multiple adsorption heads adsorbed at equal intervals. The silicon wafer transmission device is connected to the string cutting knife mechanism, and a finished product area is also arranged on the side of the silicon wafer transmission device. The cut silicon wafers and solder tape are moved to the silicon wafer transmission device under the action of the string cutting knife mechanism. The translation device can grab the welded silicon wafers placed on the silicon wafer transmission device to the finished product area through the adsorption heads below, and then be manually carried;

[0031] For the blanking mechanism, the series of silicon wafers are successively introduced to become finished products, and reach the finished product position through the up-down, front-back translation in this mechanism, and the work ends here. The next work is completed by manual handling.

[0032] The beneficial effects of the present utility model:

[0033] 1. By combining and connecting the feeding glue applicator, the series connection welding machine and the blanking mechanism into a U-shaped device, its overall structure is compactly designed, and with the cooperation of various different mechanisms, it can simultaneously perform glue application, detection, welding and blanking operations on silicon wafers, improving the efficiency of the series welding processing of silicon wafers;

[0034] 2. By arranging a flipping and conveying mechanism, a camera detection mechanism, a welding tape and wire guiding mechanism, a clip module mechanism, a guide groove and pallet mechanism, a welding tape pressing net mechanism and a guide groove moving mechanism in the series welding machine, it can detect the silicon wafers after gluing, so as to reject unqualified silicon wafers, and it can guide, position and straighten the welding tape, making the welding tape more precise and smooth on the silicon wafers, improving the welding precision and yield. Brief Description of the Drawings

[0035] Figure 1 It is a front view sectional schematic diagram of a battery string welding device proposed by the present utility model;

[0036] Figure 2 It is a structural block diagram of a battery string welding device proposed by the present utility model;

[0037] Figure 3 It is a structural schematic diagram of a cartridge lifting mechanism of a battery string welding device proposed by the present utility model;

[0038] Figure 4 It is a structural schematic diagram of a positioning and translation mechanism of a battery string welding device proposed by the present utility model;

[0039] Figure 5 It is a structural schematic diagram of a gluing mechanism of a battery string welding device proposed by the present utility model;

[0040] Figure 6 It is a structural schematic diagram of a silicon wafer conveying mechanism a of a battery string welding device proposed by the present utility model;

[0041] Figure 7 It is a structural schematic diagram of a silicon wafer grasping mechanism of a battery string welding device proposed by the present utility model;

[0042] Figure 8 It is a structural schematic diagram of a silicon wafer conveying mechanism b of a battery string welding device proposed by the present utility model;

[0043] Figure 9 It is a structural schematic diagram of a flipping and conveying mechanism of a battery string welding device proposed by the present utility model;

[0044] Figure 10 It is a structural schematic diagram of a camera detection mechanism of a battery string welding device proposed by the present utility model;

[0045] Figure 11 It is a structural schematic diagram of a manipulator mechanism of a battery string welding device proposed by the present utility model;

[0046] Figure 12Schematic diagram of the solder tape unwinding mechanism of a solder string welding device proposed by the present utility model;

[0047] Figure 13 Schematic diagram of the solder tape guiding mechanism of a solder string welding device proposed by the present utility model;

[0048] Figure 14 Side view of the solder tape guiding mechanism of a solder string welding device proposed by the present utility model;

[0049] Figure 15 Schematic diagram of the shearing combination mechanism of a solder string welding device proposed by the present utility model;

[0050] Figure 16 Schematic diagram of the clip module mechanism of a solder string welding device proposed by the present utility model;

[0051] Figure 17 Schematic diagram of the guide groove support plate mechanism of a solder string welding device proposed by the present utility model;

[0052] Figure 18 Schematic diagram of the solder tape pressing mesh mechanism of a solder string welding device proposed by the present utility model;

[0053] Figure 19 Schematic diagram of the guide groove moving mechanism of a solder string welding device proposed by the present utility model;

[0054] Figure 20 Schematic diagram of the transmission adsorption mechanism of a solder string welding device proposed by the present utility model;

[0055] Figure 21 Schematic diagram of the lamp shade welding mechanism of a solder string welding device proposed by the present utility model;

[0056] Figure 22 Schematic diagram of the string cutting knife mechanism of a solder string welding device proposed by the present utility model;

[0057] Figure 23 Schematic diagram of the blanking mechanism of a solder string welding device proposed by the present utility model.

[0058] Reference numerals in the figures: 1, loading and gluing machine; 11, cartridge lifting mechanism; 12, positioning and translation mechanism; 13, gluing mechanism; 14, silicon wafer transfer mechanism a; 15, silicon wafer gripping mechanism; 2, series connection welding machine; 21, silicon wafer transfer mechanism b; 201, silicon wafer front alignment structure; 202, silicon wafer positioning structure; 22, flipping and transfer mechanism; 23, camera detection mechanism; 24, manipulator mechanism; 25, solder tape pay-off mechanism; 26, solder tape guiding mechanism; 27, shearing combination mechanism; 28, clip module mechanism; 29, guide groove support plate mechanism; 210, solder tape pressing net mechanism; 211, guide groove moving mechanism; 212, transfer and adsorption mechanism; 213, lamp cover welding mechanism; 214, series cutting knife mechanism; 3, unloading mechanism. Detailed implementation manners

[0059] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0060] Refer to Figure 1-23 , a battery string welding device, including a loading and gluing machine 1, a series connection welding machine 2 is arranged on the right side of the loading and gluing machine 1, and an unloading mechanism 3 is arranged on the right side of the series connection welding machine 2. The loading and gluing machine 1 is used for loading silicon wafers, and the unloading mechanism 3 is used for unloading silicon wafers. The series connection welding machine 2 includes a silicon wafer transfer assembly, a solder tape loading assembly, and a welding assembly. During the process of transferring the silicon wafers, the silicon wafer transfer assembly detects the silicon wafers through a detection assembly, accurately guides and transfers the solder tape through the solder tape loading assembly, and the welding assembly welds the solder tape and multiple silicon wafers together in series to complete the welding operation. A series cutting assembly is installed at the rear end of the welding assembly to cut off the redundant positions after welding.

[0061] The loading and gluing machine 1 includes a cartridge lifting mechanism 11, which is used to store silicon wafers and lift and feed multiple stacked silicon wafers upward;

[0062] A positioning and translation mechanism 12, which is used to grab the silicon wafers above the cartridge lifting mechanism 11 to the positioning table for positioning and transfer them to the next mechanism;

[0063] A gluing mechanism 13, which receives the translated silicon wafers and injects glue with a certain pressure in cooperation with a piezoelectric valve;

[0064] A silicon wafer transfer mechanism a 14, which is used to convey the glued silicon wafers into the series connection welding machine 2 for welding operations;

[0065] The silicon wafer gripping mechanism 15 is used to grip the silicon wafers on the top of the cassette lifting mechanism 11 and place them on the positioning and translation mechanism 12, and to grip and place the silicon wafers after gluing on the silicon wafer transfer mechanism a14. The silicon wafer gripping mechanism 15 includes a moving module that moves left and right, and a suction cup for gripping silicon wafers is also provided on the slider below the moving module.

[0066] The cassette lifting mechanism 11 includes a cassette and a lifting device placed below the cassette, and a photoelectric sensor for detecting silicon wafers is also provided above the cassette. Multiple silicon wafers are manually stacked and placed in the cassette, and the silicon wafers are pushed upward by the lifting device below. The silicon wafer at the uppermost position is gripped by the suction cup in the silicon wafer gripping mechanism 15 and placed on the positioning table in the positioning and translation mechanism 12 for positioning. At this time, after the upper photoelectric sensor detects that the silicon wafer above is missing, the lifting device will move the entire stack of silicon wafers upward by the thickness of one silicon wafer, so as to facilitate the gripping of the next silicon wafer.

[0067] The silicon wafer transfer assembly includes a silicon wafer transfer mechanism b21, which is connected to the silicon wafer transfer mechanism a14 in the feeding and gluing machine 1 and conveys the silicon wafers to this mechanism.

[0068] The flipping and transfer mechanism 22 is used to convey the silicon wafers on the silicon wafer transfer mechanism b21 and flip them 180 degrees, and convey them to the next mechanism.

[0069] A moving platform for placing the flipped silicon wafers is also provided on the left side of the flipping and transfer mechanism 22. After the silicon wafers placed on the silicon wafer transfer mechanism b32 are conveyed to the end, the suction cup in the flipping and transfer mechanism 22 will grip the silicon wafers and flip them 180 degrees and place them on the moving platform. The moving platform will move below the detection component and perform corresponding detections.

[0070] The manipulator mechanism 24 grips the detected silicon wafers, rejects the unqualified silicon wafers into the NG box, and conveys the qualified silicon wafers to the next mechanism.

[0071] The silicon wafer transfer mechanism b21 is located directly to the right of the silicon wafer transfer mechanism a14 and is designed to be flush with it. Silicon wafer positioning structures 202 are provided on both the front and back sides of the end of the silicon wafer transfer mechanism b21 close to the silicon wafer transfer mechanism a14. Both the silicon wafer transfer mechanism b21 and the silicon wafer transfer mechanism a14 are composed of two groups of conveyor belts. In the silicon wafer transfer mechanism b21, a silicon wafer front alignment structure 201 is also provided between the two conveyor belts. The silicon wafer front alignment structure 201 includes a rotary cylinder installed between the two conveyor belts, and a positioning plate is provided on the rotary cylinder. The silicon wafer positioning structure 202 includes a cylinder and a push plate, which are used to align the silicon wafers conveyed above the silicon wafer transfer mechanism b21. The positioning plate can position the silicon wafers so that they cannot move forward continuously. Then the cylinder pushes the push plate inward, and the inner side of the push plate contacts the silicon wafers, so as to align them.

[0072] The detection component includes a camera detection mechanism 23. The camera detection mechanism 23 includes a CCD camera. Below the CCD camera, there is an acrylic plate. The CCD camera can take pictures and detect the gluing position of the silicon wafer. Those that do not meet the requirements enter the NG box, and those that are qualified enter the next process.

[0073] The solder tape feeding component includes a solder tape unwinding mechanism 25, which unwinds the solder tape and conveys it into the next mechanism.

[0074] The solder tape guiding mechanism 26, which is composed of guide wheels and provides guidance for the solder tape.

[0075] The shearing combination mechanism 27. The solder tape is transmitted here, dipped in flux in the flux pool, introduced, fixed, and then sheared.

[0076] The clip module mechanism 28, which clamps the sheared solder tape and conveys it to the next mechanism.

[0077] The transmission adsorption mechanism 212. The sheared solder tape is placed on this mechanism, and it is also used to receive the qualified silicon wafer, and the silicon wafer is placed on the solder tape.

[0078] The shearing combination mechanism 27 also includes a flux supply device. The flux supply device includes a flux pool and a flux supply device connected to the flux pool, which can leave flux on the surface of the solder tape, thus facilitating subsequent welding operations.

[0079] At the discharge end of the clip module mechanism 28, there is a guide groove support plate mechanism 29. The guide groove support plate mechanism 29 is provided with a solder tape groove, which is used to hold the solder tape, introduce the solder tape, and position and guide it, improving the moving accuracy of the solder tape.

[0080] Above the guide groove support plate mechanism 29, there is also a solder tape pressing net mechanism 210. The solder tape pressing net mechanism 210 includes a transverse movement cylinder. The transverse movement cylinder is installed with a pressing cylinder through a sliding seat. The pressing cylinder is provided with a pressing plate, and below the pressing plate, there is a pressing strip matching the solder tape groove, which can be used to press the solder tape, make it accurately positioned, and prevent it from shifting.

[0081] On the upper side close to the solder tape pressing net mechanism 210 of the transmission adsorption mechanism 212, there is a guide groove moving mechanism 211 movably arranged. The guide groove moving mechanism 211 includes a moving plate and a moving module that pushes the moving plate to move. The cylinder is installed on the side of the transmission adsorption mechanism 212, and the moving plate is placed above it. The moving plate is driven by the moving module to move, and the moving direction is opposite to the conveying direction of the conveying adsorption mechanism 212, which can reverse and smooth the solder tape placed on the conveying adsorption mechanism 212 to make it flat.

[0082] The welding assembly includes a lamp cover welding mechanism 213, which is placed above the transfer and adsorption mechanism 212 and welds and fuses the transferred solder tapes and silicon wafers in series at a specified position.

[0083] The string cutting assembly includes a string cutting knife mechanism 214. The string cutting knife mechanism 214 is installed at the tail end of the transfer and adsorption mechanism 212. The transfer and adsorption mechanism 212 transfers the welded and fused solder tapes and silicon wafers thereon to the lower part of the string cutting knife mechanism 214. The redundant positions are cut off by the string cutting knife mechanism 214. After cutting, the silicon wafers are introduced into the next mechanism through the string cutting knife mechanism 214. The string cutting knife mechanism 214 includes two parts: a conveyor belt and a cutting knife structure. The cutting knife structure is installed above the conveyor belt. The solder tapes and silicon wafers on the transfer and adsorption mechanism 212 are transported onto the conveyor belt and placed under the cutting knife structure. After being cut by the cutting knife structure, they are transported to the blanking mechanism 3 through the conveyor belt.

[0084] An adsorption heating device is also arranged inside the transfer and adsorption mechanism 212, where the silicon wafers can be transferred and kept at a constant temperature.

[0085] The blanking mechanism 3 includes a silicon wafer transfer device and a translation device. Below the translation device, there are multiple suction heads adsorbed at equal intervals. The silicon wafer transfer device is connected to the string cutting knife mechanism 214, and a finished product area is also arranged on the side of the silicon wafer transfer device;

[0086] For the blanking mechanism 3, the series of silicon wafers are successively introduced to become finished products and reach the finished product area through the up-down and front-back translation in this mechanism, and the work ends here. The subsequent work is completed by manual handling.

[0087] In the actual welding method during the working process, it includes the following steps: The feeding and gluing machine 1 adopts the cooperative operation of two mechanisms in the working condition without interfering with each other, thereby improving its working efficiency. Manually stack multiple silicon wafers into the material box in the material box lifting mechanism 11, and the silicon wafers are pushed up by the lifting device below. The silicon wafer at the top is grabbed by the suction cup in the silicon wafer grasping mechanism 15 and placed on the positioning table in the positioning and translation mechanism 12 for positioning. Then, the positioning table in the positioning and translation mechanism 12 will be translated to the lower part of the gluing mechanism 13. At this time, the silicon wafer under the gluing mechanism 13 is given a certain pressure with the cooperation of the piezoelectric valve to inject glue. The glued silicon wafer is grabbed by the suction cup in the silicon wafer grasping mechanism 15 and placed on the silicon wafer transfer mechanism a14;

[0088] The silicon wafers with glue applied are conveyed to the silicon wafer transfer mechanism b21 through the silicon wafer transfer mechanism a14. When the silicon wafers placed on the silicon wafer transfer mechanism b32 are conveyed to the end, the suction cups in the flipping transfer mechanism 22 will grasp the silicon wafers and flip them 180 degrees and then place them on the moving platform. And the moving platform is placed below the CCD camera and is detected. After that, the manipulator mechanism 24 will grasp the silicon wafers and make the non-compliant silicon wafers enter the NG box, and the qualified silicon wafers enter and are placed above the solder tapes on the transfer adsorption mechanism 212;

[0089] Among them, the solder tape pay-off mechanism 25 will lower the solder tape through the solder tape guiding mechanism 26. The lowered solder tape is placed on the shearing combination mechanism 27. The solder tape is transmitted here, dipped in flux in the flux bath, introduced, fixed and sheared, and under the action of the clip module mechanism 28, it passes through the guide groove support mechanism 29, the solder tape pressing net mechanism 210 and the guide groove moving mechanism 211 for guiding, straightening and then placed on the transfer adsorption mechanism 212;

[0090] After that, the qualified silicon wafers are placed on the solder tape. The transfer adsorption mechanism 212 makes the silicon wafers and the solder tape move together to the lower part of the lamp cover welding mechanism 213, and welds and fuses the transmitted solder tape and the battery wafers in series together. 214, the welded and fused solder tape and silicon wafers on the transfer adsorption mechanism 212 are conveyed to the lower part of the string cutting knife mechanism 214, and the redundant positions are cut off, and then introduced into the blanking mechanism 3. The in-series silicon wafers are successively introduced to become finished products, and reach the finished product position through the up-and-down, front-and-back translation in this mechanism. So far, the work is completed, and the next work is completed by manual handling.

[0091] By combining and connecting the loading and gluing machine 1, the series connection welding machine 2 and the blanking mechanism 3 to form a shaped device, its overall structure is compactly designed, and with the cooperation of a variety of different mechanisms working together, it can simultaneously perform gluing, detection, welding and blanking operations on silicon wafers, improving the efficiency of the series connection welding processing of silicon wafers;

[0092] By setting the flipping transfer mechanism 22, the camera detection mechanism 23, the solder tape guiding mechanism 26, the clip module mechanism 28, the guide groove support mechanism 29, the solder tape pressing net mechanism 210 and the guide groove moving mechanism 211 in the series connection welding machine 2, it can detect the silicon wafers after gluing, so as to eliminate the non-compliant silicon wafers, and it can guide, position and straighten the solder tape, making the solder tape placed on the silicon wafers more precise and smooth, improving the welding precision and the yield rate.

[0093] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0094] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more, unless otherwise specifically defined.

[0095] The above is only the preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and inventive concept of the present utility model, makes equivalent substitutions or changes, and should be covered by the protection scope of the present utility model.

Claims

1. A battery string welding device, characterized in that, It includes a loading and gluing machine (1). A series connection welding machine (2) is arranged on the right side of the loading and gluing machine (1). A blanking mechanism (3) is arranged on the right side of the series connection welding machine (2). The loading and gluing machine (1) is used for loading silicon wafers, and the blanking mechanism (3) is used for unloading silicon wafers. The series connection welding machine (2) includes a silicon wafer transmission component, a solder tape loading component, and a welding component. During the process of transmitting silicon wafers, the silicon wafer transmission component detects the silicon wafers through a detection component, accurately guides and transmits the solder tape for loading through the solder tape loading component, and the welding component welds the solder tape and multiple silicon wafers in series together to complete the welding operation. A series cutting component is installed at the rear end of the welding component to cut off the redundant positions after welding.

2. The battery string welding device according to claim 1, wherein, The loading and gluing machine (1) includes a cartridge lifting mechanism (11) for storing silicon wafers and lifting multiple stacked silicon wafers upward for feeding. A positioning and translation mechanism (12) for grasping the silicon wafers above the cartridge lifting mechanism (11) to the positioning table for positioning and transferring them to the next mechanism. A gluing mechanism (13) for receiving the translated silicon wafers and injecting glue with a certain pressure in cooperation with a piezoelectric valve. A silicon wafer transmission mechanism a (14) for conveying the glued silicon wafers into the series connection welding machine (2) for welding operations. A silicon wafer grasping mechanism (15) for grasping the silicon wafers at the top of the cartridge lifting mechanism (11) and placing them on the positioning and translation mechanism (12), and grasping and placing the glued silicon wafers on the silicon wafer transmission mechanism a (14). The cartridge lifting mechanism (11) includes a cartridge and a lifting device placed below the cartridge, and a photoelectric sensor for detecting silicon wafers is also arranged above the cartridge.

3. A battery string welding device according to claim 1, characterized in that, The silicon wafer transmission component includes a silicon wafer transmission mechanism b (21) that connects to the silicon wafer transmission mechanism a (14) in the loading and gluing machine (1) and conveys the silicon wafers to this mechanism. A flipping and transmission mechanism (22) for conveying the silicon wafers on the silicon wafer transmission mechanism b (21), flipping them 180 degrees, and conveying them to the next mechanism. A manipulator mechanism (24) for grasping the detected silicon wafers, rejecting the unqualified silicon wafers into the NG box, and conveying the qualified silicon wafers to the next mechanism. The silicon wafer transmission mechanism b (21) is directly to the right of the silicon wafer transmission mechanism a (14) and is designed to be flush. Silicon wafer positioning structures (202) are arranged on both the front and rear sides of the end of the silicon wafer transmission mechanism b (21) close to the silicon wafer transmission mechanism a (14). Both the silicon wafer transmission mechanism b (21) and the silicon wafer transmission mechanism a (14) are composed of two groups of conveyor belts. In the silicon wafer transmission mechanism b (21), a silicon wafer front alignment structure (201) is also arranged between the two conveyor belts. The silicon wafer front alignment structure (201) includes a rotary cylinder installed between the two conveyor belts, and a positioning plate is arranged on the rotary cylinder. The silicon wafer positioning structure (202) includes a cylinder and a push plate. A moving platform for placing the flipped silicon wafers is also arranged on the left side of the flipping and transmission mechanism (22).

4. A battery string welding device according to claim 1, characterized in that, The detection component includes a camera detection mechanism (23), and the camera detection mechanism (23) includes a CCD camera. An acrylic plate is arranged below the CCD camera.

5. A battery string welding device according to claim 1, characterized in that The solder tape feeding component includes a solder tape unwinding mechanism (25) that puts down the solder tape and conveys it into the next mechanism. A solder tape guiding mechanism (26), which is a mechanism composed of guide wheels to guide the solder tape. A shearing combination mechanism (27), where the solder tape is transferred here, dipped in flux in a flux pool, introduced, fixed, and sheared. A clip module mechanism (28) that clamps the sheared solder tape and conveys it to the next mechanism. A transmission adsorption mechanism (212), on which the sheared solder tape is placed, and is used to receive qualified silicon wafers, with the silicon wafers placed on the solder tape.

6. The battery string welding device according to claim 5, wherein, The shearing combination mechanism (27) further includes a flux supply device, and the flux supply device includes a flux pool and a flux liquid supply device connected to the flux pool. A guide groove support plate mechanism (29) is arranged at the discharge end of the clip module mechanism (28), and a solder tape groove is arranged on the guide groove support plate mechanism (29). Above the guide groove support plate mechanism (29), there is also a solder tape pressing net mechanism (210). The solder tape pressing net mechanism (210) includes a transverse movement cylinder. The transverse movement cylinder is installed with a pressing cylinder through a sliding seat, and a pressing plate is arranged on the pressing cylinder. A guide groove movement mechanism (211) is movably arranged above the transmission adsorption mechanism (212) near the solder tape pressing net mechanism (210). The guide groove movement mechanism (211) includes a moving plate and a moving module for pushing the moving plate to move.

7. A battery string welding device according to claim 6, characterized in that, The welding component includes a lamp cover welding mechanism (213), which is arranged above the transmission adsorption mechanism (212) to weld and fuse the transmitted solder tape and silicon wafers together in series at a specified position.

8. A battery string welding device according to claim 5, characterized in that, The string cutting component includes a string cutting knife mechanism (214). The string cutting knife mechanism (214) is installed at the tail end of the transmission adsorption mechanism (212). The transmission adsorption mechanism (212) conveys the welded and fused solder tape and silicon wafers thereon to the lower part of the string cutting knife mechanism (214), and the redundant part is cut off by the string cutting knife mechanism (214). After cutting, the silicon wafers are introduced into the next mechanism through the string cutting knife mechanism (214).

9. A battery string welding device according to claim 5, characterized in that An adsorption heating device is also arranged inside the transmission adsorption mechanism (212).

10. A battery string welding device according to claim 1, characterized in that, The blanking mechanism (3) includes a silicon wafer transmission device and a translation device. A plurality of equally spaced adsorption heads are arranged below the translation device. The silicon wafer transmission device is connected to the string cutting knife mechanism (214), and a finished product area is also arranged on the side of the silicon wafer transmission device. The blanking mechanism (3), where the series of silicon wafers are successively introduced to become finished products, reach the finished product area through the up, down, front, and back translation in this mechanism, and the work ends here. The next work is completed by manual handling.

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