Colloid heating equipment

Abstract

The utility model discloses colloid heating equipment, and belongs to the technical field of colloid heating. The colloid heating equipment comprises a colloid barrel, a heating barrel and a heat preservation shell, the glue barrel is sleeved with the heating barrel, a heating cavity is formed between the inner wall of the heating barrel and the outer wall of the glue barrel, and the heating cavity is used for containing a fluid heat-conducting medium; the heating barrel is sleeved with the heat preservation shell, a heat preservation cavity is formed between the inner wall of the heat preservation shell and the outer wall of the heating barrel, and a heat preservation filling medium can be arranged in the heat preservation cavity. According to the colloid heating equipment, the heat preservation shell and the heat preservation filling medium are arranged outside the heating barrel, on one hand, outward radiation and diffusion of heat in the heating barrel can be effectively reduced, the heat loss of the colloid heating equipment is greatly reduced, the needed heating power is reduced, and more energy is saved; and on the other hand, outward heat transfer of the heating barrel is reduced, so that the scalding risk of an operator when the operator is in contact with the colloid heating equipment is reduced, and the safety of the colloid heating equipment is improved.

Description

Technical Field

[0001] This application belongs to the technical field of colloid heating, and particularly relates to a colloid heating device. Background Art

[0002] In the packaging industry, jelly glue (also known as gel glue or animal protein glue) has many applications. For example, jelly glue is often used in the production of the covers of gift boxes, wine boxes, etc., and the pasting of the covers of hardcover book covers, photo albums, etc. to increase the stiffness and quality of the products. However, jelly glue usually solidifies into a jelly-like solid or semi-solid substance at room temperature. Therefore, when using jelly glue, it is necessary to continuously heat the jelly glue to melt it into a liquid state.

[0003] When the colloid heating device purchased on the existing market heats the jelly glue, part of the heat will also radiate and diffuse outward from the colloid heating device and cannot be well utilized, which makes the heating power consumption of the colloid heating device high. Utility Model Content

[0004] This application aims to at least solve the technical problem of high heating power consumption of the colloid heating device in the prior art.

[0005] To this end, this application proposes a colloid heating device, including: a glue bucket, a heating bucket, and a heat preservation outer shell; the glue bucket is used for placing the colloid;

[0006] The heating bucket is sleeved outside the glue bucket, and a heating cavity is constructed between the inner wall of the heating bucket and the outer wall of the glue bucket, and the heating cavity is used for setting a fluid heat conduction medium;

[0007] The heat preservation outer shell is sleeved outside the heating bucket, and a heat preservation cavity is constructed between the inner wall of the heat preservation outer shell and the outer wall of the heating bucket, and the heat preservation cavity can be filled with a heat preservation medium.

[0008] According to the colloid heating device of this application, by setting a heat preservation outer shell and a heat preservation filling medium outside the heating bucket, on the one hand, it can effectively reduce the outward radiation and diffusion of the heat in the heating bucket, greatly reducing the heat loss of the colloid heating device, reducing the required heating power, and being more energy-saving; on the other hand, the heat transfer from the heating bucket to the outside is reduced, reducing the risk of scalding for the operator when contacting the colloid heating device and increasing the safety of the colloid heating device.

[0009] According to an embodiment of this application, the colloid heating device further includes: a first pump body;

[0010] The first pump body is installed on the heating bucket, and the liquid inlet end of the first pump body is arranged in the heating cavity, and the liquid outlet end of the first pump body is arranged in the glue bucket.

[0011] According to one embodiment of the present application, the colloid heating device further includes: a detection mechanism and a controller;

[0012] The detection mechanism is used to obtain a first fluidity index of the colloid in the glue barrel;

[0013] The controller is electrically connected to the detection mechanism and the first pump body, and is used to control the first pump body to inject the fluid heat-conducting medium into the rubber barrel when the first fluidity index is less than the preset fluidity index.

[0014] According to one embodiment of the present application, a placement opening is provided on the top of the thermal insulation shell, and the glue barrel and the heating barrel are used to be placed in the thermal insulation shell from the placement opening. An installation cover is also provided on the top of the thermal insulation shell, and the installation cover closes the placement opening.

[0015] According to one embodiment of the present application, the colloid heating device further includes: a second pump body;

[0016] A partition plate is provided in the rubber barrel, and the partition plate divides the inner cavity of the rubber barrel into a feeding cavity and a supply cavity. A feeding port connected to the feeding cavity is provided on the top of the thermal insulation shell. The liquid inlet end of the second pump body is arranged in the supply cavity, and the liquid outlet end of the second pump body is arranged outside the thermal insulation shell.

[0017] According to an embodiment of the present application, a cover is detachably provided on the top of the heat-insulating shell, and the cover closes the feeding port.

[0018] According to an embodiment of the present application, a stirring device is provided in the feed chamber, and a stirring end of the stirring device is staggered with a liquid inlet end of the second pump body.

[0019] According to one embodiment of the present application, the colloid heating device further includes: a heating tube;

[0020] The top of the heat-insulating shell is provided with a liquid inlet communicated with the heating chamber, and the heating pipe is close to the liquid inlet and arranged at the bottom of the heating chamber.

[0021] According to an embodiment of the present application, there is a gap between the bottom surface of the glue barrel and the bottom surface of the heating barrel; there is a gap between the side wall surface of the glue barrel and the side wall surface of the heating barrel.

[0022] According to an embodiment of the present application, rollers are provided at the bottom of the heat-insulating outer shell, and handrails are provided on the outer wall of the heat-insulating outer shell.

[0023] The above one or more technical solutions in the embodiments of the present application have at least one of the following technical effects:

[0024] Furthermore, a heat-insulating outer shell and a heat-insulating filling medium are provided outside the heating barrel. On the one hand, it can effectively reduce the outward radiation and diffusion of heat in the heating barrel, greatly reducing the heat loss of the colloid heating device, reducing the required heating power, and being more energy-efficient. On the other hand, the reduction of heat transfer from the heating barrel to the outside reduces the risk of scalding for operators when they come into contact with the colloid heating device, increasing the safety of the colloid heating device.

[0025] Even further, the fluid heat-conducting medium can be water, and the colloid in the inner cavity of the glue barrel can be jelly glue. By using the first pump body to pump the water in the heating cavity into the inner cavity of the glue barrel, the viscosity of the jelly glue can be reduced, and the fluidity of the jelly glue can be improved. This can significantly reduce the resistance to pumping the jelly glue, improve the pumping efficiency, and ensure the smoothness of the pumping process.

[0026] Still further, by real-time monitoring the first fluidity index of the colloid, the heating process of the colloid can be accurately controlled to ensure that the colloid always maintains the best fluid state. And when it is detected that the first fluidity index is lower than the preset fluidity index, the controller can immediately start the first pump body to inject the fluid heat-conducting medium into the glue barrel to restore the fluidity of the colloid. This automatic response mechanism greatly reduces manual intervention and improves production efficiency.

[0027] The additional aspects and advantages of the present application will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and / or additional aspects and advantages of the present application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0029] Figure 1 is a schematic structural diagram of the colloid heating device provided by the embodiment of the present application;

[0030] Figure 2 is a partial structural diagram of the glue barrel and the heating barrel provided by the embodiment of the present application;

[0031] Figure 3 is Figure 2 the top view of

[0032] Figure 4 is a partial structural diagram of the colloid heating device provided by the embodiment of the present application;

[0033] Figure 5 is a partial structural diagram of the colloid heating device provided by the embodiment of the present application after removing the mounting cover and the cover body;

[0034] Figure 6 is Figure 4 a schematic structural diagram of the colloid heating device from another angle.

[0035] Reference numerals:

[0036] 100, glue bucket; 110, partition orifice plate; 120, feeding cavity; 130, feeding chamber; 131, stirring device;

[0037] 200, heating barrel; 210, heating cavity; 220, heating tube;

[0038] 300, heat preservation housing; 310, heat preservation cavity; 320, mounting cover; 321, liquid inlet; 330, placing opening; 340, cover body; 350, roller; 360, handrail;

[0039] 410, first pump body; 420, heating tube. Detailed implementation manners

[0040] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and should not be construed as a limitation of the present application.

[0041] Based on the characteristics that the colloid becomes liquid after heating and solidifies after cooling, the colloid is heated by a colloid heating device before use.

[0042] The colloid can be jelly glue (also called gel glue or animal protein glue), which is in a solid or semi-solid state at room temperature and needs to be heated to a specific temperature (usually 60°C to 80°C) before use. Jelly glue is mainly used in bookbinding, carton packaging and other occasions.

[0043] The colloid can also be hot melt adhesive, and the present application does not limit the type of the colloid.

[0044] Below with reference to Figures 1-6 Describe a colloid heating device according to an embodiment of the present application.

[0045] The colloid heating device includes: a glue bucket 100, a heating barrel 200 and a heat preservation housing 300.

[0046] The inner cavity of the glue bucket 100 can place a colloid such as jelly glue or hot melt adhesive that needs to be heated before use.

[0047] As Figure 2 and Figure 3 shown, the heating barrel 200 is sleeved outside the glue bucket 100, and a heating cavity 210 is formed between the inner wall of the heating barrel 200 and the outer wall of the glue bucket 100. The heating cavity 210 is used to set a fluid heat conducting medium. By raising the temperature of the fluid heat conducting medium in the heating cavity 210, the colloid in the glue bucket 100 is melted.

[0048] It should be noted that if the fluid heat-conducting medium is water, when the water is heated, steam will be generated and the pressure inside the heating chamber 210 will rise. If the pressure inside the heating chamber 210 cannot be effectively released, it may cause the heating chamber 210 to rupture.

[0049] In actual implementation, a safety valve can be installed inside the heating chamber 210 to automatically release the excess pressure when the pressure exceeds the set value, ensuring the stability of the pressure inside the heating chamber 210.

[0050] Of course, the fluid heat-conducting medium can also be heat-conducting oil, and this embodiment is not limited.

[0051] As Figure 4 shown, the heat-insulating outer shell 300 is sleeved outside the heating barrel 200, and a heat-insulating cavity 310 is constructed between the inner wall of the heat-insulating outer shell 300 and the outer wall of the heating barrel 200, and the heat-insulating cavity 310 can be provided with a heat-insulating filling medium.

[0052] In actual implementation, the heat-insulating outer shell 300 can be formed by sheet metal, and the heat-insulating filling medium can be one or more of glass wool (glass fiber), rock wool, aerogel, etc.

[0053] It should be noted that based on the characteristic that the colloid solidifies at normal temperature, the colloid heating device needs to continuously heat the colloid. In the related art, manufacturers only provide a colloid heating device with a glue bucket 100 and a heating barrel 200. During the heating process of this colloid heating device, part of the heat will radiate and diffuse outward and is not utilized. This results in the need to increase the heating power of this colloid heating device in order to heat the colloid to a specific temperature.

[0054] In the above embodiment of the present application, the heat-insulating outer shell 300 and the heat-insulating filling medium inside it can effectively reduce the outward radiation and diffusion of the heat in the heating barrel 200, and the heat loss of the colloid heating device is greatly reduced. Therefore, the required heating power can be reduced and it is more energy-efficient.

[0055] In addition, the reduction of the heat transfer from the heating barrel 200 outward reduces the risk of scalding for the operator when contacting the colloid heating device, increasing the safety of the colloid heating device.

[0056] According to the colloid heating device provided by the embodiment of the present application, by providing a heat-insulating outer shell 300 and a heat-insulating filling medium outside the heating barrel 200, on the one hand, it can effectively reduce the outward radiation and diffusion of the heat in the heating barrel 200, greatly reducing the heat loss of the colloid heating device, reducing the required heating power and being more energy-efficient; on the other hand, the reduction of the heat transfer from the heating barrel 200 outward reduces the risk of scalding for the operator when contacting the colloid heating device, increasing the safety of the colloid heating device.

[0057] AsFigure 4 and Figure 5 As shown in Figure 5 , in some embodiments, a placement opening 330 is provided at the top of the heat-insulating housing 300. The glue bucket 100 and the heating bucket 200 are placed in the heat-insulating housing 300 through the placement opening 330. An installation cover 320 is further provided at the top of the heat-insulating housing 300, and the installation cover 320 closes the placement opening 330.

[0058] In this embodiment, by providing the placement opening 330 at the top of the heat-insulating housing 300, users can conveniently place the glue bucket 100 and the heating bucket 200 into the heat-insulating housing 300 from the top or take them out when needed, which improves the installation and maintenance efficiency of the glue bucket 100 and the heating bucket 200.

[0059] In addition, the placement opening 330 closed by the installation cover 320 can isolate the inner cavity of the glue bucket 100. On the one hand, it can reduce the heat transfer of the colloid to the external environment during the heating process and reduce the heat loss of the colloid heating device. On the other hand, the installation cover 320 can also prevent dust, debris or other foreign objects from entering the inner cavity of the glue bucket 100 to ensure the purity of the colloid.

[0060] As Figure 4 shown, in some embodiments, the colloid heating device further includes: a first pump body 410.

[0061] The first pump body 410 is installed on the heating bucket 200, and the liquid inlet end of the first pump body 410 is arranged in the heating cavity 210, and the liquid outlet end of the first pump body 410 is arranged in the glue bucket 100.

[0062] It should be noted that the colloid with poor fluidity may encounter greater resistance during the extraction process, resulting in a slower extraction speed and even a risk of blockage.

[0063] In this embodiment, the fluid heat-conducting medium can be water, and the colloid in the inner cavity of the glue bucket 100 can be jelly glue. By using the first pump body 410 to pump the water in the heating cavity 210 into the inner cavity of the glue bucket 100, the viscosity of the jelly glue can be reduced, the fluidity of the jelly glue can be improved, which can significantly reduce the resistance of extracting the jelly glue, improve the extraction efficiency, and ensure the smoothness of the extraction process.

[0064] In some embodiments, the colloid heating device further includes: a detection mechanism and a controller.

[0065] The detection mechanism is used to obtain the first fluidity index of the colloid in the glue bucket 100.

[0066] The controller is electrically connected to the detection mechanism and the first pump body 410, and is used to control the first pump body 410 to inject the fluid heat-conducting medium into the glue bucket 100 when the first fluidity index is less than the preset fluidity index.

[0067] It should be noted that the first fluidity index can be a viscosity value and a flow rate.

[0068] When the first fluidity index is a viscosity value, the detection mechanism can be a viscometer, and the probe of the viscometer is arranged in the colloid in the glue bucket 100 for measuring the viscosity value of the colloid in real time.

[0069] The viscometer transmits the measured viscosity value of the colloid to the controller, and the controller determines whether to start the first pump body 410 to inject the fluid heat-conducting medium into the glue bucket 100 according to the preset viscosity threshold (preset fluidity index).

[0070] When the first fluidity index is a flow rate, the detection mechanism can be a flowmeter, which is installed in the outlet pipeline of the colloid, and the flow rate is measured by monitoring the speed of the fluid flowing through the probe of the flowmeter. For example, when the flowmeter is an ultrasonic flowmeter, the flow rate of the colloid is measured by the time difference of ultrasonic transmission.

[0071] The flowmeter transmits the flow rate data to the controller, and the controller determines whether to start the first pump body 410 to inject the fluid heat-conducting medium into the glue bucket 100 according to the preset flow rate threshold (preset fluidity index).

[0072] In this embodiment, by monitoring the first fluidity index of the colloid in real time, the heating process of the colloid can be accurately controlled to ensure that the colloid always maintains the best flow state. And when it is detected that the first fluidity index is lower than the preset fluidity index, the controller can immediately start the first pump body 410 to inject the fluid heat-conducting medium into the glue bucket 100 to restore the fluidity of the colloid. This automatic response mechanism greatly reduces manual intervention and improves production efficiency.

[0073] As Figure 4 and Figure 5 shown, in some embodiments, the colloid heating device further includes: a second pump body.

[0074] A partition orifice plate 110 is arranged in the glue bucket 100. The partition orifice plate 110 divides the inner cavity of the glue bucket 100 into a feeding cavity 120 and a feeding chamber 130. A feeding port communicating with the feeding cavity 120 is arranged at the top of the heat preservation housing 300. The liquid inlet end of the second pump body is arranged in the feeding chamber 130, and the liquid outlet end of the second pump body is arranged outside the heat preservation housing 300.

[0075] In this embodiment, the colloid is in a solid state or a semi-solid state at normal temperature, which is convenient to be added through the feeding port at the top of the heat preservation housing 300. The partition orifice plate 110 divides the inner cavity of the glue bucket 100 into a feeding cavity 120 and a feeding chamber 130, which can prevent the colloids in different states (such as solid or semi-solid colloids and liquid colloids) from mixing in the inner cavity of the glue bucket 100. This can avoid the retention of solid or semi-solid colloids in the inner cavity of the glue bucket 100, thus affecting the extraction of the colloid by the second pump body.

[0076] like Figure 4 and Figure 5 As shown, in some embodiments, a cover 340 is detachably provided on the top of the heat-insulating shell 300, and the cover 340 closes the feed port.

[0077] In this embodiment, when the feeding port is not in use, closing the feeding port by the cover 340 can effectively prevent external dust, debris or other pollutants from entering the interior of the glue barrel 100, thereby protecting the purity of the colloid.

[0078] In actual implementation, the feeding chamber 120 is also provided with a return port, which is arranged side by side with the feeding port and is used to recycle unused colloid.

[0079] like Figure 4 and Figure 5 As shown, in some embodiments, a stirring device 131 is provided in the feed chamber 130, and a stirring end of the stirring device 131 is staggered with a liquid inlet end of the second pump body.

[0080] In this embodiment, the stirring device 131 can keep the colloid in the feeding chamber 130 continuously and evenly mixed, ensuring that the viscosity and fluidity of the colloid are consistent, thereby maintaining stable quality of the colloid in the subsequent feeding process.

[0081] like Figure 2 , Figure 3 and Figure 5 As shown, in some embodiments, the colloid heating device further includes: a heating tube 420 .

[0082] A liquid inlet 321 communicating with the heating chamber 210 is disposed at the top of the heat-insulating shell 300 . The heating tube 420 is close to the liquid inlet 321 and is disposed at the bottom of the heating chamber 210 .

[0083] In this embodiment, the heating tube 420 is disposed at the bottom of the heating chamber 210 and close to the liquid inlet 321, so that the fluid heat-conducting medium can quickly reach the required temperature after entering the heating chamber 210, thereby improving the heating efficiency.

[0084] In actual implementation, there is a gap between the bottom surface of the glue barrel 100 and the bottom surface of the heating barrel 200 ; there is a gap between the side wall surface of the glue barrel 100 and the side wall surface of the heating barrel 200 .

[0085] In this embodiment, the heat-conducting medium in the gap can fully cover the bottom surface and the side wall surface of the glue barrel 100, so that the heat transfer is more comprehensive and efficient.

[0086] like Figure 6 As shown, in some embodiments, a roller 350 is disposed on the bottom of the heat-insulating outer shell 300 , and a handrail 360 is disposed on the outer wall of the heat-insulating outer shell 300 .

[0087] In this embodiment, rollers 350 are provided at the bottom of the heat-insulating housing 300 so that the heat-insulating housing 300 can be easily moved. In a factory workshop or laboratory environment, the design of the rollers 350 and the handrail 360 reduces the need for manual handling, saving time and effort.

[0088] The embodiments of the present application will be described below in combination with actual usage scenarios.

[0089] The colloidal heating device includes: a glue bucket 100, a heating bucket 200, and a heat-insulating housing 300.

[0090] The heating bucket 200 is sleeved outside the glue bucket 100, and a heating cavity 210 is formed between the inner wall of the heating bucket 200 and the outer wall of the glue bucket 100. A heating pipe 420 is provided in the heating cavity 210, and the heating pipe 420 is used to heat the fluid heat-conducting medium in the heating cavity 210.

[0091] The heat-insulating housing 300 is sleeved outside the heating bucket 200, and a heat-insulating cavity 310 is formed between the inner wall of the heat-insulating housing 300 and the outer wall of the heating bucket 200. The heat-insulating cavity 310 is used to arrange heat-insulating filling medium.

[0092] It should be noted that based on the characteristic that the colloid solidifies at normal temperature, the colloidal heating device needs to continuously heat the colloid. At least 14 hours a day need to be continuously powered on, and in some cases, there are two shifts, or even 24 hours a day are powered on. The power consumption of this colloidal heating device is very large.

[0093] In the related art, manufacturers only provide a colloidal heating device with a glue bucket 100 and a heating bucket 200. During the heating process of this colloidal heating device, part of the heat will radiate and diffuse outward and is not utilized. Therefore, this colloidal heating device needs to be equipped with at least a 6.5KW heating pipe 420 to heat the colloid to a specific temperature.

[0094] In the above embodiments of the present application, the heat-insulating housing 300 and the heat-insulating filling medium inside it can effectively reduce the outward radiation and diffusion of the heat in the heating bucket 200, and the heat loss of the colloidal heating device is greatly reduced. The colloidal heating device of the present application is equipped with a 4.5KW heating pipe 420 and can heat the colloid to a specific temperature. The colloidal heating device of the present application is more energy-saving.

[0095] The terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of this application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / ", generally indicates an "or" relationship between the associated objects before and after.

[0096] In the description of this application, the "first feature", "second feature" may include one or more of such features.

[0097] In the description of this application, the meaning of "a plurality" is two or more.

[0098] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through additional features therebetween.

[0099] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0100] Although the embodiments of this application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of this application, and the scope of this application is defined by the claims and their equivalents.

Claims

1. A colloid heating device, characterized in that, include: A glue barrel, a heating barrel and a heat-insulating shell, wherein the glue barrel is used to place the colloid; The heating barrel is sleeved outside the rubber barrel, and a heating chamber is constructed between the inner wall of the heating barrel and the outer wall of the rubber barrel, and the heating chamber is used to set a fluid heat-conducting medium; The heat-insulating outer shell is sleeved outside the heating barrel, and a heat-insulating cavity is constructed between the inner wall of the heat-insulating outer shell and the outer wall of the heating barrel, and the heat-insulating cavity is used to set a heat-insulating filling medium.

2. The colloidal heating device according to claim 1, wherein The thermal insulation shell is formed of sheet metal; the thermal insulation filling medium is glass wool, rock wool or aerogel.

3. The colloid heating device according to claim 1, characterized in that, Also includes: A first pump body, a detection mechanism and a controller; The first pump body is installed in the heating barrel, and the liquid inlet end of the first pump body is arranged in the heating chamber, and the liquid outlet end of the first pump body is arranged in the rubber barrel; The detection mechanism is used to obtain a first fluidity index of the colloid in the glue barrel; The controller is electrically connected to the detection mechanism and the first pump body, and is used to control the first pump body to inject the fluid heat-conducting medium into the rubber barrel when the first fluidity index is less than a preset fluidity index.

4. The colloidal heating device according to claim 1, characterized in that The top of the heat-insulating shell is provided with a placement opening, and the glue barrel and the heating barrel are used to be placed in the heat-insulating shell through the placement opening. The top of the heat-insulating shell is also provided with an installation cover, and the installation cover closes the placement opening.

5. The colloidal heating device according to claim 1, wherein Also includes: The second pump body; A partition plate is provided in the rubber barrel, and the partition plate divides the inner cavity of the rubber barrel into a feeding cavity and a supply cavity. A feeding port connected to the feeding cavity is provided on the top of the thermal insulation shell. The liquid inlet end of the second pump body is arranged in the supply cavity, and the liquid outlet end of the second pump body is arranged outside the thermal insulation shell.

6. The colloid heating device according to claim 5, wherein, The top of the heat-insulating shell is also detachably provided with a cover body, and the cover body closes the feeding port.

7. The colloid heating device according to claim 5, characterized in that, A stirring device is arranged in the feeding cavity, and a stirring end of the stirring device is staggered with a liquid inlet end of the second pump body.

8. The colloidal heating device according to claim 1, wherein, Also includes: Heating pipe; The top of the heat-insulating shell is provided with a liquid inlet communicated with the heating chamber, and the heating pipe is close to the liquid inlet and arranged at the bottom of the heating chamber.

9. The colloid heating device according to claim 1, characterized in that There is a gap between the bottom surface of the glue barrel and the bottom surface of the heating barrel; there is a gap between the side wall surface of the glue barrel and the side wall surface of the heating barrel.

10. The colloid heating device according to any one of claims 1-9, characterized in that, The bottom of the heat-insulating shell is provided with rollers, and the outer wall of the heat-insulating shell is provided with handrails.

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