Welding glue brushing device for main board

Abstract

The utility model relates to the technical field of welding glue, and discloses a welding glue brushing device of a main board, which comprises a base, a placing frame is arranged on the base, a gluing plate is arranged on the placing frame, a plurality of gluing holes are arranged on the gluing plate, a mounting plate is arranged on one side of the placing frame, and the mounting plate is arranged on the other side of the placing frame. A glue scraping assembly is mounted on the side, close to the placing frame, of the mounting plate through a first horizontal moving device, the glue scraping assembly comprises two lifting driving devices, a mounting frame and two scraping plates, the mounting frame is arranged at the driving end of the first horizontal moving device, the two lifting driving devices are both arranged on the mounting frame, and the two scraping plates are arranged on the mounting frame. The two scraping plates are arranged at the driving ends of the corresponding lifting driving devices correspondingly, and the welding glue flows into the contact ball containing area below the gluing plate through the gluing holes, so that the contact balls can be conveniently bonded later, and the problem that in the prior art, the welding glue cannot be accurately brushed into the mounting grooves of the contact balls of the mainboard is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of solder paste brushing, in particular to a solder paste brushing device for a main board. Background Art

[0002] The main board, also known as the mainframe board, system board, logic board, motherboard, baseboard, etc., is the central or main circuit board that constitutes a complex electronic system such as a computer. During the processing of the intelligent gateway main board, it is necessary to perform soldering processing on it. When performing soldering processing on the main board, in order to ensure the accuracy of the soldering processing, it is necessary to fix the main board.

[0003] In the prior art, when applying glue to the main board, the solder paste cannot be accurately brushed into the installation groove of the contact ball on the main board. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the problems existing in the prior art, and to propose a solder paste brushing device for a main board.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A solder paste brushing device for a main board, including a base, a placement rack is arranged on the base, a glue brushing board is installed on the placement rack, and a number of glue brushing holes are arranged on the glue brushing board;

[0007] One side of the placement rack is provided with a mounting plate, and a glue scraping component is installed on the side of the mounting plate close to the placement rack through a first horizontal movement device;

[0008] The glue scraping component includes two lifting driving devices, a mounting rack and two scraping plates. The mounting rack is arranged at the driving end of the first horizontal movement device. Both of the two lifting driving devices are arranged on the mounting rack, and the two scraping plates are respectively arranged at the driving ends of the corresponding lifting driving devices;

[0009] A contact ball placement area is arranged below the glue brushing board.

[0010] Preferably, the contact ball placement area includes a mounting seat, a mounting groove and a material placement plate. A second horizontal movement device is installed on the base. The mounting seat is arranged at the driving end of the second horizontal movement device. The mounting groove is arranged above the mounting seat. The material placement plate is arranged in the mounting groove, and a number of placement holes are arranged on the material placement plate.

[0011] Preferably, the positions of a number of the glue brushing holes and a number of the placement holes correspond to each other.

[0012] Preferably, both the first horizontal movement device and the second horizontal movement device are electric slide rails.

[0013] Preferably, the glue - applying plate is installed on the placing rack through an installation component. The installation component includes a plurality of bolts and a plurality of limit blocks. The plurality of bolts penetrate through the placing rack and are in threaded connection with the placing rack, and the plurality of limit blocks are rotatably arranged at one end of the corresponding bolts.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] In the present utility model, through the provided glue - applying plate, the welding glue can be placed on the glue - applying plate. Then, through the lifting driving device, the scraping plate is driven to move to adjust the scraping plate to a suitable position. Then, through the first horizontal moving device, the scraping plate is driven to move left and right, and the welding glue on the glue - applying plate is moved to the glue - applying hole, and flows through the glue - applying hole into the contact - ball placing area below the glue - applying plate, which is convenient for the subsequent bonding of the contact balls, and solves the problem in the prior art that the welding glue cannot be accurately applied to the installation groove of the contact balls on the main board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 FIG. 1 is an overall schematic diagram of a welding - glue brushing device for a main board proposed by the present utility model;

[0017] Figure 2 FIG. 2 is a side schematic diagram of a welding - glue brushing device for a main board proposed by the present utility model.

[0018] In the figure: 1, base; 2, placing rack; 3, glue - applying plate; 4, glue - applying hole; 5, mounting plate; 6, first horizontal moving device; 7, lifting driving device; 8, mounting rack; 9, scraping plate; 10, mounting seat; 11, mounting groove; 12, material - placing plate; 13, second horizontal moving device; 14, bolt; 15, limit block; 16, placing hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0020] Refer to Figures 1 to 2 , a welding - glue brushing device for a main board, including a base 1. A placing rack 2 is arranged on the base 1. A glue - applying plate 3 is installed on the placing rack 2, and a plurality of glue - applying holes 4 are arranged on the glue - applying plate 3;

[0021] On one side of the placing rack 2, there is a mounting plate 5, and a glue - scraping assembly is installed on the side of the mounting plate 5 close to the placing rack 2 through a first horizontal moving device 6;

[0022] The glue scraping assembly includes two lifting drive devices 7, a mounting frame 8, and two scraping plates 9. The mounting frame 8 is arranged at the driving end of the first horizontal moving device 6. Both of the two lifting drive devices 7 are arranged on the mounting frame 8. The two scraping plates 9 are respectively arranged at the driving ends of the corresponding lifting drive devices 7.

[0023] A contact ball placement area is arranged below the glue spreading plate 3.

[0024] When the device is in use, solder paste can be placed on the glue spreading plate 3. Then, through the lifting drive device 7, the scraping plate 9 is driven to move to adjust the scraping plate 9 to a proper position. Then, through the first horizontal moving device 6, the scraping plate 9 is driven to move left and right to move the solder paste on the glue spreading plate 3 to the glue application hole 4. Through the glue application hole 4, it flows into the contact ball placement area below the glue spreading plate 3, which is convenient for the subsequent bonding of the contact balls, solving the problem in the prior art that the solder paste cannot be accurately brushed into the installation groove 11 of the contact balls on the main board.

[0025] Furthermore, the contact ball placement area includes a mounting seat 10, an installation groove 11, and a material placement plate 12. A second horizontal moving device 13 is mounted on the base 1. The mounting seat 10 is arranged at the driving end of the second horizontal moving device 13. The installation groove 11 is arranged above the mounting seat 10. The material placement plate 12 is arranged in the installation groove 11. A number of placement holes 16 are arranged on the material placement plate 12. Through the arranged second horizontal driving device, the mounting seat 10 can be driven to move to a proper position. Through the arranged mounting seat 10, the material placement plate 12 can be placed in the installation groove 11. Through the arranged placement holes 16, the contact balls can fall into the corresponding placement holes 16.

[0026] Furthermore, the positions of a number of the glue application holes 4 and a number of the placement holes 16 correspond to each other. By making the positions of the glue application holes 4 and the placement holes 16 correspond to each other, it is convenient for the solder paste to flow from the glue application holes 4 into the corresponding placement holes 16.

[0027] Furthermore, both the first horizontal moving device 6 and the second horizontal moving device 13 are electric slide rails.

[0028] Furthermore, the glue spreading plate 3 is mounted on the placement rack 2 through a mounting assembly. The mounting assembly includes a number of bolts 14 and a number of limit blocks 15. The number of bolts 14 penetrate through the placement rack 2 and are threadedly connected with the placement rack 2. The number of limit blocks 15 are rotatably arranged at one ends of the corresponding bolts 14. Through the arranged number of bolts 14, by screwing the bolts 14, the limit blocks 15 can be movably abutted against the brushing plate to mount the brushing plate on the first mounting frame 8. By screwing the bolts 14, the limit blocks 15 can also be separated from the brushing plate to realize the disassembly of the brushing plate.

[0029] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, making equivalent replacements or changes, shall be covered by the protection scope of the present utility model.

Claims

1. A solder paste brushing device for a main board, comprising a base (1), characterized in that: A placement rack (2) is provided on the base (1), a glue - spreading plate (3) is installed on the placement rack (2), and a number of glue - spreading holes (4) are provided on the glue - spreading plate (3). One side of the placement rack (2) is provided with a mounting plate (5), and a glue - scraping assembly is installed on the side of the mounting plate (5) close to the placement rack (2) through a first horizontal movement device (6). The glue - scraping assembly includes two lifting drive devices (7), a mounting frame (8) and two scraping plates (9). The mounting frame (8) is arranged at the driving end of the first horizontal movement device (6). Both of the two lifting drive devices (7) are arranged on the mounting frame (8), and the two scraping plates (9) are respectively arranged at the driving ends of the corresponding lifting drive devices (7). A contact ball placement area is provided below the glue - spreading plate (3).

2. The solder paste brushing device for a main board according to claim 1, wherein: The contact ball placement area includes a mounting seat (10), a mounting groove (11) and a material placement plate (12). A second horizontal movement device (13) is installed on the base (1). The mounting seat (10) is arranged at the driving end of the second horizontal movement device (13). The mounting groove (11) is arranged above the mounting seat (10). The material placement plate (12) is arranged in the mounting groove (11), and a number of placement holes (16) are provided on the material placement plate (12).

3. The solder paste brushing device for a main board according to claim 1, characterized in that: The positions of a number of the glue - spreading holes (4) and a number of the placement holes (16) correspond to each other.

4. The solder paste brushing device for a main board according to claim 2, wherein: Both the first horizontal movement device (6) and the second horizontal movement device (13) are electric slide rails.

5. The solder paste brushing device for a main board according to claim 1, characterized in that: The glue - spreading plate (3) is installed on the placement rack (2) through a mounting assembly. The mounting assembly includes a number of bolts (14) and a number of limit blocks (15). The number of bolts (14) penetrate through the placement rack (2) and are thread - connected with the placement rack (2). The number of limit blocks (15) are rotatably arranged at one ends of the corresponding bolts (14).

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