Test sorting machine with high-voltage insulation test function

Abstract

The utility model discloses a test sorting machine with a high-voltage insulation test function, and the test sorting machine comprises a test track which is used for guiding a semiconductor device to slide among a plurality of stations, and the plurality of stations comprise a first insulation test station and a second insulation test station. The material blocking mechanism is used for blocking the semiconductor device on the first insulation testing station when the semiconductor device slides along the testing track, the first insulation testing mechanism comprises a positive electrode assembly, a negative electrode assembly and a first insulation testing assembly, the first insulation testing assembly comprises a base and a moving assembly, the base is fixed relative to the testing track, and the moving assembly is fixed relative to the testing track. The moving assembly comprises a driver and a first test piece which are in transmission connection, the driver can drive the first test piece to reciprocate in the first direction so that the first test piece can abut against or be separated from a shell of the semiconductor device, the positive electrode assembly is electrically connected with the first test piece, and the negative electrode assembly is electrically connected with the first insulation test station. The high-voltage insulation test of the semiconductor device is automatically completed, and meanwhile manpower is saved and safety is achieved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and particularly to a test sorter with a high-voltage insulation test function. Background Art

[0002] The straight-back gravity test sorter is a device for sorting and testing materials based on the principle of gravity. The materials to be sorted enter the track or chute of the sorter evenly through the feeding device, move along a specific path under the action of gravity, and during the movement, various detection devices detect and measure the relevant parameters of the materials. The existing straight-back gravity test sorters are usually semi-automatic detection devices. When it is necessary to perform a withstand voltage insulation test on the outer shell of a semiconductor device, it is necessary to manually place the semiconductor device on the fixture, and apply a voltage to the semiconductor device through a high-voltage test instrument for the withstand voltage insulation test. There are certain safety hazards in the operation. At the same time, relying on manual observation and starting the test instrument, the working efficiency is relatively low, which is time-consuming and laborious. Content of the Utility Model

[0003] Aiming at the above deficiencies in the prior art, this application discloses a test sorter with a high-voltage insulation test function, which can quickly and accurately perform insulation tests on semiconductor devices, improve the automation degree of the test, reduce the manual labor intensity, help improve the product quality and production efficiency, and at the same time can quickly screen out products with unqualified insulation performance and prevent them from flowing into subsequent production links, thus saving production costs and time.

[0004] To achieve the above object, this application discloses a test sorter with a high-voltage insulation test function for testing semiconductor devices, including:

[0005] A test track for guiding the semiconductor device to slide between multiple workstations, and the multiple workstations include a first insulation test workstation;

[0006] A material blocking mechanism for blocking the semiconductor device at the first insulation test workstation when the semiconductor device slides along the test track;

[0007] A first insulation test mechanism including a positive electrode assembly, a negative electrode assembly and a first insulation test assembly. The first insulation test assembly includes a base and a moving assembly provided on the base. The base is relatively fixed to the test track. The moving assembly includes a driver and a first test piece connected in transmission. The driver can drive the first test piece to reciprocate along a first direction so that the first test piece abuts against or separates from the outer shell of the semiconductor device. The positive electrode assembly is electrically connected to the first test piece, and the negative electrode assembly is electrically connected to the first insulation test workstation.

[0008] In one possible implementation, the first insulation test station includes an insulation test socket arranged on the test track, an insulation test piece is connected to the insulation test socket, the negative electrode assembly is electrically connected to the insulation test piece, and when the first test piece abuts against the outer shell of the semiconductor device, the outer shell of the semiconductor device abuts against the insulation test socket.

[0009] In one possible implementation, the moving component also includes a first guide rail and a first sliding member, the first guide rail is arranged on the base along the first direction, the first sliding member and the first guide rail are slidably matched, the first sliding member is transmission-connected to the driver, and the first test member is arranged on the first sliding member.

[0010] In one possible implementation, the moving assembly further includes a first buffer structure, the first sliding member is transmission-connected to the driver via the first buffer structure, and the first buffer structure is used to provide buffering when the first test member abuts against the housing of the semiconductor device.

[0011] In one possible implementation, the first buffer structure includes a first mounting seat, a second mounting seat, a first connecting shaft and a first spring sleeved on the first connecting shaft, the first mounting seat is connected to the output end of the driver, the second mounting seat is connected to the first sliding member, the first connecting shaft extends along the first direction, the first end of the first connecting shaft is fixed to the first mounting seat, the second mounting seat is provided with a first mounting groove, the second end of the first connecting shaft passes through the first mounting groove, the second end of the first connecting shaft is provided with a first limiting member, the outer circumferential size of the first limiting member is larger than the size of the first mounting groove, the first connecting shaft is provided with a first movable washer, the first movable washer is located between the first spring and the second mounting seat, and the outer circumferential size of the first movable washer is larger than the size of the first mounting groove.

[0012] In one possible implementation, the moving component also includes a second test piece, which is transmission-connected to the driver, and the driver can drive the second test piece to reciprocate along a first direction so that the second test piece abuts against or separates from the housing of the semiconductor device, and the second test piece is electrically connected to the first test piece.

[0013] In one possible implementation, the test sorter further includes a second insulation testing mechanism, the plurality of workstations further includes a second insulation testing workstation, the second insulation testing mechanism is the same as the first insulation testing mechanism, and the second insulation testing mechanism corresponds to the second insulation testing workstation.

[0014] In a possible implementation manner, an assembly hole is provided on a side of the first test piece facing the first insulation test station. The assembly hole is used for assembling a thimble, and the thimble is used for testing a semiconductor device having a through hole.

[0015] In a possible implementation manner, a first sensor is provided on the base. The first sensor includes a first transmitting end and a first receiving end. A first baffle is fixed on the first sliding member. The first sliding member drives the first baffle to slide synchronously, so that a part of the first baffle is located between the first transmitting end and the first receiving end or the first baffle leaves between the first transmitting end and the first receiving end. When a part of the first baffle is located between the first transmitting end and the first receiving end, the first sensor determines that the thimble leaves the through hole of the semiconductor device.

[0016] In a possible implementation manner, the moving component further includes a third guide rail and a third sliding member. The third guide rail is arranged on the base along the first direction. The third sliding member is slidably matched with the third guide rail. The first mounting seat is arranged on the third sliding member;

[0017] and / or the first mounting seat is connected to the output end of the driver through a floating joint;

[0018] and / or the base includes a fixed bracket and a mounting bracket arranged on the fixed bracket. The moving component is arranged on the mounting bracket. The fixed bracket includes a first cantilever and a second cantilever. The first cantilever and the second cantilever are respectively located on two sides of the mounting bracket. The test and sorting machine further includes a test board for fixing the test track. The first cantilever and the second cantilever are fixedly connected to the test board.

[0019] Compared with the prior art, the beneficial effects of the present application are as follows:

[0020] In the test sorter with a high-voltage insulation test function provided by this application, the test track can guide the semiconductor device to slide between multiple workstations. The material blocking mechanism stops the semiconductor device at the first insulation test workstation of the test track. The first insulation test mechanism includes a positive electrode assembly, a negative electrode assembly, and a first insulation test assembly. The driver controls the first test piece to reciprocate along the first direction, realizing the contact and separation between the first test piece and the housing of the semiconductor device, ensuring the accuracy and stability of the movement of the first test piece. The positive electrode assembly is electrically connected to the first test piece, and the negative electrode assembly is electrically connected to the first insulation test workstation. When the first test piece contacts the housing of the semiconductor device, a high-voltage insulation performance test is carried out on the housing of the semiconductor device by energizing between the positive and negative electrode assemblies. Each component of this test sorter cooperates with each other to form a complete and automated semiconductor device insulation test system, improving the degree of automation of the test, reducing the manual labor intensity, ensuring the accuracy and reliability of the test, being able to quickly and accurately perform insulation tests on semiconductor devices, helping to improve product quality and production efficiency, and at the same time being able to quickly screen out products with unqualified insulation performance and prevent them from flowing into subsequent production links, thereby saving production costs and time. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of this application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0022] Figure 1 Schematic structural diagram showing the test track of a test sorter with a high-voltage insulation test function provided by an embodiment of the present utility model;

[0023] Figure 2 Schematic structural diagram of the first insulation test assembly of a test sorter with a high-voltage insulation test function provided by an embodiment of the present utility model;

[0024] Figure 3 Schematic structural diagram showing the moving assembly of a test sorter with a high-voltage insulation test function provided by an embodiment of the present utility model;

[0025] Figure 4 Schematic structural diagram showing the assembly holes of a test sorter with a high-voltage insulation test function provided by an embodiment of the present utility model.

[0026] Description of the reference numerals:

[0027] 10 - Test track; 11 - First insulation test station; 12 - Second insulation test station; 20 - First insulation test mechanism; 21 - First insulation test assembly; 211 - Base; 2111 - Fixed bracket; 21111 - First cantilever; 21112 - Second cantilever; 2112 - Mounting bracket; 212 - Moving assembly; 2121 - Driver; 2122 - First test piece; 21221 - Assembly hole; 2123 - First guide rail; 2124 - First slider; 21241 - First stop piece; 2125 - First buffer structure; 21251 - First mounting seat; 21252 - Second mounting seat; 212521 - First mounting groove; 21253 - First connecting shaft; 21254 - First spring; 21255 - First limiting piece; 21256 - First movable washer; 2126 - Second test piece; 2127 - Second guide rail; 2128 - Second slider; 2129 - Second buffer structure; 21291 - Third mounting seat; 212911 - Second mounting groove; 21292 - Second connecting shaft; 21293 - Second spring; 21294 - Second limiting piece; 21295 - Second movable washer; 2130 - Third guide rail; 2131 - Third slider; 2132 - Floating joint; 2133 - First sensor; 30 - Second insulation test mechanism. Detailed implementation manners

[0028] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0029] In the present application, the terms "installation", "setting", "provided with", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the internal connection between two devices, components, or parts. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0030] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, components, or parts (the specific types and structures may be the same or different), and do not indicate or imply the relative importance and quantity of the indicated devices, components, or parts. Unless otherwise specified, the meaning of "a plurality" is two or more.

[0031] The straight-back gravity test sorting machine is a device that sorts and tests materials based on the principle of gravity. The materials to be sorted are evenly fed into the track or slide of the sorting machine through the feeding device, and move along a specific path under the action of gravity. During the movement, the relevant parameters of the materials are detected and measured through various detection devices. Existing straight-back gravity test sorting machines are usually semi-automatic detection equipment. When the housing of a semiconductor device needs to be subjected to a withstand voltage insulation test, it is necessary to manually place the semiconductor device on the fixture, and apply voltage to the semiconductor device through a high-voltage test instrument for a withstand voltage insulation test. There are certain safety hazards in the operation. At the same time, it relies on manual observation and starting of the test instrument, which has low work efficiency, is troublesome and labor-intensive.

[0032] In view of this, some embodiments of the present application provide a test sorting machine with a high-voltage insulation testing function, which can quickly and accurately perform insulation tests on semiconductor devices, improve the degree of automation of the test, reduce manual labor intensity, and help improve product quality and production efficiency. At the same time, it can quickly screen out products with unqualified insulation performance to prevent them from flowing into subsequent production links, thereby saving production costs and time.

[0033] The present application is described in detail below through specific embodiments:

[0034] The test sorter with high voltage insulation test function of the embodiment of the present application is used to test semiconductor devices, such as Figures 1-4 As shown, the test handler with high voltage insulation test function includes:

[0035] A test track 10, the test track 10 is used to guide the semiconductor device to slide between a plurality of stations, the plurality of stations including a first insulation test station 11;

[0036] A material stopping mechanism, which is used to stop the semiconductor device on the first insulation test station 11 when the semiconductor device slides along the test track 10;

[0037] The first insulation testing mechanism 20 includes a positive electrode assembly, a negative electrode assembly and a first insulation testing assembly 21. The first insulation testing assembly 21 includes a base 211 and a moving assembly 212 arranged on the base 211. The base 211 is relatively fixed to the test track 10. The moving assembly 212 includes a drive 2121 and a first test piece 2122 connected by a transmission connection. The drive 2121 can drive the first test piece 2122 to reciprocate along a first direction so that the first test piece 2122 abuts against or separates from the housing of the semiconductor device. The positive electrode assembly is electrically connected to the first test piece 2122, and the negative electrode assembly is electrically connected to the first insulation testing station 11.

[0038] The test and sorting machine with high-voltage insulation test function provided by the embodiment of the present application. The test track 10 can guide the semiconductor device to slide between multiple stations. The material blocking mechanism stops the semiconductor device at the first insulation test station 11 of the test track 10. The first insulation test mechanism 20 includes a positive electrode assembly, a negative electrode assembly and a first insulation test assembly 21. The driver 2121 controls the first test piece 2122 to reciprocate along the first direction, so as to realize the contact and separation between the first test piece 2122 and the outer shell of the semiconductor device, ensuring the accuracy and stability of the movement of the first test piece 2122. The positive electrode assembly is electrically connected to the first test piece 2122, and the negative electrode assembly is electrically connected to the first insulation test station 11. When the first test piece 2122 contacts the outer shell of the semiconductor device, a high-voltage insulation performance test is carried out on the outer shell of the semiconductor device by energizing between the positive and negative electrode assemblies. Each component of this test and sorting machine cooperates with each other to form a complete and automated semiconductor device insulation test system, improving the degree of automation of the test, reducing the manual labor intensity, ensuring the accuracy and reliability of the test, being able to quickly and accurately perform insulation tests on semiconductor devices, helping to improve product quality and production efficiency, and at the same time being able to quickly screen out products with unqualified insulation performance and prevent them from flowing into subsequent production links, thus saving production costs and time.

[0039] It should be noted that some structures of the test and sorting machine are improved in the present application, so the overall structure of the test and sorting machine is not shown. In the present application, the positive electrode assembly and the negative electrode assembly are not shown either. Specifically, the positive electrode assembly includes a positive electrode wire. The first test piece 2122 is made of a conductive material and is connected to the positive electrode wire. The negative electrode assembly includes a copper column and a negative electrode wire. The copper column connects the first insulation test station 11 and the negative electrode wire.

[0040] Specifically, the first insulation test station 11 includes an insulation test seat provided on the test track 10. An insulation test piece is connected to the insulation test seat. The negative electrode assembly is electrically connected to the insulation test piece. When the first test piece 2122 contacts the outer shell of the semiconductor device, the outer shell of the semiconductor device contacts the insulation test seat. The insulation test seat provides a stable support surface for the semiconductor device, reducing the instability of the test results caused by device shaking or position deviation during the test. The insulation test piece connected to the insulation test seat is electrically connected to the negative electrode assembly. The insulation test piece can be provided on the back of the test track 10, which does not affect the sliding of the semiconductor device on the test track 10, and at the same time can ensure good electrical contact, improving the stability and accuracy of electrical signal transmission, thus ensuring the reliability of the test results.

[0041] In this embodiment, in order to ensure reliable contact between the first test piece 2122 and the semiconductor device, the moving component 212 also includes a first guide rail 2123 and a first sliding member 2124. The first guide rail 2123 is arranged on the base 211 along the first direction, providing a clear and stable path for the movement of the first sliding member 2124. The first sliding member 2124 and the first guide rail 2123 are slidably matched, and the first sliding member 2124 is transmission-connected to the driver 2121. The first test piece 2122 is arranged on the first sliding member 2124, which helps to ensure that the first test piece 2122 reciprocates along an accurate direction under the drive of the driver 2121, thereby improving the accuracy and consistency of the movement, and ensuring that the position of the first test piece 2122 abutting against the semiconductor device is more accurate. At the same time, the sliding match method can reduce friction and resistance during the movement, making the movement smoother and reducing test errors caused by jamming or jitter. The first guide rail 2123 and the first sliding member 2124 can withstand a large driving force and load, ensuring that good performance can be maintained during long-term use. In another possible implementation, the first test piece 2122 is disposed on the output end of the driver 2121 , and the driver 2121 directly pushes the first test piece 2122 to abut against or separate from the semiconductor device.

[0042] When the first test piece 2122 abuts against the housing of the semiconductor device, a large impact force may be generated. Furthermore, in order to avoid excessive impact force of the first test piece 2122 on the semiconductor device, the moving component 212 in this embodiment also includes a first buffer structure 2125. The first sliding piece 2124 is transmission-connected to the driver 2121 through the first buffer structure 2125. The first buffer structure 2125 is used to provide buffering when the first test piece 2122 abuts against the housing of the semiconductor device. The first buffer structure 2125 can absorb and mitigate such impact force, reduce the risk of damage to the semiconductor device, and also reduce the impact on the first test piece 2122 and the driver 2121, extending their service life. The buffering effect can make the contact between the first test piece 2122 and the housing of the semiconductor device softer and smoother, avoiding instantaneous instability of contact caused by strong impact, thereby improving the accuracy and reliability of the test results. Different semiconductor devices may have certain differences in size and shape. The first buffer structure 2125 can compensate for such differences to a certain extent, ensuring that appropriate pressure and stable contact can be provided when contacting different semiconductor devices.

[0043] Specifically, Figure 3As shown, the first buffer structure 2125 includes a first mounting base 21251, a second mounting base 21252, a first connecting shaft 21253, and a first spring 21254 sleeved on the first connecting shaft 21253. The first mounting base 21251 is connected to the output end of the driver 2121, the second mounting base 21252 is connected to the first sliding member 2124, the first connecting shaft 21253 extends along the first direction, the first end of the first connecting shaft 21253 is fixed to the first mounting base 21251, so that the power of the driver 2121 can be transmitted to the first connecting shaft 21253. A first mounting groove 212521 is provided on the second mounting base 21252. The second end of the first connecting shaft 21253 passes through the first mounting groove 212521. A first limiting member 21255 is provided at the second end of the first connecting shaft 21253. The outer peripheral dimension of the first limiting member 21255 is larger than the dimension of the first mounting groove 212521. A first movable washer 21256 is provided on the first connecting shaft 21253. The first movable washer 21256 is located between the first spring 21254 and the second mounting base 21252. The outer peripheral dimension of the first movable washer 21256 is larger than the dimension of the first mounting groove 212521, so that the connection mode between the first connecting shaft 21253 and the second mounting base 21252 is a movable connection. The first spring 21254 is sleeved on the first connecting shaft 21253. When the first spring 21254 is subjected to an impact force, it can absorb energy through compression and extension to provide an effective buffering effect, which makes the abutment of the first test piece 2122 against the semiconductor device housing more stable, reduces the damage to the device and the test component caused by the impact, and at the same time can maintain a good connection during the buffering process. The first limiting member 21255 and the first movable washer 21256, whose outer peripheral dimensions are larger than the dimension of the first mounting groove 212521, can effectively prevent the second mounting base 21252 from falling off the first connecting shaft 21253, ensuring the integrity and stability of the structure.

[0044] Furthermore, as Figure 2As shown, the moving component 212 further includes a second test piece 2126. The second test piece 2126 is in transmission connection with the driver 2121. The driver 2121 can drive the second test piece 2126 to reciprocate in the first direction, so that the second test piece 2126 abuts against or separates from the housing of the semiconductor device. Driving the first test piece 2122 and the second test piece 2126 by the same driver 2121 can reduce costs and ensure the consistency and accuracy of the test process. The second test piece 2126 is electrically connected to the first test piece 2122. The first test piece 2122 and the second test piece 2126 can simultaneously test different parts of the housing of the semiconductor device, which can more comprehensively detect the insulation performance of the device, reduce missed detections or misjudgments that may be caused by single-point testing, and improve the accuracy and reliability of the test results. For semiconductor devices of different shapes and sizes, by adjusting the positions and abutting methods of the first test piece 2122 and the second test piece 2126, the test requirements of various devices can be better adapted, increasing the versatility and applicability of the test sorter. If the test results are abnormal, the setting of the two test pieces can help to more quickly determine which test point has a problem, so as to more accurately perform fault diagnosis and positioning, and help to take repair measures in a timely manner or adjust the production process.

[0045] Specifically, the moving component 212 further includes a second guide rail 2127 and a second sliding member 2128. The second guide rail 2127 is arranged on the base 211 in the first direction. The second sliding member 2128 is in sliding fit with the second guide rail 2127. The second test piece 2126 is arranged on the first sliding member 2124. The moving component 212 further includes a second buffer structure 2129. The second buffer structure 2129 includes a third mounting seat, a second connecting shaft 21292, and a second spring 21293 sleeved on the second connecting shaft 21292. The third mounting seat 21291 is connected to the first sliding member 2124. The second connecting shaft 21292 extends in the first direction. The first end of the second connecting shaft 21292 is fixed to the first mounting seat 21251. A second mounting groove 212911 is provided on the third mounting seat 21291. The second end of the second connecting shaft 21292 passes through the second mounting groove 212911. A second limiting member 21294 is provided at the second end of the second connecting shaft 21292. The outer peripheral dimension of the second limiting member is larger than the dimension of the second mounting groove 212911. A second movable washer 21295 is provided on the second connecting shaft 21292. The second movable washer 21295 is located between the second spring 21293 and the third mounting seat 21291. The outer peripheral dimension of the second movable washer 21295 is larger than the dimension of the second mounting groove 212911, so as to provide buffering when the second test piece 2126 abuts against the housing of the semiconductor device.

[0046] As Figure 1As shown, the test sorter further includes a second insulation test mechanism 30. The multiple workstations further include a second insulation test workstation 12. The second insulation test mechanism 30 is the same as the first insulation test mechanism 20. The second insulation test mechanism 30 corresponds to the second insulation test workstation 12. Conducting two insulation tests can verify the test results with each other, reduce the misjudgment that may occur in a single test, thereby improving the accuracy and reliability of the judgment of the insulation performance of semiconductor devices. The dual test provides a more stringent guarantee for quality control in the production process, helps to screen out semiconductor devices with better quality, and improves the overall quality level of products. If different test results appear in the two insulation test workstations, the reasons can be analyzed more deeply, providing more clues and data support for improving the production process, optimizing the test method, or finding equipment failures.

[0047] Since semiconductor devices have different types, for the type of semiconductor device with vias, such as Figure 4 As shown, an assembly hole 21221 is provided on the side of the first test piece 2122 facing the first insulation test workstation 11. The assembly hole 21221 is used to assemble a thimble, and the thimble is used to test semiconductor devices with vias, greatly expanding the types of semiconductor devices that the test sorter can test, enabling it to adapt to more products with different structures. The thimble can more accurately contact the test points inside the vias of the semiconductor device for targeted testing, reducing test errors, thereby improving the accuracy and reliability of the test results.

[0048] After the semiconductor device is tested, it needs to continue to slide to other workstations. Therefore, in this embodiment, as Figure 3 As shown, a first sensor 2133 is provided on the base 211. The first sensor 2133 includes a first transmitting end and a first receiving end. A first baffle 21241 is fixed on the first sliding member 2124. The first sliding member 2124 drives the first baffle 21241 to slide synchronously, so that a part of the first baffle 21241 is located between the first transmitting end and the first receiving end or the first baffle 21241 leaves between the first transmitting end and the first receiving end. When a part of the first baffle 21241 is located between the first transmitting end and the first receiving end, the first sensor 2133 determines that the thimble has left the via of the semiconductor device. Thus, it can detect in real time and accurately whether the thimble has left the via of the semiconductor device, providing precise position feedback for the test process, ensuring that after the thimble leaves the via, subsequent operations are carried out, and avoiding adverse effects on the device or test results due to the thimble not leaving in time.

[0049] Further, the moving component 212 further includes a third guide rail 2130 and a third slider 2131. The third guide rail 2130 is disposed on the base 211 along the first direction. The third slider 2131 is slidably engaged with the third guide rail 2130. The first mounting seat 21251 is provided on the third slider 2131. The third guide rail 2130 is disposed along the first direction, providing a clear and stable guide for the movement of the third slider 2131, which helps to ensure that the first mounting seat 21251 moves along an accurate straight line direction under the action of the driver 2121, thereby improving the accuracy and stability of the movement, and ensuring the accuracy of the contact between the test piece and the semiconductor device. The cooperation between the third slider 2131 and the third guide rail 2130 can share the load transmitted by the driver 2121, enhancing the load-bearing capacity of the entire moving component 212, enabling it to adapt to more complex and high-intensity test work.

[0050] In this embodiment, the first mounting seat 21251 is connected to the output end of the driver through a floating joint 2132. During the actual installation process, there may be certain installation errors. The floating joint 2132 can compensate for these errors to a certain extent, ensuring that the power of the driver 2121 can be smoothly and effectively transmitted to the first mounting seat 21251. During the operation of the driver 2121, vibrations and impacts may occur. The floating joint 2132 can play a buffering role, absorbing these adverse factors and extending the service life of the equipment. When there is an axial deviation or angular deviation between the output end of the driver and the first mounting seat 21251, the floating joint 2132 can automatically adjust to make the power transmission smoother, avoiding jamming or excessive wear, enabling the moving component 212 to have a certain degree of flexibility during operation, adapting to different working conditions and environmental changes, and improving the stability and reliability of the entire test system.

[0051] Specifically, the base 211 includes a fixed bracket 2111 and a mounting bracket 2112. The mounting bracket 2112 is disposed on the fixed bracket 2111, and the moving assembly 212 is disposed on the mounting bracket 2112. The fixed bracket 2111 includes a first cantilever 21111 and a second cantilever 21112. The first cantilever 21111 and the second cantilever 21112 are respectively located on both sides of the mounting bracket 2112. The test and sorting machine further includes a test board for fixing the test track 10. The first cantilever 21111 and the second cantilever 21112 are fixedly connected to the test board. The first cantilever 21111 and the second cantilever 21112 of the fixed bracket 2111 are respectively located on both sides of the mounting bracket 2112 and are fixedly connected to the test board, forming a stable support structure, which can effectively prevent the mounting bracket 2112 from shaking or displacing during operation, improving the stability of the entire base 211. Various forces generated during the test process can be evenly dispersed onto the test board through the first cantilever 21111 and the second cantilever 21112, avoiding structural damage or deformation caused by excessive local stress and extending the service life of the device. The fixed bracket 2111 and the mounting bracket 2112 of the base 211 can be installed and disassembled separately, facilitating the assembly and subsequent maintenance of the device. If a certain component fails or is damaged, it can be quickly replaced, reducing the device downtime. The cantilever design reduces the space occupation while ensuring the structural strength, making the overall layout of the test and sorting machine more compact and reasonable, which is conducive to arranging more functional components in a limited space.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A test sorting machine with a high-voltage insulation test function for testing semiconductor devices, characterized in that, Comprising: A test track for guiding a semiconductor device to slide between multiple workstations, the multiple workstations including a first insulation test workstation; A material blocking mechanism for blocking the semiconductor device at the first insulation test workstation when the semiconductor device slides along the test track; A first insulation test mechanism, the first insulation test mechanism including a positive electrode assembly, a negative electrode assembly and a first insulation test assembly, the first insulation test assembly including a base and a moving assembly provided on the base, the base being relatively fixed to the test track, the moving assembly including a driver and a first test piece connected in a transmission manner, the driver being capable of driving the first test piece to reciprocate along a first direction so that the first test piece abuts against or separates from the outer shell of the semiconductor device, the positive electrode assembly being electrically connected to the first test piece, and the negative electrode assembly being electrically connected to the first insulation test workstation.

2. The test sorting machine with a high-voltage insulation test function according to claim 1, characterized in that, The first insulation test workstation includes an insulation test seat provided on the test track, an insulation test piece is connected to the insulation test seat, the negative electrode assembly is electrically connected to the insulation test piece, and when the first test piece abuts against the outer shell of the semiconductor device, the outer shell of the semiconductor device abuts against the insulation test seat.

3. The test and sorting machine with a high-voltage insulation test function according to claim 1, wherein The moving assembly further includes a first guide rail and a first sliding member, the first guide rail is arranged on the base along the first direction, the first sliding member is in sliding fit with the first guide rail, the first sliding member is in transmission connection with the driver, and the first test piece is arranged on the first sliding member.

4. The test and sorting machine with a high-voltage insulation test function according to claim 3, wherein The moving assembly further includes a first buffer structure, the first sliding member is in transmission connection with the driver through the first buffer structure, and the first buffer structure is used for providing buffering when the first test piece abuts against the outer shell of the semiconductor device.

5. The test sorting machine with a high-voltage insulation test function according to claim 4, wherein, The first buffer structure includes a first mounting seat, a second mounting seat, a first connecting shaft and a first spring sleeved on the first connecting shaft, the first mounting seat is connected to the output end of the driver (2121), the second mounting seat is connected to the first sliding member, the first connecting shaft extends along the first direction, the first end of the first connecting shaft is fixed to the first mounting seat, a first mounting groove is provided on the second mounting seat, the second end of the first connecting shaft passes through the first mounting groove, a first limiting member is provided at the second end of the first connecting shaft, the outer peripheral dimension of the first limiting member is larger than the dimension of the first mounting groove, a first movable washer is provided on the first connecting shaft, the first movable washer is located between the first spring and the second mounting seat, and the outer peripheral dimension of the first movable washer is larger than the dimension of the first mounting groove.

6. The test and sorting machine with a high-voltage insulation test function according to claim 5, wherein The moving assembly further includes a second test piece, the second test piece is in transmission connection with the driver, the driver is capable of driving the second test piece to reciprocate along the first direction so that the second test piece abuts against or separates from the outer shell of the semiconductor device, and the second test piece is electrically connected to the first test piece.

7. The test and sorting machine with a high-voltage insulation test function according to claim 1, characterized in that The test sorting machine further includes a second insulation test mechanism, and the plurality of workstations further include a second insulation test workstation. The second insulation test mechanism is the same as the first insulation test mechanism, and the second insulation test mechanism corresponds to the second insulation test workstation.

8. The test and sorting machine with a high-voltage insulation test function according to claim 3, characterized in that, An assembly hole is provided on one side of the first test piece facing the first insulation test workstation. The assembly hole is used for assembling a thimble, and the thimble is used for testing a semiconductor device having a through hole.

9. The test sorting machine with a high-voltage insulation test function according to claim 8, wherein, A first sensor is provided on the base. The first sensor includes a first transmitting end and a first receiving end. A first baffle is fixed on the first sliding member. The first sliding member drives the first baffle to slide synchronously, so that a part of the first baffle is located between the first transmitting end and the first receiving end or the first baffle leaves between the first transmitting end and the first receiving end. When a part of the first baffle is located between the first transmitting end and the first receiving end, the first sensor determines that the thimble leaves the through hole of the semiconductor device.

10. The test and sorting machine with a high-voltage insulation test function according to claim 5, characterized in that, The moving assembly further includes a third guide rail and a third sliding member. The third guide rail is arranged on the base along the first direction. The third sliding member is slidably matched with the third guide rail, and the first mounting seat is arranged on the third sliding member; and / or the first mounting seat is connected to the output end of the driver through a floating joint; and / or the base includes a fixed bracket and a mounting bracket arranged on the fixed bracket. The moving assembly is arranged on the mounting bracket. The fixed bracket includes a first cantilever and a second cantilever. The first cantilever and the second cantilever are respectively located on both sides of the mounting bracket. The test sorting machine further includes a test board for fixing the test track. The first cantilever and the second cantilever are fixedly connected to the test board.

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