Cooling system, heating plate and vacuum eutectic reflow soldering furnace

Abstract

The utility model discloses a cooling system, a heating plate and a vacuum eutectic reflow soldering furnace thereof, which comprise a water removal passage configured to remove water in a cooling pipe, an unloading passage configured to remove pressure generated by high temperature of the system, and a cooling passage configured to be the cooling system, wherein the water removal passage comprises an air compressor, a flow regulation control device, a first stop valve for opening and closing a pipeline, a cooling pipe and a water chilling unit storing cooling water which are communicated in sequence, and the air compressor is used for generating compressed gas; the unloading passage comprises a safety valve communicated with the cooling pipe, and the safety valve is communicated with the atmosphere; the cooling passage comprises a second stop valve, the second stop valve is communicated with the water chilling unit, the second stop valve is communicated with the cooling pipe, and the other end of the cooling pipe is communicated with the water chilling unit. The unloading passage can be used for unloading pressure generated by high temperature of the cooling pipe of the system, so that quick cooling of parts can be met, and the processing quality and the processing efficiency are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of vacuum eutectic reflow soldering furnaces, and particularly relates to a cooling system, a heating plate and a vacuum eutectic reflow soldering furnace thereof. Background Art

[0002] The vacuum eutectic reflow soldering furnace is a key device for chip soldering in the microelectronics industry under vacuum or protective atmosphere. Among them, the cooling effect and rate of the chip during the production process have a great impact on the processing quality.

[0003] Existing vacuum eutectic reflow soldering furnace equipment often uses air cooling or a combination of air cooling and water cooling to indirectly cool the heating plate and the chip. However, the controllability, safety, and reliability of water under high-temperature and closed conditions are often overlooked during use.

[0004] To solve the above technical problems, the cooling device of a reflow soldering furnace with the application number 2023213627913 is disclosed, including a reflow soldering furnace device. A circular groove is opened on one side of the inner cavity of the reflow soldering furnace device. A fan is fixedly connected in the circular groove on one side of the inner cavity of the reflow soldering furnace device. Hanging plates are fixedly connected on both sides of the inner cavity of the reflow soldering furnace device close to the fan. A plurality of molten plate devices are placed on the top of each hanging plate. A heating device is arranged at the bottom of the inner cavity of the reflow soldering furnace device. A circular through hole is opened at the top of one side of the reflow soldering furnace device. An air extraction device is fixedly connected in the circular through hole at the top of one side of the reflow soldering furnace device.

[0005] Its defect is that the method of extracting gas through the air extraction device still cannot completely avoid the damage to the air extraction device and the air extraction pipeline caused by the high temperature of the gas. Summary of the Utility Model

[0006] In view of the above problems existing in the prior art, the present utility model provides a vacuum eutectic reflow soldering furnace, including a water removal passage configured to remove moisture in the cooling pipe, a pressure relief passage configured to relieve the pressure generated by the high temperature of the system, and a cooling passage configured to cool the system. The pressure relief passage in the cooling system of the present utility model can relieve the pressure generated by the high temperature of the system cooling pipe, can meet the rapid cooling of parts, improve the processing quality and processing efficiency, and the water removal passage of the vacuum eutectic reflow soldering furnace of the present utility model can blow the water in the cooling pipe into the chiller to save water resources.

[0007] To solve the above technical problems, the present utility model adopts the following technical solutions:

[0008] A cooling system includes a water removal passage configured to remove moisture in the cooling pipe, a pressure relief passage configured to relieve the pressure generated by the high temperature of the system, and a cooling passage configured to cool the system;

[0009] Wherein, the water removal passage includes a sequentially connected air compressor, a flow rate adjustment control device, a first stop valve for opening and closing the pipeline, a cooling pipe, and a chiller storing cooling water. The air compressor is used to generate compressed gas;

[0010] The pressure relief passage includes a safety valve communicated with the cooling pipe, and the safety valve is communicated with the atmosphere;

[0011] The cooling passage includes a second stop valve connected in sequence. The second stop valve is communicated with the chiller, the second stop valve is communicated with the cooling pipe, and the other end of the cooling pipe is communicated with the chiller.

[0012] Further, the water removal passage further includes a first check valve. The first check valve is communicated with the cooling pipe, and the first check valve is communicated with the water removal passage through a first tee. The first tee is located between the first stop valve and the second stop valve.

[0013] Further, the pressure relief passage further includes a safety valve communicated with the cooling pipe. The safety valve is simultaneously communicated with a second check valve. The second check valve is communicated with a second tee. One end of the second tee is communicated with a third stop valve, and the third stop valve is connected to the atmosphere. The other end of the second tee is communicated with a fourth stop valve, and the fourth stop valve is communicated with the chiller.

[0014] Further, the cooling passage further includes a third check valve and a flow switch connected in sequence. The flow switch is communicated with the second stop valve.

[0015] Further, the shape of the cooling pipe is one of S-shaped or M-shaped.

[0016] Further, the safety valve is also communicated with the atmosphere through a pipeline.

[0017] The present utility model also claims protection for a heating plate, and the heating plate is provided with any one of the above-mentioned cooling pipes.

[0018] The present utility model also claims protection for a vacuum eutectic reflow soldering furnace, which includes a furnace body, and the furnace body of the vacuum eutectic reflow soldering furnace is installed with the above-mentioned heating plate.

[0019] Compared with the prior art, the beneficial effects of this solution are:

[0020] The vacuum eutectic reflow soldering furnace of the present utility model is configured with a water removal passage for removing moisture in the cooling pipe, a pressure relief passage for relieving the pressure generated by the high temperature of the system, and a cooling passage for cooling the system; the pressure relief passage in the cooling system is used to relieve the pressure generated by the high temperature of the system. Compared with the prior art, after the vacuum eutectic reflow soldering furnace of the present utility model is welded, the water removal passage, the pressure relief passage and the cooling passage of the cooling system operate cyclically during the use of the equipment, meeting the cooling rate requirements for chip package soldering while improving the controllability, safety and reliability of the system under high temperature and sealed conditions;

[0021] The water removal passage of the vacuum eutectic reflow soldering furnace of the present utility model can blow the water in the cooling pipe into the chiller, saving water resources. And compared with the existing vacuum eutectic reflow soldering furnace that extracts gas through a pumping device, the water removal passage, in cooperation with the pressure relief passage, can basically completely avoid the damage to the pumping device and the pumping pipeline caused by the high gas temperature, greatly improving the safety of the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is the operation schematic diagram of the present utility model;

[0023] Figure 2 is the connection schematic diagram of each component of the present utility model.

[0024] The reference numerals are in sequence: furnace body 1, heating plate 2, cooling pipe 3. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The present utility model will be further described in detail below with reference to the drawings.

[0026] A cooling system, as Figure 1 and Figure 2 shown, includes a water removal passage configured to remove moisture in the cooling pipe 3, a pressure relief passage configured to relieve the pressure generated by the high temperature of the system, and a cooling passage configured to cool the system;

[0027] Among them, the water removal passage includes a sequentially connected air compressor, a flow rate adjustment control device. The flow rate adjustment control device can specifically adopt a pressure regulating valve, a first stop valve for opening and closing the pipeline. The stop valve refers to a valve in which the closing member (valve flap) moves along the center line of the valve seat and is very suitable for use as a cut-off. The cooling pipe 3 and a chiller storing cooling water. The air compressor is used to generate compressed gas, and the chiller is a simple and easy-to-operate one. Specifically, the chiller can be set as a bucket filled with cold water, and a pump is arranged in the bucket to pump the cold water into the passage;

[0028] The unloading passage includes a safety valve communicating with the cooling pipe 3. In this embodiment, the safety valve directly communicates the cooling pipe 3 with the air, which has a simple structure and is not prone to failure. The safety valve communicates with the atmosphere. The function of the safety valve is to discharge pressurized gas or liquid into the air during non-working or emergency states to avoid other accidents.

[0029] The cooling passage includes a second stop valve connected in sequence. The second stop valve communicates with the chiller, the second stop valve communicates with the cooling pipe 3, and the other end of the cooling pipe 3 communicates with the chiller.

[0030] In the actual production process, the cooling pipe 3 is in a bent S shape, M shape, etc. After the cooling process, there is residual moisture inside the cooling pipe 3, and the fluid resistance is relatively large. The cooling water cannot flow out smoothly due to the resistance and remains inside the cooling pipe 3. Therefore, before the next heating, since the temperature inside the vacuum eutectic reflow soldering furnace is relatively high, in order to avoid the high pressure formed by the water vapor generated by the high temperature of the residual water inside the vacuum eutectic reflow soldering furnace, the present utility model uses compressed gas with a certain pressure to blow out the residual water inside the cooling pipe 3.

[0031] According to a specific embodiment provided by the present utility model, the water removal passage, unloading passage, and cooling passage of the cooling system of the present utility model are in a circulating flow. The water removal passage is used to remove the moisture in the cooling pipe 3, the cooling passage is used to cool down the entire system, and the cooling system of the present utility model further includes an unloading passage, which is used to relieve the pressure generated by the high temperature of the system.

[0032] Further, the water removal passage further includes a first check valve. The first check valve communicates with the cooling pipe 3, and the first check valve communicates with the water removal passage through a first three-way joint. The first three-way joint is located between the first stop valve and the second stop valve.

[0033] The water removal passage has the following operating route: compressor - pressure regulating valve - first stop valve - first three-way joint - first check valve - cooling pipe 3 - safety valve - second check valve - second three-way joint - fourth stop valve - chiller.

[0034] When using the water removal passage, the following operating conditions need to be met:

[0035] (1) Close the second stop valve and the third stop valve;

[0036] (2) Open the first stop valve, and the chiller is in a stopped state;

[0037] (3) Start the air compressor. The pressure of the compressed gas needs to be set to a certain value through the pressure regulating valve, but it should not be greater than the preset opening pressure of the safety valve;

[0038] (4)The first shut-off valve is set to a certain opening time through the control system to ensure that most of the residual water is blown out of the inside of the cooling pipe 3.

[0039] Further, the unloading passage further includes a safety valve communicated with the cooling pipe 3. The safety valve is simultaneously communicated with a second check valve. The second check valve is communicated with a second three-way joint. One end of the second three-way joint is communicated with a third shut-off valve, and the third shut-off valve is connected to the atmosphere. The other end of the second three-way joint is communicated with a fourth shut-off valve, and the fourth shut-off valve is communicated with the chiller.

[0040] Further, the cooling passage further includes a third check valve and a flow switch connected in sequence. The flow switch is communicated with the second shut-off valve. The flow switch is mainly installed online or in an insertion manner in pipelines of media such as water, gas, and oil to monitor the magnitude of the water flow in the water system. When the water flow is higher or lower than a certain set point, it triggers an output alarm signal and transmits it to the unit, and the system can make corresponding indicating actions after obtaining the signal.

[0041] According to a specific embodiment provided by the present invention, after the welding operation of the vacuum eutectic reflow soldering furnace is completed, it is necessary to cool down the heating plate 2 and the product in the furnace body 1 to meet the processing quality and processing efficiency. The cooling passage is the following operation route: chiller - third check valve - flow switch - second shut-off valve - first three-way joint - first check valve - cooling pipe 3 - safety valve - second check valve - second three-way joint - fourth shut-off valve - chiller, and the cooling water can be recycled through the above cooling channel.

[0042] When using the cooling passage, the following operating conditions need to be met:

[0043] (1)Close the first shut-off valve and the third shut-off valve, and the chiller pump is in the working state;

[0044] (2)A flow switch is provided on the cooling passage to detect whether there is cooling water passing through this passage, that is, whether the chiller is turned on;

[0045] (3)The water pressure in the pipeline is not greater than the preset opening pressure of the safety valve. Specifically, a suitable pump of the chiller or frequency conversion control can be selected for implementation.

[0046] Further, the shape of the cooling pipe 3 is one of an S shape or an M shape.

[0047] Further, the safety valve is also communicated with the atmosphere through a pipeline.

[0048] According to a specific embodiment provided by the utility model, the vacuum eutectic reflow furnace will be in a high temperature state after use. Although most of the residual water is blown out of the cooling pipe 3 through the water removal passage, some will still remain. When the furnace is in a high temperature state, these residual water and cold air will be quickly gasified to form high pressure. Therefore, a load unloading passage is provided to connect with the atmosphere to ensure the safety of the cooling system. The load unloading passage is the following running route: cooling pipe 3 - safety valve - second check valve - second three-way valve - third stop valve - connected to the atmosphere.

[0049] To use the unloading channel, the following operating conditions must be met, and the operations are not in any particular order: The specific implementation is as follows:

[0050] (1) In this embodiment, the cooling pipe 3 is connected to the atmosphere through a safety valve. A safety valve is provided on the unloading passage. The safety valve is provided with a preset opening pressure, which is used to automatically release pressure through the safety valve opening passage when the internal pressure of the system is too high;

[0051] (2) Close the first stop valve, the second stop valve and the fourth stop valve, open the fourth stop valve, and the chiller is in a stopped state;

[0052] (3) When the furnace body 1 of the vacuum eutectic reflow soldering furnace is in a high temperature state and is in normal soldering operation, the unloading passage needs to remain open.

[0053] When the utility model closes the first stop valve, the second stop valve, the third stop valve and the fourth stop valve at the same time, the unloading passage, the water removal passage and the cooling passage can be closed at the same time.

[0054] The utility model also seeks to protect a heating plate, wherein the heating plate 2 is provided with any one of the above-mentioned cooling pipes.

[0055] The utility model also seeks to protect a vacuum eutectic reflow oven, comprising a furnace body. The vacuum eutectic reflow oven furnace body 1 is installed with the above-mentioned heating plate 2 .

[0056] Finally, it should be noted that in the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0057] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0058] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A cooling system, characterized in that, Including a water removal passage configured to remove moisture in the cooling pipe, a pressure relief passage configured to relieve the pressure generated by the high temperature of the system, and a cooling passage configured to cool the system; Among them, the water removal passage includes a sequentially connected air compressor, a flow rate adjustment control device, a first shut-off valve for opening and closing the pipeline, a cooling pipe, and a chiller storing cooling water. The air compressor is used to generate compressed gas; The pressure relief passage includes a safety valve connected to the cooling pipe, and the safety valve is connected to the atmosphere; The cooling passage includes a sequentially connected second shut-off valve. The second shut-off valve is connected to the chiller, the second shut-off valve is connected to the cooling pipe, and the other end of the cooling pipe is connected to the chiller.

2. The cooling system according to claim 1, wherein: The water removal passage further includes a first check valve. The first check valve is connected to the cooling pipe, and the first check valve is connected to the water removal passage through a first three-way joint. The first three-way joint is located between the first shut-off valve and the second shut-off valve.

3. The cooling system according to claim 2, wherein: The safety valve is simultaneously connected to a second check valve. The second check valve is connected to a second three-way joint. One end of the second three-way joint is connected to a third shut-off valve, and the third shut-off valve is connected to the atmosphere. The other end of the second three-way joint is connected to a fourth shut-off valve, and the fourth shut-off valve is connected to the chiller.

4. A cooling system according to claim 1 or 3, characterized in that: The cooling passage further includes a sequentially connected third check valve and a flow switch. The flow switch is connected to the second shut-off valve.

5. The cooling system according to claim 4, wherein: The shape of the cooling pipe is one of an S shape or an M shape.

6. The cooling system according to claim 3, characterized in that: The safety valve is also connected to the atmosphere through a pipeline.

7. A heating plate, characterized in that: The heating plate is provided with the cooling system according to any one of claims 1-6.

8. A vacuum eutectic reflow soldering furnace, comprising a furnace body, characterized in that: The furnace body is installed with the heating plate according to claim 7.

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