Pressing adjusting device for substrate cutting

Abstract

The utility model discloses a compaction adjusting device for cutting a base plate, and provides the following scheme that the compaction adjusting device for cutting the base plate comprises a movement mechanism, a cutting mechanism for cutting the base plate is arranged on the movement mechanism, a working table is arranged on the movement mechanism, and a clamping mechanism is arranged below the working table; a limiting groove is formed in the connecting position of the clamping mechanism and the workbench. The clamping mechanism comprises a supporting table, a transmission rod is installed on the supporting table, a connecting disc is installed on the transmission rod, a connecting frame is installed above the supporting table, clamping heads are installed on the two sides of the connecting frame, and torsional springs are arranged at the connecting positions of the connecting frame and the clamping heads; the clamping head comprises a support, the support is rotationally connected with the connecting frame, and a clamping wheel is installed below the tip end of the support. The utility model aims to provide the compression adjusting device for cutting the base plate, so that the effect of carrying out central positioning and clamping on the base plate in the cutting process of the base plate is achieved.

Description

Technical Field

[0001] The utility model discloses a pressing and adjusting device for substrate cutting, and relates to the technical field of substrate cutting. Background Art

[0002] Substrate cutting usually refers to the process of cutting large substrates or circuit boards into small pieces or specific sizes in electronic manufacturing. This process is very critical because it determines the size and shape of the final product, affecting the quality and efficiency of the overall production. In the cutting method, the substrate is precisely cut using a laser beam, which is suitable for work with complex shapes and high precision requirements. Laser cutting can reduce material loss and improve production efficiency.

[0003] In laser cutting, if the substrate is not stably centrally positioned and clamped, it is easy for the substrate to be cut inaccurately during processing, increasing the probability of product defects. Therefore, it is necessary to provide a clamping and adjusting device for substrate cutting to solve the above problem. Utility Model Content

[0004] The utility model aims to provide a clamping and adjusting device for substrate cutting, so as to achieve the effect of center positioning and clamping the substrate during substrate cutting.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A clamping and adjusting device for cutting a substrate comprises a moving mechanism, which is characterized in that: a cutting mechanism for cutting the substrate is installed on the moving mechanism, a workbench is installed on the moving mechanism, a clamping mechanism is installed below the workbench, and a limiting groove is arranged at the connection between the clamping mechanism and the workbench; the clamping mechanism comprises a supporting table, which is characterized in that: a transmission rod is installed on the supporting table, a connecting plate is installed on the transmission rod, a connecting frame is installed above the supporting table, clamping heads are installed on both sides of the connecting frame, and a torsion spring is arranged at the connection between the connecting frame and the clamping head; the clamping head comprises a bracket, which is characterized in that: the bracket is rotatably connected to the connecting frame, and a clamping wheel is installed below the tip of the bracket; wherein the clamping mechanism performs linear motion along the limiting groove on the workbench, and the connecting frame drives the clamping head to move toward the center.

[0007] Preferably, the clamping mechanism is driven by a cylinder.

[0008] Preferably, the connecting disk rotates along the central axis, a limiting wheel is installed on the side of the transmission rod, the limiting wheel conflicts with the transmission rod, and the limiting wheel rotates along the central axis.

[0009] Preferably, a cylinder is installed on the support platform to control the movement of the support platform along the inner axis of the cylinder.

[0010] Preferably, the connecting frame is provided with a resistance groove, and the connection between the connecting frame and the supporting platform is provided with an adjustment hole for adjusting the situation where the substrate is clamped too tightly.

[0011] Preferably, the clamping wheel is a rotatable wheel for clamping the substrate.

[0012] Preferably, the bracket is in a "V" shape, and an arc groove is provided in the middle of the "V" shape of the bracket.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows: By controlling the driving rod to move inwards through the air cylinder, the connecting disc is driven to rotate counterclockwise, so that the connecting frame drives the clamping head to move towards the center and approach the substrate until it is clamped. While clamping the substrate, the center positioning effect of the substrate clamping is achieved, so that the cutting mechanism can cut the substrate more precisely. The cooperation between the "V" - shaped bracket arranged on the clamping head and the clamping wheel enables the substrate structure to be protected from damage while clamping the substrate. Description of the Drawings

[0014] Figure 1 It is an overall schematic diagram of the pressing and adjusting device for substrate cutting;

[0015] Figure 2 It is Figure 1 The schematic diagram of the clamping mechanism of the pressing and adjusting device for substrate cutting in

[0016] Among them, each reference numeral in the figure:

[0017] 1. Movement mechanism; 2. Cutting mechanism; 3. Workbench; 31. Limit groove; 4. Clamping mechanism; 41. Support table; 42. Clamping head; 421. Bracket; 422. Clamping wheel; 423. Arc groove; 43. Connecting frame; 431. Contact groove; 432. Torsion spring; 433. Adjusting hole; 44. Driving rod; 45. Connecting disc; 46. Limit wheel. Detailed Embodiments

[0018] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0019] Specific implementation cases:

[0020] As Figure 1 shown, the pressing and adjusting device for substrate cutting includes a movement mechanism 1, a cutting mechanism 2 for cutting the substrate is installed on the movement mechanism 1, a workbench 3 is installed on the movement mechanism 1, a clamping mechanism 4 is installed below the workbench 3, a limit groove 31 is provided at the connection between the clamping mechanism 4 and the workbench 3, and the driving mode of the clamping mechanism 4 is air - cylinder driving;

[0021] When the mechanism works, the substrate to be processed is placed in the middle of the clamping mechanism 4 arranged on the workbench 3. The motor drives the clamping mechanism 4 to move towards the center along the limit groove 31 until the workpiece is clamped, and the motion mechanism 1 controls the cutting mechanism 2 to perform cutting;

[0022] The motion principles of the cutting mechanism 2 and the motion mechanism 1 are both prior arts and will not be elaborated here;

[0023] As Figure 2 shown, the clamping mechanism 4 includes a support table 41. A transmission rod 44 is installed on the support table 41. A connection disk 45 is installed on the transmission rod 44. The connection disk 45 can rotate along the central axis. A limit wheel 46 is installed on the side of the transmission rod 44. The limit wheel 46 abuts against the transmission rod 44 and the limit wheel 46 can rotate along the central axis. A cylinder (not marked in the figure) is installed on the support table 41. The cylinder controls the support table 41 to move along the inner axis of the cylinder, and its moving direction is the same as the linear motion direction of the clamping mechanism 4 along the limit groove 31 on the workbench 3. A connection frame 43 is installed above the support table 41. Clamping heads 42 are installed on both sides of the connection frame 43. A torsion spring 432 is arranged at the connection part of the connection frame 43 and the clamping head 42. A resisting groove 431 is arranged on the connection frame 43 to limit the movement range of the clamping head 42. An adjusting hole 433 is arranged at the connection part of the connection frame 43 and the support table 41 to adjust the situation of over-tight clamping when the clamping head 42 clamps the substrate;

[0024] The clamping head 42 includes a bracket 421. The bracket 421 is rotatably connected with the connection frame 43. The shape of the bracket 421 is "V". The connection frame 43 drives the clamping head 42 to move towards the center and approach the substrate. A clamping wheel 422 is installed below the tip of the bracket 421. The clamping wheel 422 is a rotatable wheel for clamping the substrate. An arc groove 423 is arranged in the middle of the "V" shape of the bracket 421;

[0025] In this mechanism, two groups of clamping heads 42 and connection frames 43 are symmetrically distributed with respect to the connection disk 45, and two groups of transmission rods 44 are symmetrically distributed with respect to the center of the connection disk 45;

[0026] For the convenience of understanding, in the initial state of the mechanism, the torsion spring 432 is in an open state, the clamping head 42 is opened. The clamping wheel 422 arranged on the inner side of the clamping head 42 is regarded as the inner wheel, and the clamping wheel 422 arranged on the outer side of the clamping head 42 is regarded as the outer wheel;

[0027] When the mechanism clamps the substrate, the air cylinder controls the transmission rod 44 to move inwards. The horizontal position is restricted by the limit wheel 46, driving the connecting disc 45 to rotate counterclockwise, and at the same time driving another transmission rod 44 to move inwards, so that the connecting frame 43 drives the clamping head 42 to move towards the center and approach the substrate. When the side of the substrate first contacts the inner wheel of the clamping wheel 422, the clamping head 42 continuously moves inwards until the inner wheels of the four clamping wheels 422 contact the side of the substrate simultaneously. Under the continuously inwards pressure, the torsion spring 432 is tightened, and the clamping head 42 is buckled inwards until the outer wheel abuts against the side of the substrate to complete the clamping. The function of the adjustment hole 433 is to adjust the situation of over-tight clamping when the clamping head 42 clamps the substrate. In the clamped state, the corners of the substrate are located in the arc groove 423 of the bracket 421 and the side of the substrate does not contact the inner wall of the bracket 421. The abutting groove 431 is used to limit the movement range of the inner wheel in the inwardly buckled state of the clamping head 42;

[0028] In summary, by controlling the transmission rod 44 to move inwards through the air cylinder, driving the connecting disc 45 to rotate counterclockwise, the connecting frame 43 drives the clamping head 42 to move towards the center and approach the substrate until it is clamped. While clamping the substrate, the center positioning effect of the substrate clamp is achieved, so that the cutting mechanism 2 can cut the substrate more precisely. The cooperation between the "V"-shaped bracket 421 and the clamping wheel 422 provided on the clamping head 42 protects the substrate structure from damage while clamping the substrate.

[0029] The above is only the preferred embodiment of the present application, and the protection scope of the present application is not limited to the above embodiments. All technical solutions falling within this concept belong to the protection scope of the present application. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and retouches should also be regarded as the protection scope of the present application.

Claims

1. A pressing and adjusting device for substrate cutting, comprising a motion mechanism (1), characterized in that: The motion mechanism (1) is provided with a cutting mechanism (2) for cutting a substrate, the motion mechanism (1) is provided with a workbench (3), a clamping mechanism (4) is provided below the workbench (3), and a limiting groove (31) is provided at the connection between the clamping mechanism (4) and the workbench (3); The clamping mechanism (4) comprises a support platform (41), characterized in that: a transmission rod (44) is installed on the support platform (41), a connecting plate (45) is installed on the transmission rod (44), a connecting frame (43) is installed above the support platform (41), clamping heads (42) are installed on both sides of the connecting frame (43), and a torsion spring (432) is provided at the connection between the connecting frame (43) and the clamping head (42); The clamping head (42) comprises a bracket (421), characterized in that: the bracket (421) is rotatably connected to the connecting frame (43), and a clamping wheel (422) is installed below the tip of the bracket (421); The clamping mechanism (4) performs linear motion along the limiting groove (31) on the workbench (3), and the connecting frame (43) drives the clamping head (42) to move toward the center.

2. The pressing and adjusting device for substrate cutting according to claim 1, wherein: The clamping mechanism (4) is driven by a cylinder.

3. The pressing and adjusting device for substrate cutting according to claim 1, wherein: The connecting disk (45) rotates along the central axis. A limiting wheel (46) is installed on the side of the transmission rod (44). The limiting wheel (46) is in conflict with the transmission rod (44). The limiting wheel (46) rotates along the central axis.

4. The pressing and adjusting device for substrate cutting according to claim 1, wherein: The support platform (41) is provided with a cylinder for controlling the movement of the support platform (41) along the axis inside the cylinder.

5. The pressing and adjusting device for substrate cutting according to claim 1, characterized in that: The connecting frame (43) is provided with a resistance groove (431), and the connection between the connecting frame (43) and the supporting platform (41) is provided with an adjustment hole (433) for adjusting the situation where the substrate is clamped too tightly.

6. The pressing and adjusting device for substrate cutting according to claim 1, wherein: The clamping wheel (422) is a rotatable wheel used for clamping the substrate.

7. The pressing and adjusting device for substrate cutting according to claim 1, wherein: The support (421) is in a "V" shape, and an arc groove (423) is provided in the middle of the "V" shape of the support (421).

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