Automatic production line for sticking short round bars

Abstract

The utility model relates to an automatic production line for sticking short round rods, which comprises a feeding part for feeding and conveying silicon rods; the cleaning part is used for cleaning the end surface of the silicon rod; the length measuring part is used for measuring the length of the silicon rod; the circle center finding part is used for finding the circle center of the silicon rod; the crystal wire finding part is used for finding a crystal wire of the silicon rod; the rod sticking part is used for placing the silicon rod for gluing and rod sticking; the gluing machine is used for gluing the end face of the silicon rod placed on the rod sticking part; and the silicon rod transfer system is used for realizing the transfer function of the silicon rod among the feeding part, the cleaning part, the length measuring part, the circle center finding part, the crystal line finding part, the rod sticking part and the gluing machine so as to realize the rod sticking operation. According to the silicon rod sticking device, the function of automatically sticking silicon rods with the same specification and different lengths is achieved, then the number of operators and the use amount of glue are reduced, and the advantages of being lower in use cost, smaller in occupied space and the like are achieved.

Description

Technical Field

[0001] This application relates to the technical field of silicon rod processing, and particularly to an automated production line for sticking short round rods. Background Art

[0002] In the upstream photovoltaic industry, the lengths of single-crystal silicon rods pulled out by crystal pulling furnaces are not completely consistent. When reaching the truncation station, the short rods cut out are also of different lengths. During slicing, the crystal carrier and the adhesive plate are usually of fixed length. However, the time taken by the slicing machine to cut a long rod is the same as that to cut a short rod, but the number of silicon wafers produced varies greatly. If there are many short rods, it is a serious waste of the processing capacity of the slicing machine. Therefore, people began to find a solution at the adhesive station, splicing two short square rods into a whole square rod. Although the slicing productivity has increased, the automatic process for splicing square rods has high precision requirements. If not handled well, the two rods will not be spliced neatly, leading to problems such as wire breakage of the diamond wire of the slicing machine and even secondary contamination of the silicon wafers themselves. In order to improve production efficiency, double-sided squaring machines have gradually become the mainstream in the industry. However, squaring a long and a short rod simultaneously will also cause waste of the processing capacity of the squaring machine. Therefore, people's focus on solving the problem has gradually shifted to the previous step of the squaring process: sticking and splicing round rods.

[0003] Currently, sticking short round rods mainly relies on manual offline sticking, which requires a large number of workers. To stick two short round silicon rods concentrically and with the same crystal line direction, the operation is cumbersome and the accurate docking cannot be achieved. Moreover, manual sticking requires a variety of auxiliary equipment and tooling, the glue consumption is not fixed, the workshop occupies a large area, the equipment investment is large, there are many personnel, and the glue loss is large.

[0004] Therefore, there is an urgent need to provide an automated production line for sticking short round rods to solve the above-mentioned technical problems. Utility Model Content

[0005] Based on this, an automated production line for sticking short round rods is provided, which realizes the function of automatically sticking silicon rods of the same specification but different lengths, thereby reducing the number of operators and the glue consumption, and achieving the advantages of lower usage cost and smaller floor space.

[0006] On the one hand, an automated production line for sticking short round rods is provided, including: a feeding section for feeding and transporting silicon rods; a cleaning section for cleaning the end faces of the silicon rods; a length measuring section for measuring the lengths of the silicon rods; a center finding section for finding the centers of the silicon rods; a crystal line finding section for finding the crystal lines of the silicon rods; a sticking section for placing the silicon rods for gluing and sticking; a gluing machine for gluing the end faces of the silicon rods placed on the sticking section; and a silicon rod transfer system for realizing the transfer function of the silicon rods between the feeding section, the cleaning section, the length measuring section, the center finding section, the crystal line finding section, the sticking section and the gluing machine to achieve the sticking operation.

[0007] Preferably, the silicon rod transfer system includes a mounting base plate, a manipulator, and a gripper; the manipulator is arranged on the mounting base plate and can be circumferentially movably arranged; the gripper is arranged at the front end of the manipulator and can grip the silicon rod.

[0008] Preferably, the cleaning part includes a cleaning bracket, a power source installed on the cleaning bracket, and a cleaning brush installed on the output end of the power source; the power source controls the cleaning brush to clean the end face of the silicon rod.

[0009] Preferably, the length measurement part includes two relatively arranged measurement brackets and displacement laser sensors arranged on the measurement brackets; the displacement laser sensors are used to measure the length of the silicon rod located between the two measurement brackets and the relative distance between the gripper and the silicon rod placement surface.

[0010] Preferably, the sensor distance between the two displacement laser sensors is set to L1; the left laser measurement value from one displacement laser sensor to the non-placement surface of the silicon rod is L2; the right laser measurement value from one displacement laser sensor to the placement surface of the silicon rod is L3; the length L0 of the silicon rod is equal to L1 - L2 - L3; the length from the gripper to the placement surface of the silicon rod is L4; when L2 < L3, L4 = {L0 / 2 + (|L2 - L3| / 2)}; when L2 > L3, L4 = {L0 / 2 - (|L2 - L3| / 2)}.

[0011] Preferably, the crystal line finding part includes a support table, a calibration disc, and a crystal line finding mechanism; the calibration disc is rotatably arranged at the upper end of the support table and remains horizontal, the lower end of the silicon rod is supported on the upper surface of the calibration disc, and the center of the silicon rod coincides with the center of the calibration disc; the crystal line finding mechanism is arranged on one side of the support table and is used to find the crystal line of the silicon rod during the rotation of the calibration disc.

[0012] Preferably, the crystal line finding mechanism includes a transverse moving part and a probe arranged on the transverse moving part; the probe can advance or retreat under the action of the transverse moving part; the probe advances to contact the surface of the silicon rod to detect the crystal line on the surface of the silicon rod.

[0013] Preferably, the silicon rod sticking part includes a support base and a support disc; the support disc is arranged at the upper end of the support base and remains horizontal; the lower end of the silicon rod is supported on the upper surface of the support disc; the glue applicator applies glue to the upper end of the silicon rod.

[0014] Preferably, the glue applicator includes a machine body, an X-direction translation member, a Y-direction translation member, a Z-direction translation member, and a glue applicator head; the X-direction translation member is disposed on the machine body; the Z-direction translation member is slidably mounted on the X-direction translation member; the Y-direction translation member is slidably mounted on the Z-direction translation member; and the glue applicator head is slidably mounted on the Y-direction translation member.

[0015] Preferably, the short round rod sticking rod automatic production line further includes a rod pressing part for pressing the silicon rod after bonding on the sticking rod part.

[0016] Preferably, the rod pressing part includes a gantry, a longitudinal moving member disposed on the gantry, and a pressing plate disposed on the output end of the longitudinal moving member; the longitudinal moving member controls the pressing plate to descend and presses the silicon rod after bonding on the sticking rod part.

[0017] Beneficial effects:

[0018] The above-mentioned short round rod sticking rod automatic production line can conveniently and quickly realize the function of automatically sticking silicon rods of the same specification but different lengths by setting a feeding part, a cleaning part, a length measuring part, a center finding part, a crystal line finding part, a sticking rod part, a glue applicator, and a silicon rod transfer system, without manual processing by operators. Compared with the traditional manual processing operation method, this method of the present application is more time-saving, labor-saving, and material-saving, and can greatly improve the processing production efficiency of silicon rods. Moreover, it also solves the operation rate of subsequent processing equipment, improves the processing output per unit time, can reduce the number of square rod splicing rods in front of the existing slicing, and improves the sticking rod efficiency of square rods. Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of a short round rod sticking rod automatic production line in an embodiment;

[0020] Figure 2 It is a top view of a short round rod sticking rod automatic production line in an embodiment;

[0021] Figure 3 It is a schematic structural diagram of a silicon rod transfer system in an embodiment;

[0022] Figure 4 It is a schematic structural diagram of a cleaning part in an embodiment;

[0023] Figure 5 It is a schematic structural diagram of a length measuring part in an embodiment;

[0024] Figure 6 It is a measurement schematic diagram when the gripper grabs the silicon rod and places it normally at the calibrated gripper center in an embodiment;

[0025] Figure 7Schematic diagram of measurement when the gripper center of the gripper offset calibration grabs the silicon rod and places it misaligned in an embodiment

[0026] Figure 8 Schematic structural diagram of the center-finding part in an embodiment;

[0027] Figure 9 Schematic structural diagram of the crystal-line finding part in an embodiment;

[0028] Figure 10 Side view schematic diagram of the crystal-line finding part in an embodiment;

[0029] Figure 11 Schematic structural diagram of the rod-bonding part in an embodiment;

[0030] Figure 12 Side view schematic diagram of the rod-bonding part in an embodiment;

[0031] Figure 13 Schematic structural diagram of the glue applicator in an embodiment;

[0032] Figure 14 Schematic structural diagram of the rod-pressing part in an embodiment.

[0033] Reference numerals: 1, loading part; 11, loading roller path; 12, support frame body; 2, cleaning part; 21, cleaning bracket; 22, power source; 23, cleaning brush; 231, roller; 232, brush; 3, length measurement part; 31, measurement bracket; 32, displacement laser sensor; 4, center-finding part; 41, camera bracket; 411, cross bar; 412, supplementary light; 42, camera; 5, crystal-line finding part; 51, support table; 52, calibration disc; 53, crystal-line finding mechanism; 531, transverse moving part; 532, probe; 533, mounting frame; 54, first gear disc; 55, first main gear; 56, first driving part; 6, rod-bonding part; 61, support base; 62, support disc; 63, second gear disc; 64, second main gear; 65, second driving part; 7, glue applicator; 71, machine body; 72, X-direction translation part; 73, Y-direction translation part; 74, Z-direction translation part; 75, glue application head; 8, silicon rod transfer system; 81, installation bottom plate; 82, manipulator; 83, gripper; 9, rod-pressing part; 91, gantry; 92, longitudinal moving part; 93, pressing disc; 101, silicon rod. Detailed implementation manners

[0034] In order to make the objectives, technical solutions and advantages of the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0035] It should be noted that the illustrations provided in this embodiment only schematically illustrate the basic concept of the present application. Therefore, only the components related to the present application are shown in the drawings, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0036] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the conditions under which the present application can be implemented. Therefore, they do not have substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that the present application can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present application.

[0037] The orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "middle", "longitudinal", "transverse", "horizontal", "inner", "outer", "radial", "circumferential", etc. cited in this specification is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0038] The embodiment of the present application provides an automated production line for sticking short round rods. On the basis of the original rod sticking, by adding functions such as automatic cleaning, length measurement, center finding, crystal line finding, rod sticking, automatic glue application, and automatic handling, the function of automatically sticking silicon rods of the same specification but different lengths is realized. Subsequently, the number of operators and the amount of glue used are reduced, achieving advantages such as lower usage costs and smaller floor space.

[0039] The following will describe in detail an automated production line for sticking short round rods provided in this embodiment with reference to the accompanying drawings. Please refer to Figures 1 - 3As shown in the figure, it includes: a feeding section 1, a cleaning section 2, a length measuring section 3, a center finding section 4, a crystal line finding section 5, a stick adhering section 6, a glue applicator 7, and a silicon rod transfer system 8. Among them, the feeding section 1 is used for feeding and conveying the silicon rod 101; the cleaning section 2 is used for cleaning the end face of the silicon rod 101; the length measuring section 3 is used for measuring the length of the silicon rod 101; the center finding section 4 is used for finding the center of the silicon rod 101; the crystal line finding section 5 is used for finding the crystal line of the silicon rod 101; the stick adhering section 6 is used for placing the silicon rod 101 for glue application and stick adhesion; the glue applicator 7 is used for applying glue to the end face of the silicon rod 101 placed on the stick adhering section 6; the silicon rod transfer system 8 is used to realize the transfer function of the silicon rod 101 between the feeding section 1, the cleaning section 2, the length measuring section 3, the center finding section 4, the crystal line finding section 5, the stick adhering section 6, and the glue applicator 7 to realize the stick adhesion operation.

[0040] In this embodiment, by setting the feeding section 1, the cleaning section 2, the length measuring section 3, the center finding section 4, the crystal line finding section 5, the stick adhering section 6, the glue applicator 7, and the silicon rod transfer system 8, it is possible to more conveniently and quickly realize the automatic stick adhesion function for silicon rods 101 of the same specification but different lengths, without the need for manual processing by operators. Therefore, compared with the manual processing operation in the prior art, this method of the present application is more time-saving, labor-saving, and material-saving, and can greatly improve the processing and production efficiency of the silicon rod 101, achieving advantages such as lower usage cost and smaller floor space.

[0041] In this embodiment, it should be noted that the feeding section 1, the cleaning section 2, the length measuring section 3, the center finding section 4, the crystal line finding section 5, the stick adhering section 6, and the glue applicator 7 can be sequentially arranged on the outer circumference of the silicon rod transfer system 8. Among them, the silicon rod transfer system 8 includes a mounting base plate 81 and a manipulator 82 arranged on the mounting base plate 81. A gripper 83 for grasping the silicon rod 101 is provided at the front end of the manipulator 82. This manipulator 82 can be a six-axis robot, which is a commercially available product and can be selected according to actual needs. By adopting the cooperation of the manipulator 82 and the gripper 83, the grasping of silicon rods 101 with different outer diameters and lengths is realized, which is convenient for placing and taking the silicon rod 101 in the appropriate position without manual placement and taking by staff. Therefore, it can save time and effort, thereby improving the processing and production efficiency.

[0042] Please refer to Figure 1 、 Figure 3As shown, in this embodiment, it should be noted that the feeding section 1 includes a feeding roller table 11, which can be supported by a support frame 12. The feeding roller table 11 is used to convey the silicon rod 101. The silicon rod 101 is placed horizontally on the feeding roller table 11 in a transverse direction, and the feeding roller table 11 conveys the silicon rod 101 forward along the axial direction of the silicon rod 101. Thus, when the feeding roller table 11 conveys the silicon rod 101 to the corresponding position, the manipulator 82 rotates to the position of the feeding roller table 11 and grabs the silicon rod 101 through the gripper 83 at the front end, and moves the grabbed silicon rod 101 to the cleaning section 2 for end face cleaning. The feeding section 1 can also be a belt conveyor or other conveyor lines, which can be selected according to actual needs and no specific requirements are made here.

[0043] Please refer to Figure 1 、 Figure 3 and Figure 4 As shown, the cleaning section 2 is arranged in the next process of the feeding section 1. The cleaning section 2 includes a cleaning bracket 21, a power source 22 and a cleaning brush 23. The cleaning bracket 21 is arranged vertically. The cleaning brush 23 is installed on the side of the cleaning bracket 21 and includes a roller 231 and a brush 232. The roller 231 is arranged vertically and the upper and lower ends of the roller 231 are respectively rotatably installed on the cleaning bracket 21 through bearing seats and bearings. The brush 232 is covered on the outer periphery of the roller 231. The power source 22 is installed on the cleaning bracket 21 and is located at the lower end of the cleaning brush 23. The output end of the power source 22 is connected to the lower end of the roller 231. Thus, the gripper 83 grabs the silicon rod 101 from the feeding section 1 and then moves it to a position close to the brush 232 and contacts it. Subsequently, the power source 22 controls the roller 231 to rotate. During the rotation of the roller 231, the brush 232 can clean the end face of the silicon rod 101, such as the bonding end, while rotating. Preferably, the power source 22 uses a motor to automatically control the cleaning brush 23 to rotate. After cleaning, the gripper 83 moves the silicon rod 101 to the length measuring section 3 for length measurement.

[0044] Please refer to Figure 1 、 Figure 3 and Figure 5As shown, in this embodiment, it should also be noted that the length measurement unit 3 is arranged in the next process of the cleaning unit 2, and includes a measurement bracket 31 and a displacement laser sensor 32. There are two measurement brackets 31, which are arranged opposite to each other. The displacement laser sensors 32 are respectively installed on each measurement bracket 31 and are aligned. The displacement laser sensor 32 is used to measure the length of the silicon rod 101 located between the two measurement brackets 31 and the relative distance between the gripper 83 and the placement surface of the silicon rod 101. For the sake of easy distinction, in this embodiment, the placement surface of the silicon rod 101 is defined as the bonding surface when bonding the rod in the rod bonding unit 6, and the opposite end is the non-placement surface. The gripper 83 grabs the silicon rod 101 after being cleaned by the cleaning unit 2 and grabs it to the calibration position placed between the two measurement brackets 31, so that the axis direction of the silicon rod 101 is consistent with the connection direction between the two measurement brackets 31. Then, the displacement laser sensor 32 measures the length of the silicon rod 101 and the relative distance between the gripper 83 and the placement surface of the silicon rod 101. In this embodiment, by measuring the relative distance between the gripper 83 and the placement surface of the silicon rod 101, it can be more accurate when placing it in the next station. By judging the relative distance between the gripper 83 and the placement surface of the silicon rod 101, it can be known how high to place it when placing the rod later, so as to avoid hitting the rod when docking and bonding. Normally, the calibration gripper center of the gripper 83 should be located at the middle position of the silicon rod 101, and each movement of the gripper 83 during rod bonding is determined based on the calibration gripper center of the gripper 83 being located at the middle position of the silicon rod 101. However, sometimes the gripper 83 may not exactly grab the middle position of the silicon rod 101 and may grab it off-center, resulting in the distance from the gripper 83 to the placement surface of the silicon rod 101 being greater than the distance from the gripper 83 to the placement surface when grabbing the middle position of the silicon rod 101, leading to hitting the rod when bonding. Therefore, the pick-and-place operation of the gripper 83 is adjusted by judging the relative distance between the gripper 83 and the placement surface of the silicon rod 101. For example, the length of a silicon rod 101 is 600 mm. Normally, the calibration gripper center of the gripper 83 should be located at the middle position of the silicon rod 101, and the distance from the gripper 83 to the placement surface of the silicon rod 101 should be 300 mm. At this time, when moving to the rod bonding unit 6 for rod bonding, there will be no interference or rod hitting problem. When the gripper 83 grabs off-center, such as the distance from the gripper 83 to the placement surface of the silicon rod 101 is 310 mm and the distance to the other end of the silicon rod 101 is 290 mm. At this time, the distance of 310 mm from the gripper 83 to the placement surface of the silicon rod 101 is greater than the distance of 300 mm from the gripper 83 to the placement surface when grabbing the middle position of the silicon rod 101. If the gripper 83 continues to move according to the original movement, there will be a rod hitting problem when bonding in the rod bonding unit 6. Therefore, at this time, it is necessary to adjust the gripper 83 to control the pick-and-place operation of the silicon rod 101 to avoid hitting the rod when bonding.

[0045] Please refer to Figure 6As shown in the figure, it is a schematic diagram of the calibration hand grasping center of the gripper 83 located at the middle position of the silicon rod 101 when the silicon rod 101 is placed normally. The sensor spacing between the two displacement laser sensors 32 is set as L1. The left laser measurement value measured by the left displacement laser sensor 32 to the left end face of the silicon rod 101, that is, the non-placement face, is L2. The right laser measurement value measured by the right displacement laser sensor 32 to the right end face of the silicon rod 101, that is, the placement face, is L3. Then, at this time, the length L0 of the silicon rod 101 is equal to L1 - L2 - L3.

[0046] Please refer to Figure 7 As shown in the figure, it is a schematic diagram of the calibration hand grasping center of the gripper 83 deviating from the middle position of the silicon rod 101 when the silicon rod 101 is misaligned. At this time, taking the right side of the silicon rod 101 as the placement face, in order to prevent the right end face from hitting the workbench and the lower silicon rods during rod splicing, calculate the length L4 from the gripper 83 to this end face: when L2 < L3, L4 = {L0 / 2 + (|L2 - L3| / 2)}; when L2 > L3, L4 = {L0 / 2 - (|L2 - L3| / 2)}.

[0047] Please refer to Figure 1 、 Figure 8 As shown in the figure, in this embodiment, it should also be noted that the center finding part 4 is arranged in the next process of the length measuring part 3. The center finding part 4 includes a camera bracket 41 and a camera 42. The camera bracket 41 is arranged vertically. A cross bar 411 is connected to the upper end of the camera bracket 41. The camera 42 is installed on the cross bar 411. The gripper 83 grabs and moves the silicon rod 101 below the camera 42 and adjusts the posture of the silicon rod 101 to make the silicon rod 101 vertical. Thus, the camera 42 takes a picture of the silicon rod 101 below it and finds the center of the end face of the silicon rod 101. After finding the center, the gripper 83 grabs and moves the silicon rod 101 to the crystal line finding part 5 to find the crystal line. Preferably, a supplementary light 412 is also arranged on the camera bracket 41. Of course, the camera 42 is calibrated with a standard rod before finding the center. After calibration, the center coordinates of the calibration rod are confirmed by taking a picture. When grabbing the silicon rod 101 to take a picture later, the center is automatically determined according to the center coordinates of the calibration rod. This part is well known in the art and will not be elaborated here.

[0048] Please refer to Figure 1 、 Figure 9 and Figure 10As shown, the crystal line finding part 5 is arranged in the next process of the center finding part 4, and includes a support platform 51, a calibration disc 52 and a crystal line finding mechanism 53. The calibration disc 52 is arranged at the upper end of the support platform 51 and remains horizontal, and the center of the calibration disc 52 is used as the coordinate origin. When the lower end of the silicon rod 101 is placed on the calibration disc 52, its center coincides with the coordinate origin. Therefore, after the center of the silicon rod 101 is found by the camera 42, the gripper 83 grabs the silicon rod 101 and places it on the upper end surface of the calibration disc 52, so that the center of the silicon rod 101 coincides with the coordinate origin of the calibration disc 52. If there is a deviation, the placement position of the silicon rod 101 is adjusted by the gripper 83 until they coincide. The crystal line finding mechanism 53 is arranged on one side of the support platform 51 and is used to find the crystal line of the silicon rod 101 during the rotation of the calibration disc 52. By finding the crystal line of the silicon rod 101, the crystal lines of the two silicon rods 101 to be bonded can be adjusted to the same direction during subsequent rod bonding, so that the crystal line positions of the two bonded silicon rods 101 correspond to each other, which is convenient for subsequent square cutting.

[0049] In a feasible way, the crystal line finding mechanism 53 includes a lateral moving part 531, a probe 532 and a mounting bracket 533. The mounting bracket 533 is mounted on the lateral moving part 531, and the probe 532 is arranged at the front end of the mounting bracket 533. The probe 532 can move forward or backward under the action of the lateral moving part 531, and the probe 532 is used to detect the crystal line on the surface of the silicon rod 101 when it advances to contact the surface of the silicon rod 101. There are four crystal lines on the surface of the silicon rod 101, and the included angle between two adjacent crystal lines is 90 degrees. When the probe 532 advances to contact the surface of the silicon rod 101, then the calibration disc 52 is rotated to make the calibration disc 52 and the silicon rod 101 rotate synchronously. When the crystal line of the silicon rod 101 just contacts the probe 532 during rotation, the probe 532 transmits a signal to the system, and a wave peak appears in the system. Then the calibration disc 52 continues to rotate. If a wave peak appears again after rotating 90 degrees, the crystal line is found. The probe 532 rotates to the wave peak position and stops rotating. Subsequently, the crystal lines of all the silicon rods 101 are found in the above-mentioned manner. Then, each time the manipulator 82 grabs the silicon rod 101 to the rod bonding part 6 according to the same operation, the crystal line positions of the two bonded silicon rods 101 can correspond to each other.

[0050] In one example, the calibration disc 52 rotates automatically. A first gear disc 54 is fixedly arranged on the lower end face of the calibration disc 52. The first gear disc 54 and the calibration disc 52 are coaxially arranged. A first main gear 55 meshes with the outer side of the first gear disc 54. A first driving member 56 is arranged on the support platform 51. The output end of the first driving member 56 is connected to the first main gear 55. Thus, the first driving member 56 drives the first main gear 55 to rotate. During the rotation of the first main gear 55, it meshes with the first gear disc 54 to rotate, and the first gear disc 54 drives the calibration disc 52 to rotate synchronously. Of course, the probe 532 can also be interlocked with the first driving member 56. When the probe 532 advances to contact the surface of the silicon rod 101, at this time, the first driving member 56 is driven to complete the crystal wire finding of the silicon rod 101. After the crystal wire is found, the gripper 83 grabs the silicon rod 101 to the stick bonding part 6 for glue application and stick bonding. It should be noted that the first driving member 56 can be a motor.

[0051] Please refer to Figure 1 、 Figure 11 and Figure 12 As shown, in this embodiment, it should also be noted that the stick bonding part 6 is arranged in the next process of the crystal wire finding part 5, including a support base 61 and a support disc 62. The support disc 62 is arranged on the upper end of the support base 61 and remains horizontal. The lower end of the silicon rod 101 is supported on the upper surface of the support disc 62. The glue applicator 7 applies glue to the upper end of the silicon rod 101 to facilitate the subsequent bonding of two silicon rods 101.

[0052] In some embodiments, the support disc 62 rotates automatically. In this way, glue can be applied while rotating to achieve uniform glue application. A second gear disc 63 is fixedly arranged on the lower end face of the support disc 62. The second gear disc 63 and the support disc 62 are coaxially arranged. A second main gear 64 meshes with the outer side of the second gear disc 63. A second driving member 65 is arranged on the support base 61. The output end of the second driving member 65 is connected to the second main gear 64. Thus, the second driving member 65 drives the second main gear 64 to rotate. During the rotation of the second main gear 64, it meshes with the second gear disc 63 to rotate, and the second gear disc 63 drives the support disc 62 to rotate synchronously. After the glue application is completed, the support disc 62 rotates back to the origin (the initial position where the gripper 83 places the silicon rod 101, so that the crystal wire orientation remains the same as before, facilitating bonding). It should be noted that the second driving member 65 can be a motor.

[0053] Please refer to Figure 1 、 Figure 13As shown in the figure, the glue applicator 7 includes a machine body 71, an X-direction translation member 72, a Y-direction translation member 73, a Z-direction translation member 74, and a glue applicator head 75; the X-direction translation member 72 is arranged on the machine body 71, the Z-direction translation member 74 is slidably installed on the X-direction translation member 72, the Y-direction translation member 73 is slidably installed on the Z-direction translation member 74, and the glue applicator head 75 is slidably installed on the Y-direction translation member 73, so that the glue applicator head 75 moves in the X-axis direction, Y-axis direction, and Z-axis direction under the action of the X-direction translation member 72, Y-direction translation member 73, and Z-direction translation member 74, and applies adhesive to different positions of the silicon rod 101. The X-direction translation member 72 and the Z-direction translation member 74 can be a lead screw transmission device, or a pneumatic slide rail, or other linear motion devices, which are selected according to actual needs and no specific requirements are made here; the Y-direction translation member 73 can be a cylinder, or a lead screw transmission device, or other linear motion devices, which are selected according to actual needs and no specific requirements are made here.

[0054] By using the glue applicator 7, the silicon rod 101 can be automatically coated with glue, the coating time can be shortened, and the glue can be applied quantitatively, avoiding waste of the adhesive and improving the bonding efficiency of the silicon rod 101.

[0055] Please refer to Figure 1 、 Figure 14 As shown in the figure, in this embodiment, it should also be noted that after the glue applicator 7 applies glue to the first silicon rod 101, then the silicon rod transfer system 8 returns to the origin and continues to grab the second silicon rod 101. The second silicon rod 101 passes through the cleaning unit 2, length measurement unit 3, center finding unit 4, and crystal line finding unit 5 in sequence and then reaches the rod bonding unit 6. The lower end of the second silicon rod 101 is bonded to the glue-coated surface of the first silicon rod 101 and stacked together for bonding, and then the rod pressing unit 9 is used for pressing.

[0056] The rod pressing unit 9 is arranged in the next process of the rod bonding unit 6. The rod pressing unit 9 is arranged above the rod bonding unit 6 and is used for pressing the silicon rod 101 after bonding in the rod bonding unit 6. Specifically, it includes a gantry 91, a longitudinal moving member 92 arranged on the gantry 91, and a pressure plate 93 arranged at the output end of the longitudinal moving member 92. The longitudinal moving member 92 controls the pressure plate 93 to descend and presses the silicon rod 101 after bonding in the rod bonding unit 6 to complete the splicing of the silicon rod 101. By pressing the bonded silicon rod 101, the deviation of the bonded silicon rod 101 can be avoided, which affects the bonding quality. Preferably, the longitudinal moving member 92 can be a cylinder, or a lead screw transmission device, or other linear motion devices, which are selected according to actual needs and no specific requirements are made here.

[0057] In one example, the longitudinal moving member 92 and the pressure plate 93 are arranged in multiple groups, and the multiple groups of longitudinal moving members 92 and pressure plates 93 are arranged at intervals on the gantry 91, so that multiple silicon rods 101 can be pressed.

[0058] The implementation principle of this embodiment is as follows: the silicon rod transfer system 8 grabs the silicon rod 101 from the loading part 1 and moves it to the cleaning part 2 to clean the end face of the silicon rod 101. After cleaning, the silicon rod transfer system 8 grabs the silicon rod 101 and moves it to the length measuring part 3 to measure the length of the silicon rod 101 and calculate the relative distance between the gripper 83 and the end face of the silicon rod 101. Then the silicon rod transfer system 8 grabs the silicon rod 101 and moves it to the circle center finding part 4 to find the center of the silicon rod 101 through the camera 42. After finding the center of the silicon rod 101, the silicon rod transfer system 8 grabs the silicon rod 101 and places it in the crystal line finding part 5 to find the crystal line through the crystal line finding mechanism 53. Then the silicon rod transfer system 8 grabs the first silicon rod 101 and places it in the sticking part 6 to prepare for the glue coating operation. The glue coating machine 7 quantitatively coats the end face of the first silicon rod 101 with glue. After the glue coating is completed, the silicon rod transfer system 8 returns to the loading part 1 to grab the second silicon rod 101, passes through the cleaning part 2, the length measuring part 3, the center finding part 4, and the crystal line finding part 5 in turn, and then reaches the stick bonding part 6 for stick bonding. Since the first silicon rod 101 and the second silicon rod 101 have both passed through the center finding part 4 and the crystal line finding part 5 to find the center and the crystal line, it can be ensured that the upper and lower silicon rods 101 are concentric and have the same crystal line direction when sticking the rods. After the stick bonding is completed, the silicon rod 101 is pressurized and compacted by the stick pressing part 9. After the glue is cured, the silicon rod transfer system 8 grabs the silicon rod 101 to complete the entire process. Due to the adoption of the above technical scheme, the stick bonding function of silicon rods 101 of the same specification but different lengths can be automatically realized, the number of operators and the amount of glue used can be reduced, and the advantages of lower use cost and smaller space can be achieved.

[0059] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An automated production line for gluing short round rods, characterized in that, Comprising: A loading section (1) for loading and conveying a silicon rod (101); A cleaning section (2) for cleaning the end face of the silicon rod (101); A length measuring section (3) for measuring the length of the silicon rod (101); A center finding section (4) for finding the center of the silicon rod (101); A crystal line finding section (5) for finding the crystal line of the silicon rod (101); A rod sticking section (6) for placing the silicon rod (101) for gluing and rod sticking; A gluing machine (7) for gluing the end face of the silicon rod (101) placed on the rod sticking section (6); A silicon rod transfer system (8) for realizing the transfer function of the silicon rod (101) between the loading section (1), the cleaning section (2), the length measuring section (3), the center finding section (4), the crystal line finding section (5), the rod sticking section (6) and the gluing machine (7) to realize the rod sticking operation.

2. The short round bar sticking rod automatic production line according to claim 1, characterized in that, The silicon rod transfer system (8) includes a mounting base plate (81), a manipulator (82) and a gripper (83); The manipulator (82) is arranged on the mounting base plate (81) and can be circumferentially movably arranged; The gripper (83) is arranged at the front end of the manipulator (82) and can grip the silicon rod (101).

3. The short round rod sticking automatic production line according to claim 1, characterized in that The cleaning section (2) includes a cleaning bracket (21), a power source (22) mounted on the cleaning bracket (21) and a cleaning brush (23) mounted on the output end of the power source (22); The power source (22) controls the cleaning brush (23) to clean the end face of the silicon rod (101).

4. The short round rod sticking automatic production line according to claim 2, characterized in that The length measuring section (3) includes two relatively arranged measuring brackets (31) and a displacement laser sensor (32) arranged on the measuring brackets (31); The displacement laser sensor (32) is used for measuring the length of the silicon rod (101) located between the two measuring brackets (31) and the relative distance between the gripper (83) and the placement surface of the silicon rod (101).

5. The short round bar sticking automation production line according to claim 4, characterized in that, The sensor distance between the two displacement laser sensors (32) is set to L1; The left laser measurement value of one displacement laser sensor (32) to the non-placement surface of the silicon rod (101) is L2; The right laser measurement value of one displacement laser sensor (32) to the placement surface of the silicon rod (101) is L3; The length L0 of the silicon rod (101) is equal to L1 - L2 - L3; The length from the gripper (83) to the placement surface of the silicon rod (101) is L4; When L2 < L3, L4 = {L0 / 2 + (|L2 - L3| / 2)}; when L2 > L3, L4 = {L0 / 2 - (|L2 - L3| / 2)}.

6. The short round rod sticking automatic production line according to claim 1, characterized in that The crystal line finding section (5) includes a support table (51), a calibration disc (52), and a crystal line finding mechanism (53); The calibration disc (52) is rotatably arranged at the upper end of the support table (51) and remains horizontal. The lower end of the silicon rod (101) is supported on the upper surface of the calibration disc (52), and the center of the silicon rod (101) coincides with the center of the calibration disc (52). The crystal line finding mechanism (53) is arranged on one side of the support table (51) and is used to find the crystal line of the silicon rod (101) during the rotation of the calibration disc (52).

7. The short round rod sticking automatic production line according to claim 6, characterized in that The crystal line finding mechanism (53) includes a transverse moving member (531) and a probe (532) arranged on the transverse moving member (531). The probe (532) can move forward or backward under the action of the transverse moving member (531). The probe (532) advances to abut against the surface of the silicon rod (101) to detect the crystal line on the surface of the silicon rod (101).

8. The short round rod sticking automatic production line according to claim 1, characterized in that The sticking part (6) includes a support base (61) and a support disc (62). The support disc (62) is arranged at the upper end of the support base (61) and remains horizontal. The lower end of the silicon rod (101) is supported on the upper surface of the support disc (62). The gluing machine (7) glues the upper end of the silicon rod (101).

9. The short round rod sticking automatic production line according to claim 1, characterized in that The gluing machine (7) includes a machine body (71), an X-direction translation member (72), a Y-direction translation member (73), a Z-direction translation member (74), and a gluing head (75). The X-direction translation member (72) is arranged on the machine body (71). The Z-direction translation member (74) is slidably installed on the X-direction translation member (72). The Y-direction translation member (73) is slidably installed on the Z-direction translation member (74). The gluing head (75) is slidably installed on the Y-direction translation member (73).

10. The short round rod sticking automatic production line according to claim 1, characterized in that The short round rod sticking automatic production line further includes a rod pressing part (9) for pressing the silicon rod (101) bonded on the sticking part (6).

11. The short round rod sticking automatic production line according to claim 10, characterized in that The rod pressing part (9) includes a gantry (91), a longitudinal moving member (92) arranged on the gantry (91), and a pressing disc (93) arranged at the output end of the longitudinal moving member (92). The longitudinal moving member (92) controls the pressing disc (93) to descend and presses the silicon rod (101) bonded on the sticking part (6).

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