Coating equipment

Abstract

The utility model discloses coating equipment which comprises coating chambers, coating areas are arranged in the coating chambers, the number of the coating chambers is a, the number of the coating areas is a * N, a is a natural number of 2-4, and N is a natural number of 2-4. According to the coating equipment, multi-target coating can be carried out according to needs.

Description

Technical Field

[0001] This application relates to the technical field of machining, and particularly to a coating device. Background Art

[0002] Existing cookware achieves non-stick performance by coating a chemical coating on the surface of the cookware, generally polytetrafluoroethylene. The polytetrafluoroethylene coating is non-toxic under normal conditions, but it will start to volatilize when the heating temperature of the coating reaches 260°C, and the polytetrafluoroethylene coating will start to decompose when the temperature reaches 350°C. Therefore, the operating temperature of non-stick cookware with a polytetrafluoroethylene coating generally cannot exceed 250°C. However, for general cookware such as a wok, the heating temperature often exceeds 260°C, so there are safety hazards. In addition, the coating is not wear-resistant and there is a risk of peeling off, which is easily ingested with food and affects physical health.

[0003] Currently, there is a PVD process that can form a deposition layer on the surface of a product, which has wear-resistant properties. However, the existing PVD is for processing wear-resistant coatings on the surfaces of products such as mobile phones. The equipment and process can only coat one target material and cannot meet the needs of various personalized production requirements. Utility Model Content

[0004] In order to solve the above technical problems, this application provides a coating device that can perform personalized coating production and processing according to needs.

[0005] This application provides a coating device, including a coating chamber, a coating area is provided in the coating chamber, the number of coating chambers is set to a, and the number of coating areas is set to a*N, where a is a natural number from 2 to 4, and N is a natural number from 2 to 4.

[0006] By adopting the above technical solution, the coating chamber is set to at least two, and each coating chamber can be set with a target material for sputtering coating processing. The coating area is set to 2-4 times the number of coating chambers, which can not only achieve good coating processing, but also make the production line length economically reasonable, and is convenient for the standardized manufacturing of the coating chamber.

[0007] In a further aspect, a is 2 or 3.

[0008] By adopting the above technical solution, the coating chamber can meet the conventional coating production requirements. Generally, when coating a product with multiple materials, 2 target materials are the most commonly used, which can meet the product performance requirements and are the most economical. When the coating chamber is set to two or three, only one coating chamber is used, and the other coating chambers are used as cooling chambers. Then the production line can also meet the requirements of sputtering coating processing of one target material for the product, and the production line can be switched more flexibly. It is possible to meet the coating requirements of the performance of multiple products without changing the production line.

[0009] In a further embodiment, N is 2 or 3.

[0010] By adopting the above technical solution, generally only one coating area needs to be processed in the coating chamber. However, during the research and development and debugging process of the equipment, it is found that when the number of coating areas is set to 2 or 3, the coating quality is more stable, the production line length is most reasonable, and the processing cost and the defective rate are relatively low.

[0011] In a further embodiment, a transfer valve is provided between every two of the coating chambers.

[0012] By adopting the above technical solution, a transfer valve is provided between every two coating chambers so that a relatively sealed space can be formed between them, that is, different coating chambers can be maintained in a common vacuum state when the transfer valve is opened, and the influence of factors such as the targets and temperature of different coating chambers can be reduced when the transfer valve is closed, ensuring the quality of the coating process. When the transfer valve conveys the workpiece after coating in the previous coating chamber to the next coating chamber, it can reduce the environmental interference between different coating chambers and improve the processing quality of the workpiece coating.

[0013] In a further embodiment, the coating chamber at least includes two coating areas, a buffer area and a sputtering area, which are connected in sequence, and the buffer area is connected to the entrance of the coating chamber.

[0014] By adopting the above technical solution, the coating chamber is divided into a buffer area and a sputtering area, and a transfer valve is provided between each area so that the buffer area and the sputtering area form a relatively sealed space, which can reduce the environmental interference between different areas and improve the processing quality of the coating. The buffer area is connected to the entrance of the coating chamber, and when the workpiece from the previous process enters the coating chamber, it can be buffered in the buffer area to complete the buffer processing before sputtering.

[0015] In a further embodiment, when a is greater than or equal to 2, the materials of the targets in each of the sputtering areas are different.

[0016] By adopting the above technical solution, the coating equipment can realize coating processing of two or more materials, which can meet the processing requirements of different product performances.

[0017] In a further embodiment, the coating chamber is connected to an etching chamber, the entrance of the coating chamber and the exit of the etching chamber are connected and a gate valve is provided therebetween, and the gate valve is used to control the connection or closing between the entrance of the coating chamber and the exit of the etching chamber.

[0018] By adopting the above technical solution, the valve can partition the etching chamber and the coating chamber for processing when it is closed, and can make the etching chamber and the coating chamber in the same vacuum state when it is open. When processing the surface of the workpiece, the valve is closed, and the surface of the workpiece is first etched in the etching chamber to improve the adhesion performance of the workpiece surface. Then the valve is opened, and the etched workpiece enters the coating chamber and the valve is closed again. In the coating chamber, physical vapor deposition processing is performed on the surface of the workpiece to form a non-sticky and wear-resistant coating layer.

[0019] In a further solution, the outlet of the coating chamber and the inlet of the etching chamber are connected by a conveying mechanism to form a circular production line.

[0020] By adopting the above technical solution, the conveying mechanism can circulate and transport the workpiece between the etching chamber and the coating chamber, and can realize automatic processing and transportation in a vacuum state. Through the design improvement of the coating equipment, the etching chamber and the coating chamber can not only realize partition processing, but also realize the continuous transmission of the workpiece through the conveying mechanism, so as to realize the continuous and uninterrupted processing of the workpiece, reduce the switching time, improve the production efficiency, reduce the processing cost, and is conducive to mass production.

[0021] In a further solution, the outlet of the etching chamber and the inlet of the coating chamber are hermetically connected, and in the working state, the etching chamber and the coating chamber are in the same vacuum state.

[0022] By adopting the above technical solution, in the working state, from the etching of the workpiece to the coating processing, the whole process will not affect the production efficiency due to frequent vacuum pumping and breaking of the vacuum, and seamless docking and continuous automatic processing can be realized. The whole process does not require personnel intervention and has high production efficiency. If the surface coating processing of the cookware product is carried out, the processing time of a single product can be shortened to 5 - 8 minutes, which improves the production efficiency and greatly reduces the processing cost of a single product, and can meet the requirements of mass production.

[0023] In a further solution, it further includes a vacuum device connected to the etching chamber and / or the coating chamber, and the vacuum device is used to form a vacuum in at least one of the etching chamber and the coating chamber.

[0024] By adopting the above technical solutions, the vacuum device can create a vacuum state in at least one of the etching chamber and the coating chamber, and through sealed connection, the two can reach the same vacuum state. When the workpiece enters the etching chamber from the external atmospheric pressure environment for etching, it is necessary to break the vacuum in the etching chamber so that the workpiece can enter when the pressure in the etching chamber is the same as the external atmospheric pressure. The etching chamber and the coating chamber are connected by a valve gate, which are spatially separated and sealed. When the etching chamber breaks the vacuum, the vacuum state of the coating chamber is maintained. The workpiece can first enter the etching chamber, then close the inlet valve gate of the etching chamber, and evacuate through the vacuum device connected to the etching chamber and / or the coating chamber. The valve gates of the etching chamber and the coating chamber are opened and connected to reach the same vacuum state. Because there is a valve gate isolation between the etching chamber and the coating chamber, and the vacuum device can be connected separately, the time for the etching chamber to reach the vacuum state again after the workpiece enters is short, reducing the switching time.

[0025] In summary, the present application has at least one of the following beneficial technical effects:

[0026] 1. For the coating equipment of the present application, the processing time of a single-piece product can be shortened from 3 hours to 5 - 8 minutes, improving the production efficiency, significantly reducing the processing cost of a single-piece product, and meeting the requirements of mass production.

[0027] 2. The coating equipment of the present application can achieve coating processing of two or more materials, with more stable processing quality and reduced environmental pollution.

[0028] 3. For the coating equipment of the present application, the production line space and process are reasonably set, reducing the labor intensity of workers and improving the automated production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic structural diagram of the first embodiment of the coating equipment of the present application;

[0030] Figure 2 is a schematic diagram of the workpiece being transported to the first chamber by a trolley;

[0031] Figure 3 is a schematic diagram of the workpiece being transported to the output chamber by a trolley;

[0032] Figure 4 is a schematic structural diagram of the coating chamber;

[0033] Figure 5 is a schematic diagram of the structure of the second embodiment of the coating equipment of the present application;

[0034] Figure 6 is a schematic diagram of the structure of the third embodiment of the coating equipment of the present application.

[0035] REFERENCE NUMERALS:

[0036] 1. Etching chamber; 11. Etching inlet; 2. Valve; 3. Coating chamber; 31. First chamber; 311. First buffer zone; 312. First sputtering zone; 313. First cooling zone; 32. Transfer valve; 33. Second chamber; 331. Second buffer zone; 332. Second sputtering zone; 333. Second cooling zone; 34. Coating outlet; 35. Output chamber; 4. Conveyor mechanism; 41. Unloading area; 42. Loading area; 100. Trolley. Detailed implementation manners

[0037] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings. The components of the embodiments of the present application described and illustrated in the drawings here can be arranged and designed in various different configurations. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.

[0038] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0039] In the description of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0040] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application.

[0041] The following will describe in detail some embodiments of the present application with reference to the accompanying drawings. Without conflict, the features in the following embodiments can be combined with each other.

[0042] Embodiment 1

[0043] Please refer to Figures 1 - 4, Structural schematic of the first embodiment of the coating equipment. The coating equipment includes a coating chamber 3, in which a coating area is provided. The number of coating chambers 3 is set to a, and the number of coating areas is set to a*N, where a is a natural number from 2 to 4 and N is a natural number from 2 to 4. A transfer valve 32 is provided between every two coating chambers 3.

[0044] Please refer to Figure 1 , The coating equipment further includes an etching chamber 1, a transfer mechanism 4, and a vacuum device (not shown in the figure). The inlet of the coating chamber 3 is connected to the outlet of the etching chamber 1, and a gate valve 2 is provided therebetween. The gate valve 2 is used to control the connection or disconnection between the inlet of the coating chamber 3 and the outlet of the etching chamber 1. The outlet of the coating chamber 3 and the inlet of the etching chamber 1 are connected by the transfer mechanism 4 to form a circular production line. The vacuum device is connected to the etching chamber 1 and / or the coating chamber 3, and the vacuum device is used to create a vacuum in at least one of the etching chamber 1 and the coating chamber 3. The outlet of the etching chamber 1 and the inlet of the coating chamber 3 are hermetically connected. In the working state, the etching chamber 1 and the coating chamber 3 are in the same vacuum state. Because of the vacuum seal between the etching chamber 1 and the coating chamber 3, the vacuum device can also be connected to the etching chamber 1 alone or to the coating chamber 3 alone to make the etching chamber 1 and the coating chamber 3 reach the same vacuum state together.

[0045] Please refer to Figure 2 , The etching chamber 1 is used to etch the surface of the workpiece to improve the adhesion performance of the workpiece surface. The etching chamber 1 includes a plasma source for processing the surface of the workpiece and an etching inlet 11. The coating chamber 3 is used to form a deposition layer on the workpiece surface. The coating chamber 3 includes a sputtering cathode for sputtering the surface of the workpiece after etching. At least part of the transfer mechanism 4 is arranged in the etching chamber 1 or the coating chamber 3. A transport trolley 100 is provided on the transfer mechanism 4 and is used to transport the workpiece processed in the etching chamber 1 to the coating chamber 3. In this embodiment, the vacuum device is connected to the etching chamber 1 and the coating chamber 3 respectively to create a vacuum state in the etching chamber 1 and the coating chamber 3. The transfer mechanism 4 connects the entire coating equipment into a circular production line. The transport trolley 100 circulates to transport the workpiece under the drive of the transfer mechanism 4, and continuous production of workpiece processing can be achieved.

[0046] The transfer mechanism 4 is provided with a blanking area 41 and a loading area 42 on the line between the outlet of the coating chamber 3 and the inlet of the etching chamber 1. When the trolley 100 loaded with processed workpieces comes out of the outlet of the coating chamber 3 and runs to the blanking area 41 driven by the transfer mechanism 4, the workpieces in the trolley 100 are taken out manually or by a manipulator. At the loading area 42, the workpieces to be processed are put into the trolley 100 manually or by a manipulator. The trolley 100 moves to the etching inlet 11 driven by the transfer mechanism 4. The etching chamber 1 breaks the vacuum, the valve 2 at the etching inlet 11 is opened, and the trolley 100 enters the etching chamber 1 for etching processing. The etching chamber 1 is also connected with a vacuum device. Before the etching processing, the vacuum device evacuates the etching chamber 1 first. The vacuum device in this embodiment is a vacuum pump.

[0047] The valve 2 is opened, and the trolley 100 driven by the transfer mechanism 4 enters the coating chamber 3 through the valve 2 with the etched workpieces for coating. The coating chamber 3 includes a connected first chamber 31 and a second chamber 33, and a transfer valve 32 is connected between the first chamber 31 and the second chamber 33.

[0048] Please refer to Figure 3 , the coating outlet 34 of the coating chamber 3 is also connected with an output chamber 35, and a valve 2 is also arranged between the output chamber 35 and the coating chamber 3. The processed workpieces are transported into the output chamber 35 by the trolley 100 and then transported from the output chamber 35 to the blanking area 41. The trolleys 100 loaded with workpieces are arranged in sequence on the transfer mechanism 4. Driven by the transfer mechanism 4, the trolleys 100 carry the workpieces to continuously enter the etching chamber 1 and the coating chamber 3 for processing, and then carry the processed workpieces to continuously enter the blanking area 41 for unloading. Then, the workpieces to be processed are loaded into the trolleys 100 at the loading area 42. Through the continuous transfer of the workpieces by the transfer mechanism 4, the continuous and uninterrupted processing of the workpieces is realized, the switching time is reduced, the production efficiency is improved, the processing cost is reduced, and the batch production is realized.

[0049] Please refer to Figure 4 , the technical solution of this embodiment is to use two coating chambers 3, namely the first chamber 31 and the second chamber 33, to coat the workpieces. Each coating chamber 3 includes two coating areas, namely a buffer area and a sputtering area that are connected to each other. The first buffer area 311 is connected to the valve 2. The first sputtering area 312 of the first chamber 31 is connected to the second buffer area 331 of the second chamber 33, and a transfer valve 32 is arranged therebetween. The transfer valve 32 can form a relatively sealed space between the first chamber 31 and the second chamber 33. The second chamber 33 is provided with a coating outlet 34 for transporting the coated workpieces out of the second chamber 33 from the coating outlet 34.

[0050] The vacuum device is connected to at least one of the first buffer 311, the first sputtering area 312, the second buffer 331, and the second sputtering area 332, and is used to make the first chamber 31 and the second chamber 33 in a vacuum state. The first buffer 311 is connected to the etching chamber 1 and is used to park the workpieces transferred from the etching chamber 1. Sputtering cathodes are arranged in the first sputtering area 312 and the second sputtering area 332. The target materials in the first sputtering area 312 and the second sputtering area 332 are different. After the workpiece is coated with one target material in the first sputtering area 312, it enters the second sputtering area 332 for coating processing with the second target material. Thus, the workpiece can be coated with two materials. If coating processing with three or four materials is required, the coating chamber 3 can be added. For example, a third chamber and a fourth chamber are connected behind the second chamber 33, and each coating chamber 3 uses a target material of a different material.

[0051] Please refer to Figures 1 - 4 , the coating equipment in this embodiment includes a processing step under atmospheric pressure and a processing step under vacuum:

[0052] The processing step under atmospheric pressure includes:

[0053] Transfer out: The workpiece coated by the transfer mechanism 4 is transported to the unloading area 41 through the trolley 100 and transferred to the loading and unloading step.

[0054] Loading and unloading: When the clutch detection device detects that there is no workpiece on the trolley 100, the loading mechanism feeds the trolley 100; when it detects that there is a workpiece on the trolley 100, after the unloading mechanism disassembles the workpiece, the loading mechanism feeds the workpiece.

[0055] Heating: The transfer mechanism 4 transports the workpiece to be processed into the heating channel, and the workpiece is heated to 150°C to 250°C.

[0056] Transfer in: The transfer mechanism 4 transports the workpiece to be processed after heating to the etching inlet 11. After the valve 2 at the etching inlet 11 is opened, the trolley 100 enters the etching chamber 1.

[0057] The processing step under vacuum includes:

[0058] Vacuum mode: The vacuum device evacuates the etching chamber 1 and the coating chamber 3 to a vacuum state.

[0059] Input: The valve 2 at the etching inlet 11 is closed, the valve 2 between the etching chamber 1 and the coating chamber 3 is closed. After the trolley 100 enters the etching chamber 1, the etching chamber 1 is evacuated to a vacuum state.

[0060] Heating: The workpiece is heated.

[0061] Etching: After heating, the workpiece enters the etching area, and the plasma source etches the surface of the workpiece.

[0062] Coating: The valve 2 between the etching chamber 1 and the coating chamber 3 is opened, and the etched workpiece enters the first buffer area 311 of the first chamber 31. The valve 2 between the etching chamber 1 and the coating chamber 3 is closed. The transfer valve 32 between the first buffer area 311 and the first sputtering area 312 is opened, and the workpiece enters the first sputtering area 312. The transfer valve 32 between the first buffer area 311 and the first sputtering area 312 is closed, and the surface of the workpiece is processed in the first sputtering area 312 to form a first deposition layer. The transfer valve 32 between the first sputtering area 312 and the second buffer area 331 is opened, and the coated workpiece enters the second buffer area 331. The transfer valve 32 between the first sputtering area 312 and the second buffer area 331 is closed, and the surface of the workpiece is processed in the second sputtering area 332 to form a second deposition layer.

[0063] Output: The valve 2 at the coating outlet 34 is opened, and the workpiece enters the output chamber 35. The valve 2 at the coating outlet 34 is closed. The output chamber 35 breaks the vacuum. The valve 2 of the output chamber 35 is opened, and the workpiece enters the transfer-out step. The valve 2 of the output chamber 35 is closed, and the output chamber 35 is evacuated.

[0064] Embodiment 2

[0065] Please refer to Figure 5 , the difference from Embodiment 1 is that the first chamber 31 further includes a first cooling area 313. The first cooling area 313 is respectively connected to the first sputtering area 312 and the second buffer area 331. The workpiece processed in the first sputtering area 312 enters the second buffer area 331 through the first cooling area 313. According to the processing requirements, a cooling area may not be provided in the first chamber 31, and a cooling area may be provided in the second chamber 33.

[0066] Embodiment 3

[0067] Please refer to Figure 6 , the difference between this embodiment and Embodiment 1 is that the first chamber 31 is provided with a first cooling area 313, and the second chamber 33 is provided with a second cooling area 333. The first cooling area 313 is respectively connected to the first sputtering area 312 and the second buffer area 331. The workpiece processed in the first sputtering area 312 enters the second buffer area 331 through the first cooling area 313. The second cooling area 333 is respectively connected to the second sputtering area 332 and the coating outlet 34. The workpiece processed in the second sputtering area 332 enters the output chamber 35 through the second cooling area 333.

[0068] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only to illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes, modifications, substitutions and variations, and all these changes, modifications, substitutions and variations fall within the scope of the present invention claimed.

Claims

1. A coating device, comprising a coating chamber (3), characterized in that, A coating area is provided inside the coating chamber (3). The number of coating chambers (3) is set to be a, and the number of coating areas is set to be a * N, where a is a natural number from 2 to 4 and N is a natural number from 2 to 4. The coating chamber (3) at least includes two coating areas, namely a buffer area and a sputtering area, which are connected in sequence. The buffer area is connected to the inlet of the coating chamber (3). When a is greater than or equal to 2, the materials of the targets in each sputtering area are different.

2. The coating device according to claim 1, characterized in that, The a is 2 or 3.

3. The coating device according to claim 1, characterized in that, The N is 2 or 3.

4. The coating equipment according to claim 1, wherein, A transfer valve (32) is provided between every two coating chambers (3).

5. The coating equipment according to any one of claims 1 to 4, characterized in that, The coating chamber (3) is connected to an etching chamber (1). The inlet of the coating chamber (3) is connected to the outlet of the etching chamber (1), and a gate valve (2) is provided therebetween. The gate valve (2) is used to control the connection or closing between the inlet of the coating chamber (3) and the outlet of the etching chamber (1).

6. The coating equipment according to claim 5, wherein, The outlet of the coating chamber (3) and the inlet of the etching chamber (1) are connected through a transfer mechanism (4) to form a circular production line.

7. The coating equipment according to claim 5, wherein The outlet of the etching chamber (1) and the inlet of the coating chamber (3) are hermetically connected. In the working state, the etching chamber (1) and the coating chamber (3) are in the same vacuum state.

8. The coating device according to claim 5, characterized in that, It further includes a vacuum device connected to the etching chamber (1) and / or the coating chamber (3). The vacuum device is used to form a vacuum in at least one of the etching chamber (1) and the coating chamber (3).

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