Combined transmission device for heat exchange of semiconductor equipment

Abstract

The utility model discloses a combined transmission device for heat exchange of semiconductor equipment, which is applied to the field of transmission devices and comprises a heat absorption module, a heat insulation module is mounted at one end of the heat absorption module, and a heat release module is mounted at one end of the heat insulation module. According to the utility model, the heat absorption module, the heat insulation module and the heat release module are arranged, so that a medium absorbs heat and releases heat through a refrigerant in the device, heat can be transmitted in a controllable direction, and the effect of cooling or heating a specific space is achieved; by arranging the filter screen capable of filtering the medium, impurities in the medium can be filtered out in the medium conveying process of the device, so that the purity of the medium is improved, the filter screen can be detached, cleaned, replaced and maintained due to threaded connection of the connecting base and the connecting pipeline, and operation is easy, convenient and fast.

Description

Technical Field

[0001] The utility model relates to the field of transmission devices, and particularly relates to a combined transmission device for heat exchange of semiconductor equipment. Background Art

[0002] The combined transmission device for heat exchange of semiconductor equipment is a transmission device for refrigerant in a heat exchange pipeline system; when the traditional combined transmission device for heat exchange of semiconductor equipment is used, it can only meet the directional transportation of the medium, which is not conducive to cooling or heating during the transportation of the medium.

[0003] In order to solve the above problems, we propose a combined transmission device for heat exchange of semiconductor equipment. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a combined transmission device for heat exchange of semiconductor equipment, and its advantage is that it can cool or heat a specific space.

[0005] The above technical purpose of the utility model is achieved through the following technical solutions: a combined transmission device for heat exchange of semiconductor equipment, including an endothermic module, an insulating module is installed at one end of the endothermic module, and an exothermic module is installed at one end of the insulating module;

[0006] The endothermic module includes a first flange connector, a first insulating elbow is fixedly connected to the first flange connector, and an endothermic pipe is fixedly connected to one end of the first insulating elbow;

[0007] The first insulating elbow is a right-angle elbow made of non-metallic material, which can effectively isolate the heat transfer at both ends to protect the front-end pipeline;

[0008] The endothermic pipe is made of metal material to increase the temperature of the refrigerant. When necessary, an external heating device can act on the endothermic pipe;

[0009] The insulating module includes an insulating member, and insulating connectors are provided at both ends of the insulating member;

[0010] The insulating member is used for the transmission of the heated refrigerant to extend the functional part of this combined device;

[0011] The exothermic module includes a second insulating pipe, a second insulating elbow is fixedly connected to one end of the second insulating pipe, a heat release pipe is fixedly connected to the end of the second insulating elbow away from the second insulating pipe, and a second flange connector is fixedly connected to the end of the heat release pipe away from the heat release pipe;

[0012] The second insulating pipe is a straight pipe made of non-metallic material and is used for heat preservation transmission of the heated refrigerant;

[0013] The second heat-insulating elbow uses a right-angle elbow made of non-metallic material, which can effectively isolate the heat transfer at both ends to prevent the heat of the refrigerant from escaping after heating up;

[0014] The heat-releasing pipeline is made of metal material and is used to release the heat carried by the refrigerant after heating up;

[0015] The second flange connector is used to cooperate with the same-specification flange and serves as an interface for this combined device and other devices to form a system with each other, facilitating the output of the refrigerant;

[0016] The heat-insulating part includes the first heat-insulating pipeline. Both ends of the first heat-insulating pipeline are fixedly connected with connecting pipelines. Filters are arranged inside both connecting pipelines. The surface of the connecting pipeline is threadedly connected with a connecting seat, and one end of the connecting seat away from the connecting pipeline is communicated with the heat-insulating connector.

[0017] Adopting the above technical solution, by setting the heat-absorbing module, heat-insulating module and heat-releasing module, through the heat absorption and heat release of the refrigerant in this device, the controllable transmission of the heat direction can be realized, playing the role of cooling or heating a specific space; by setting the heat-insulating part, the filtration of the transmission medium can be realized, reducing the influence caused by the transmission impurities.

[0018] The present utility model is further arranged as: the orientations of the two filters are the same.

[0019] Adopting the above technical solution, through the setting that the orientations of the two filters are the same, it is ensured that the medium entering this device through the heat-releasing module can flow smoothly and the impurities in the medium are filtered out.

[0020] The present utility model is further arranged as: a fixed sleeve is fixedly sleeved on the surface of the filter, and one side of the fixed sleeve close to the filter is in contact with the connecting seat.

[0021] Adopting the above technical solution, through the setting of the fixed sleeve, it plays a role in fixedly supporting the filter.

[0022] The present utility model is further arranged as: two limiting blocks are fixedly connected inside the connecting pipeline, and one side of the fixed sleeve close to the limiting block is in contact with the limiting block.

[0023] Adopting the above technical solution, through the setting of the limiting block, it plays a role in limiting the fixed sleeve, ensuring that the fixed sleeve can be effectively limited and fixed between the connecting seat and the connecting pipeline.

[0024] The present utility model is further arranged as: the heat-insulating part is specifically a telescopic non-metallic corrugated pipe.

[0025] With the above technical solution, by providing a heat insulation member, specifically a telescopic non-metallic corrugated pipe, the transmission path can be extended or shortened within a certain range according to installation needs, improving the flexibility of the functional part of this combined device.

[0026] In summary, the present utility model has the following beneficial effects:

[0027] 1. By providing a heat absorption module, a heat insulation module, and a heat release module, the present utility model can achieve controllable heat transfer in terms of heat direction through the heat absorption and heat release of the refrigerant in the device, playing a role in cooling or heating a specific space;

[0028] 2. By providing a filter screen that can filter the medium, impurities in the medium can be filtered out during the transmission of the medium in the device, thereby improving the purity of the medium. In addition, the threaded connection between the connecting seat and the connecting pipe enables the filter screen to be disassembled, cleaned, replaced, and maintained, with simple and convenient operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a three-dimensional view of the structure of the present utility model;

[0030] Figure 2 is a schematic view of the heat absorption module of the structure of the present utility model;

[0031] Figure 3 is a schematic view of the heat insulation module of the structure of the present utility model;

[0032] Figure 4 is a cross-sectional view of the heat insulation member of the structure of the present utility model;

[0033] Figure 5 is the present utility model Figure 4 partial structural schematic diagram at position A;

[0034] Figure 6 is a schematic view of the heat release module of the structure of the present utility model.

[0035] Reference numerals: 1, heat absorption module; 101, first flange connection head; 102, first heat insulation elbow; 103, heat absorption pipe;

[0036] 2, heat insulation module; 21, heat insulation member; 2101, first heat insulation pipe; 2102, connecting pipe; 2103, filter screen; 2104, connecting seat; 22, heat insulation connection head;

[0037] 3, heat release module; 301, second heat insulation pipe; 302, second heat insulation elbow; 303, heat release pipe; 304, second flange connection head;

[0038] 4, fixed sleeve; 5, limit block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0039] The following further elaborates on the present utility model in conjunction with the accompanying drawings.

[0040] Embodiment 1:

[0041] Reference Figures 1-6 , a combined transmission device for heat exchange in semiconductor equipment, includes a heat absorption module 1. One end of the heat absorption module 1 is installed with a heat insulation module 2, and one end of the heat insulation module 2 is installed with a heat release module 3;

[0042] The heat absorption module 1 includes a first flange connection head 101. A heat insulation elbow 102 is fixedly connected to the first flange connection head 101, and one end of the heat insulation elbow 102 is fixedly connected to a heat absorption pipe 103;

[0043] The heat insulation elbow 102 is a right-angle elbow made of non-metallic material, which can effectively isolate the heat transfer at both ends to protect the front-end pipe;

[0044] The heat absorption pipe 103 is made of metal material to increase the temperature of the refrigerant. When necessary, an external heating device can act on the heat absorption pipe 103;

[0045] The heat insulation module 2 includes a heat insulation part 21, and heat insulation connection heads 22 are provided at both ends of the heat insulation part 21;

[0046] The heat insulation part 21 is used for the transmission of the heated refrigerant to extend the functional part of this combined device;

[0047] The heat release module 3 includes a second heat insulation pipe 301. One end of the second heat insulation pipe 301 is fixedly connected to a second heat insulation elbow 302. The end of the second heat insulation elbow 302 away from the second heat insulation pipe 301 is fixedly connected to a heat release pipe 303, and the end of the heat release pipe 303 away from the heat release pipe 303 is fixedly connected to a second flange connection head 304;

[0048] The second heat insulation pipe 301 is a straight pipe made of non-metallic material for thermally insulating the transmission of the heated refrigerant;

[0049] The second heat insulation elbow 302 is a right-angle elbow made of non-metallic material, which can effectively isolate the heat transfer at both ends to prevent the heat of the heated refrigerant from escaping;

[0050] The heat release pipe 303 is made of metal material to release the heat carried by the heated refrigerant;

[0051] The second flange connection head 304 is used to cooperate with a flange of the same specification as an interface for this combined device to form a system with other devices to facilitate the output of the refrigerant;

[0052] The heat insulation member 21 includes a first heat insulation pipeline 2101. Both ends of the first heat insulation pipeline 2101 are fixedly connected with connecting pipelines 2102. Filter meshes 2103 are arranged inside both of the two connecting pipelines 2102. A connecting seat 2104 is threadedly connected to the surface of the connecting pipeline 2102. One end of the connecting seat 2104 away from the connecting pipeline 2102 communicates with the heat insulation connector 22. By providing the heat absorption module 1, the heat insulation module 2 and the heat release module 3, the medium can achieve a controllable heat transfer direction through the heat absorption and heat release of the refrigerant in the device, playing a role in cooling or heating a specific space. By providing the filter mesh 2103 that can filter the medium, impurities in the medium can be filtered out during the transmission of the medium in the device, thereby improving the purity of the medium. Moreover, the threaded connection between the connecting seat 2104 and the connecting pipeline 2102 enables the filter mesh 2103 to be disassembled, cleaned, replaced and maintained, and the operation is simple and convenient.

[0053] Furthermore, the orientations of the two filter meshes 2103 are the same. By setting the same orientations of the two filter meshes 2103, it is ensured that the medium entering the device through the heat release module 3 can flow smoothly and the impurities in the medium can be filtered out.

[0054] Furthermore, a fixing sleeve 4 is fixedly sleeved on the surface of the filter mesh 2103. One side of the fixing sleeve 4 close to the filter mesh 2103 contacts the connecting seat 2104. By providing the fixing sleeve 4, it plays a role in fixedly supporting the filter mesh 2103.

[0055] Furthermore, two limiting blocks 5 are fixedly connected inside the connecting pipeline 2102. One side of the fixing sleeve 4 close to the limiting block 5 contacts the limiting block 5. By providing the limiting blocks 5, it plays a role in limiting the fixing sleeve 4, ensuring that the fixing sleeve 4 can be effectively limited and fixed between the connecting seat 2104 and the connecting pipeline 2102.

[0056] Furthermore, the heat insulation member 21 is specifically a telescopic non-metallic corrugated pipe. By setting the heat insulation member 21 as a telescopic non-metallic corrugated pipe, the transmission distance can be extended or shortened within a certain range according to the installation needs, improving the flexibility of the functional part of this combined device.

[0057] Brief description of the usage process: During use, first check whether all components of this combined transmission device are in good condition, whether the connections are well-sealed without leakage hazards, and whether the internal conveying pipeline channels are unobstructed.

[0058] After confirming that the combined transmission device functions properly, connect the first flange connector 101 and the second flange connector 304 to the input and output ends of the refrigerant respectively, and turn on the pump body and valves of the heat exchange circulation system to achieve the normal operation of the heat exchange circulation system. The medium enters the heat insulation part 21 through the heat release module 3, and the two filters 2103 inside the two connecting pipes 2102 of the heat insulation part 21 will filter the impurities in the medium twice, thereby purifying the purity of the medium and improving the quality of the medium;

[0059] Through the heat absorption and heat release of the refrigerant in this combined transmission device, the controllable transmission of the heat direction can be realized, which plays a role in cooling or heating a specific space;

[0060] In addition to being used for the transmission of the refrigerant in the heat exchange pipeline system, this combined transmission device can also be used for the transmission of various fluids such as other gases or liquids;

[0061] When this combined transmission device is connected to the pipeline system, different interfaces can be adopted according to actual needs, such as flange connection, threaded connection, quick connection, welding, flexible connection, etc.

[0062] This specific embodiment is only an explanation of the present invention, and it is not a limitation of the present invention. After reading this specification, those skilled in the art can make modifications to this embodiment without creative contributions according to needs, but as long as it is within the scope of the claims of the present invention, it is protected by the patent law.

Claims

1. A combined transfer device for heat exchange of semiconductor devices, comprising a heat absorption module (1), characterized in that: One end of the heat absorption module (1) is equipped with a heat insulation module (2), and one end of the heat insulation module (2) is equipped with a heat release module (3); The heat absorption module (1) includes a first flange connector (101), the first flange connector (101) is fixedly connected with a first heat insulation elbow (102), and one end of the first heat insulation elbow (102) is fixedly connected with a heat absorption pipeline (103); The heat insulation module (2) includes a heat insulation part (21), and heat insulation connectors (22) are provided at both ends of the heat insulation part (21); The heat release module (3) includes a second heat insulation pipeline (301), one end of the second heat insulation pipeline (301) is fixedly connected with a second heat insulation elbow (302), the end of the second heat insulation elbow (302) far from the second heat insulation pipeline (301) is fixedly connected with a heat release pipeline (303), and the end of the heat release pipeline (303) far from the heat release pipeline (303) is fixedly connected with a second flange connector (304); The heat insulation part (21) includes a first heat insulation pipeline (2101), connecting pipelines (2102) are fixedly connected to both ends of the first heat insulation pipeline (2101), filter screens (2103) are arranged inside both of the connecting pipelines (2102), a connecting seat (2104) is threadedly connected to the surface of the connecting pipeline (2102), and one end of the connecting seat (2104) far from the connecting pipeline (2102) communicates with the heat insulation connector (22).

2. The combined transmission device for heat exchange of a semiconductor device according to claim 1, characterized in that: The orientations of the two filter screens (2103) are the same.

3. A combined transmission device for heat exchange of a semiconductor device according to claim 1, characterized in that: A fixing sleeve (4) is fixedly sleeved on the surface of the filter screen (2103), and one side of the fixing sleeve (4) close to the filter screen (2103) contacts the connecting seat (2104).

4. The combined transfer device for heat exchange of a semiconductor device according to claim 3, wherein: Two limiting blocks (5) are fixedly connected to the inside of the connecting pipeline (2102), and one side of the fixing sleeve (4) close to the limiting block (5) contacts the limiting block (5).

5. A combined transfer device for heat exchange of a semiconductor device according to claim 1, characterized in that: The heat insulation part (21) is specifically a telescopic non-metallic corrugated pipe.

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