Nanometer aluminum oxide sintering furnace for electronic substrate

Abstract

The utility model relates to the field of heating equipment, in particular to a nanometer aluminum oxide sintering furnace for an electronic substrate, which comprises a furnace body, a heating cabin and a cooling cabin are arranged in the furnace body, the cooling cabin is connected with a vacuum pump, an airtight door is arranged at one end of the furnace body close to the cooling cabin, an electric heating tube is arranged on the side wall of the heating cabin, and a heat insulation door is vertically and rotatably arranged in the middle of the furnace body. The upper end and the lower end of the heat insulation door are each provided with a connecting pipe rotationally connected with the furnace body, the heat insulation door is provided with a containing plate, the upper end and the lower end of the cooling bin are each provided with a lifting mechanism, the lifting mechanisms are connected with heat exchangers, the heat exchangers are connected with medium conveying pipes extending out of the furnace body, and the medium conveying pipes are connected with a cooling liquid supply mechanism. The cooling device has the advantage that the cooling speed of the nanometer aluminum oxide ceramic is high.

Description

Technical Field

[0001] The utility model relates to the field of heating equipment, in particular to a nano-aluminum oxide sintering furnace for electronic substrates. Background Art

[0002] An electronic substrate is the basic material for manufacturing a PCB. Hole processing, electroless copper plating, electroplating copper, etching, etc. are selectively performed on the electronic substrate to obtain the required circuit pattern. According to different raw materials, electronic substrates can be divided into ceramic substrates and metal substrates. Among them, ceramic substrates usually refer to those using nano-aluminum oxide ceramics as the main component, which have good thermal conductivity, high frequency performance, and high temperature stability. During the production of electronic substrates, nano-aluminum oxide needs to be sintered, and the equipment used is a sintering furnace. After sintering, it is necessary to rapidly cool inside the sintering furnace so that the nano-aluminum oxide can be rapidly cooled to the furnace outlet temperature without being oxidized. However, the existing sintering furnaces have a slow cooling rate. Therefore, it is particularly necessary to develop a nano-aluminum oxide sintering furnace for electronic substrates that can improve the cooling rate. Summary of the Invention

[0003] The purpose of the utility model is to provide a nano-aluminum oxide sintering furnace for electronic substrates, which has the advantage of being able to improve the cooling rate.

[0004] The adopted technical solution is as follows:

[0005] A nano-aluminum oxide sintering furnace for electronic substrates includes a furnace body. Inside the furnace body, there are a heating chamber and a cooling chamber. The cooling chamber is connected to a vacuum pump. One end of the furnace body close to the cooling chamber is provided with an airtight door. The side wall of the heating chamber is provided with electric heating tubes. A partition door is vertically rotatably arranged in the middle of the furnace body. Both the upper and lower ends of the partition door are provided with connecting pipes rotatably connected to the furnace body. The partition door is provided with a placement plate. Lifting mechanisms are arranged at both the upper and lower ends of the cooling chamber. The lifting mechanisms are both connected to heat exchangers. The heat exchangers are both connected to medium conveying pipes extending outside the furnace body. The medium conveying pipes are connected to a coolant supply mechanism.

[0006] Preferably, the placement plate is connected with a plurality of horizontal shafts. The horizontal shafts are slidably connected to the partition door. The placement plate is connected with a rack parallel to the horizontal shafts. A transmission shaft is coaxially rotatably arranged inside the driving tube. A first driving motor connected to the transmission shaft is arranged outside the furnace body. A gear is connected to the end of the transmission shaft. The gear meshes with the rack.

[0007] Preferably, the furnace body is provided with a second driving motor connected to one of the driving tubes.

[0008] Preferably, the lifting mechanism is a scissor lift.

[0009] Preferably, the medium conveying pipe is a steel wire braided hose.

[0010] Preferably, a temperature sensor is arranged in the cooling chamber.

[0011] Compared with the prior art, the beneficial effects are as follows:

[0012] In the utility model, the nano-aluminum oxide to be heated is placed on the placement plate, the partition door is rotated to rotate the placement plate into the heating chamber, and then the furnace body is evacuated to a vacuum state by using a vacuum pump. After heating is completed, the partition door is rotated 180 degrees to rotate the placement plate to the cooling chamber, and then two heat exchangers are controlled to approach the placement plate, and the nano-aluminum oxide ceramic is rapidly cooled by using the heat exchangers. The distance between the heat exchanger and the nano-aluminum oxide part can be adjusted, so as to change the distance according to the sizes of different parts, thereby improving the cooling speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 FIG. is a schematic structural diagram of a nano-aluminum oxide sintering furnace for an electronic substrate according to the utility model.

[0014] Figure 2 is Figure 1 a schematic structural diagram of part A in

[0015] Figure 3 is Figure 1 a schematic structural diagram of part B in

[0016] In the figure: 1, furnace body; 2, heating chamber; 3, cooling chamber; 4, vacuum pump; 5, airtight door; 6, electric heating tube; 7, partition door; 8, connecting pipe; 9, second driving motor; 10, placement plate; 11, horizontal shaft; 12, rack; 13, transmission shaft; 14, first driving motor; 15, gear; 16, lifting mechanism; 17, heat exchanger; 18, medium delivery pipe; 19, coolant supply mechanism; 20, temperature sensor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] The following further describes the utility model with reference to specific embodiments, as Figures 1 to 3 shown:

[0018] Embodiment 1: A nano-aluminum oxide sintering furnace for an electronic substrate, comprising a furnace body 1. A heating chamber 2 and a cooling chamber 3 are arranged in the furnace body 1. The cooling chamber 3 is connected with a vacuum pump 4. An airtight door 5 is arranged at one end of the furnace body 1 close to the cooling chamber 3. When the airtight door 5 is closed, the vacuum pump 4 evacuates the inside of the furnace body 1 to a vacuum environment. Electric heating tubes 6 are arranged on the side wall of the heating chamber 2, and the electric heating tubes 6 heat the raw materials in the heating chamber 2.

[0019] In the middle of the furnace body 1, a heat-insulating door 7 is vertically rotatably arranged. At both the upper and lower ends of the heat-insulating door 7, there are connecting pipes 8 rotatably connected to the furnace body 1. The heat-insulating door 7 is provided with a placement plate 10, which is horizontally arranged for placing nano-aluminum oxide ceramics. At both the upper and lower ends of the cooling chamber 3, there are lifting mechanisms 16. The lifting mechanisms 16 are both connected to heat exchangers 17, and the heat exchangers 17 are both connected to medium conveying pipes 18 extending outside the furnace body 1. The medium conveying pipes 18 are connected to a coolant supply mechanism 19. The lifting mechanisms 16 control the corresponding heat exchangers 17 to lift, so as to adjust the distance between the heat exchangers 17 and the nano-aluminum oxide ceramics.

[0020] Place the nano-aluminum oxide to be heated on the placement plate 10, rotate the heat-insulating door 7 to rotate the placement plate 10 into the heating chamber 2, and then use the vacuum pump 4 to evacuate the inside of the furnace body 1 to a vacuum state. After heating is completed, rotate the heat-insulating door 7 by 180 degrees to rotate the placement plate 10 to the cooling chamber 3, and then control the two heat exchangers 17 to approach the placement plate 10, and use the heat exchangers 17 to quickly cool the nano-aluminum oxide ceramics.

[0021] Embodiment 2: A nano-aluminum oxide sintering furnace for electronic substrates, including a furnace body 1. Inside the furnace body 1, there are a heating chamber 2 and a cooling chamber 3. The cooling chamber 3 is connected to a vacuum pump 4. One end of the furnace body 1 close to the cooling chamber 3 is provided with an airtight door 5. When the airtight door 5 is closed, the vacuum pump 4 evacuates the inside of the furnace body 1 to a vacuum environment. The side wall of the heating chamber 2 is provided with electric heating tubes 6, and the electric heating tubes 6 heat the raw materials inside the heating chamber 2.

[0022] In the middle of the furnace body 1, a heat-insulating door 7 is vertically rotatably arranged. At both the upper and lower ends of the heat-insulating door 7, there are connecting pipes 8 rotatably connected to the furnace body 1. The furnace body 1 is provided with a second driving motor 9 connected to one of the driving pipes, and the second driving motor 9 is arranged at the upper end of the furnace body 1.

[0023] The heat-insulating door 7 is provided with a placement plate 10, which is horizontally arranged for placing nano-aluminum oxide ceramics. The placement plate 10 is connected to a plurality of horizontal shafts 11, and the horizontal shafts 11 are slidably connected to the heat-insulating door 7. The placement plate 10 is connected to a rack 12 parallel to the horizontal shafts 11. A transmission shaft 13 is coaxially and rotatably arranged inside the driving pipe. Outside the furnace body 1, there is a first driving motor 14 connected to the transmission shaft 13. The end of the transmission shaft 13 is connected to a gear 15, and the gear 15 meshes with the rack 12. The first driving motor 14 is arranged at the lower end of the furnace body 1. The transmission shaft 13 controls the placement plate 10 to move horizontally through the meshing of the gear 15 and the rack 12, so as to adjust the position of the nano-aluminum oxide ceramics inside the heating chamber 2 and make the nano-aluminum oxide ceramics heat evenly.

[0024] Lifting mechanisms 16 are provided at both the upper and lower ends of the cooling chamber 3. The lifting mechanisms 16 are scissor lifts. The lifting mechanisms 16 are each connected to a heat exchanger 17. The heat exchangers 17 are each connected to a medium delivery pipe 18 that extends outside the furnace body 1. The medium delivery pipe 18 is a steel wire braided hose. The medium delivery pipe 18 is connected to a coolant supply mechanism 19. The lifting mechanisms 16 control the corresponding heat exchangers 17 to move up and down, thereby adjusting the distance between the heat exchangers 17 and the nano-aluminum oxide ceramics. A temperature sensor 20 is provided in the cooling chamber 3, and the temperature sensor 20 monitors the temperature in the cooling chamber 3.

[0025] The specific working process is as follows: Place the nano-aluminum oxide to be heated on the placement plate 10. Rotate the heat-insulating door 7 to rotate the placement plate 10 into the heating chamber 2. Control the first drive motor 14 to control the placement plate 10 to slide horizontally, so that the nano-aluminum oxide ceramics are heated evenly. Subsequently, use a vacuum pump 4 to evacuate the inside of the furnace body 1 to a vacuum state. After heating is completed, control the placement plate 10 to move to a position close to the heat-insulating door 7, rotate the heat-insulating door 7 by 180 degrees, and rotate the placement plate 10 to the cooling chamber 3. Subsequently, control the two heat exchangers 17 to approach the placement plate 10, and use the heat exchangers 17 to quickly cool the nano-aluminum oxide ceramics.

[0026] The above embodiments are only the preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention fall within the scope of protection required by the present invention.

Claims

1. A nano-aluminum oxide sintering furnace for an electronic substrate, characterized in that: It includes a furnace body, where a heating chamber and a cooling chamber are arranged inside the furnace body. The cooling chamber is connected to a vacuum pump. An airtight door is arranged at one end of the furnace body close to the cooling chamber. Electric heating tubes are arranged on the side wall of the heating chamber. A heat insulation door is vertically rotatably arranged in the middle of the furnace body. Connecting pipes rotatably connected to the furnace body are arranged at both the upper and lower ends of the heat insulation door. A placement plate is arranged on the heat insulation door. Lifting mechanisms are arranged at both the upper and lower ends of the cooling chamber. The lifting mechanisms are both connected to heat exchangers. The heat exchangers are both connected to a medium conveying pipe extending outside the furnace body. The medium conveying pipe is connected to a coolant supply mechanism.

2. The nano-aluminum oxide sintering furnace for an electronic substrate according to claim 1, characterized in that: The placement plate is connected to a plurality of horizontal shafts, and the horizontal shafts are slidably connected to the heat insulation door. The placement plate is connected to a rack parallel to the horizontal shafts. A transmission shaft is coaxially rotatably arranged inside the drive pipe. A first drive motor connected to the transmission shaft is arranged outside the furnace body. A gear is connected to the end of the transmission shaft, and the gear meshes with the rack.

3. The nano-aluminum oxide sintering furnace for electronic substrates according to claim 1, wherein: The furnace body is provided with a second drive motor connected to one of the drive pipes.

4. A nano-aluminum oxide sintering furnace for an electronic substrate according to claim 1, characterized in that: The lifting mechanism is a scissor lift.

5. The nano-aluminum oxide sintering furnace for an electronic substrate according to claim 1, wherein: The medium conveying pipe is a steel wire braided hose.

6. The nano-aluminum oxide sintering furnace for an electronic substrate according to claim 1, wherein: A temperature sensor is arranged inside the cooling chamber.

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