Inertial navigation module, image acquisition equipment and movable platform

Abstract

The utility model provides an inertial navigation module, image acquisition equipment and a movable platform, the inertial navigation module comprises an inertial measurement unit, a circuit board, a buffer layer and an inertial navigation module shell, the inertial measurement unit is arranged on the circuit board, a mounting groove is formed in the inertial navigation module shell, and the circuit board is bonded in the mounting groove through the buffer layer; the inertial navigation module shell is also provided with a first connecting part; the first connecting part is used for connecting a shell of image acquisition equipment. According to the application, the influence of stress on the inertial measurement unit when the inertial navigation module is connected with the shell of the image acquisition equipment can be reduced; besides, the influence of vibration generated by the external environment on the inertial measurement unit in the use process of the image acquisition equipment can be reduced, the service life of the inertial measurement unit is prolonged, and the measurement precision of the inertial measurement unit is ensured.

Description

Technical Field

[0001] This application relates to camera assembly technology, and particularly to an inertial navigation module, an image acquisition device, and a movable platform. Background Art

[0002] An inertial measurement unit, also known as an IMU (Inertial Measurement Unit) sensor, is an electronic device integrating multiple sensors (mainly including an accelerometer, a gyroscope, and a magnetometer), and is used to measure and report three basic linear motions (acceleration) and three basic angular motions (angular velocity) of an object. The inertial measurement unit plays an irreplaceable role in vehicle-mounted cameras. By providing accurate motion state information and anti-shake functions, it not only improves the shooting quality and user experience, but also enhances the perception accuracy and safety of the autonomous driving system.

[0003] In the solutions of related technologies, the inertial measurement unit is installed on a circuit board, and the circuit board is fixed to the housing of the image acquisition device through fasteners such as screws. When the fasteners fix the circuit board, the stress generated will be transmitted to the inertial measurement unit, thus affecting the measurement accuracy of the inertial measurement unit. In addition, during the use of the image acquisition device, the vibration generated by the external environment will also be transmitted to the inertial measurement unit through the housing of the image acquisition device, thus causing damage to the inertial measurement unit. Summary of the Utility Model

[0004] In order to overcome the above defects in related technologies, the purpose of this application is to provide an inertial navigation module, an image acquisition device, and a movable platform. This application can reduce the influence of the stress when the inertial navigation module is connected to the housing of the image acquisition device on the inertial measurement unit; in addition, it can also reduce the influence of the vibration generated by the external environment on the inertial measurement unit during the use of the image acquisition device, which is beneficial to improving the service life of the inertial measurement unit and ensuring the measurement accuracy of the inertial measurement unit.

[0005] On the one hand, this application provides an inertial navigation module, including an inertial measurement unit, a circuit board, a buffer layer, and an inertial navigation module housing. The inertial measurement unit is disposed on the circuit board. An installation groove is formed in the inertial navigation module housing, and the circuit board is bonded to the installation groove through the buffer layer; a first connection portion is further provided on the inertial navigation module housing, and the first connection portion is used to connect to the housing of the image acquisition device.

[0006] In a possible implementation manner, a connection boss is provided on the bottom wall of the installation groove, and the circuit board is bonded to the connection boss through the buffer layer.

[0007] In a possible implementation manner, a plurality of limiting bosses are further provided on the connection boss, and the circuit board abuts against the limiting bosses.

[0008] In a possible implementation, a plurality of limiting ribs are formed on the side wall of the installation groove, and all of the plurality of limiting ribs are abutted against the circuit board, or there is a gap between the plurality of limiting ribs and the circuit board.

[0009] In a possible implementation, a stress relief groove is further provided on the circuit board, and the stress relief groove is arranged close to the inertial measurement unit.

[0010] In a possible implementation, a first connector is further provided on the circuit board, and the first connector is used for communicating and connecting with a second connector on the image acquisition device.

[0011] In a possible implementation, the first connecting portion includes a connecting plate arranged on the inertial navigation module housing, and a positioning post and a fixing hole are provided on the connecting plate.

[0012] On the other hand, the present application provides an image acquisition device, including a housing and the inertial navigation module as described in any one of the above, the housing is provided with a second connecting portion, and the inertial navigation module is connected to the second connecting portion through the first connecting portion on the inertial navigation module housing.

[0013] In a possible implementation, an assembly groove is formed in the housing, the second connecting portion is arranged on the end face of the assembly groove, the inertial navigation module housing is arranged in the assembly groove, and a sealing ring is provided between the inertial navigation module housing and the assembly groove;

[0014] A circuit board of the image acquisition device is arranged in the assembly groove, a second connector is provided on the circuit board of the image acquisition device, and the inertial navigation module is communicatively connected to the second connector through the first connector on the circuit board;

[0015] Alternatively, a circuit board of the image acquisition device is arranged in the housing, and the circuit board is communicatively connected to the circuit board of the image acquisition device through a communication cable.

[0016] On yet another aspect, the present application provides a movable platform, including the image acquisition device as described in any one of the above.

[0017] The present application provides an inertial navigation module, an image acquisition device, and a movable platform. The inertial navigation module includes an inertial measurement unit, a circuit board, a buffer layer, and an inertial navigation module housing. The inertial measurement unit is disposed on the circuit board. An installation groove is formed in the inertial navigation module housing, and the circuit board is adhesively bonded to the installation groove through the buffer layer. The inertial navigation module housing is further provided with a first connection portion for connecting to the housing of the image acquisition device. By providing the inertial navigation module housing in the present application, the circuit board is adhesively bonded to the installation groove of the inertial navigation module housing through the buffer layer. The inertial navigation module housing is connected to the housing of the image acquisition device, and the stress during connection directly acts on the inertial navigation module housing. The buffer layer between the inertial navigation module housing and the circuit board can effectively isolate the stress during connection and reduce the influence on the inertial measurement unit during the connection process. In addition, the buffer layer can also reduce the influence of vibrations generated by the external environment on the inertial measurement unit during the use of the image acquisition device, which is beneficial to improving the service life of the inertial measurement unit and ensuring the measurement accuracy of the inertial measurement unit. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the following will briefly introduce the drawings required for use in the description of the embodiments or the related art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 Structural schematic diagram of the inertial navigation module provided by an embodiment of the present application;

[0020] Figure 2 Exploded view of the inertial navigation module provided by an embodiment of the present application;

[0021] Figure 3 Structural schematic diagram of the inertial navigation module housing provided by an embodiment of the present application;

[0022] Figure 4 Structural schematic diagram of the circuit board from a first perspective provided by an embodiment of the present application;

[0023] Figure 5 Structural schematic diagram of the circuit board from a second perspective provided by an embodiment of the present application;

[0024] Figure 6 Structural schematic diagram of the image acquisition device provided by an embodiment of the present application;

[0025] Figure 7 Exploded view of the image acquisition device provided by an embodiment of the present application;

[0026] Figure 8 Structural schematic diagram of the housing provided by an embodiment of the present application;

[0027] Figure 9 Schematic diagram of the structure of the image acquisition device provided by another embodiment of the present application;

[0028] Figure 10 Schematic diagram of the structure of the image acquisition device provided by still another embodiment of the present application.

[0029] Reference numerals:

[0030] 1 - Image acquisition device;

[0031] 10 - Inertial navigation module;

[0032] 20 - Housing; 21 - Second connection part; 211 - Fastener; 22 - Assembly groove; 23 - Sealing ring; 24 - Second connector; 25 - Communication cable; 26 - Connection part;

[0033] 100 - Inertial measurement unit;

[0034] 200 - Circuit board; 210 - Stress relief groove; 220 - First connector;

[0035] 300 - Inertial navigation module housing; 310 - Installation groove; 311 - Connection boss; 312 - Limiting boss; 313 - Limiting rib; 320 - First connection part; 321 - Connection plate; 322 - Positioning post; 323 - Fixing hole;

[0036] 400 - Buffer layer. Detailed implementation manners

[0037] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, rather than all, of the embodiments of the present application.

[0038] All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application. Without conflict, the following embodiments and the features in the embodiments may be combined with each other.

[0039] As described in the background art, in the solutions of the related art, the inertial measurement unit is disposed on the circuit board of the image acquisition device, and the circuit board of the image acquisition device is generally assembled with the housing of the image acquisition device directly through fasteners such as screws. During the process of locking the circuit board to the housing of the image acquisition device by the fasteners, the generated stress will be transmitted to the inertial measurement unit through the circuit board, thereby affecting the measurement accuracy of the inertial measurement unit. In addition, during the use of the image acquisition device, the vibration generated by the external environment will also be transmitted to the inertial measurement unit through the housing of the image acquisition device, thereby causing damage to the inertial measurement unit.

[0040] In view of this, embodiments of the present application aim to provide an inertial navigation module, an image acquisition device and a mobile platform. By providing an inertial navigation module housing, the circuit board is bonded to the installation groove of the inertial navigation module housing through a buffer layer. The inertial navigation module housing is connected to the housing of the image acquisition device. The stress during connection directly acts on the inertial navigation module housing. The buffer layer between the inertial navigation module housing and the circuit board can effectively isolate the stress during connection and reduce the influence on the inertial measurement unit during the connection process. In addition, the buffer layer can also reduce the influence of the vibration generated by the external environment on the inertial measurement unit during the use of the image acquisition device, which is beneficial to improving the service life of the inertial measurement unit and ensuring the measurement accuracy of the inertial measurement unit.

[0041] The content of the embodiments of the present application will be described in detail below with reference to the drawings, so that those skilled in the art can understand the content of the present application in more detail.

[0042] Please refer to Figures 1 - 5 , this embodiment provides an inertial navigation module 10, including an inertial measurement unit 100, a circuit board 200, a buffer layer 400 and an inertial navigation module housing 300. The inertial measurement unit 100 is disposed on the circuit board 200. Exemplarily, the inertial measurement unit 100 can be fixed to the circuit board 200 by surface mount technology. An installation groove 310 is formed in the inertial navigation module housing 300. The shape of the installation groove 310 is adapted to the outer shape of the circuit board 200. The circuit board 200 is bonded to the installation groove 310 through the buffer layer 400. Exemplarily, the buffer layer 400 can be an elastic layer such as a rubber layer or a silicone layer. A first connection portion 320 is further provided on the inertial navigation module housing 300. The first connection portion 320 is used to connect the housing of the image acquisition device. Exemplarily, the first connection portion 320 can be fixedly connected to the housing of the image acquisition device by means of snap connection, screw connection or the like.

[0043] In this embodiment, by providing an inertial navigation module housing 300, the circuit board 200 is adhesively bonded to the installation groove 310 of the inertial navigation module housing 300 through a buffer layer 400. The inertial navigation module housing 300 is connected to the housing of the image acquisition device. The stress during connection directly acts on the inertial navigation module housing 300. The buffer layer 400 between the inertial navigation module housing 300 and the circuit board 200 can effectively isolate the stress during connection and reduce the impact on the inertial measurement unit 100 during the connection process. The inertial navigation module 10 can be used as a separate component through the above structure, and the assembly with the image acquisition device is simpler and faster, and can be flexibly applied to a variety of image acquisition devices.

[0044] The buffer layer 400 of this embodiment can also reduce the impact of vibrations generated by the external environment on the inertial measurement unit 100 during the use of the image acquisition device, which is beneficial to improving the service life of the inertial measurement unit 100 and ensuring the measurement accuracy of the inertial measurement unit 100.

[0045] In this embodiment, by limiting the circuit board 200 in the installation groove 310 as a separate module, it is beneficial to reduce the volume of the circuit board 200, thereby miniaturizing the inertial navigation module 10. After the inertial navigation module 10 is assembled, calibration equipment can be used to calibrate the parameters of the inertial navigation module 10. Since the assembled inertial navigation module 10 has a small volume, the calibration equipment can calibrate more inertial navigation modules 10 at one time, thereby improving the calibration efficiency and being beneficial to the improvement of the production efficiency of the entire image acquisition device.

[0046] Please continue to refer to Figures 1 - 3 , on the bottom wall or bottom plane of the installation groove 310 of this embodiment, there is a connecting boss 311. Exemplarily, as Figure 3 shown, the connecting boss 311 can be arranged around the perimeter of the bottom wall or bottom plane of the installation groove 310, and one side of the connecting boss 311 can be connected to the side wall of the installation groove 310; alternatively, the connecting boss 311 can be arranged in the middle of the bottom wall or bottom plane of the installation groove 310; the specific position of the connecting boss 311 can be selected according to needs. The circuit board 200 is adhesively bonded to the connecting boss 311 through the buffer layer 400; that is to say, the connecting boss 311 of this embodiment provides an installation track for the buffer layer 400. When assembling the inertial navigation module 10, glue can be applied to the connecting boss 311, and then the circuit board 200 is placed on the glue and slightly pressed. After the glue cures, the buffer layer 400 is formed, thereby adhesively bonding the circuit board 200 and the connecting boss 311 into one body. The cured buffer layer 400 can effectively isolate the stress generated during the assembly process of the inertial navigation module 10 and the housing of the image acquisition device and the interference of external vibrations during the use of the image acquisition device.

[0047] Further, a plurality of limiting bosses 312 are also provided on the connecting boss 311, and the circuit board 200 abuts against the limiting bosses 312. Exemplarily, the plurality of limiting bosses 312 can be evenly distributed on the connecting boss 311. For example, in this embodiment, the circuit board 200 is generally square, and the corresponding mounting groove 310 is also generally a square groove. Four limiting bosses 312 can be provided on the connecting boss 311, and the four limiting bosses 312 are respectively located at the four corners of the mounting groove 310. When the inertial navigation module 10 is assembled, the plurality of limiting bosses 312 can be used to abut against the circuit board 200, so as to ensure that a gap with a preset height is formed between the circuit board 200 and the limiting bosses 312, and this gap is the thickness of the buffer layer 400. In the above manner, not only can it be ensured that the thickness of the buffer layer 400 meets the requirements of buffering and vibration reduction, but also it can be ensured that the position of the circuit board 200 meets the requirements for subsequent assembly with the image acquisition device.

[0048] Please continue to refer to Figure 1 and Figure 3 , in this embodiment, a plurality of limiting ribs 313 are formed on the side wall of the mounting groove 310, and the plurality of limiting ribs 313 all abut against the circuit board 200, or there is a small gap between the plurality of limiting ribs 313 and the circuit board 200. Among them, this gap is less than or equal to a preset value, and this preset value can be a relatively small value such as 0.15 mm or 0.1 mm. Exemplarily, the plurality of limiting ribs 313 can all be arranged along the direction perpendicular to the bottom wall of the mounting groove 310, and the number of limiting ribs 313 on each side wall of the mounting groove 310 can be set as required. As Figure 1 shown, when the circuit board 200 is installed in the mounting groove 310, the plurality of limiting ribs 313 protruding from the side wall of the mounting groove 310 all abut against the side wall of the circuit board 200 or there is a small gap between the plurality of limiting ribs 313 and the circuit board 200, so as to form a limit on the circuit board 200, prevent the circuit board 200 from moving, and improve the assembly accuracy of the inertial navigation module 10.

[0049] Please continue to refer to Figure 4 and Figure 5 , a stress relief groove 210 is also provided on the circuit board 200 of this embodiment, and the stress relief groove 210 is arranged close to the inertial measurement unit 100. Exemplarily, the stress relief groove 210 can penetrate through the circuit board 200; the stress relief groove 210 can be located at a position on the circuit board 200 close to the inertial measurement unit 100. By providing the stress relief groove 210, the stress during the assembly of the inertial navigation module 10 and the image acquisition device can be blocked from being transmitted to the inertial measurement unit 100, thereby further reducing the risk of damage to the inertial measurement unit 100.

[0050] In this embodiment, a first connector 220 is further provided on the circuit board 200. The first connector 220 is used for communicating and connecting with a second connector on the image acquisition device. The communication between the inertial navigation module 10 and the image acquisition device is realized by the way of plugging and matching between the first connector 220 and the second connector on the image acquisition device, which is beneficial to improving the assembly efficiency.

[0051] Exemplarily, the inertial measurement unit 100 and the first connector 220 can be arranged on the same side of the circuit board 200. Or, as Figure 4 and Figure 5 shown, the inertial measurement unit 100 and the first connector 220 can be respectively arranged on two sides of the circuit board 200. The specific arrangement positions of the two can be determined according to the installation requirements of the image acquisition device.

[0052] The stress relief groove 210 can be arranged between the inertial measurement unit 100 and the first connector 220, so as to block the stress during the assembly of the inertial navigation module 10 and the image acquisition device.

[0053] Please continue to refer to Figure 1 and Figure 3 , in this embodiment, the first connection portion 320 includes a connection plate 321 provided on the inertial navigation module housing 300. The connection plate 321 is provided with positioning posts 322 and fixing holes 323. The positioning posts 322 are used for positioning when the inertial navigation module 10 and the image acquisition device are assembled, and the fixing holes 323 are used for connecting the inertial navigation module 10 and the image acquisition device integrally, which is convenient for quickly removing and replacing in case of a failure of the inertial navigation module 10.

[0054] In other possible embodiments, the first connection portion 320 can be formed by the inertial navigation module housing 300 (such as the side surface or the top surface of the inertial navigation module housing 300), and the first connection portion 320 can be connected integrally with the image acquisition device by means of welding, bonding, etc.

[0055] Please refer to Figures 1 - 10 , this embodiment further provides an image acquisition device 1, including a housing 20 and the above-mentioned inertial navigation module 10. The housing 20 is provided with a second connection portion 21, and the inertial navigation module 10 is connected to the second connection portion 21 through the first connection portion 320 on the inertial navigation module housing 300.

[0056] In a possible implementation, an assembly groove 22 is formed in the housing 20 of this embodiment. The second connecting portion 21 is disposed on the end surface of the assembly groove 22. The second connecting portion 21 includes a first through hole and a second through hole. The first through hole is inserted and fitted with the positioning post 322 of the first connecting portion 320 to achieve positioning during the assembly of the inertial navigation module 10 and the image acquisition device. The fastener 211 locks the second through hole and the fixing hole 323 of the first connecting portion 320 to achieve the fixed connection between the inertial navigation module 10 and the image acquisition device. In other embodiments, the second connecting portion 21 includes a first blind hole and a second blind hole. The first blind hole is inserted and fitted with the positioning post 322 of the first connecting portion 320 to achieve positioning during the assembly of the inertial navigation module 10 and the image acquisition device. The fastener 211 locks the second blind hole and the fixing hole 323 of the first connecting portion 320 to achieve the fixed connection between the inertial navigation module 10 and the image acquisition device. Through the above structure, the inertial navigation module 10 is detachably connected to the housing 20, which facilitates installation and replacement in case of failure.

[0057] In other possible implementation manners, when the first connecting portion 320 is formed by the inertial navigation module housing 300 (such as the side surface or the top surface of the inertial navigation module housing 300), the first connecting portion 320 can be fixedly connected to an appropriate position of the housing 20 or the end surface of the assembly groove 22 by welding, bonding or other means.

[0058] In this embodiment, the inertial navigation module housing 300 is disposed in the assembly groove 22, and a sealing ring 23 is provided between the inertial navigation module housing 300 and the assembly groove 22. The sealing ring 23 can be a rubber ring for example. By providing the sealing ring 23, the waterproof and dustproof performance of the inertial navigation module 10 can be improved.

[0059] In this embodiment, the specific installation position of the inertial navigation module 10 can be set according to needs.

[0060] Please continue to refer to Figures 6 - 8 , in a possible implementation manner, a circuit board of the image acquisition device 1 is provided in the assembly groove 22 of this embodiment. A second connector 24 is provided on the circuit board of the image acquisition device 1. The first connector 220 and the second connector 24 are board-to-board connectors for example. After the inertial navigation module 10 is installed in the assembly groove 22, the first connector 220 and the second connector 24 are docked, and the inertial navigation module 10 is communicatively connected to the second connector 24 through the first connector 220 on the circuit board 200.

[0061] In a possible implementation manner, the image acquisition device 1 can be a monocular camera or a binocular camera for example. The inertial navigation module 10 is installed on the housing 20 of the monocular camera, or installed on the housing 20 of the left-eye or right-eye camera of the binocular camera.

[0062] In other possible implementation manners, the image acquisition device 1 can be other types of devices such as a radar. For exampleFigure 9 The device shown is a device with a lidar and a trinocular camera. The inertial navigation module 10 is arranged on the housing of the device. A circuit board of the camera or radar is arranged inside the housing of the device. A connector is arranged on the circuit board of the camera or radar, and this connector can be connected to the first connector 220 of the inertial navigation module 10. The installation structure of the housing of the device and the inertial navigation module 10 is similar to that of the above embodiment.

[0063] Please continue to refer to Figure 10 , in another possible implementation, the image acquisition device 1 can be, for example, a binocular camera. At this time, the inertial navigation module 10 can be arranged on the cross beam in the middle of the housing 20. A circuit board of the image acquisition device 1 is arranged inside the housing 20. The circuit board of the image acquisition device 1 is located on one side of the housing 20. A through hole is opened in the area of the housing 20 where the circuit board is arranged. The circuit board 200 is communicatively connected to the circuit board 200 of the image acquisition device 1 through a communication cable 25 passing through the through hole. The communication cable 25 can be, for example, a flexible circuit board or a communication connection cable, etc. Optionally, in order to facilitate the fixing of the communication cable 25, at least one connecting portion 26 can be arranged on the housing 20. The connecting portion 26 can be made of, for example, an insulating material, and the connecting portion 26 can be connected to the communication cable 25 by means of bonding, etc.

[0064] As can be seen from the above description, since the image acquisition device 1 of this embodiment adopts the above inertial navigation module 10, the inertial navigation module 10 can be used as a separate component, and the assembly with the image acquisition device 1 is simpler and faster.

[0065] When the inertial navigation module 10 is connected to the housing 20, the stress directly acts on the housing 300 of the inertial navigation module. The buffer layer 400 between the housing 300 of the inertial navigation module and the circuit board 200 can effectively isolate the stress during connection and reduce the influence on the inertial measurement unit 100 during the connection process.

[0066] During the use of the image acquisition device 1, the buffer layer 400 can also reduce the influence of vibrations generated by the external environment on the inertial measurement unit 100, which is beneficial to improving the service life of the inertial measurement unit 100 and ensuring the measurement accuracy of the inertial measurement unit 100.

[0067] This embodiment also provides a movable platform, including the above image acquisition device.

[0068] Specifically, the movable platform of this embodiment can be, for example, a vehicle, a drone, a robot, etc. Since the above image acquisition device is adopted, it can effectively reduce the influence of vibrations generated during the use of the movable platform on the inertial measurement unit, which is beneficial to improving the service life of the inertial measurement unit and ensuring the measurement accuracy of the inertial measurement unit.

[0069] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present application.

[0070] In the present application, unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected to", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0071] It should be noted that in the description of the present application, the terms "first" and "second" are only used for conveniently describing different components, and should not be understood as indicating or implying a sequential relationship, relative importance, or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features.

[0072] The embodiments or implementation manners in the present application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts among the various embodiments can be referred to each other.

[0073] In the description of the present application, the description with reference to terms such as "one implementation manner", "some implementation manners", "schematic implementation manner", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the implementation manner or example are included in at least one implementation manner or example of the present application. In the present application, the schematic expressions of the above terms do not necessarily refer to the same implementation manner or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more implementation manners or examples.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An inertial navigation module, characterized in that, It includes an inertial measurement unit, a circuit board, a buffer layer, and an inertial navigation module housing. The inertial measurement unit is arranged on the circuit board. An installation groove is formed in the inertial navigation module housing, and the circuit board is bonded in the installation groove through the buffer layer. A first connection part is further provided on the inertial navigation module housing, and the first connection part is used for connecting the housing of an image acquisition device.

2. The inertial navigation module according to claim 1, characterized in that A connection boss is provided on the bottom wall of the installation groove, and the circuit board is bonded to the connection boss through the buffer layer.

3. The inertial navigation module according to claim 2, characterized in that, A plurality of limiting bosses are further provided on the connection boss, and the circuit board abuts against the limiting bosses.

4. The inertial navigation module according to claim 1, wherein A plurality of limiting ribs are formed on the side wall of the installation groove, and all of the plurality of limiting ribs abut against the circuit board, or there are gaps between the plurality of limiting ribs and the circuit board.

5. The inertial navigation module according to claim 1, wherein A stress relief groove is further provided on the circuit board, and the stress relief groove is arranged close to the inertial measurement unit.

6. The inertial navigation module according to claim 1, wherein A first connector is further provided on the circuit board, and the first connector is used for communicating and connecting with a second connector on the image acquisition device.

7. The inertial navigation module according to claim 1, characterized in that The first connection part includes a connection plate arranged on the inertial navigation module housing, and a positioning post and a fixing hole are provided on the connection plate.

8. An image acquisition device, characterized in that, It includes a housing and the inertial navigation module according to any one of claims 1-7. The housing is provided with a second connection part, and the inertial navigation module is connected to the second connection part through the first connection part on the inertial navigation module housing.

9. The image acquisition device according to claim 8, characterized in that, An assembly groove is formed in the housing, the second connection part is arranged on the end face of the assembly groove, the inertial navigation module housing is arranged in the assembly groove, and a sealing ring is provided between the inertial navigation module housing and the assembly groove; The circuit board of the image acquisition device is arranged in the assembly groove. A second connector is provided on the circuit board of the image acquisition device, and the inertial navigation module communicates and connects with the second connector through the first connector on the circuit board; Alternatively, the circuit board of the image acquisition device is arranged in the housing, and the circuit board communicates and connects with the circuit board of the image acquisition device through a communication cable.

10. A movable platform, characterized in that, It includes the image acquisition device according to any one of claims 8-9.

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