Packaging structure of temperature and pressure sensor

Through the design of thermally conductive protective pipe body and insulated injection molded parts, the long response time of the temperature and pressure sensor and thermistor failure are solved, rapid response and structural sealing are achieved, and the overall performance of the sensor is improved.

CN223077687UActive Publication Date: 2025-07-08ZHEJIANG YILI AUTO MOBILE AIR CONDITION CO LTD
View PDF 0 Cites 1 Cited by

Patent Information

Application Number
CN202422209669.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-10
Publication Date
2025-07-08
Estimated Expiration
2034-09-10

AI Technical Summary

Technical Problem

The temperature response time of existing temperature pressure sensors is too long and the NTC exposed temperature pressure sensors are at risk of thermistor failure.

Method used

The thermally conductive protective pipe is used to cover the NTC thermistor, and the structure is compact and insulated protection are achieved through the insulated injection molded parts inner body and sealing ring to avoid refrigerant corrosion, ensure fast response time and avoid thermistor failure.

Benefits of technology

实现了温压传感器的快速响应时间(T90≤5S)和提高了结构的密封性,避免了热敏电阻的失效,提升了传感器的综合性能。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223077687U_ABST
    Figure CN223077687U_ABST
Patent Text Reader

Abstract

The utility model discloses a packaging structure of a temperature and pressure sensor, which comprises an electric appliance connector connected with a circuit board, a pressure sensing component and an NTC (Negative Temperature Coefficient) thermistor, the circuit board and the pressure sensing component are positioned in a shell of the temperature and pressure sensor, and the electric appliance connector and the NTC thermistor are positioned outside the shell; a built-in body is arranged in a shell of the temperature and pressure sensor, the pressure sensing component is embedded in a groove body of the built-in body, the NTC thermistor is fixedly installed relative to the built-in body, and the NTC thermistor is covered with a heat conduction protection pipe body. Structural assembly compactness of parts of the sensor is achieved through the built-in body, the insulation protection function is achieved, the NTC thermistor is covered with the heat conduction protection pipe body to achieve refrigerant corrosion prevention, it is guaranteed that the response time is short, and the thermistor can be prevented from losing efficacy.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model belongs to the technical field of temperature and pressure sensors, and particularly relates to a packaging structure of a temperature and pressure sensor. Background Technique

[0002] A temperature and pressure sensor is a sensor that can measure temperature and pressure simultaneously. It can provide two important physical parameters, namely temperature and pressure, which are very important for many industrial, scientific research, and environmental monitoring applications. Currently, some temperature and pressure sensors have too long temperature response times to meet market demands, and although NTC exposed temperature and pressure sensors can solve the response time problem, there is a risk of failure of the thermistor at the same time. Summary of the Invention

[0003] Purpose of the Invention: In order to overcome the deficiencies in the prior art, the utility model provides a packaging structure of a temperature and pressure sensor, which uses a heat-conducting protective tube to cover the NTC thermistor to prevent corrosion by refrigerant, ensuring a fast response time and avoiding failure of the thermistor.

[0004] Technical Solution: To achieve the above purpose, a packaging structure of a temperature and pressure sensor of the utility model includes an electrical connector connected to a circuit board, a pressure sensing component, and an NTC thermistor. The circuit board and the pressure sensing component are located inside the housing of the temperature and pressure sensor, and the electrical connector and the NTC thermistor are located outside the housing;

[0005] An inner package is arranged inside the housing of the temperature and pressure sensor. The pressure sensing component is embedded in a groove of the inner package. The NTC thermistor is fixedly installed relative to the inner package, and a heat-conducting protective tube is provided outside the NTC thermistor.

[0006] Further, the inner package is an insulating injection molded part.

[0007] Further, connection pins are installed through the inner package, and both the NTC thermistor and the pressure sensing component are connected to the circuit board through the connection pins.

[0008] Further, the connection pins are pin resistors.

[0009] Further, the heat-conducting protective tube is a metal tube with a heat-conducting adhesive layer coated on its surface.

[0010] Further, the electrical connector and the housing are connected by a riveting structure.

[0011] Further, sealing rings for structural sealing are provided at the three splicing joints between the pressure sensing component and the inner package, between the inner package and the housing, and between the inner package and the heat-conducting protective tube.

[0012] Further, the pressure-sensitive component is a ceramic capacitor.

[0013] Beneficial effects: The utility model realizes the structural assembly compactness of the sensor components through the inner body and plays an insulating and protective role, and covers the NTC thermistor with a heat-conducting protective tube body to prevent corrosion by the refrigerant, ensuring a fast response time and avoiding the failure of the thermistor. Within 5S of the T90 temperature response time, the comprehensive performance of the temperature and pressure sensor is significantly improved, and it has a wide range of applicable fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic structural diagram of the temperature and pressure sensor of the utility model;

[0015] Figure 2 is a schematic structural diagram of the pressure-sensitive component, the inner body, the connecting pin, and the NTC thermistor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The following further describes the utility model with reference to the drawings.

[0017] As Figure 1 and Figure 2 shown, a packaging structure of a temperature and pressure sensor includes an electrical connector 3 connected to a circuit board 4, a pressure-sensitive component 2, and an NTC thermistor 5. The circuit board 4 and the pressure-sensitive component 2 are located inside the housing 1 of the temperature and pressure sensor, and the electrical connector 3 and the NTC thermistor 5 are located outside the housing 1. An inner body 6 is arranged inside the housing 1 of the temperature and pressure sensor. The pressure-sensitive component 2 is embedded in the groove body of the inner body 6. The NTC thermistor 5 is fixedly installed relative to the inner body 6, and a heat-conducting protective tube body 8 is covered outside the NTC thermistor 5. More specifically, the inner body 6 is an insulating injection molding part. The utility model realizes the structural assembly compactness of the sensor components through the inner body 6 and plays an insulating and protective role, and covers the NTC thermistor 5 with the heat-conducting protective tube body 8 to prevent corrosion by the refrigerant, ensuring a fast response time and avoiding the failure of the thermistor. Within 5S of the T90 temperature response time, the comprehensive performance of the temperature and pressure sensor is significantly improved, and it has a wide range of applicable fields.

[0018] As Figure 2 shown, a connecting pin 7 is installed through the inner body 6. Both the NTC thermistor 5 and the pressure-sensitive component 2 are connected to the circuit board 4 through the connecting pin 7. The connecting pin 7 is a pin resistor. After the pin of the NTC thermistor 5 is welded to the connecting pin 7, the connecting pin 7 is welded and conducted to the circuit board 4.

[0019] More specifically, the heat-conducting protective tube body 8 is a metal tube with a heat-conducting adhesive layer coated on its surface. The NTC thermistor 5 is inside the tube, which can not only ensure a fast response time but also avoid corrosion by the refrigerant.

[0020] The electrical connector 3 and the housing 1 are connected by a riveting structure to ensure the connection stability.

[0021] Between the pressure-sensitive component 2 and the inner body 6, between the inner body 6 and the housing 1, and between the inner body 6 and the heat-conducting protective tube 8, sealing rings 9 for structural sealing are provided at the three splicing joints, and three sealing protection measures are adopted to further improve the structural sealing performance.

[0022] As a preference, the pressure-sensitive component 2 of the present utility model is a ceramic capacitor.

[0023] The above are only the preferred embodiments of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. A packaging structure of a temperature and pressure sensor, comprising an electrical connector (3), a pressure sensing component (2), and an NTC thermistor (5) connected to a circuit board (4). The circuit board (4) and the pressure sensing component (2) are located inside the housing (1) of the temperature and pressure sensor, and the electrical connector (3) and the NTC thermistor (5) are located outside the housing (1). It is characterized in that: An inner body (6) is arranged inside the housing (1) of the temperature and pressure sensor. The pressure sensing component (2) is embedded in a groove of the inner body (6). The NTC thermistor (5) is fixedly installed relative to the inner body (6), and a heat-conducting protection tube body (8) is provided outside the NTC thermistor (5).

2. The encapsulation structure of a temperature and pressure sensor according to claim 1, characterized in that: The inner body (6) is an insulating injection molded part.

3. The encapsulation structure of a temperature and pressure sensor according to claim 2, wherein: Connection pins (7) are installed through the inner body (6). Both the NTC thermistor (5) and the pressure sensing component (2) are connected to the circuit board (4) through the connection pins (7).

4. The encapsulation structure of a temperature and pressure sensor according to claim 3, characterized in that: The connection pins (7) are pin resistors.

5. The encapsulation structure of a temperature and pressure sensor according to claim 1, characterized in that: The heat-conducting protection tube body (8) is a metal tube with a heat-conducting adhesive layer coated on its surface.

6. The encapsulation structure of a temperature and pressure sensor according to claim 1, characterized in that: The electrical connector (3) and the housing (1) are connected by a riveting connection structure through riveting.

7. The encapsulation structure of a temperature and pressure sensor according to claim 1, characterized in that: Sealing rings (9) for structural sealing are provided at the three splicing joints between the pressure sensing component (2) and the inner body (6), between the inner body (6) and the housing (1), and between the inner body (6) and the heat-conducting protection tube body (8).

8. The encapsulation structure of a temperature and pressure sensor according to claim 1, characterized in that: The pressure sensing component (2) is a ceramic capacitor.

Citation Information

Cited By

  • Ceramic capacitance type temperature and pressure sensor

    CN121048818A