Backlight module and panel display module

Abstract

The embodiment of the utility model discloses a backlight module and a panel display module. The backlight module comprises a circuit board and a chip unit, the chip unit comprises a plurality of first chips and a plurality of second chips, the first chips are arranged on the circuit board in a grid mode, and the second chips are arranged at the centers of regular polygons of the grid respectively. By designing the arrangement of the first chips and the second chips on the circuit board, the backlight module can increase the chip arrangement spacing, reduce the chip density and reduce the product cost while realizing high brightness.

Description

Technical Field

[0001] The utility model relates to the technical field of display panels, and particularly relates to a backlight module and a panel display module. Background Art

[0002] The backlight module is one of the key components of a liquid crystal display panel, and its light-emitting effect will directly affect the visual effect of the liquid crystal display module. Liquid crystal itself does not emit light. It displays graphics or characters as a result of modulating light, and is illuminated by the backlight system below it. The common backlight modes adopted by backlight modules are direct-lit backlight and edge-lit backlight. The edge-lit backlight arranges the light-emitting sources on the side, which can achieve an ultra-thin design, but has disadvantages such as low brightness, low contrast, and higher difficulty in light mixing as the size increases, and it is difficult to achieve high uniformity. The direct-lit backlight distributes the light sources on the panel surface, and the panel surface can be divided into multiple regions for independent light control, but it requires a certain thickness and higher energy consumption.

[0003] Compared with traditional backlight modes, Mini LED backlight has advantages such as being thinner and lighter, lower energy consumption, and higher contrast. In order to achieve a display effect with high brightness and high uniformity, factors such as the number and spacing of LED chips, the light-emitting angle of the chips, the chip arrangement mode, the number of partitions, the glue encapsulation mode, and the light mixing distance need to be considered during design. In order to achieve an ultra-thin design and reduce the light mixing distance at the same time, the backlight panel needs to have a good uniformity design. Generally, the uniformity of the backlight panel is improved by increasing the chip density (i.e., reducing the chip spacing) or selecting chips with a larger light-emitting angle, to avoid the situation of insufficient brightness in the gaps between chips. However, reducing the chip spacing means an increase in the number of chips on the same-size panel, resulting in an increase in production costs. And for chips with a large light-emitting angle, the brightness is generally 20% - 60% lower than that of conventional-angle chips under the same electric power, reducing the overall brightness of the backlight module. Summary of the Utility Model

[0004] In view of this, the purpose of the utility model is to provide a backlight module and a panel display module, so that while the backlight module achieves high brightness, it can increase the chip arrangement spacing, reduce the chip density, and lower the product cost.

[0005] In a first aspect, an embodiment of the utility model provides a backlight module, including:

[0006] A circuit board;

[0007] A chip unit, including a plurality of first chips and a plurality of second chips. The plurality of first chips are arranged in a grid and connected to the circuit board, and the plurality of second chips are respectively arranged at the centers of the regular polygons of the grid.

[0008] Optionally, the grid is a regular triangular grid, the first chip is disposed at the vertex of the regular triangle in the regular triangular grid, the second chip is disposed at the center of the regular triangle, and there is one regular triangle between two adjacent second chips in each row and each column.

[0009] Optionally, the grid is a regular quadrilateral grid, and a first chip is disposed at the vertex of each regular quadrilateral in the regular quadrilateral grid, and a second chip is disposed at the center of each regular quadrilateral.

[0010] Optionally, the grid is a regular hexagonal grid, and a first chip is disposed at the vertex of each regular hexagon in the regular hexagonal grid, and a second chip is disposed at the center of each regular hexagon.

[0011] Optionally, the light-emitting angle of the first chip is greater than that of the second chip.

[0012] Optionally, the first chip is a chip with a distributed Bragg reflector structure.

[0013] Optionally, the backlight module further includes a reflector, and the reflector is installed between the chip unit and the circuit board.

[0014] Optionally, the backlight module further includes a diffusion film, and the diffusion film is disposed above the chip unit.

[0015] Optionally, the backlight module further includes a brightness enhancement film, and the brightness enhancement film is disposed on the surface of the diffusion film.

[0016] In a second aspect, an embodiment of the present invention provides a panel display module, including:

[0017] A liquid crystal panel;

[0018] A backlight module, which is installed at the rear end of the liquid crystal panel and is used to provide light sources for the liquid crystal panel.

[0019] An embodiment of the present invention provides a backlight module and a panel display module. The backlight module includes a circuit board and a chip unit. The chip unit includes a plurality of first chips and a plurality of second chips. The first chips are arranged in a grid on the circuit board, and the second chips are respectively disposed at the centers of the regular polygons of the grid. By designing the arrangement of the first chips and the second chips on the circuit board, while the backlight module realizes high brightness, the chip arrangement pitch can be increased, the chip density can be reduced, and the product cost can be lowered. Description of the Drawings

[0020] Through the following description of the embodiments of the present utility model with reference to the accompanying drawings, the above and other objects, features and advantages of the present utility model will become more apparent. In the drawings:

[0021] Figure 1 It is a schematic diagram of the triangular arrangement mode of an embodiment of the present utility model;

[0022] Figure 2 It is a schematic diagram of the quadrilateral arrangement mode of another embodiment of the present utility model;

[0023] Figure 3 It is a schematic diagram of the hexagonal arrangement mode of another embodiment of the present utility model;

[0024] Figure 4 It is a chip light output photometric measurement diagram with a distributed Bragg reflector structure according to an embodiment of the present utility model;

[0025] Figure 5 It is a conventional chip light output photometric measurement diagram according to an embodiment of the present utility model;

[0026] Figure 6 It is a chip arrangement diagram for detecting the light output of chip units of the present utility model;

[0027] Figure 7 It is a chip arrangement diagram for detecting the light output of chip units without setting the first chip;

[0028] Figure 8 It is a schematic diagram of the light output effect of the chip units of the present utility model;

[0029] Figure 9 It is a schematic diagram of the light output effect of chip units without setting the first chip;

[0030] Figure 10 It is a schematic cross-sectional view of a liquid crystal panel display module according to an embodiment of the present utility model.

[0031] Description of reference numerals:

[0032] 1 - Chip unit; 11 - First chip; 12 - Second chip; 2 - Circuit board; 3 - Reflector; 4 - Diffusion film; 5 - Brightening film; 6 - Liquid crystal panel. Detailed implementation manners

[0033] The following is a description of the present application based on embodiments, but the present application is not limited to these embodiments. In the following detailed description of the present application, some specific details are described in detail. Those skilled in the art can fully understand the present application without the description of these details. In order to avoid obscuring the essence of the present application, well-known methods, processes, procedures, elements and circuits are not described in detail.

[0034] In addition, those of ordinary skill in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0035] Unless otherwise clearly specified and defined, terms such as "installed", "connected", "linked", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] For ease of description, spatially relative terms such as "inner", "outer", "below", "beneath", "lower", "above", "upper", etc. are used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as "below" or "beneath" another element or feature will then be positioned "above" that other element or feature. Thus, the exemplary term "below" can encompass both the orientation of above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein should be interpreted accordingly.

[0037] Unless the context clearly requires otherwise, words such as "including", "comprising", etc. throughout the application document should be interpreted in an inclusive sense rather than an exclusive or exhaustive sense; that is, it is the meaning of "including but not limited to".

[0038] In the description of this application, it should be understood that terms such as "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. In addition, in the description of this application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0039] Mini LED backlights have the advantages of being thinner, having lower energy consumption, and higher contrast. In order to reduce the mixing light distance, achieve a high-brightness and high-uniformity display effect, and reduce costs, conventional chips and chips with a larger light-emitting angle are arranged in cooperation. Using conventional chips as the main light-emitting body and chips with a larger light-emitting angle to compensate for the brightness loss caused by the large gaps between conventional chips, a relatively uniform display effect is formed. According to the actual situation, different arrangement methods can be selected to finally achieve a high-brightness and high-uniformity light-emitting effect at a lower cost.

[0040] Refer toFigures 1 - 3 , the backlight module according to the embodiment of the present invention includes a circuit board 2 and a chip unit 1. The chip unit 1 is arranged on the circuit board 2 to facilitate electrical connection, heat dissipation, and control of different chip partitions, and different chip arrangement methods are selected according to the circuit board 2 and actual use conditions, so as to finally achieve a high-brightness and high-uniformity light-emitting effect at a lower cost.

[0041] Among them, the circuit board 2 usually adopts a PCB board. In some embodiments, a flexible circuit board 2, a ceramic substrate, etc. can also be used as the circuit board 2 of the backlight module. Light-emitting chips are used to form the chip unit 1 for making the backlight module emit light to illuminate the liquid crystal panel 6. The chip unit 1 includes a plurality of first chips 11 and a plurality of second chips 12. Among them, the first chip 11 is a chip with a larger light-emitting angle, that is, a chip with more divergent light emission and lower brightness; the second chip 12 is a chip with a smaller light-emitting angle, that is, a chip with more concentrated light emission and higher brightness. When emitting light, the second chip 12 with a smaller light-emitting angle and more concentrated light emission provides higher brightness, and the first chip 11 with a larger light-emitting angle and more dispersed light emission makes up for the insufficient brightness area that appears after the distance between the second chips 12 is increased.

[0042] In some embodiments, the first chip 11 is selected as a chip with a distributed Bragg reflector structure, and the second chip 12 is selected as a conventional chip. Figure 4 , Figure 5 is the photometric measurement diagram of the chip with a distributed Bragg reflector structure and a conventional chip. Among them, "angle" represents the angle between the light and the vertical axis of the chip light emission. Refer to Figure 4 , the distributed Bragg reflector is an optical film system composed of periodically alternating high- and low-refractive-index dielectric materials, and its reflectivity can reach more than 99%. Depositing a distributed Bragg reflector structure on the front of the chip can reduce the front light-emitting rate of the chip, increase the side light-emitting rate, and increase the light-emitting angle of the chip. That is to say, the distributed Bragg reflector structure can reflect the light propagating towards the front of the chip to form a chip with more divergent light emission, but the brightness will also be affected.

[0043] Refer to Figure 5, The light-emitting angle of a conventional chip is smaller, that is, it has more concentrated light emission and better brightness. Therefore, a conventional chip is used as the second chip 12 to provide the brightness required for the backlight module. To reduce the chip density, the spacing of the second chips 12 is increased. At this time, due to the concentrated light emission of the conventional chip, a brightness defect appears at the position between the second chips 12, affecting the light emission uniformity. Therefore, it is necessary to set the first chip 11 between multiple second chips 12, that is, a chip with a larger light-emitting angle. Through the characteristic of its own side light emission, the brightness defect between multiple second chips 12 is compensated at the same time. Through the cooperation and complementarity of the first chip 11 and the second chip 12, the effect of reducing the chip density and the manufacturing cost while meeting the brightness uniformity is achieved.

[0044] As Figures 1 - 3 shown, multiple first chips 11 are arranged in a grid and connected to the circuit board 2. At this time, taking the line segment formed by connecting two adjacent first chips 11 as a side, multiple regularly arranged regular polygons with the same number of sides can be formed. According to the actual situation and the requirements of brightness and cost control, different arrangement methods can be adopted to form regular polygons with different numbers of sides. Usually, the regular polygons formed in this way are regular polygons that can achieve close packing, that is, regular polygons that can cover the circuit board 2 while making this coverage have no gaps and no overlaps.

[0045] Referring to Figures 1 - 3 , the second chips 12 are respectively arranged at the centers of the regular polygons of the grid. At this time, taking the line segment formed by connecting two adjacent second chips 12 as a side, multiple regularly arranged regular polygons can also be formed. According to the actual situation and the requirements of brightness and cost control, different arrangement methods can be adopted. For example, one second chip 12 can be arranged in each regular polygon of the grid to cooperate with the first chip 11 to provide uniform light emission; or the arrangement can be made at intervals of one regular polygon to avoid the too dense arrangement of the second chips 12, reduce the chip density while ensuring the light emission brightness and uniformity, and reduce the cost.

[0046] In some embodiments, referring to Figure 1 , the grid formed by the first chips 11 is a regular triangle grid. The first chips 11 are arranged at the vertices of the regular triangles in the regular triangle grid. For the regular triangles formed by the connection of the first chips 11, the top angles of two adjacent regular triangles are in opposite directions, forming a grid with the top angles of adjacent regular triangles arranged alternately. When arranging in the arrangement method of the regular triangle grid, if the second chips 12 are arranged in each regular triangle, the chip spacing is relatively close, and the improvement of brightness is not significant. Therefore, the distance between the second chips 12 with a smaller light-emitting angle is increased to reduce the chip density while maintaining the light emission uniformity and reduce the cost.

[0047] As Figure 1As shown in the figure, the second chip 12 is arranged at the center of a regular triangle. There is a regular triangle between every two adjacent second chips 12 in each row and each column, and no second chip 12 is arranged inside this regular triangle. That is to say, the second chips 12 are arranged in non-adjacent regular triangles. For example, in a regular hexagon formed by six regular triangles sharing a vertex, the second chips 12 inside it are arranged at intervals in three non-adjacent regular triangles. Connecting with the second chips 12 as vertices can form a new regular triangle grid, and this regular triangle grid is arranged in an interleaved manner with the regular triangle grid formed by the first chips 11, realizing complementary light emission, reducing the chip density, and reducing the cost.

[0048] In some embodiments, referring to Figure 2 , the grid formed by the first chips 11 is a regular quadrilateral grid. The first chips 11 are arranged at the vertices of each regular quadrilateral in the regular quadrilateral grid. For the regular quadrilaterals formed by connecting the first chips 11, two adjacent regular quadrilaterals share one side, forming a closely paved regular quadrilateral grid. The second chips 12 are arranged at the centers of each regular quadrilateral. Connecting with the second chips 12 as vertices can form a new regular quadrilateral grid, and this regular quadrilateral grid is arranged in an interleaved manner with the regular quadrilateral grid formed by the first chips 11, realizing complementary light emission, reducing the chip density, and reducing the cost.

[0049] In some embodiments, referring to Figure 3 , the grid formed by the first chips 11 is a regular hexagon grid. The first chips 11 are arranged at the vertices of each regular hexagon in the regular hexagon grid. For the regular hexagons formed by connecting the first chips 11, two adjacent regular hexagons share one side, forming a closely paved regular hexagon network. The second chips 12 are arranged at the centers of each regular hexagon. Connecting with the second chips 12 as vertices can form a new regular triangle grid, and the apex directions of two adjacent regular triangles in this regular triangle grid are opposite. That is to say, a grid with interleaved apex directions of adjacent regular triangles is formed. And, the side length of the regular triangle formed by the second chips 12 is greater than the side length of the regular hexagon formed by the first chips 11, that is, the arrangement of the second chips 12 is sparser, increasing the chip spacing, reducing the chip density, and reducing the cost.

[0050] The chip unit 1 composed of the first chips 11 and the second chips 12 is detected to verify its light-emitting effect. Referring to Figure 6 , taking nine second chips 12 as an example, on the circuit board 2, the first chips 11 are arranged around the second chips 12 in a regular hexagon manner to make them emit light for detection, and the detected results are as shown in Figure 8 . At the same time, an example without the first chips 11 is used as a control, referring to Figure 7, only nine second chips 12 are arranged on the circuit board 2 to make them emit light for detection, and the detection results are as Figure 9 shown. It can be seen that as Figure 8 shown, after the first chip 11 is set, the overall light emission of the backlight module becomes more uniform. When the first chip 11 is not set, referring to Figure 9 , simply increasing the spacing between the second chips 12 will cause brightness defects between multiple second chips 12. At the same time, due to the large light-emitting angle of the first chip 11, it can perform brightness compensation on multiple second chips 12 around, buffer the brightness change caused by the spacing between multiple second chips 12, and enhance the uniformity of light output.

[0051] In some embodiments, referring to Figure 10 , the backlight module further includes a reflector 3. The reflector 3 is installed between the chip unit 1 and the circuit board 2, and reflects the light that propagates toward the circuit board 2 side when the chip emits light outward, improving the light utilization rate of the chip. The reflected light propagates outward and is mixed with the light that propagates outward when emitting light, improving the uniformity and brightness of the light output of the backlight module.

[0052] As Figure 10 shown, the backlight module further includes a diffusion film 4. The diffusion film 4 is arranged above the chip unit 1, diffuses the light emitted by the chip unit 1 and the light reflected by the reflector 3, increases the uniformity of light output, and avoids the situation of uneven brightness, which affects the light-emitting quality.

[0053] According to the actual situation, referring to Figure 10 , the backlight module further includes a brightness enhancement film 5. The brightness enhancement film 5 is arranged on the surface of the diffusion film 4, redirects the light that has been diffused and homogenized by the diffusion film 4, making it emit more toward the front direction of the backlight module, reducing the light scattered in other directions, that is, concentrating the light, so as to enhance the light-emitting brightness of the backlight module. In actual situations, the brightness enhancement film 5 can also be integrally arranged with the diffusion film 4, that is, the diffusion film 4 with brightness enhancement characteristics.

[0054] Referring to Figure 10 , an embodiment of the present invention provides a liquid crystal panel 6 display module, including a liquid crystal panel 6 and a backlight module. Since the liquid crystal panel 6 itself does not have the function of emitting light, but only processes light, therefore, the backlight module needs to be installed at the back end of the liquid crystal panel 6 to provide a light source for the liquid crystal panel 6.

[0055] An embodiment of the present application provides a backlight module and a panel display module. The backlight module includes a circuit board and a chip unit. The chip unit includes a plurality of first chips and a plurality of second chips. The first chips are arranged in a grid on the circuit board, and the second chips are respectively arranged at the centers of the regular polygons of the grid. Since the first chips have a large light-emitting angle, they can compensate the brightness of a plurality of second chips around them, buffer the brightness change caused by the spacing between the plurality of second chips, so the uniformity of light output is enhanced, and at the same time, a larger spacing can be provided between the second chips. By designing the cooperation of the first chips and the second chips on the circuit board, while achieving high brightness, the backlight module can increase the chip arrangement spacing, reduce the chip density, and lower the product cost.

[0056] The foregoing are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various modifications and changes can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A backlight module, characterized in that, The backlight module includes: A circuit board (2); A chip unit (1), including a plurality of first chips (11) and a plurality of second chips (12). The plurality of first chips (11) are connected to the circuit board (2) in a grid arrangement, and the plurality of second chips (12) are respectively disposed at the centers of the regular polygons of the grid.

2. The backlight module according to claim 1, characterized in that The grid is a regular triangle grid. The first chips (11) are disposed at the vertices of the regular triangles in the regular triangle grid, and the second chips (12) are disposed at the centers of the regular triangles. There is one regular triangle between two adjacent second chips (12) in each row and each column.

3. The backlight module according to claim 1, wherein, The grid is a regular quadrilateral grid. One first chip (11) is disposed at each vertex of each regular quadrilateral in the regular quadrilateral grid, and one second chip (12) is disposed at the center of each regular quadrilateral.

4. The backlight module according to claim 1, wherein The grid is a regular hexagon grid. One first chip (11) is disposed at each vertex of each regular hexagon in the regular hexagon grid, and one second chip (12) is disposed at the center of each regular hexagon.

5. The backlight module according to claim 1, wherein The light-emitting angle of the first chip (11) is greater than the light-emitting angle of the second chip (12).

6. The backlight module according to claim 1, wherein The first chip (11) is a chip with a distributed Bragg reflector structure.

7. The backlight module according to claim 1, wherein The backlight module further includes a reflector (3), and the reflector (3) is installed between the chip unit (1) and the circuit board (2).

8. The backlight module according to claim 1, wherein The backlight module further includes a diffusion film (4), and the diffusion film (4) is disposed above the chip unit (1).

9. The backlight module according to claim 8, wherein The backlight module further includes a brightness enhancement film (5), and the brightness enhancement film (5) is disposed on the surface of the diffusion film (4).

10. A panel display module, characterized in that, The panel display module includes: A liquid crystal panel (6); The backlight module according to any one of claims 1-9, and the backlight module is installed at the rear end of the liquid crystal panel (6) for providing light source for the liquid crystal panel (6).

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