Hard disk cooling device

Abstract

The utility model belongs to the technical field of hard disk heat dissipation, and discloses a hard disk cooling device. The hard disk cooling device comprises a liquid cooling plate and a heat dissipation structure, and a first cooling liquid flow channel is arranged in the liquid cooling plate. The heat dissipation structure comprises two heat dissipation plates, the two heat dissipation plates are arranged in parallel, one ends of the two heat dissipation plates are connected, and the other ends of the two heat dissipation plates are connected to the liquid cooling plate. The multiple heat dissipation structures are arranged at intervals and connected to the liquid cooling plate, a hard disk can be contained between every two adjacent heat dissipation structures, and the heat dissipation plate abuts against the hard disk. When the hard disks work, heat of the hard disks can be sequentially transmitted to the liquid cooling plate from the heat dissipation plate, heat of the liquid cooling plate is absorbed through flowing of the cooling liquid in the first cooling liquid flow channel, and cooling and heat dissipation of the multiple hard disks are achieved. The two opposite faces of the hard disks abut against the different heat dissipation plates, and each heat dissipation plate only abuts against one hard disk, so that the mutual influence between the different hard disks during heat dissipation can be reduced, and the effect that the multiple hard disks dissipate heat at the same time is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of hard disk heat dissipation, in particular to a hard disk cooling device. Background Art

[0002] With the rapid application and popularization of Internet digital technology, the demand for servers with large storage capacity, excellent performance and high integration has increased rapidly. Along with the improvement of the server's own performance, a traditional single solid-state drive cannot meet the demand for storage capacity. Therefore, multiple solid-state drives need to be stacked during use to increase the storage capacity. This stacking method significantly increases the storage capacity, but at the same time, due to the high-density hard disk array in the storage device, the heat dissipation problem becomes more severe.

[0003] In the research and application of liquid cooling technology in the field of hard disk heat dissipation, the mainstream direction includes local cold plate contact liquid cooling. At present, the contact cold plate heat dissipation technology has been slightly applied at the main components of the server, such as the CPU, memory, GPU, etc. The research on internal liquid cooling heat dissipation in the hard disk field has not achieved satisfactory results. The existing solutions mainly focus on the heat dissipation problem of a single hard disk, with a small amount of heat dissipation, and the heat dissipation effect is poor when multiple hard disks act together.

[0004] Therefore, there is an urgent need for a hard disk cooling device to solve the above problems. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a hard disk cooling device, which can be used for the installation and heat dissipation of multiple hard disks to ensure the heat dissipation effect.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] Provide a hard disk cooling device, including:

[0008] A liquid cooling plate, with a first coolant flow channel arranged inside the liquid cooling plate;

[0009] A heat dissipation structure, which includes two heat dissipation plates. The two heat dissipation plates are arranged in parallel, one end of the two heat dissipation plates is connected, and the other end is connected to the liquid cooling plate;

[0010] A plurality of the heat dissipation structures are provided. The plurality of heat dissipation structures are spaced apart from each other and connected to the liquid cooling plate. A hard disk can be accommodated between two adjacent heat dissipation structures, and the side wall of the heat dissipation plate abuts against the hard disk.

[0011] As an optional solution of the hard disk cooling device, the two heat dissipation plates of each heat dissipation structure are spaced apart, and a filling space is formed between the liquid cooling plate and the heat dissipation structure. The filling space is used to accommodate a filler.

[0012] As an alternative solution for the hard disk cooling device, the hard disk cooling device further includes a thermal pad, and the thermal pad is disposed between the side wall of the heat dissipation structure and the hard disk.

[0013] As an alternative solution for the hard disk cooling device, the liquid cooling plate includes an upper plate and a lower plate, and the upper plate and the lower plate are connected to form the first coolant flow channel, and the heat dissipation structure is connected to a side of the lower plate facing away from the upper plate.

[0014] As an alternative solution for the hard disk cooling device, the upper plate is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet communicate with the first coolant flow channel.

[0015] As an alternative solution for the hard disk cooling device, the lower plate includes a grid structure, and the grid structure is disposed on a side of the lower plate facing the upper plate and within the first coolant flow channel.

[0016] As an alternative solution for the hard disk cooling device, the heat dissipation plate includes a mounting groove, and the mounting groove is disposed on a side of the heat dissipation plate facing another heat dissipation structure, and the hard disk is limited within the mounting groove.

[0017] As an alternative solution for the hard disk cooling device, the hard disk cooling device further includes a fixing plate, and the fixing plate abuts against an end of the heat dissipation structure away from the liquid cooling plate.

[0018] As an alternative solution for the hard disk cooling device, the fixing plate is provided with a plurality of limiting grooves, and the plurality of limiting grooves correspond to the plurality of heat dissipation structures one by one, and the heat dissipation structures are limited within the limiting grooves.

[0019] As an alternative solution for the hard disk cooling device, a second coolant flow channel is provided inside the fixing plate.

[0020] Advantages of the present utility model:

[0021] The present utility model provides a hard disk cooling device, which includes a liquid cooling plate and a plurality of heat dissipation structures. A first coolant flow channel is formed inside the liquid cooling plate, and the first coolant flow channel can accommodate the flow of coolant. The plurality of heat dissipation structures are connected to the liquid cooling plate at intervals, and a hard disk can be placed between every two adjacent heat dissipation structures, so that the hard disk cooling device can install a plurality of hard disks simultaneously. Each heat dissipation structure includes two heat dissipation plates arranged in parallel, and the heat dissipation plates are abutted against the hard disk to fix the hard disk. When the hard disk is working, the heat of the hard disk can be transferred from the heat dissipation plate to the liquid cooling plate in sequence, and the heat of the liquid cooling plate can be absorbed through the flow of the coolant in the first coolant flow channel, realizing the cooling and heat dissipation of a plurality of hard disks. The opposite two sides of the hard disk are abutted against different heat dissipation plates, and each heat dissipation plate is only abutted against one hard disk, which can reduce the mutual influence between different hard disks during heat dissipation and improve the heat dissipation effect of a plurality of hard disks simultaneously. The hard disk cooling device has a simple structure and is convenient for the installation and replacement of hard disks. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic structural diagram of the hard disk cooling device provided by the present utility model;

[0023] Figure 2 is a partial cross-sectional view of the hard disk cooling device provided by the present utility model.

[0024] In the figure:

[0025] 100, liquid cooling plate; 110, first coolant flow channel; 120, upper plate; 121, liquid inlet; 122, liquid outlet; 123, liquid inlet pipe; 124, liquid outlet pipe; 130, lower plate; 131, grid structure;

[0026] 200, heat dissipation structure; 210, heat dissipation plate; 220, filling space. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The present utility model will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. In addition, it should be noted that for the convenience of description, only parts related to the present utility model are shown in the drawings, rather than all the structures.

[0028] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0029] In the present utility model, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may also include the first and second features not being in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0030] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0031] As Figures 1 to 2 shown, the hard disk cooling device of this embodiment includes a liquid cooling plate 100 and a heat dissipation structure 200. A first coolant flow channel 110 is provided inside the liquid cooling plate 100. The heat dissipation structure 200 includes two heat dissipation plates 210. The two heat dissipation plates 210 are arranged in parallel. One end of the two heat dissipation plates 210 is connected, and the other end is connected to the liquid cooling plate 100, that is, the heat dissipation structure 200 forms a U-shaped structure, and the open end of the U-shaped structure is connected to the liquid cooling plate 100. A plurality of heat dissipation structures 200 are provided. The plurality of heat dissipation structures 200 are spaced apart from each other and connected to the liquid cooling plate 100. A hard disk can be accommodated between two adjacent heat dissipation structures 200, and the heat dissipation plate 210 abuts against the hard disk.

[0032] Based on the above design, the hard disk cooling device includes a liquid cooling plate 100 and a plurality of heat dissipation structures 200. A first coolant flow channel 110 is formed inside the liquid cooling plate 100, and the first coolant flow channel 110 can accommodate the flow of coolant. The plurality of heat dissipation structures 200 are connected to the liquid cooling plate 100 at intervals. A hard disk can be placed between every two adjacent heat dissipation structures 200, so that the hard disk cooling device can install multiple hard disks simultaneously. Each heat dissipation structure 200 includes two heat dissipation plates 210 arranged in parallel. The heat dissipation plates 210 are in contact with the hard disk to fix the hard disk. When the working temperature of the hard disk rises, the heat of the hard disk can be transferred from the heat dissipation plates 210 to the liquid cooling plate 100 in sequence, and the heat of the liquid cooling plate 100 can be absorbed through the flow of the coolant in the first coolant flow channel 110, realizing the cooling and heat dissipation of multiple hard disks. The two opposite sides of the hard disk are in contact with different heat dissipation plates 210, and each heat dissipation plate 210 is only in contact with one hard disk, which can reduce the mutual influence during heat dissipation between different hard disks and improve the heat dissipation effect of multiple hard disks simultaneously. The structure of the hard disk cooling device is simple, facilitating the installation and replacement of the hard disk.

[0033] In this embodiment, the heat dissipation structure 200 is made of copper plate, which has good processing performance, corrosion resistance and heat conduction performance, is easy to process, has a stable structure. The heat dissipation structure 200 is connected to the liquid cooling plate 100 by means of soldering, and can quickly guide the heat generated by the hard disk to the liquid cooling plate 100. In some other embodiments, the heat dissipation structure 200 can also be made of other metal materials, such as aluminum alloy, stainless steel, etc., or can also be made of non-metal materials, such as thermal conductive silicone, ceramic materials, etc.

[0034] Furthermore, the two heat dissipation plates 210 of each heat dissipation structure 200 are arranged at intervals, and a filling space 220 is formed between the liquid cooling plate 100 and the heat dissipation structure 200. The filling space 220 is used to accommodate a filler. When the heat dissipation structure 200 is a U-shaped structure, in order to improve the stiffness of the heat dissipation structure 200 and ensure the stability of the heat dissipation structure 200, a filler is arranged in the filling space 220 to bond the two heat dissipation plates 210, increase the thickness of the heat dissipation structure 200, and improve the stability when the heat dissipation structure 200 clamps the hard disk. In this embodiment, the filler can use epoxy adhesive. The epoxy adhesive has the advantages of high temperature resistance, high strength, aging resistance, etc., and the thermal conductivity coefficient of the epoxy adhesive is low, which can reduce the heat transfer from the heat dissipation plate 210 to the epoxy adhesive, ensure that the heat is transferred from the heat dissipation plate 210 to the liquid cooling plate 100, and reduce the influence of the filler on the heat dissipation efficiency.

[0035] Further, the liquid cooling plate 100 includes an upper plate 120 and a lower plate 130. The upper plate 120 and the lower plate 130 are connected to form a first coolant flow channel 110. The heat dissipation structure 200 is connected to the side of the lower plate 130 facing away from the upper plate 120. Setting the liquid cooling plate 100 as the upper plate 120 and the lower plate 130 facilitates the processing of the first coolant flow channel 110, and can also ensure that even after the heat dissipation structure 200 is welded to the lower plate 130, it is possible to check whether the welding deformation affects the smoothness of the first coolant flow channel 110, ensuring the cooling effect.

[0036] Optionally, the upper plate 120 is provided with a liquid inlet 121 and a liquid outlet 122. The liquid inlet 121 is externally connected to a liquid inlet pipe 123, and the liquid outlet 122 is externally connected to a liquid outlet pipe 124. The liquid inlet pipe 123 communicates with the first coolant flow channel 110 through the liquid inlet 121, and the liquid outlet pipe 124 communicates with the first coolant flow channel 110 through the liquid outlet 122, for the coolant to enter and flow out of the first coolant flow channel 110.

[0037] Preferably, the lower plate 130 includes a grille structure 131. The grille structure 131 is arranged on the side of the lower plate 130 facing the upper plate 120 and is located within the first coolant flow channel 110. The grille structure 131 divides the first coolant flow channel 110 into multiple flow channels, enabling the coolant to be evenly distributed within the first coolant flow channel 110 and ensuring the uniformity of heat dissipation of the hard disk cooling device.

[0038] Further, the hard disk cooling device further includes a thermal conductive gasket (not shown in the figure). The thermal conductive gasket is arranged between the side wall of the heat dissipation structure 200 and the hard disk, and one side of the thermal conductive gasket abuts against the hard disk, and the other side abuts against the heat dissipation plate 210. Through the thermal conductive gasket, an interference fit between the hard disk and the heat dissipation structure 200 can be achieved, improving the stability of the hard disk installation in the hard disk cooling device. The thermal conductive gasket has a high thermal conductivity, which can accelerate the heat transfer speed from the hard disk to the heat dissipation plate 210. Moreover, when the surface of the hard disk or the heat dissipation plate 210 is uneven, the thermal conductive gasket can fill the gap between the hard disk and the heat dissipation plate 210, expanding the contact area between the hard disk and the heat dissipation plate 210, that is, expanding the area for the hard disk to transfer heat to the heat dissipation plate 210, and further improving the efficiency of heat transfer between the hard disk and the heat dissipation plate 210. Exemplarily, the thermal conductive gasket can be an organosilicon-based thermal conductive gasket, a carbon fiber thermal conductive gasket, a silicone thermal conductive gasket, etc.

[0039] Optionally, the heat dissipation plate 210 includes a mounting groove (not shown in the figure). The mounting groove is arranged on the side of the heat dissipation plate 210 facing another heat dissipation structure 200. The hard disk and the thermal conductive gasket can be limited within the mounting groove, realizing the positioning of the hard disk and the thermal conductive gasket, facilitating the installation of multiple hard disks on the hard disk cooling device, and being beneficial to ensuring the stability of the hard disk.

[0040] Further, the hard disk cooling device further includes a fixing plate which abuts against one end of the heat dissipation structure 200 away from the liquid cooling plate 100, ensuring that the heat dissipation structure 200 can stably clamp the hard disk. Optionally, the fixing plate is provided with a plurality of limiting grooves, and the plurality of limiting grooves correspond to the plurality of heat dissipation structures 200 one by one. The heat dissipation structure 200 is limited in the limiting grooves, further fixing the heat dissipation structure 200 and improving the stability of the hard disk cooling device during use.

[0041] Optionally, a second coolant flow channel is provided inside the fixing plate. The second coolant flow channel can accommodate the flow of the coolant, enabling part of the heat on the heat dissipation structure 200 to be transferred to the fixing plate and dissipated by the coolant in the second coolant flow channel, which is beneficial to accelerating the cooling of the fixing plate and improving the cooling effect of the heat dissipation structure 200.

[0042] Further, the hard disk cooling device further includes a fan which can blow the air around the liquid cooling plate 100, accelerating the flow rate of the air on the surface of the liquid cooling plate 100 and improving the heat dissipation effect.

[0043] Obviously, the above embodiments of the present utility model are merely examples for clearly explaining the present utility model, rather than limitations on the implementation manners of the present utility model. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the claims of the present utility model.

Claims

1. A hard disk cooling device, characterized in that Comprising: A liquid cooling plate (100), with a first coolant flow channel (110) provided inside the liquid cooling plate (100); A heat dissipation structure (200), the heat dissipation structure (200) includes two heat dissipation plates (210), the two heat dissipation plates (210) are arranged in parallel, one ends of the two heat dissipation plates (210) are connected, and the other ends are connected to the liquid cooling plate (100); A plurality of the heat dissipation structures (200) are provided, the plurality of heat dissipation structures (200) are spaced apart from each other and connected to the liquid cooling plate (100), a hard disk can be accommodated between two adjacent heat dissipation structures (200), and the heat dissipation plate (210) abuts against the hard disk.

2. The hard disk cooling device according to claim 1, wherein, The two heat dissipation plates (210) of each heat dissipation structure (200) are spaced apart, a filling space (220) is formed between the liquid cooling plate (100) and the heat dissipation structure (200), and the filling space (220) is used to accommodate a filler.

3. The hard disk cooling device according to claim 1, wherein The hard disk cooling device further includes a heat conductive gasket, and the heat conductive gasket is arranged between the side wall of the heat dissipation structure (200) and the hard disk.

4. The hard disk cooling device according to claim 1, characterized in that, The liquid cooling plate (100) includes an upper layer plate (120) and a lower layer plate (130), the upper layer plate (120) and the lower layer plate (130) are connected to form the first coolant flow channel (110), and the heat dissipation structure (200) is connected to a surface of the lower layer plate (130) facing away from the upper layer plate (120).

5. The hard disk cooling device according to claim 4, wherein The upper layer plate (120) is provided with a liquid inlet (121) and a liquid outlet (122), and the liquid inlet (121) and the liquid outlet (122) communicate with the first coolant flow channel (110).

6. The hard disk cooling device according to claim 4, characterized in that The lower layer plate (130) includes a grid structure (131), and the grid structure (131) is arranged on a surface of the lower layer plate (130) facing the upper layer plate (120) and is located inside the first coolant flow channel (110).

7. The hard disk cooling device according to claim 1, wherein The heat dissipation plate (210) includes a mounting groove, and the mounting groove is arranged on a surface of the heat dissipation plate (210) facing another heat dissipation structure (200), and the hard disk is limited in the mounting groove.

8. The hard disk cooling device according to claim 1, characterized in that, The hard disk cooling device further includes a fixing plate, and the fixing plate abuts against one end of the heat dissipation structure (200) away from the liquid cooling plate (100).

9. The hard disk cooling device according to claim 8, characterized in that, The fixing plate is provided with a plurality of limiting grooves, the plurality of limiting grooves correspond to the plurality of heat dissipation structures (200) one by one, and the heat dissipation structure (200) is limited in the limiting grooves.

10. The hard disk cooling device according to claim 8, characterized in that, A second coolant flow channel is provided inside the fixing plate.

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