Liquid cooling fin type heat dissipation structure for processor and manufacturing method

Abstract

The invention relates to the technical field of liquid cooling heat dissipation, in particular to a liquid cooling fin type heat dissipation structure for a processor and a manufacturing method.The liquid cooling fin type heat dissipation structure comprises a composite fin unit, a nano-porous thermal interface layer and a double-phase cooling runner, and the composite fin unit is composed of a plurality of heat dissipation fins; the heat dissipation fins are made of a silicon carbide particle reinforced copper-based double-gradient nano-structure composite material; the nano-porous thermal interface layer is arranged on the outer surface of the heat dissipation fins; the double-phase cooling flow channel is arranged in the heat dissipation fins and comprises a main cooling channel, a micro-jet branch pipe and a spiral fractal flow channel. According to the double-phase cooling flow channel, the main cooling channel, the micro-jet branch pipes and the spiral fractal flow channel are matched with one another, the main cooling channel extends in the length direction of the fins, it is ensured that cooling liquid can evenly flow in the fins, the contact area of the cooling liquid and the fins is increased, and the cooling efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling and heat dissipation, and in particular to a liquid cooling fin type heat dissipation structure for a processor and a manufacturing method thereof. Background Art

[0002] Liquid cooling utilizes the good specific heat capacity of the coolant to absorb the high heat generated by the processor. The coolant flows in the circulation pipe, taking away the heat from the surface of the processor, effectively reducing the operating temperature of the processor and ensuring that it runs stably within the appropriate temperature range, thereby ensuring the performance of the processor and avoiding frequency reduction caused by overheating.

[0003] However, in the existing heat dissipation structure, due to the internal setting design reasons, the internal transmission stability is poor and the local heat source cannot be ensured to dissipate heat. Therefore, it is necessary to make new improvements to the structure with respect to the existing heat dissipation components. Summary of the invention

[0004] To solve the above problems, the two-phase cooling channel of the present invention cooperates with each other through the main cooling channel, the micro-injection branch and the spiral fractal channel. The main cooling channel extends along the length direction of the fin to ensure that the coolant can flow evenly inside the fin; the micro-injection branch arranged in a fishbone shape can spray the coolant to various places inside the fin in a more uniform manner, thereby enhancing the contact area between the coolant and the fin and improving the cooling efficiency of the liquid-cooled fin-type heat dissipation structure and manufacturing method for the processor.

[0005] The technical solution adopted by the present invention is: a liquid-cooled fin-type heat dissipation structure for a processor, comprising a composite fin unit, a nanoporous thermal interface layer and a dual-phase cooling channel, wherein the composite fin unit is composed of a plurality of heat dissipation fins, and the heat dissipation fins are made of a copper-based dual-gradient nanostructure composite material reinforced with silicon carbide particles; the nanoporous thermal interface layer is arranged on the outer surface of the heat dissipation fin, the porosity of the nanoporous thermal interface layer is 40%-60%, the pore size is 50-200nm, and it contains a graphene quantum dot enhanced phase; the dual-phase cooling channel is arranged inside the heat dissipation fin, the dual-phase cooling channel comprises a main cooling channel, a micro-injection branch and a spiral fractal channel, the main cooling channel extends along the length direction of the heat dissipation fin, a plurality of micro-injection branches are arranged, and the plurality of micro-injection branches are arranged in a fishbone shape on both sides of the main cooling channel; the spiral fractal channel is arranged on the periphery of the main cooling channel, the main cooling channel is provided with an access port and an access port, and a plurality of heat dissipation fins are connected through the access port and the access port.

[0006] A further improvement to the above solution is that the hydraulic diameter of the main cooling channel is 1.5 - 3.0 mm; the diameter of the micro - injection branch pipe is 0.1 - 0.5 mm; the diameter of the spiral fractal flow channel is 0.3 - 1.2 mm, and the helix angle is 25° - 45°.

[0007] A further improvement to the above solution is that the fractal dimension of the spiral fractal flow channel is 1.5 - 1.8, and the ratio of adjacent flow channel spacings satisfies:

[0008] wherein, dn is the spacing of the n - th level flow channel.

[0009] A further improvement to the above solution is that the silicon carbide particle - reinforced copper - based dual - gradient nanostructured composite material includes a base layer, an intermediate layer, and a functional layer arranged in sequence. The thickness of the base layer is 0.5 - 1.0 mm; the thickness of the intermediate layer is 0.3 - 0.8 mm; the thickness of the functional layer is 50 - 200 μm.

[0010] A further improvement to the above solution is that the base layer is prepared by adding 3 wt% of titanium to a copper matrix; the intermediate layer is a copper - based silicon carbide composite material, and the volume fraction of silicon carbide is 15% - 30%; the functional layer is nanocrystalline silicon carbide, and the nanograin size is 20 - 50 nm.

[0011] A further improvement to the above solution is that the injection angle of the micro - injection branch pipe is 30° - 60°, and a turbulence generator is provided at the outlet of the micro - injection branch pipe. The turbulence generator includes an array of hemispherical pits and a nanowire fence structure, and the array of hemispherical pits and the nanowire fence structure are arranged alternately.

[0012] A further improvement to the above solution is that the preparation of the nanoporous thermal interface layer includes: The copper matrix is anodized to form a CuO nanotube template; Silicon carbide nanowire networks are formed by chemical vapor deposition silicon infiltration; Graphene quantum dots are electrochemically deposited, and the deposition current density is 2 - 5 mA / cm².

[0013] A further improvement to the above solution is that it also includes a laser - induced hydrophilic modification area. Micron - scale groove arrays are processed on the surface of the heat - dissipating fins by femtosecond laser. The groove depth of the micron - scale groove arrays is 50 - 200 μm, and the width - to - depth ratio is 1:1 to 1:3.

[0014] A manufacturing method of a liquid - cooled fin - type heat - dissipation structure includes the liquid - cooled fin - type heat - dissipation structure for a processor as described above; The method includes the following steps: Step S1, gradient fin forming: using electron beam melting technology to deposit silicon carbide particles to reinforce copper-based double gradient nanostructured composite materials layer by layer, with an electron beam current of 10-15 mA, a scanning speed of 2000-3000 mm / s, and a layer thickness of 40-60 μm; Step S2, inner flow channel processing: manufacturing a spiral fractal flow channel by two-photon polymerization 3D printing, with a laser wavelength of 780nm, a pulse energy of 3-5nJ, and a resolution of ±2μm; Step S3, surface modification: Plasma electrolytic oxidation is performed on the outer surface of the heat sink fins at a voltage of 300-500 V, and the electrolyte contains 10 g / L, 35 g / L Na2SiO3 and silicon carbide nanoparticles to generate a nanoporous thermal interface layer with a thickness of 20-50 μm; The inner wall of the spiral fractal flow channel is coated with Al2O3 / TiO2 superlattice coating by atomic layer deposition. The single layer thickness is 0.5~1.5nm, the total number of layers is 50~100, and the interface thermal resistance is ≤5×10 -9 m²·K / W.

[0015] The beneficial effects of the present invention are: Compared with the existing heat dissipation structure, the heat dissipation fins made of silicon carbide particles reinforced copper-based double gradient nanostructure composite materials in the present invention have excellent thermal conductivity and mechanical properties. High thermal conductivity can quickly conduct the heat generated by the processor, effectively reduce the surface temperature of the processor, ensure its operation in a stable temperature environment, and improve work efficiency and reliability; good mechanical properties ensure that the fins are not easily damaged during long-term use, extending the service life of the heat dissipation structure. The porosity of the nanoporous thermal interface layer is 40%~60%, the pore size is 50~200nm, and it contains a graphene quantum dot enhanced phase, which greatly increases the effective heat dissipation area of the heat dissipation fins and can more efficiently exchange heat with the surrounding medium. At the same time, the graphene quantum dot enhanced phase further improves the thermal conductivity of the thermal interface layer, allowing heat to be transferred more smoothly from the fins to the surrounding environment, enhancing the overall heat dissipation effect. The two-phase cooling channel cooperates with each other through the main cooling channel, micro-injection branch and spiral fractal channel. The main cooling channel extends along the length of the fin to ensure that the coolant can flow evenly inside the fin; the micro-injection branch arranged in a fishbone shape can spray the coolant to various places inside the fin in a more uniform manner, enhancing the contact area between the coolant and the fin and improving the cooling efficiency; the spiral fractal channel further extends the flow path of the coolant in the fin, fully utilizing the cooling capacity of the coolant, effectively taking away heat, and significantly improving the heat dissipation performance of the entire heat dissipation structure.

[0016] Manufacturing method of a liquid-cooled fin-type heat dissipation structure. In the gradient fin forming step, an electron beam melting technology is used to stack silicon carbide particle-reinforced copper-based dual-gradient nanostructured composites, precisely controlling the electron beam current, scanning speed, and layer thickness, so as to prepare gradient fins with excellent thermal conductivity and mechanical properties, which can efficiently conduct the heat generated by the processor and meet the high-power heat dissipation requirements. For the internal flow channel processing, two-photon polymerization 3D printing is used to manufacture a spiral fractal flow channel, and an Al2O3 / TiO2 superlattice coating is deposited on its inner wall. The unique flow channel structure can effectively improve the flow uniformity and turbulence degree of the coolant, enhancing the convective heat transfer effect; the extremely low interfacial thermal resistance of the superlattice coating further reduces the thermal resistance during the heat transfer process, greatly improving the heat dissipation efficiency. For the surface modification, a nano-porous thermal interface layer is generated by plasma electrolytic oxidation, which can significantly increase the surface roughness, improve the surface heat dissipation coefficient, and optimize the heat exchange capacity between the heat dissipation fins and the surrounding environment. Description of the Drawings

[0017] Figure 1 FIG. is a schematic structural diagram of the liquid-cooled fin-type heat dissipation structure for a processor according to the present invention; Figure 2 is Figure 1 the internal structural schematic diagram of the liquid-cooled fin-type heat dissipation structure for a processor in Figure 3 is Figure 1 the sectional structural schematic diagram of the liquid-cooled fin-type heat dissipation structure for a processor in Figure 4 is Figure 1 the sectional structural schematic diagram of the liquid-cooled fin-type heat dissipation structure for a processor in Figure 5 FIG. is a schematic structural diagram of the silicon carbide particle-reinforced copper-based dual-gradient nanostructured composite according to the present invention; Figure 6 FIG. is a schematic structural diagram of the turbulence generator according to the present invention; Figure 7 FIG. is a schematic flow diagram of the manufacturing method of the liquid-cooled fin-type heat dissipation structure according to the present invention.

[0018] Description of the reference numerals: composite fin unit 1, heat dissipation fin 11, base layer 111, intermediate layer 112, functional layer 113, micron-level groove 12, nano-porous thermal interface layer 2, two-phase cooling flow channel 3, main cooling channel 31, inlet 311, outlet 312, micro-injection branch pipe 32, hemispherical pit array 321, nanowire fence structure 322, spiral fractal flow channel 33. Detailed Embodiments

[0019] To facilitate the understanding of the present invention, the present invention will be described more fully hereinafter with reference to the relevant drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the understanding of the disclosure of the present invention is more thorough and comprehensive.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0022] Such as Figures 1 to 7As shown, in one embodiment of the present invention, a liquid-cooled fin-type heat dissipation structure for a processor is involved, comprising a composite fin unit 1, a nanoporous thermal interface layer 2 and a dual-phase cooling flow channel 3, wherein the composite fin unit 1 is composed of a plurality of heat dissipation fins 11, and the heat dissipation fins 11 are made of a copper-based dual-gradient nanostructure composite material reinforced with silicon carbide particles; the nanoporous thermal interface layer 2 is arranged on the outer surface of the heat dissipation fin 11, and the nanoporous thermal interface layer 2 has a porosity of 40% to 60%, a pore size of 50 to 200 nm, and contains a graphene quantum dot enhanced phase; the dual-phase cooling flow channel The channel 3 is arranged inside the heat sink fin 11, and the two-phase cooling channel 3 includes a main cooling channel 31, a micro-injection branch 32 and a spiral fractal channel 33. The main cooling channel 31 extends along the length direction of the heat sink fin 11, and the micro-injection branch 32 is provided with a plurality of micro-injection branches 32, and the plurality of micro-injection branches 32 are arranged in a fishbone shape on both sides of the main cooling channel 31; the spiral fractal channel 33 is arranged on the periphery of the main cooling channel 31, and the main cooling channel 31 is provided with an access port 311 and an access port 312, and the plurality of heat sink fins 11 are connected through the access port 311 and the access port 312. The heat sink fin 11 made of a copper-based double gradient nanostructure composite material reinforced with silicon carbide particles in this embodiment has excellent thermal conductivity and mechanical properties. High thermal conductivity can quickly conduct the heat generated by the processor, effectively reduce the surface temperature of the processor, ensure its operation in a stable temperature environment, and improve work efficiency and reliability; good mechanical properties ensure that the fins are not easily damaged during long-term use, thereby extending the service life of the heat sink structure. The nanoporous thermal interface layer 2 has a porosity of 40% to 60%, a pore size of 50 to 200 nm, and contains a graphene quantum dot enhanced phase, which greatly increases the effective heat dissipation area of the heat sink 11 and can more efficiently exchange heat with the surrounding medium. At the same time, the graphene quantum dot enhanced phase further improves the thermal conductivity of the thermal interface layer, so that heat can be more smoothly transferred from the fins to the surrounding environment, enhancing the overall heat dissipation effect. The two-phase cooling channel 3 cooperates with each other through the main cooling channel 31, the micro-injection branch 32 and the spiral fractal channel 33. The main cooling channel 31 extends along the length of the fin to ensure that the coolant can flow evenly inside the fin; the micro-injection branch 32 arranged in a fishbone shape can spray the coolant to various places inside the fin in a more uniform manner, increase the contact area between the coolant and the fin, and improve the cooling efficiency; the spiral fractal channel 33 further extends the flow path of the coolant in the fin, fully utilizes the cooling capacity of the coolant, effectively takes away heat, and significantly improves the heat dissipation performance of the entire heat dissipation structure.

[0023] The hydraulic diameter of the main cooling channel 31 is sized at 1.5 - 3.0 mm; the diameter of the micro - injection branch pipe 32 is sized at 0.1 - 0.5 mm; the diameter of the spiral fractal flow channel 33 is sized at 0.3 - 1.2 mm, and the helix angle is 25° - 45°. In this embodiment, the hydraulic diameter of the main cooling channel 31 is designed to be within 1.5 - 3.0 mm. This specification can ensure that the coolant has a proper flow space, avoiding excessive flow resistance caused by a too - narrow channel, which affects the coolant circulation efficiency, and preventing insufficient coolant flow velocity due to a too - wide channel, thus reducing the heat dissipation effect. The diameter of the micro - injection branch pipe 32 is 0.1 - 0.5 mm, which can achieve fine injection of the coolant, making the coolant contact the fins more evenly and enhancing the heat exchange efficiency between the coolant and the fins. The diameter of the spiral fractal flow channel 33 is 0.3 - 1.2 mm, combined with a helix angle of 25° - 45°, which can effectively extend the flow path of the coolant in the channel, increase the contact time between the coolant and the fins. At the same time, the spiral flow pattern can break the boundary layer and improve the convective heat transfer coefficient.

[0024] The fractal dimension of the spiral fractal flow channel 33 is 1.5 - 1.8, and the adjacent flow - channel spacing ratio satisfies: where dn is the spacing of the n - th level flow channel. In this embodiment, the fractal dimension range makes the flow of the coolant in the channel exhibit complex and orderly characteristics, increasing the contact area between the coolant and the fins, strengthening the convective heat - transfer process, and thus significantly improving the heat - dissipation efficiency. A reasonable adjacent flow - channel spacing ratio ensures the uniform distribution of the coolant among the flow channels at all levels, avoiding situations of excessive or insufficient local flow rate, effectively preventing the generation of hot spots, and ensuring the temperature uniformity of all parts of the processor.

[0025] Referring to Figure 5 As shown, the silicon - carbide - particle - reinforced copper - based dual - gradient nanostructured composite material includes a base layer 111, an intermediate layer 112, and a functional layer 113 arranged in sequence. The thickness of the base layer 111 is sized at 0.5 - 1.0 mm; the thickness of the intermediate layer 112 is sized at 0.3 - 0.8 mm; the thickness of the functional layer 113 is sized at 50 - 200 μm. In this embodiment, the thickness of the base layer 111 is 0.5 - 1.0 mm, providing a stable support foundation for the entire heat - dissipation structure, ensuring structural stability, and being able to effectively withstand the heat and mechanical stress generated during the operation of the processor. The thickness design of the intermediate layer 112 of 0.3 - 0.8 mm plays a key role in transitioning and optimizing the heat - dissipation path, enhancing the uniformity of heat conduction inside the composite material, reducing the thermal resistance, and enabling heat to be transferred from the functional layer 113 to the base layer 111 more efficiently. The functional layer 113 with a thickness of 50 - 200 μm is in direct contact with the coolant or heat - dissipation medium. With its special nanostructure and the strengthening effect of silicon - carbide particles, it greatly improves the surface heat - dissipation efficiency, accelerates heat dissipation, and reduces the operating temperature of the processor.

[0026] The base layer 111 is formed by using copper as the matrix and adding 3 wt% of titanium; the intermediate layer 112 is a copper-based silicon carbide composite material, and the volume fraction of silicon carbide is 15% - 30%; the functional layer 113 is nanocrystalline silicon carbide, and the nanograin size is 20 - 50 nm. In this embodiment, the base layer 111 uses copper as the matrix and adds 3 wt% of titanium. The good electrical conductivity and thermal conductivity of copper lay the foundation for heat dissipation. The addition of titanium enhances the strength and corrosion resistance of the base layer 111, improves the stability and durability of the overall structure, and ensures long-term stable heat dissipation. For the copper-based silicon carbide composite material of the intermediate layer 112, the volume fraction of 15% - 30% of silicon carbide endows it with characteristics such as high hardness and low thermal expansion coefficient, which can effectively improve the thermomechanical properties of the heat dissipation structure, enhance the bonding force with the base layer 111 and the functional layer 113, optimize the heat conduction path, and reduce the thermal resistance. For the nanocrystalline silicon carbide of the functional layer 113, the nanograin size of 20 - 50 nm greatly increases the specific surface area and improves the surface heat dissipation efficiency. With its excellent high-temperature stability and wear resistance, it can maintain efficient heat dissipation under complex working conditions.

[0027] Refer to Figure 6 As shown, the injection angle of the micro-injection branch pipe 32 is 30° - 60°. A turbulence generator is arranged at the outlet of the micro-injection branch pipe 32. The turbulence generator includes a hemispherical pit array 321 and a nanowire fence structure 322, and the hemispherical pit array 321 and the nanowire fence structure 322 are arranged alternately. In this embodiment, the angle range enables the coolant to impact the fin surface along a suitable trajectory, which not only ensures that the coolant covers a sufficient heat dissipation area but also generates sufficient impact force, effectively breaking the boundary layer thermal resistance between the coolant and the fin surface and enhancing the convective heat transfer efficiency. The turbulence generator arranged at the outlet plays an important role. The hemispherical pit array 321 and the nanowire fence structure 322 are arranged alternately. The hemispherical pits can make the coolant form complex vortex flows, increase the disturbance inside the coolant, and improve the fluid mixing degree. The nanowire fence structure 322 further refines the flow field, strengthens the microscopic turbulence effect of the coolant, enables the coolant to fully contact the fin surface at the microscopic scale, and greatly improves the heat transfer coefficient between the coolant and the fins.

[0028] The preparation of the nano-porous thermal interface layer 2 includes: anodizing a copper substrate to form a CuO nanotube template; depositing silicon carbide nanowire networks by chemical vapor deposition; and electrochemically depositing graphene quantum dots with a deposition current density of 2 - 5 mA / cm². In this embodiment, the CuO nanotube template formed by anodizing the copper substrate greatly increases the specific surface area of the heat dissipation structure, provides more heat exchange sites, and effectively improves the heat transfer efficiency. Secondly, the SiC nanowire networks deposited by chemical vapor deposition have excellent thermal conductivity, like building highly efficient heat conduction channels, quickly conducting the heat generated by the processor and reducing heat accumulation. Moreover, the electrochemically deposited graphene quantum dots, at a deposition current density of 2 - 5 mA / cm², not only further improve the thermal resistance of the thermal interface but also enhance the liquid wettability of the surface of the heat dissipation structure, enabling the coolant to spread and flow better, optimizing the contact state between the coolant and the fins, and thus comprehensively improving the heat dissipation performance of the liquid-cooled fin heat dissipation structure.

[0029] It also includes a laser-induced hydrophilic modification area, where femtosecond laser is used to process on the surface of the heat dissipation fins to form: an array of microgrooves 12 with a groove depth of 50 - 200 μm and an aspect ratio of width to depth of 1:1 to 1:3. In this embodiment, the array of microgrooves 12 increases the surface roughness and specific surface area of the fins. The design with a groove depth of 50 - 200 μm and an aspect ratio of width to depth of 1:1 to 1:3 reduces the contact angle of the coolant on the fin surface, enhances the wettability of the coolant to the fin surface, enables the coolant to spread more evenly on the fin surface, and effectively improves the heat exchange conditions between the coolant and the fins. The laser-induced hydrophilic modification further optimizes the heat dissipation performance. These structures formed by femtosecond laser processing prompt the formation of a thinner and more uniform liquid film during the flow of the coolant, reduce the thermal resistance, improve the heat dissipation efficiency, and can transfer the heat generated by the processor more quickly and effectively, ensuring that the processor operates in a stable temperature environment.

[0030] In the above embodiments, the tests are carried out under the following conditions: Thermal resistance calculation:

[0031] Pressure drop measurement: A differential pressure sensor (range 0 - 100 kPa, accuracy ±0.5%) is used; Temperature uniformity: It is collected by an infrared thermal imager (FLIR A65, spatial resolution 0.05 °C); The following data are obtained from the verification of the basic performance:

[0032] The following data are obtained from the high-flow condition test:

[0033] The following data was obtained from the extreme heat dissipation capacity test:

[0034] (Note: The above data is based on the actual measurement of the NVIDIA A100 GPU module. The test environment temperature is 25±1°C, and the humidity is 50±5%). Refer to Figures 1 to 7 As shown, a manufacturing method of a liquid-cooled fin heat dissipation structure includes the liquid-cooled fin heat dissipation structure for a processor; the method includes the following steps: Step S1, gradient fin forming: Stacking silicon carbide particle-reinforced copper-based double-gradient nanostructured composite materials layer by layer using electron beam melting technology, with an electron beam current of 10-15 mA, a scanning speed of 2000-3000 mm / s, and a layer thickness of 40-60 μm; Step S2, internal flow channel processing: Manufacturing a spiral fractal flow channel 33 through two-photon polymerization 3D printing, with a laser wavelength of 780 nm, a pulse energy of 3-5 nJ, and a resolution of ±2 μm; Step S3, surface modification: Performing plasma electrolytic oxidation on the outer surface of the heat dissipation fin 11, with a voltage of 300-500 V, an electrolyte containing 10 g / L, 5 g / L of Na2SiO3 and silicon carbide nanoparticles, to generate a nano-porous thermal interface layer 2 with a thickness of 20-50 μm; The inner wall of the spiral fractal flow channel 33 is coated with an Al2O3 / TiO2 superlattice coating by atomic layer deposition, with a single-layer thickness of 0.5-1.5 nm and a total number of layers of 50-100 layers, and the interfacial thermal resistance ≤ 5×10 -9 m²·K / W. In the gradient fin forming step of this embodiment, the electron beam melting technology is used to stack silicon carbide particle-reinforced copper-based double-gradient nanostructured composite materials, and the electron beam current, scanning speed, and layer thickness are precisely controlled, enabling the preparation of gradient fins with excellent thermal conductivity and mechanical properties, which can efficiently conduct the heat generated by the processor and meet the high-power heat dissipation requirements. In the internal flow channel processing, a spiral fractal flow channel 33 is manufactured by two-photon polymerization 3D printing, and an Al2O3 / TiO2 superlattice coating is coated on its inner wall. The unique flow channel structure can effectively improve the flow uniformity and turbulence degree of the coolant, enhancing the convective heat transfer effect; the extremely low interfacial thermal resistance of the superlattice coating further reduces the thermal resistance during the heat transfer process, greatly improving the heat dissipation efficiency. The surface modification generates a nano-porous thermal interface layer 2 through plasma electrolytic oxidation, which can significantly increase the surface roughness, improve the surface heat dissipation coefficient, and optimize the heat exchange capacity between the heat dissipation fin 11 and the surrounding environment.

[0035] The above embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

1. A liquid-cooled fin-type heat dissipation structure for a processor, characterized in that: Comprising a composite fin unit, which is composed of a plurality of heat dissipation fins made of a silicon carbide particle-reinforced copper-based dual-gradient nanostructured composite material; a nanoporous thermal interface layer disposed on the outer surface of the heat dissipation fins, with the nanoporous thermal interface layer having a porosity of 40% - 60%, a pore diameter of 50 - 200 nm, and containing a graphene quantum dot reinforcement phase; and a two-phase cooling channel disposed inside the heat dissipation fins, the two-phase cooling channel including a main cooling channel, micro-injection branch pipes, and a spiral fractal channel. The main cooling channel extends along the length direction of the heat dissipation fins. There are a plurality of micro-injection branch pipes, and the plurality of micro-injection branch pipes are arranged in a fishbone shape on both sides of the main cooling channel. The spiral fractal channel is disposed on the outer periphery of the main cooling channel. The main cooling channel is provided with an inlet and an outlet, and multiple heat dissipation fins are connected through the inlet and the outlet.

2. The liquid-cooled fin heat dissipation structure for a processor according to claim 1, wherein: The hydraulic diameter of the main cooling channel is 1.5 - 3.0 mm; the diameter of the micro-injection branch pipe is 0.1 - 0.5 mm; the diameter of the spiral fractal channel is 0.3 - 1.2 mm, and the angle of the spiral lift angle is 25° - 45°.

3. The liquid-cooled fin heat dissipation structure for a processor according to claim 1, wherein: The fractal dimension of the spiral fractal channel is 1.5 - 1.8, and the adjacent channel spacing ratio satisfies: , where dn is the channel spacing of the nth stage.

4. The liquid-cooled fin heat dissipation structure for a processor according to claim 1, wherein: The silicon carbide particle-reinforced copper-based dual-gradient nanostructured composite material includes a base layer, an intermediate layer, and a functional layer arranged in sequence. The thickness of the base layer is 0.5 - 1.0 mm; the thickness of the intermediate layer is 0.3 - 0.8 mm; the thickness of the functional layer is 50 - 200 μm.

5. The liquid-cooled fin heat dissipation structure for a processor according to claim 4, characterized in that: The base layer is prepared by adding 3 wt% of titanium to a copper matrix.

6. The liquid-cooled fin heat dissipation structure for a processor according to claim 5, wherein: The intermediate layer is a copper-based silicon carbide composite material, and the volume fraction of silicon carbide is 15% - 30%; The functional layer is nanocrystalline silicon carbide, and the nanograin size is 20 - 50 nm.

7. The liquid-cooled fin heat dissipation structure for a processor according to claim 1, wherein: The injection angle of the micro-injection branch pipe is 30° - 60°, and a turbulence generator is provided at the outlet of the micro-injection branch pipe. The turbulence generator includes a hemispherical pit array and a nanowire fence structure, and the hemispherical pit array and the nanowire fence structure are arranged alternately.

8. The liquid-cooled fin heat dissipation structure for a processor according to claim 1, wherein: The preparation of the nanoporous thermal interface layer includes: forming a CuO nanotube template on a copper matrix by anodic oxidation; chemically vapor depositing silicon to generate a SiC nanowire network; electrochemically depositing graphene quantum dots with a deposition current density of 2 - 5 mA / cm².

9. The liquid-cooled fin heat dissipation structure for a processor according to claim 1, wherein: It further includes a laser-induced hydrophilic modification area, and a microgroove array is machined on the surface of the heat dissipation fins by femtosecond laser. The groove depth of the microgroove array is 50 - 200 μm, and the width-depth ratio is 1:1 to 1:

3.

10. A manufacturing method of a liquid-cooled finned heat dissipation structure, characterized in that: Comprising the liquid-cooled fin-type heat dissipation structure for a processor according to any one of claims 1 - 9; The method includes the following steps: Step S1, gradient fin forming: using an electron beam melting technology to stack the silicon carbide particle-reinforced copper-based dual-gradient nanostructured composite material layer by layer, with an electron beam current of 10 - 15 mA, a scanning speed of 2000 - 3000 mm / s, and a layer thickness of 40 - 60 μm; Step S2, inner flow channel processing: A spiral fractal flow channel is fabricated by two-photon polymerization 3D printing with a laser wavelength of 780 nm, a pulse energy of 3 - 5 nJ, and a resolution of ±2 μm. The inner wall of the spiral fractal flow channel is coated with an Al2O3 / TiO2 superlattice coating by atomic layer deposition, with a single-layer thickness of 0.5 - 1.5 nm, a total of 50 - 100 layers, and an interfacial thermal resistance ≤ 5×10 -9 m²·K / W; Step S3, surface modification: Perform plasma electrolytic oxidation on the outer surface of the heat dissipation fins at a voltage of 300 - 500 V. The electrolyte contains 10 g / L, 5 g / L of Na2SiO3 and silicon carbide nanoparticles to generate a nano-porous thermal interface layer with a thickness of 20 - 50 μm.

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