Environment-friendly intelligent card

Abstract

The utility model discloses an eco-friendly smart card comprising a wood chip material. The environment-friendly intelligent card comprises a card base, the card base comprises at least one functional layer, the at least one functional layer comprises a wood chip layer, and the wood chip layer comprises wood chip materials and bonding glue for bonding the wood chip materials; and the chip is fixed on the card base. Compared with a card base prepared from materials such as plastic, resin and metal in the prior art, the cost of the wood chip layer is lower, and the wood chip material is more environment-friendly and degradable and cannot damage the environment. The card base is a main body structure of the environment-friendly intelligent card, at least one functional layer in the card base comprises the wood chip layer, that is, at least one functional layer is prepared from the wood chip layer, and the wood chip layer comprises the wood chip material and the bonding glue for bonding the wood chip material, so that compared with a card base prepared from materials such as plastic, resin and metal in the prior art, the cost of the wood chip layer is lower; and the wood chip material is more environment-friendly and degradable, and cannot damage the environment.

Description

Technical Field

[0001] This application relates to the technical field of smart cards, and particularly to an environmentally friendly smart card. Background Art

[0002] A smart card generally refers to a card embedded with a chip module. Smart cards include standard cards with specific numerical dimensions and are made of plastic materials. Smart cards are media used to identify individuals and store personal information. Various smart cards, such as employee ID cards, identity cards, various financial transaction cards, membership cards, etc., have been widely used in people's lives.

[0003] Limited by the structural materials of existing smart cards, existing smart cards cannot meet the requirements for environmental protection. Summary of the Utility Model

[0004] The embodiments of this application provide an environmentally friendly smart card. Compared with the card base prepared from materials such as plastic, resin, and metal in the prior art, the sawdust layer has a lower cost, the sawdust material is more environmentally friendly and degradable, and will not cause damage to the environment.

[0005] The embodiments of this application provide an environmentally friendly smart card, including: a card base, the card base includes at least one functional layer, at least one of the functional layers includes a sawdust layer, the sawdust layer includes sawdust material and an adhesive for bonding the sawdust material; a chip module fixed to the card base.

[0006] According to the embodiment provided by this application, in the thickness direction of the card base, the functional layer includes a first substrate layer and a second substrate layer stacked; at least one of the first substrate layer and the second substrate layer includes the sawdust layer.

[0007] According to the embodiment provided by this application, it further includes an intermediate layer and a coil disposed between the first substrate layer and the second substrate layer, the coil is located in the intermediate layer, and the coil is electrically connected to the chip; at least one of the first substrate layer, the intermediate layer, and the second substrate layer includes the sawdust layer.

[0008] According to the embodiment provided by this application, the intermediate layer includes a first layer and a second layer stacked, and a weight is disposed between the first layer and the second layer.

[0009] According to the embodiment provided by this application, at least one of the first substrate layer, the intermediate layer, and the second substrate layer includes a poly(lactic acid) layer, a recycled polyvinyl chloride layer, a polyethylene terephthalate-1,4-cyclohexanedimethanol ester layer.

[0010] According to the embodiments provided by the present application, the first substrate layer includes a first slot, the intermediate layer and the second substrate layer are embedded in the first slot, and in the thickness direction of the card substrate, the orthographic projection areas of the intermediate layer and the second substrate layer on the first substrate layer are equal; or, the second substrate layer includes a first slot, the intermediate layer and the first substrate layer are embedded in the first slot, and in the thickness direction of the card substrate, the orthographic projection areas of the intermediate layer and the first substrate layer on the second substrate layer are equal.

[0011] According to the embodiments provided by the present application, an adhesive layer is provided between any two adjacent layers of the first substrate layer, the intermediate layer and the second substrate layer.

[0012] According to the embodiments provided by the present application, at least one of the first substrate layer and the second substrate layer includes a printed pattern layer, the wood chip layer, and a glue film layer or a glue layer.

[0013] According to the embodiments provided by the present application, a thickness compensation layer is provided between the first substrate layer and the intermediate layer; and / or, a thickness compensation layer is provided between the second substrate layer and the intermediate layer.

[0014] According to the embodiments provided by the present application, the card substrate is integrally prepared from the wood chip layer.

[0015] According to the embodiments provided by the present application, the wood chip material includes at least one of oak chips, pine chips, poplar wood chips, birch wood chips, oak wood chips, fir wood chips, beech wood chips, and bamboo chips; and / or, the wood chip layer includes a fragrance material.

[0016] According to the embodiments provided by the present application, the environmentally friendly smart card includes a chip module, the chip module includes a circuit board, the chip and a coil, the circuit board is provided with a printed circuit, and the chip and the coil are electrically connected to the printed circuit of the circuit board.

[0017] The environmentally friendly smart card provided by the embodiments of the present application includes a card substrate. The card substrate is the main structure of the environmentally friendly smart card. At least one functional layer in the card substrate includes a wood chip layer, that is, at least one functional layer is prepared from the wood chip layer. The wood chip layer includes a wood chip material and an adhesive for bonding the wood chip material. Compared with the card substrates prepared from materials such as plastics, resins, and metals in the prior art, the cost of the wood chip layer is lower, the wood chip material is more environmentally friendly and degradable, and it will not cause damage to the environment. Description of the Drawings

[0018] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the embodiments of the present application. Obviously, the accompanying drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0019] Figure 1 It is a schematic structural diagram of an environmental protection smart card according to an embodiment of the present application;

[0020] Figure 2 It is an embodiment of the present application Figure 1 The schematic cross-sectional view at A-A in;

[0021] Figure 3 It is another embodiment of the present application Figure 1 The schematic cross-sectional view at A-A in;

[0022] Figure 4 It is yet another embodiment of the present application Figure 1 The schematic cross-sectional view at A-A in;

[0023] Figure 5 It is yet another embodiment of the present application Figure 1 The schematic cross-sectional view at A-A in;

[0024] Figure 6 It is yet another embodiment of the present application Figure 1 The schematic cross-sectional view at A-A in.

[0025] Reference numerals:

[0026] 1. Card base; 11. First substrate layer; 12. Intermediate layer; 13. Second substrate layer;

[0027] 2. Chip module;

[0028] G. Functional layer; M. Wood chip layer; K1. First slot; L. Printed pattern layer; B. Thickness compensation layer; E. Adhesive film layer; J. Adhesive layer. Detailed implementation manners

[0029] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, many specific details are set forth in order to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0030] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. The embodiments will be described in detail below with reference to the accompanying drawings.

[0031] Relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0032] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "above" or "over" another layer or another region, it may mean directly above the other layer or another region, or there may be other layers or regions between it and the other layer or another region. And if the component is turned over, this layer or region will be "below" or "beneath" the other layer or another region.

[0033] In addition, the term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the front and back associated objects.

[0034] It should be understood that in the embodiments of the present application, "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0035] Figure 1 is a schematic structural diagram of an environmental protection smart card according to an embodiment of the present application; Figure 2 is an embodiment of the present application Figure 1 The cross-sectional schematic view at A-A in.

[0036] Please refer to Figure 1 and Figure 2 , the embodiments of the present application provide an environmental protection smart card, comprising: a card base 1, the card base 1 includes at least one functional layer G, at least one functional layer G includes a wood chip layer M, the wood chip layer M includes wood chip materials and an adhesive for bonding the wood chip materials; a chip, fixed to the card base 1.

[0037] The environmentally friendly smart card provided by the embodiment of the present application includes a card substrate 1. The card substrate 1 is the main structure of the environmentally friendly smart card. At least one functional layer G in the card substrate 1 includes a wood chip layer M, that is, at least one functional layer G is prepared from the wood chip layer M. The wood chip layer M includes wood chip materials and an adhesive for bonding the wood chip materials. Compared with the card substrate 1 prepared from materials such as plastic, resin, and metal in the prior art, the cost of the wood chip layer M is lower, the wood chip materials are more environmentally friendly and degradable, and will not cause damage to the environment.

[0038] Optionally, the wood chip materials include at least one of oak chips, pine chips, poplar wood chips, birch wood chips, oak chips, fir wood chips, beech wood chips, and bamboo chips; and / or, the wood chip layer M includes fragrance materials.

[0039] The specific selection of the wood chip materials can be considered in terms of cost and material properties. For example, oak chips can be used as the wood chip materials.

[0040] Materials that can produce fragrance, such as vanilla, sandalwood materials, agarwood materials, or micron-sized fragrance capsules, etc., can be added to the wood chip layer M to improve the user experience.

[0041] In this embodiment, when the environmentally friendly smart card is a non-contact card, the environmentally friendly smart card includes a chip and a coil electrically connected to the chip, and the coil powers the chip. The chip and the coil can be disposed inside the card substrate 1, as Figure 2 shown.

[0042] Optionally, the coil is arranged in a ring shape, and specifically can be arranged in a square or circular shape.

[0043] Optionally, the chip is close to the magnetic field of the card reader, and it is required that the induced current generated by the coil can supply non-contact communication. The larger the area surrounded by the coil, the larger the induced current generated by the coil.

[0044] When the environmentally friendly smart card is a contact card, the environmentally friendly smart card includes a chip module 2. The chip module 2 includes a chip and a carrier tape. There are contact pads on the front of the carrier tape to power the chip during contactless payment. The chip module 2 can be at least partially disposed in a groove on the surface of the card substrate 1.

[0045] When the environmentally friendly smart card is a dual-interface card, the environmentally friendly smart card includes a chip module 2 and a coil. The chip module 2 includes a chip and a carrier tape. There are contact pads on the front of the carrier tape to power the chip during contactless payment. The back of the carrier tape also includes contacts connected to the coil in the intermediate layer. During non-contact payment, the coil powers the chip.

[0046] Optionally, the carrier tape is provided with a chip bearing area and a plurality of functional areas that are isolated from each other. These functional areas are, in sequence, an input / output functional area, a clock functional area, a power functional area, a ground functional area, a reset functional area, and a vacant functional area.

[0047] The functional layer G may specifically include a substrate layer, an intermediate layer 12 for accommodating a fixed coil, a thickness compensation layer B, and other film layers.

[0048] Please refer to Figure 2 , in some alternative embodiments, in the thickness direction of the card substrate 1, the functional layer G includes a first substrate layer 11 and a second substrate layer 13 that are stacked; at least one of the first substrate layer 11 and the second substrate layer 13 includes a wood chip layer M.

[0049] The film layer structure provided in this embodiment can be applied to a contact card that does not require an intermediate layer. One of the first substrate layer 11 and the second substrate layer 13 may include a wood chip layer M. For example, the first substrate layer 11 includes a wood chip layer M, or the second substrate layer 13 includes a wood chip layer M. Alternatively, both the first substrate layer 11 and the second substrate layer 13 may include a wood chip layer M.

[0050] Optionally, the environmentally friendly smart card further includes an intermediate layer 12 and a coil disposed between the first substrate layer 11 and the second substrate layer 13. The coil is located in the intermediate layer 12, and the coil is electrically connected to the chip;

[0051] At least one of the first substrate layer 11, the intermediate layer 12, and the second substrate layer 13 includes a wood chip layer M.

[0052] The first substrate layer 11, the intermediate layer 12, and the second substrate layer 13 are all functional layers G of the card substrate 1.

[0053] In this embodiment, the intermediate layer 12 may include one layer or two layers. When the intermediate layer 12 is a single layer, the coil may be embedded in the intermediate layer 12. Alternatively, when the intermediate layer 12 includes two layers, the coil is located between the upper and lower intermediate layers 12. The coil is connected to the chip and generates an induced current in the alternating magnetic field of the card reader when entering the magnetic field to supply power to the chip and complete operations related to secure payment.

[0054] Optionally, when the intermediate layer includes two layers, a weight block is further included between the two intermediate layers. The coil is located outside the weight block, and the weight block may be made of a metal block. For example, the intermediate layer 12 includes a first layer and a second layer that are stacked, and a weight block is provided between the first layer and the second layer. By providing the weight block, the structural strength of the environmentally friendly smart card can be improved, making the environmentally friendly smart card not easily bent or damaged; and it can effectively increase the weight of the environmentally friendly smart card, making it easy for the user to discover when the environmentally friendly smart card drops or the like, thereby reducing the loss of the environmentally friendly smart card.

[0055] For a contactless card, the coil is directly connected to the chip and is located on the intermediate layer 12.

[0056] For a dual-interface card, the coil is connected to the chip of the chip module 2. The first substrate layer 11 is provided with a slot for accommodating the chip module 2. Both ends of the coil are respectively connected to the interfaces of the chip module 2.

[0057] At least one of the first substrate layer 11, the intermediate layer 12, and the second substrate layer 13 includes a wood chip layer M, which means that at least one of the first substrate layer 11, the intermediate layer 12, and the second substrate layer 13 can be prepared from wood chip materials and adhesives.

[0058] Except for the film layers formed by using wood chip materials in the first substrate layer 11, the intermediate layer 12, and the second substrate layer 13, other film layers can be made of other materials, such as other environmentally friendly materials.

[0059] Optionally, at least one of the first substrate layer 11, the intermediate layer 12, and the second substrate layer 13 includes a polylactide (PLA) layer, a recycled polyvinyl chloride (rPVC) layer, and a polyethylene terephthalate-1,4-cyclohexanedimethanol ester (PETG) layer. By using environmentally friendly materials to prepare the film layers of the environmentally friendly smart card, environmental damage can be avoided, and it is convenient for degradation or recycling.

[0060] In some alternative embodiments, the environmentally friendly smart card further includes a protective layer provided on the surface of the wood chip layer M.

[0061] By providing the protective layer, the wear resistance of the wood chip layer M can be improved, and the smoothness of its surface can be ensured. For example, when the first substrate layer 11 includes the wood chip layer M, the protective layer can be provided on the surface of the wood chip layer M facing away from the intermediate layer 12, that is, the exposed surface. The protective layer can specifically adopt an oil film layer, which can achieve lubrication while providing protection. For example, the protective layer can include a UV (UltraViolet) light-cured film, and the UV light-cured film can improve the gloss and wear resistance of the wood chip layer M.

[0062] Please refer to Figure 3 , in some alternative embodiments, the first substrate layer 11 includes a first slot K1, and the intermediate layer 12 and the second substrate layer 13 are embedded in the first slot K1. In the thickness direction of the card substrate 1, the orthographic projection areas of the intermediate layer 12 and the second substrate layer 13 on the first substrate layer 11 are equal; or, the second substrate layer 13 includes a first slot K1, and the intermediate layer 12 and the first substrate layer 11 are embedded in the first slot K1. In the thickness direction of the card substrate 1, the orthographic projection areas of the intermediate layer 12 and the first substrate layer 11 on the second substrate layer 13 are equal.

[0063] In this embodiment, the size of the second substrate layer 13 is set to be larger than those of the intermediate layer 12 and the first substrate layer 11. A first slot K1 is formed on the surface of the second substrate layer 13 to accommodate the intermediate layer 12 and the first substrate layer 11. The intermediate layer 12 and the first substrate layer 11 with smaller areas can adopt irregular shapes without special limitations. The orthographic projection areas of the intermediate layer 12 and the first substrate layer 11 on the second substrate layer 13 are equal, that is, their area sizes are equal, which is convenient for them to be arranged in the first slot K1 together.

[0064] Optionally, an adhesive layer is provided between any two adjacent layers of the first substrate layer 11, the intermediate layer 12, and the second substrate layer 13 to achieve tight connection between the film layers. The adhesive layer can be a liquid quick-drying glue or a double-sided tape.

[0065] Please refer to Figure 4 and Figure 5 , optionally, at least one of the first substrate layer 11 and the second substrate layer 13 includes a printed pattern layer L, a wood chip layer M, and a film adhesive layer E or an adhesive layer J printed pattern layer L. By preparing the printed pattern layer L additionally, it is convenient to display the patterns required for the environmentally friendly smart card. Alternatively, the first substrate layer 11 and the second substrate layer 13 can also each only include a layer of wood chip layer M. The pattern is prefabricated on the wood chip layer M or formed by engraving or other methods on the wood chip layer M, without the need to prepare the printed pattern layer L additionally.

[0066] Optionally, the printed pattern layer L can be formed into graphics and texts in the form of 3D printing or inkjet printing. Fragrance materials, such as micron-level fragrance capsules, can be added to the ink.

[0067] In some alternative embodiments, a thickness compensation layer B is provided between the first substrate layer 11 and the intermediate layer 12; and / or, a thickness compensation layer B is provided between the second substrate layer 13 and the intermediate layer 12.

[0068] It should be noted that in this embodiment, the thickness compensation layer B is used for thickness compensation in the thickness direction to ensure that the thickness dimensions of the environmentally friendly smart card all meet the processing requirements, so as to ensure normal card feeding on the processing equipment. Optionally, the thickness compensation layer B can be made of a PVC white substrate.

[0069] Please refer to Figure 4 , optionally, the first substrate layer 11 includes a wood chip layer M. A film adhesive layer E can be provided between the wood chip layer M and the thickness compensation layer B as a protective layer L1. One side of the film adhesive layer E has glue. In this embodiment, the glue surface is connected to the wood chip layer M, and the film is connected to the thickness compensation layer B.

[0070] Please refer to Figure 5 , or, the wood chip layer M and the thickness compensation layer B can also be directly connected through an adhesive layer J.

[0071] Please refer to Figure 6 Optionally, the card substrate 1 is integrally prepared from a wood chip layer M, that is, the overall structure of the card substrate 1 is formed by using wood materials and an adhesive. For a contact or dual-interface card, when the card substrate 1 is formed, a groove can be reserved for placing the chip module 2. The chip module 2 can be pasted onto the card substrate 1 through an adhesive material such as double-sided tape.

[0072] Optionally, in this embodiment, to further increase the winding area of the coil, the size of the chip can be increased so that the size of the chip is larger than that of the existing chips.

[0073] Optionally, the chip module 2 includes a circuit board, a chip, and a coil. The circuit board is provided with a printed circuit, and the chip and the coil can be electrically connected to the printed circuit of the circuit board. The chip is generally located within the area surrounded by the coil. When the coil approaches the card reader, the coil induces a current under the action of the magnetic field of the card reader to supply power to the circuit board, and the card reader reads and writes the stored information in the chip module 2 to realize non-contact communication.

[0074] The chip module 2 provided in the embodiment of the present application is set to a conventional shape such as a square, and can also be set to a circular shape, a waist shape, an irregular shape, or any other special-shaped shape.

[0075] The environmentally friendly smart card provided in the embodiment of the present application can be used to implement an electronic transaction function. The environmentally friendly smart card is a type of card with a predetermined length, width, and thickness, and also has portability and convenience in use. The environmentally friendly smart card can be a financial card, a credit card, a stored-value card, a bus card, an access control card, or a membership card, but is not limited to the card types listed above.

[0076] As described above, the above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An environmentally friendly smart card, characterized in that, Comprising: A card substrate, the card substrate including at least one functional layer, at least one of the functional layers including a wood chip layer, the wood chip layer including wood chip material and an adhesive for bonding the wood chip material, in the thickness direction of the card substrate, the functional layer including a first substrate layer and a second substrate layer arranged in a stacked manner; At least one of the first substrate layer and the second substrate layer includes the wood chip layer; A chip, fixed to the card substrate.

2. The environmentally friendly smart card according to claim 1, wherein Further including an intermediate layer and a coil disposed between the first substrate layer and the second substrate layer, the coil being located in the intermediate layer, the coil being electrically connected to the chip; At least one of the first substrate layer, the intermediate layer, and the second substrate layer includes the wood chip layer.

3. The environmental protection smart card according to claim 2, characterized in that, The intermediate layer includes a first layer and a second layer arranged in a stacked manner, and a weight is provided between the first layer and the second layer.

4. The environmental protection smart card according to claim 2, characterized in that, At least one of the first substrate layer, the intermediate layer, and the second substrate layer includes a polylactide layer, a recycled polyvinyl chloride layer, and a polyethylene terephthalate-1,4-cyclohexanedimethanol ester layer.

5. The environmentally friendly smart card according to claim 2, characterized in that, The first substrate layer includes a first slot, the intermediate layer and the second substrate layer are embedded in the first slot, in the thickness direction of the card substrate, the orthographic projection areas of the intermediate layer and the second substrate layer on the first substrate layer are equal; or, the second substrate layer includes a first slot, the intermediate layer and the first substrate layer are embedded in the first slot, in the thickness direction of the card substrate, the orthographic projection areas of the intermediate layer and the first substrate layer on the second substrate layer are equal.

6. The environmental protection smart card according to claim 2, characterized in that, An adhesive layer is provided between any two adjacent layers of the first substrate layer, the intermediate layer, and the second substrate layer.

7. The environmentally friendly smart card according to claim 1, wherein At least one of the first substrate layer and the second substrate layer includes a printed pattern layer, the wood chip layer, and a film adhesive layer or an adhesive layer.

8. The environmentally friendly smart card according to claim 2, characterized in that, A thickness compensation layer is provided between the first substrate layer and the intermediate layer; and / or, A thickness compensation layer is provided between the second substrate layer and the intermediate layer.

9. The environmental protection smart card according to claim 1, wherein The card substrate is integrally prepared from the wood chip layer.

10. The environmentally friendly smart card according to claim 1, characterized in that, The environmental protection intelligent card includes a chip module, the chip module including a circuit board, the chip, and a coil, the circuit board being provided with a printed circuit, the chip and the coil being electrically connected to the printed circuit of the circuit board.

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