Data storage device and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, in particular to a data storage device, which comprises a heat conducting piece, a circuit board and a fan, the heat conducting piece is arranged on the circuit board, a plurality of radiating fins convexly extend on the surface of the heat conducting piece away from the heat conducting piece, the radiating fins are arranged at intervals, any two adjacent radiating fins form a plurality of radiating channels, and the radiating channels are communicated with the circuit board. The fan is arranged on the surface, away from the circuit board, of the heat conduction piece. An air outlet of the fan faces one end of each heat dissipation channel. When the data storage device generates heat, the heat conduction piece guides the heat of the circuit board to the heat dissipation channel, and the fan drives airflow to flow along the heat dissipation channel to take away the heat in the heat dissipation channel, so that the data storage device has good heat dissipation performance, the risk of damage to the data storage device can be reduced, and the service life of the data storage device is prolonged. And the service life of the data storage device is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic devices, in particular to a data storage device and an electronic device. Background Art

[0002] Common electronic devices include computers, tablets or mobile phones, etc. These electronic devices are usually provided with data storage devices, such as memory cards or solid-state drives. The data storage device is installed on the main body of the electronic device to provide storage space for the electronic device. In the prior art, the heat generated by the data storage device is dissipated by contacting the gas in its own environment and transferring the heat to the gas.

[0003] However, in the process of implementing the present utility model, the inventor found that: as the storage capacity of the data storage device increases, more heat is generated, resulting in too high a temperature of the data storage device, which greatly affects the service life of the data storage device and even causes damage to the data storage device. Summary of the Utility Model

[0004] The present utility model provides a data storage device, which has good heat dissipation performance, can reduce the risk of damage to the data storage device, and improve the service life of the data storage device.

[0005] To solve the above technical problems, one technical solution adopted by the present utility model is: to provide a data storage device, including a circuit board, a heat conducting member and a fan. The heat conducting member is disposed on the circuit board. A plurality of heat dissipation fins protrude from the surface of the heat conducting member facing away from the circuit board. The plurality of heat dissipation fins are spaced apart, and a plurality of heat dissipation channels are formed between any two adjacent heat dissipation fins. The heat conducting member is used to direct the heat of the circuit board to the heat dissipation channels; a fan is disposed on the surface of the heat conducting member facing away from the circuit board, and the air outlet of the fan faces the port at one end of the plurality of heat dissipation channels. The fan is used to drive the air flow to flow along the heat dissipation channels to take away the heat in the heat dissipation channels.

[0006] Optionally, the plurality of heat dissipation channels are arranged around the fan.

[0007] Optionally, the heat dissipation channels include a horizontal channel and a vertical channel, and the horizontal channel is perpendicular to the vertical channel.

[0008] Optionally, the circuit board is provided with a chip component; the data storage device further includes a thermal paste, and the thermal paste is disposed between the chip component and the heat conducting member. One end of the thermal paste abuts against the chip component, and the other end of the thermal paste abuts against the heat conducting member.

[0009] Optionally, a power device is provided on the circuit board; the data storage device further includes a first heat conduction member, one end of the first heat conduction member abuts against the power device, and the other end of the first heat conduction member abuts against the heat conduction member.

[0010] Optionally, the data storage device further includes a bottom case and a second heat conduction member. The bottom case is provided with a mounting groove, the circuit board is located in the mounting groove, and the second heat conduction member is disposed between the bottom of the mounting groove and the circuit board.

[0011] Optionally, the bottom case includes a bottom plate, a first bending portion, and a second bending portion. The first bending portion and the second bending portion are oppositely disposed on the bottom plate, so that the bottom plate, the first bending portion, and the second bending portion jointly enclose to form the mounting groove.

[0012] Optionally, a fixing portion extends from one end of the bottom case toward the mounting groove. The fixing portion is provided with a first through hole; the heat conduction member is provided with a first screw hole; the data storage device further includes a first bolt, and the first bolt passes through the first through hole and is screwed into the first screw hole.

[0013] Optionally, a groove is provided on the side wall of the heat conduction member, the first screw hole is located at the bottom of the groove, and the first bolt and the fixing portion are both received in the groove.

[0014] To solve the above technical problems, a technical solution adopted by the present utility model is: to provide an electronic device, including an electronic device main body and the above-mentioned data storage device, and the data storage device is disposed on the electronic device main body.

[0015] The beneficial effects of the embodiments of the present application are: to provide a data storage device, the data storage device includes a heat conduction member, a circuit board, and a fan. The heat conduction member is disposed on the circuit board. A plurality of heat dissipation fins protrude from the surface of the heat conduction member facing away from the heat conduction member. The plurality of heat dissipation fins are spaced apart, and a plurality of heat dissipation channels are formed between any two adjacent heat dissipation fins. The fan is disposed on the surface of the heat conduction member facing away from the circuit board, and the air outlet of the fan faces the port at one end of the plurality of heat dissipation channels. When the data storage device generates heat, the heat conduction member guides the heat of the circuit board to the heat dissipation channels, and the fan drives the air flow to flow along the heat dissipation channels to take away the heat in the heat dissipation channels. Compared with the prior art, the data storage device has good heat dissipation performance, can reduce the risk of damage to the data storage device, and can improve the service life of the data storage device. Description of the Drawings

[0016] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments of the present application. Obviously, the following described drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the drawings.

[0017] Figure 1 is a view of a data storage device provided by the present utility model;

[0018] Figure 2 is an exploded view of a data storage device provided by the present utility model.

[0019] Reference numerals:

[0020] 100, data storage device; 10, heat conducting member; 11, heat dissipation fins; 10a, heat dissipation channel; 10a1, horizontal channel; 10a2, vertical channel; 10b, first screw hole; 10c, groove; 20, circuit board; 21, chip component; 22, power device; 23, board body; 31, blade; 32, mounting bracket; 30, fan; 40, thermal paste; 50, first heat conduction member; 60, bottom case; 60a, mounting groove; 61, bottom plate; 62, first bending portion; 63, second bending portion; 64, fixing portion; 70, second heat conduction member; 80, first bolt. Detailed embodiments

[0021] To facilitate the understanding of the present utility model, the following will further illustrate the present utility model in more detail in conjunction with the drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are only for the purpose of illustration.

[0022] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in this specification in the description of the present utility model are only for the purpose of describing specific embodiments and are not used to limit the present utility model. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0023] Please refer to Figure 1, the data storage device 100 includes a heat conducting member 10, a circuit board 20, and a fan 30. The heat conducting member 10 is located between the circuit board 20 and the fan 30. The heat conducting member 10 is disposed on the circuit board 20, and the fan 30 is disposed on the heat conducting member 10. When the circuit board 20 generates heat, the heat of the circuit board 20 is conducted to the heat conducting member 10, and the fan 30 can drive the air flow to blow towards the heat conducting member 10 or extract the gas near the heat conducting member 10, thereby realizing the heat dissipation of the data storage device 100.

[0024] For the above heat conducting member 10, please refer to Figure 2 , a plurality of heat dissipation fins 11 protrude from the surface of the heat conducting member 10 facing away from the heat conducting member 10. The plurality of heat dissipation fins 11 are spaced apart, and a plurality of heat dissipation channels 10a are formed between any two adjacent heat dissipation fins 11. The fan 30 is disposed on the surface of the heat conducting member 10 facing away from the circuit board 20, and the air outlet of the fan 30 faces the port at one end of the plurality of heat dissipation channels 10a. When the data storage device 100 generates heat, the heat conducting member 10 guides the heat of the circuit board 20 to the heat dissipation channels, and the fan 30 drives the air flow to flow along the heat dissipation channels to take away the heat in the heat dissipation channels. Optionally, the heat conducting member 10 is made of at least one of aluminum, copper, or silver. Exemplarily, the aluminum heat conducting member 10 has good heat conduction, is light in weight, and has a low usage cost.

[0025] Optionally, the plurality of heat dissipation channels 10a are arranged around the fan 30. When the fan 30 drives the air flow to flow along the heat dissipation channels 10a, the air flow driven by the fan 30 acts uniformly on the heat dissipation channels 10a to achieve a good heat dissipation effect.

[0026] Optionally, the above heat dissipation channels 10a include a transverse channel 10a1 and a vertical channel 10a2 that are interconnected, and the transverse channel 10a1 is perpendicular to the vertical channel 10a2. When the fan 30 drives the air flow to flow along the heat dissipation channels 10a, the fluidity of the air flow in the transverse channel 10a1 and the vertical channel 10a2 is increased, and the heat dissipation effect of the data storage device 100 is improved.

[0027] For the above circuit board 20, please refer to Figure 2 , the circuit board 20 includes a chip component 21, a power device 22, and a board body 23. The chip component 21 is disposed on the board body 23, part of the power device 22 is disposed at one end of the board body 23, and the other part of the power device 22 is disposed at the other end of the board body 23. It should be noted that the power device 22 is a component that can generate heat for the data storage device 100, such as a power converter of a computer, a capacitor, a solid-state drive, or a graphics card, etc., which can generate heat.

[0028] For the above fan 30, please refer to Figure 2, the fan 30 includes blades 31 and a mounting bracket 32. The blades 31 are fixed to the mounting bracket 32. The heat conducting member 10 is provided with a fan 30 groove, and the mounting bracket 32 is disposed in the fan 30 groove.

[0029] In some embodiments, referring to Figure 2 , the data storage device 100 further includes a thermal paste 40. The thermal paste 40 is disposed between the chip component 21 and the heat conducting member 10. One end of the thermal paste 40 abuts against the chip component 21, and the other end of the thermal paste 40 abuts against the heat conducting member 10. It can be understood that the thermal paste 40 fills the gap between the chip component 21 and the heat conducting member 10, so that the heat of the chip component 21 can be quickly conducted to the heat conducting member 10, reducing the heat generated by the chip component 21 from staying between the chip component 21 and the heat conducting member 10. In addition, the thermal paste 40 also has an elastic function. When an external force is applied to the heat conducting member 10 towards the chip component 21, the heat conducting member 10 has a tendency to move towards the chip component 21, causing the heat conducting member 10 to undergo elastic deformation. Since the heat conducting member 10 has elasticity, the heat conducting member 10 undergoes elastic deformation in the radial direction and generates a reaction force. The reaction force can resist the movement of the heat conducting member 10 towards the chip component 21, thereby slowing down the movement of the heat conducting member 10 towards the circuit board 20, that is, the thermal paste 40 has a buffering function. The thermal paste 40 is a liquid substance of a polymer. The thermal paste 40 includes at least one of silicone resin, polyurethane, acrylate polymer, or hot melt adhesive.

[0030] In some embodiments, referring to Figure 2 , the data storage device 100 further includes a first heat conducting member 50. One end of the first heat conducting member 50 abuts against the power device 22 of the circuit board 20, and the other end of the first heat conducting member 50 abuts against the heat conducting member 10. It can be understood that the first heat conducting member 50 is located in the gap between the power device 22 and the heat conducting member 10, so that the heat of the power device 22 can be quickly conducted to the heat conducting member 10.

[0031] For the above-mentioned data storage device 100, referring to Figure 2 , the data storage device 100 further includes a bottom case 60 and a second heat conducting member 70. The bottom case 60 is provided with a mounting groove 60a. The circuit board 20 is located in the mounting groove 60a. The second heat conducting member 70 is disposed between the bottom of the mounting groove 60a and the circuit board 20. The second heat conducting member 70 fills the gap between the bottom case 60 and the circuit board 20, further improving the heat transfer efficiency between the circuit board 20 and the bottom case 60, increasing the heat dissipation effect of the data storage device 100 and extending the service life of the data storage device 100.

[0032] The bottom case 60 described above extends towards one end of the installation groove 60a, and the fixing part 64 is provided with a first through hole 60b. The heat conducting member 10 is provided with a first screw hole 10b. The data storage device 100 further includes a first bolt 80. After passing through the first through hole 60b, the first bolt 80 is screwed into the first screw hole 10b, further realizing that the heat conducting member 10 and the bottom case 60 jointly clamp the first heat conducting member 50, the second heat conducting member 70, and the circuit board 20, reducing the detachment of the first heat conducting member 50, the second heat conducting member 70, and the circuit board 20 from the heat conducting member 10, and reducing the gaps between the heat conducting member 10, the first heat conducting member 50, the second heat conducting member 70, the circuit board 20, and the bottom case 60 pairwise, further improving the heat conduction efficiency.

[0033] Regarding the above-mentioned bottom case 60, the bottom case 60 includes a bottom plate 61, a first bending part 62, and a second bending part 63. The first bending part 62 and the second bending part 63 are oppositely arranged on the bottom plate 61, so that the bottom plate 61, the first bending part 62, and the second bending part 63 jointly enclose to form an installation groove 60a. Optionally, the number of the fixing parts 64 is multiple, part of the fixing parts 64 are arranged on the first bending part 62, and the other part of the fixing parts 64 are arranged on the second bending part 63.

[0034] In some embodiments, a groove 10c is provided on the side wall of the heat conducting member 10. The first screw hole 10b is located at the bottom of the groove 10c. The first bolt 80 and the fixing part 64 are both received in the groove 10c. The groove 10c not only has a good positioning effect, but also avoids the first bolt 80 protruding from the groove 10c, increasing the aesthetics of the data storage device 100 and reducing the risk of the first bolt 80 scratching the user.

[0035] In the embodiments of the present application, a data storage device 100 is provided. The data storage device 100 includes a heat conducting member 10, a circuit board 20, and a fan 30. The heat conducting member 10 is arranged on the circuit board 20. A plurality of heat dissipation fins 11 protrude from the surface of the heat conducting member 10 facing away from the heat conducting member 10. The plurality of heat dissipation fins 11 are arranged at intervals, and a plurality of heat dissipation channels 10a are formed between any two adjacent heat dissipation fins 11. The fan 30 is arranged on the surface of the heat conducting member 10 facing away from the circuit board 20, and the air outlet of the fan 30 faces the port at one end of the plurality of heat dissipation channels 10a. When the data storage device 100 generates heat, the heat conducting member 10 guides the heat of the circuit board 20 to the heat dissipation channels 10a, and the fan 30 drives the air flow to flow along the heat dissipation channels 10a to take away the heat in the heat dissipation channels 10a. Compared with the prior art, the data storage device 100 has good heat dissipation performance, can reduce the risk of damage to the data storage device 100, and improve the service life of the data storage device 100.

[0036] The present utility model further provides an embodiment of an electronic device. The electronic device includes an electronic device main body and the above data storage device 100. The electronic device main body is provided with a socket, and the connection end of the circuit board 20 of the data storage device 100 is plugged into the socket, so as to realize the installation of the data storage device 100 and provide conditions for electronic data storage for the electronic device.

[0037] The bottom case 60 is further provided with a limiting portion, and the circuit board 20 abuts against the limiting portion 65. When the data storage device 100 is plugged into an external electronic device main body, it prevents the circuit board 20 from moving in a direction away from the plugging direction.

[0038] For the connection between the data storage device 100 and the electronic device main body, the circuit board 20 is provided with a second through hole 20a, the electronic device main body is provided with a second screw hole, and the electronic device further includes a second bolt. The second bolt passes through the second through hole 20a and is screwed into the second screw hole, so as to install the data storage device 100 on the electronic device main body. In addition, the heat conducting member 10 is provided with an avoidance hole 10e, and the avoidance hole 10e corresponds to the second through hole 20a, which facilitates the user to dock the manual handle with the second bolt to tighten or loosen the second bolt.

[0039] For the specific structure and function of the data storage device 100, reference may be made to the above embodiments, and details will not be described herein one by one.

[0040] It should be noted that the description and drawings of the present utility model give preferred embodiments of the present utility model. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments are not additional limitations to the content of the present utility model. The purpose of providing these embodiments is to make the understanding of the disclosed content of the present utility model more thorough and comprehensive. Further, the above technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as within the scope described in the description of the present utility model; furthermore, for those of ordinary skill in the art, modifications or changes can be made according to the above description, and all such modifications and changes should fall within the protection scope of the appended claims of the present utility model.

Claims

1. A data storage device, characterized in that, Comprising: A circuit board; A heat conducting member disposed on the circuit board, a plurality of heat dissipation fins protruding from a surface of the heat conducting member facing away from the circuit board, the plurality of heat dissipation fins being spaced apart, and a plurality of heat dissipation channels being formed between any two adjacent heat dissipation fins, the heat conducting member being configured to direct heat of the circuit board to the heat dissipation channels; A fan disposed on a surface of the heat conducting member facing away from the circuit board, an air outlet of the fan facing a port at one end of the plurality of heat dissipation channels, the fan being configured to drive air flow along the heat dissipation channels to take away heat in the heat dissipation channels.

2. The data storage device according to claim 1, wherein The plurality of heat dissipation channels are disposed around the fan.

3. The data storage device according to claim 2, wherein The heat dissipation channels include a horizontal channel and a vertical channel, and the horizontal channel is perpendicular to the vertical channel.

4. The data storage device according to claim 1, wherein The circuit board is provided with a chip component; The data storage device further includes a thermal paste, the thermal paste being disposed between the chip component and the heat conducting member, one end of the thermal paste abutting against the chip component, and the other end of the thermal paste abutting against the heat conducting member.

5. The data storage device according to claim 4, wherein The circuit board is provided with a power device; The data storage device further includes a first heat conducting member, one end of the first heat conducting member abutting against the power device, and the other end of the first heat conducting member abutting against the heat conducting member.

6. The data storage device according to any one of claims 1-5, wherein The data storage device further includes a bottom case and a second heat conducting member, the bottom case is provided with a mounting groove, the circuit board is located in the mounting groove, and the second heat conducting member is disposed between a bottom of the mounting groove and the circuit board.

7. The data storage device according to claim 6, wherein The bottom case includes a bottom plate, a first bending portion and a second bending portion, the first bending portion and the second bending portion are oppositely disposed on the bottom plate, so that the bottom plate, the first bending portion and the second bending portion jointly enclose to form the mounting groove.

8. The data storage device according to claim 6, wherein The bottom case extends towards one end of the mounting groove to have a fixing portion, the fixing portion is provided with a first through hole; The heat conducting member is provided with a first screw hole; The data storage device further includes a first bolt, the first bolt passes through the first through hole and is screwed into the first screw hole.

9. The data storage device according to claim 8, wherein A groove is disposed on a side wall of the heat conducting member, the first screw hole is located at a bottom of the groove, and the first bolt and the fixing portion are both received in the groove.

10. An electronic device, characterized in that, Comprising an electronic device main body and the data storage device according to any one of claims 1-9, the data storage device being disposed on the electronic device main body.

Images