Substrate mapping device

Abstract

The utility model provides a substrate mapping device which comprises a base, a motor, a belt gear set, a first mapping sensor, a second mapping sensor and a control module. The motor is arranged on the base. The belt gear set is arranged on the base and connected with the motor so as to be driven by the motor. The first mapping sensor and the second mapping sensor are movably arranged on the base and connected with the belt gear set. The control module is electrically connected with the motor, the first mapping sensor and the second mapping sensor. The control module drives the first mapping sensor and the second mapping sensor to move relatively through the motor and the belt gear set. The substrate mapping device provided by the utility model can adapt to substrates with different sizes through the sensor mechanism with variable spacing, so that the application range of the substrate mapping device is expanded.

Description

Technical Field

[0001] The utility model relates to a substrate mapping device. Background Art

[0002] Engineers familiar with the manufacturing of semiconductor integrated circuits must know that dedicated IC foundries divide semiconductor manufacturing processes into four main manufacturing processes: etching, photolithography, diffusion, and thin film. In other words, during the process of manufacturing multiple integrated circuit (IC) chips on a wafer, these four manufacturing processes are repeatedly executed until an electronic circuit including multiple active components (i.e., transistors) and multiple passive components is implemented in each IC chip. To facilitate the movement of a batch of wafers from one manufacturing station to another, dedicated IC foundries usually accommodate a batch of wafers in a wafer carrier (commonly referred to as a cassette in the industry). In addition, considering the safety and automation of wafer loading / unloading from the wafer carrier, dedicated IC foundries further purchase a wafer loader (load port) and a substrate transfer device (i.e., a robotic arm) to load / unload wafers from the wafer carrier.

[0003] In these semiconductor manufacturing devices, a single substrate or a substrate stack (such as the above-mentioned wafers, masks, thin film frames, or trays, etc.) can be held in various positions. The physical state of the substrate at each of these positions can be one of many, including but not limited to non-existent, existent, double-slot-embedded, cross-slot-embedded, and shifted / tilted. Usually, the physical state of each substrate at the holding position is determined (or mapped) to facilitate substrate processing within the semiconductor manufacturing device. Summary of the Utility Model

[0004] The utility model provides a substrate mapping device, which can adapt to different sizes of substrates through a sensor mechanism with variable spacing, so as to improve its application range.

[0005] A substrate mapping device of the utility model includes a base, a motor, a belt and gear set, a first mapping sensor, a second mapping sensor, and a control module. The motor is arranged on the base. The belt and gear set is arranged on the base and connected to the motor to be driven by the motor. The first mapping sensor and the second mapping sensor are respectively movably arranged on the base and connected to the belt and gear set. The control module is electrically connected to the motor, the first mapping sensor, and the second mapping sensor. The control module drives the first mapping sensor and the second mapping sensor to move relative to each other through the motor and the belt and gear set.

[0006] In an embodiment of the present utility model, the above belt gear set provides a closed-loop driving path, and the first mapping sensor and the second mapping sensor are arranged on opposite sides of the belt gear set, so that when the motor drives the belt gear set, the moving directions of the first mapping sensor and the second mapping sensor are opposite and they move closer to each other or move away from each other relatively.

[0007] In an embodiment of the present utility model, it further includes a track. The first moving member of the first mapping sensor and the second moving member of the second mapping sensor are respectively movably arranged on the track which is arranged thereon.

[0008] In an embodiment of the present utility model, the above first mapping sensor further includes a first sensing unit and a first clamping portion. The first moving member is connected between the first sensing unit and the first clamping portion. The first clamping portion clamps one side of the belt of the belt gear set, and the control module is electrically connected to the first sensing unit.

[0009] In an embodiment of the present utility model, the above second mapping sensor further includes a second sensing unit and a second clamping portion. The second moving member is connected between the second sensing unit and the second clamping portion. The second clamping portion clamps the other side of the belt of the belt gear set, and the control module is electrically connected to the second sensing unit.

[0010] In an embodiment of the present utility model, the above belt gear set includes two gears opposite to each other and a belt sleeved on the gears in a transmissible manner. One of the two gears is coaxially arranged with the motor.

[0011] In an embodiment of the present utility model, it further includes an encoder which is arranged on the base and is located opposite to the motor. The control module is electrically connected to the encoder, and the other one of the two gears is coaxially arranged with the encoder.

[0012] In an embodiment of the present utility model, the above belt is divided into two sides with opposite moving directions between the two gears. The first clamping portion of the first mapping sensor clamps one of the two sides, and the second clamping portion of the second mapping sensor clamps the other one of the two sides.

[0013] In an embodiment of the present utility model, it further includes a robotic arm, wherein the base and the arm of the robotic arm are an integral structure.

[0014] In an embodiment of the present utility model, the above arm is the terminal arm of the robotic arm. The robotic arm further includes a stage for clamping and carrying a substrate. The stage extends away from the base in a back-to-back manner. The moving planes of the first mapping sensor and the second mapping sensor are coplanar with the stage or are two parallel planes to each other.

[0015] Based on the above, due to the settings of the motor and the belt gear set in the substrate mapping device, the first and second mapping sensors are synchronously driven accordingly, making the distance between them variable, and further achieving the effect of stepless variation to adapt to substrates of different sizes. This makes the substrate mapping device change from a fixed sensing range to a movable sensing range, improving its applicable range and facilitating the mapping operation in a narrow (wafer cassette) space.

[0016] To make the above features and advantages of the present invention more obvious and understandable, specific embodiments are given below and detailed descriptions are provided in conjunction with the accompanying drawings as follows. Brief Description of the Drawings

[0017] Figure 1 is a schematic diagram of a substrate mapping device according to an embodiment of the present invention;

[0018] Figure 2 is Figure 1 a partial component schematic diagram of the mapping module;

[0019] Figure 3 is Figure 1 a partial component schematic diagram of the mapping module;

[0020] Figure 4 shows partial components of the mapping module from another perspective;

[0021] Figure 5 is an electrical relationship diagram of partial components of the substrate mapping device;

[0022] Figure 6 is a top view of the mapping module. Detailed Description of the Embodiment

[0023] Figure 1 is a schematic diagram of a substrate mapping device according to an embodiment of the present invention. Please refer to Figure 1 , in this embodiment, the substrate mapping device 10 includes a mapping module 100 and a robotic arm 200. The robotic arm 200 includes a body 210 and a first arm 220, a second arm 230, a third arm 240, and a fourth arm 250 pivotally arranged thereon in sequence. The first arm 220 is pivotally arranged on the body 210 along the rotation axis AX1, the second arm 230 is pivotally arranged on the first arm 220 along the rotation axis AX2, the third arm 240 is pivotally arranged on the second arm 230 along the rotation axis AX3, and the fourth arm 250 is pivotally arranged on the third arm 240 along the rotation axis AX4. The fourth arm 250 is the terminal arm of the robotic arm 200, and the mapping module 100 is arranged on the fourth arm 250.

[0024] Figure 2 is Figure 1 a partial component schematic diagram of the mapping module. Figure 3 is Figure 1Schematic diagram of some components of the mapping module. Figure 4 Shows some components of the mapping module from another perspective. Please also refer to Figures 2 to 4 , the mapping module 100 of the substrate mapping device 10 includes a base 110, a motor 120, a belt and gear set 130, a first mapping sensor 150, and a second mapping sensor 160. As Figure 2 shown, the fourth arm portion 250 of the robotic arm 200 further includes an arm body 251 and a stage 252. The base 110 of the mapping module 100 and the arm body 251 are of an integral structure. The stage 252 is used to clamp and carry a substrate (or wafer), and the stage 252 extends in a back-to-back manner with respect to the base 110. Here, the active (sensing) planes of the first mapping sensor 150 and the second mapping sensor 160 are coplanar with the stage 252 or are two parallel planes to each other. Accordingly, before the robotic arm 200 takes out the substrate (or wafer) from the cassette (not shown), the mapping module 100 can first map the substrate in the cassette.

[0025] Furthermore, the motor 120 is disposed on the base 110. The belt and gear set 130 is disposed on the base 110 and is connected to the motor 120 to be driven by the motor 120. The first mapping sensor 150 and the second mapping sensor 160 are respectively movably disposed on the base 110 and are connected to the belt and gear set 130.

[0026] Figure 5 Is the electrical relationship diagram of some components of the substrate mapping device. Please refer to Figure 5 And compare with Figures 2 to 4 any one of, the substrate mapping device 10 further includes a control module CM, which is electrically connected to the motor 120, the first mapping sensor 150, the second mapping sensor 160, and the relevant motors of the aforementioned robotic arm 200. In addition to controlling and driving the operation of each arm of the robotic arm 200 and clamping and carrying the substrate (or wafer), the control module CM also drives the relative movement of the first mapping sensor 150 and the second mapping sensor 160 through the motor 120 and the belt and gear set 130, as detailed later.

[0027] Please also refer to Figures 2 to 4, in this embodiment, the mapping module 100 further includes a track 140 disposed on the base 110. The first mapping sensor 150 includes a first moving member 152, a first sensing unit 151, and a first clamping portion 153, wherein the first moving member 152 is movably disposed on the track 140, and the first moving member 152 is connected between the first sensing unit 151 and the first clamping portion 153. Similarly, the second mapping sensor 160 includes a second moving member 162, a second sensing unit 161, and a second clamping portion 163, wherein the second moving member 162 is movably disposed on the track 140, and the second moving member 162 is connected between the second sensing unit 161 and the second clamping portion 163.

[0028] Furthermore, the belt gear set 130 includes gears 131, 132 and a belt 133, and the mapping module 100 further includes an encoder 170 disposed on the base 110, wherein the gear 131 and the motor 120 are coaxially disposed, the encoder 170 and the gear 132 are coaxially disposed, and the belt 133 is movably sleeved on the gears 131, 132, and the encoder 170 is electrically connected to the control module CM. The first clamping portion 153 of the first mapping sensor 150 and the second clamping portion 163 of the second mapping sensor 160 respectively clamp the belt 133. Accordingly, when the control module CM drives the motor 120, the driving effect generated by the gears 131, 132 and the belt 133 can be used to drive the first mapping sensor 150 and the second mapping sensor 160 to generate relative movement, and the movement speed and stroke provided by the motor 120 can be controlled through the encoder 170.

[0029] Figure 6 is a top view of the mapping module. Please refer to Figure 6 , as the corresponding configuration of the aforementioned gears 131, 132 and the belt 133, the belt gear set 130 provides a closed-loop driving path. Furthermore, since the belt 133 is divided into two sides with opposite moving directions between the two gears 131, 132, the first clamping portion 153 of the first mapping sensor 150 clamps one of the two sides, and the second clamping portion 163 of the second mapping sensor 160 clamps the other of the two sides (that is, the first mapping sensor 150 and the second mapping sensor 160 are disposed on opposite sides of the belt gear set 130). Therefore, when the belt gear set 130 operates, it will drive the first mapping sensor 150 and the second mapping sensor 160 to move in opposite directions, and generate a movement state of moving relatively closer to each other or moving relatively away from each other synchronously. In this way, the distances d1, d2 between the first mapping sensor 150 and the second mapping sensor 160 can be changed according to requirements. As Figure 6As shown, when the substrates (or wafers) W1, W2, and W3 to be clamped or carried by the robotic arm 200 are of different sizes, the mapping module 100 can first adjust their appropriate spacings d1 and d2 for the corresponding sizes, then map the substrates W1, W2, or W3 in the storage box, and finally pick up and place the substrates W1, W2, or W3 with the stage 252. Here, the spacings d1 and d2 are only for illustration. In actual operation, since the control module CM can control the stroke of the motor 120 by the encoder 170, the first mapping sensor 150 and the second mapping sensor 160 of this embodiment can be stopped at any position on the track 140 to achieve the effect of stepless adjustment.

[0030] In addition, the mapping module 100 of this embodiment further includes stop posts 181 and 182, which are respectively disposed on the substrate 110 and at opposite ends of the track 140 to provide end stops for the first moving member 152 and the second moving member 162 to prevent them from detaching from the track 140.

[0031] In summary, in the above embodiments of the present invention, the substrate mapping device drives the first and second mapping sensors synchronously through the setting of the motor and the belt and gear set, so that their spacing becomes variable and the user can make corresponding adjustments according to the size of the substrate. In other words, the user no longer needs to replace the corresponding mapping device due to the change of the substrate size.

[0032] Furthermore, since the mapping sensors are coupled to the track of the substrate by the moving members and the spacing of the mapping sensors is changed by driving the belt and gear set with the motor, the effect of stepless change can be smoothly achieved to adapt to substrates of different sizes. This makes the substrate mapping device change from a fixed sensing range to a movable sensing range, so as to improve its application range and is beneficial to perform mapping operations in a narrow (wafer box) space.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A substrate mapping device, characterized in that, Comprising: A base; A motor, disposed on the base; A belt gear set, disposed on the base and connected to the motor to be driven by the motor; A first mapping sensor, movably disposed on the base and connected to the belt gear set; A second mapping sensor, movably disposed on the base and connected to the belt gear set; And A control module, electrically connected to the motor, the first mapping sensor and the second mapping sensor, wherein the control module drives the first mapping sensor and the second mapping sensor to move relatively synchronously through the motor and the belt gear set.

2. The substrate mapping device according to claim 1, wherein The belt gear set provides a closed-loop driving path, and the first mapping sensor and the second mapping sensor are disposed on opposite sides of the belt gear set, so that when the motor drives the belt gear set, the moving directions of the first mapping sensor and the second mapping sensor are opposite and they move relatively closer to each other or relatively farther away from each other.

3. The substrate mapping device according to claim 1, characterized in that, It further includes a track, disposed on the base, and a first moving member of the first mapping sensor and a second moving member of the second mapping sensor are respectively movably disposed on the track.

4. The substrate mapping device according to claim 3, wherein The first mapping sensor further includes a first sensing unit and a first clamping portion, the first moving member is connected between the first sensing unit and the first clamping portion, the first clamping portion clamps one side of the belt of the belt gear set, and the control module is electrically connected to the first sensing unit.

5. The substrate mapping device according to claim 3, wherein The second mapping sensor further includes a second sensing unit and a second clamping portion, the second moving member is connected between the second sensing unit and the second clamping portion, the second clamping portion clamps the other side of the belt of the belt gear set, and the control module is electrically connected to the second sensing unit.

6. The substrate mapping device according to claim 1, characterized in that, The belt gear set includes two gears opposite to each other and a belt sleeved on the two gears in a transmissible manner, and one of the two gears is coaxially disposed with the motor.

7. The substrate mapping device according to claim 6, wherein It further includes an encoder, disposed on the base and located opposite to the motor, the control module is electrically connected to the encoder, and the other of the two gears is coaxially disposed with the encoder.

8. The substrate mapping device according to claim 6, wherein The belt is divided into two sides with opposite moving directions between the two gears, the first clamping portion of the first mapping sensor clamps one of the two sides, and the second clamping portion of the second mapping sensor clamps the other of the two sides.

9. The substrate mapping device according to claim 1, wherein It further includes a robotic arm, wherein the base and the arm portion of the robotic arm are an integral structure.

10. The substrate mapping device according to claim 9, wherein, The arm portion is the terminal arm portion of the robotic arm, the robotic arm further includes a stage for clamping and carrying a substrate, the stage is a mechanism extending back-to-back relative to the base, and the moving planes of the first mapping sensor and the second mapping sensor are coplanar with the stage or two parallel planes to each other.

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