Chip turnover mechanism for semiconductor flip chip mounting

Abstract

The utility model relates to a chip turnover mechanism for semiconductor flip chip mounting, which comprises a mounting plate and an extension plate, a turnover shaft and a driving assembly for driving the turnover shaft to rotate are arranged below the extension plate, a turnover table is arranged at the front end of the turnover shaft, the driving assembly comprises an air cylinder, a piston rod of the air cylinder extends along the front-back direction, and the piston rod of the air cylinder is connected with the mounting plate. A piston rod is arranged on the turnover shaft, a vertical rod is arranged on the piston rod, a cylinder is fixedly arranged on the turnover shaft in a sleeving and coaxial mode, a spiral groove is formed in the circumferential outer wall of the cylinder, and one end of the vertical rod is arranged on the spiral groove; the air cylinder is arranged below the overturning shaft, and the axial direction of the overturning shaft and the piston rod of the air cylinder are arranged in the same direction, so that the overturning mechanism is more compact, the size of equipment is reduced, and the manufacturing cost is reduced; the cylinder piston rod drives the vertical rod to move back and forth, so that the vertical rod moves in the spiral groove of the cylinder, the cylinder and the turnover shaft are driven to rotate, the turnover action is achieved, the structure is simple, and installation is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, and particularly relates to a chip flipping mechanism for semiconductor flip-chip bonding. Background Art

[0002] Chinese Patent Publication No. CN221149976U discloses a chip flipping mechanism for semiconductor flip-chip bonding, which includes a flap, a mounting bracket arranged on the flap, a driving component arranged on the mounting bracket, a flipping shaft connected to the driving component, and a folding plate arranged on the flipping shaft; although this structure can solve the problem of relatively large volume of the mechanism to a certain extent, however, the installation position of its flipping shaft and the cylinder is in a vertical state, which also occupies a certain space, and its structure is not the optimal; therefore, it is necessary to optimize its structure to further reduce the volume of the flipping mechanism and shrink the space of the equipment. Summary of the Utility Model

[0003] The utility model aims to solve at least one of the problems existing in the related prior art to some extent. For this reason, the utility model provides a chip flipping mechanism for semiconductor flip-chip bonding.

[0004] To achieve the above object, the utility model provides the following technical solution:

[0005] A chip flipping mechanism for semiconductor flip-chip bonding includes a mounting plate, an extension plate is arranged on the front side of the mounting plate, a flipping shaft and a driving component for driving the flipping shaft to rotate are arranged below the extension plate, the axial direction of the flipping shaft extends along the front-back direction, and a flipping table is arranged at the front end of the flipping shaft. The driving component includes a cylinder, the piston rod of the cylinder extends along the front-back direction, and a vertical rod is arranged on the piston rod. A cylinder is coaxially and fixedly sleeved on the flipping shaft, a spiral groove is arranged on the circumferential outer wall of the cylinder, and one end of the vertical rod is arranged on the spiral groove.

[0006] In some embodiments, a plurality of bearing seats are spaced at intervals in the front-back direction on the lower side of the extension plate, and the flipping shaft passes through the bearing seats.

[0007] In some embodiments, a cylinder mounting seat is arranged on the lower side of the extension plate, and the cylinder is mounted on the cylinder mounting seat.

[0008] In some embodiments, the mounting plate and the extension plate are integrally bent and formed.

[0009] In some embodiments, a plurality of mounting through holes are arranged on both the mounting plate and the extension plate.

[0010] In some embodiments, the turning table includes a support plate provided on the turning shaft, an adsorption platform is provided on the support plate, and a plurality of air holes are provided on the adsorption platform.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] 1. The cylinder is arranged below the turning shaft, and the axial direction of the turning shaft is the same as that of the piston rod of the cylinder, so that the turning mechanism is more compact, the volume of the equipment is reduced, and the manufacturing cost is lowered;

[0013] 2. The piston rod of the cylinder drives the vertical rod to move back and forth, so that the vertical rod moves in the spiral groove of the cylinder, thereby driving the cylinder and the turning shaft to rotate and realizing the turning action. The structure is simple and the installation is convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a three-dimensional schematic diagram of the present utility model;

[0015] Figure 2 is a front view schematic diagram of the present utility model;

[0016] Figure 3 is a top view schematic diagram of the present utility model;

[0017] Figure 4 is a partial exploded schematic diagram of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The following specific implementation content provides various different embodiments or examples for implementing the present utility model. Of course, these are only embodiments or examples and are not intended to be restrictive. Additionally, repeated reference numerals may be used in different embodiments, such as repeated numbers and / or letters. These repetitions are for the purpose of simply and clearly describing the present utility model and do not represent a specific relationship between the different embodiments and / or structures discussed.

[0019] As Figures 1-4 shown, a chip turning mechanism for semiconductor flip-chip bonding includes a mounting plate 1, an extension plate 2 is provided on the front side of the mounting plate 1, a turning shaft 3 and a driving component for driving the turning shaft 3 to rotate are provided below the extension plate 2. The axial direction of the turning shaft 3 extends in the front-rear direction, and a turning table 9 is provided at the front end of the turning shaft 3. The driving component includes a cylinder 4. The piston rod of the cylinder 4 extends in the front-rear direction, and a vertical rod 5 is provided on the piston rod. A cylinder 6 is fixedly sleeved on the turning shaft 3 coaxially. A spiral groove 7 is provided on the circumferential outer wall of the cylinder 6, and one end of the vertical rod 5 is arranged on the spiral groove 7.

[0020] In the flipping mechanism of the present utility model, the air cylinder 4 is arranged below the flipping shaft 3, and the axial direction of the flipping shaft 3 is the same as that of the piston rod of the air cylinder 4, so that the flipping mechanism is more compact, reducing the volume of the equipment and the manufacturing cost.

[0021] In addition, the piston rod of the air cylinder drives the vertical rod 5 to move back and forth, so that the vertical rod 5 moves in the spiral groove 7 of the cylinder 6, thereby driving the cylinder 6 and the flipping shaft 3 to rotate and realizing the flipping action. The structure is simple and the installation is convenient.

[0022] See Figures 1-2 As shown, several bearing seats 21 are spaced apart from front to back on the lower side of the extension plate 2. The flipping shaft 3 passes through the bearing seats 21. Under the action of the bearing seats 21, the flipping shaft 3 can rotate more smoothly.

[0023] In addition, a bearing is also arranged at the tail end of the flipping shaft 3, and the bearing is installed on the mounting plate 1.

[0024] Furthermore, an air cylinder mounting seat 31 is arranged on the lower side of the extension plate 2, and the air cylinder 4 is installed on the air cylinder mounting seat 31, so that the flipping mechanism is more compact.

[0025] In the present utility model, the mounting plate 1 and the extension plate 2 are integrally bent and formed.

[0026] In the present utility model, several mounting through holes 51 are arranged on both the mounting plate 1 and the extension plate 2, and it is installed on the equipment through the mounting through holes 51.

[0027] In the present utility model, the flipping table 9 includes a support plate 61 arranged on the flipping shaft 3. An adsorption platform 62 is arranged on the support plate 61. Several air holes 63 are arranged on the adsorption platform 62. The air holes 63 are connected to a vacuum pump through an air pipe. Under the negative pressure generated by the vacuum pump, the chip cartridge is adsorbed and fixed on the adsorption platform 62.

[0028] Combined with the drawings and the above display and description, the basic principles, main features and advantages of the present utility model have been described. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A chip flipping mechanism for semiconductor flip-chip bonding, comprising a mounting plate (1), an extension plate (2) is arranged on the front side of the mounting plate (1), a flipping shaft (3) and a driving assembly for driving the flipping shaft (3) to rotate are arranged below the extension plate (2), the axial direction of the flipping shaft (3) extends in the front-rear direction, and a flipping table (9) is arranged at the front end of the flipping shaft (3), and it is characterized in that: The driving assembly includes a cylinder (4), the piston rod of the cylinder (4) extends in the front-rear direction, and a vertical rod (5) is arranged on the piston rod. A cylinder (6) arranged coaxially is fixedly sleeved on the turning shaft (3). A spiral groove (7) is arranged on the circumferential outer wall of the cylinder (6), and one end of the vertical rod (5) is arranged on the spiral groove (7).

2. The chip flipping mechanism for semiconductor flip-chip bonding according to claim 1, wherein: A plurality of bearing seats (21) are spaced at intervals in the front-rear direction on the lower side of the extension plate (2), and the turning shaft (3) passes through the bearing seats (21).

3. The chip flipping mechanism for semiconductor flip-chip bonding according to claim 2, characterized in that: A cylinder mounting seat (31) is arranged on the lower side of the extension plate (2), and the cylinder (4) is mounted on the cylinder mounting seat (31).

4. A chip flipping mechanism for semiconductor flip-chip bonding according to claim 1, characterized in that: The mounting plate (1) and the extension plate (2) are integrally bent and formed.

5. A chip flipping mechanism for semiconductor flip-chip bonding according to claim 1, characterized in that: A plurality of mounting through holes (51) are arranged on both the mounting plate (1) and the extension plate (2).

6. A chip flipping mechanism for semiconductor flip-chip bonding according to claim 1, characterized in that: The turning table (9) includes a support plate (61) arranged on the turning shaft (3). An adsorption platform (62) is arranged on the support plate (61), and a plurality of air holes (63) are arranged on the adsorption platform (62).

Images