Half silicon wafer aligning and placing device
Through the visual correction of the half-piece silicon wafer alignment and three-axis adjustment platform linkage, the problem of changing the position of the silicon wafer in the carrier pit is solved, and the precise alignment and embedding of the silicon wafer is achieved, and processing efficiency and product quality are improved.
Patent Information
- Application Number
- CN202421834729.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-07-31
AI Technical Summary
In the prior art, silicon wafers are prone to change positions when loading into the loading pit, resulting in edge-to-edge phenomenon, affecting processing efficiency and product defect rate.
A half-piece silicon wafer alignment and swaying device is adopted, including a silicon wafer connecting table mechanism, a visual mechanism and a silicon wafer alignment adjustment mechanism. Through visual correction and a three-axis adjustment platform, precise alignment and embedding of the silicon wafer and the carrier pit are achieved.
This greatly reduces the phenomenon of silicon wafer edges, improves production efficiency, ensures that the silicon wafer is accurately embedded in the carrier pit, and improves processing quality and efficiency.
Smart Images
Figure CN223079102U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of crystal solar cell processing, and specifically relates to a semi-sheet silicon wafer alignment and placement device. Background Technique
[0002] A crystal solar cell panel is a device that converts solar energy into electrical energy using the photovoltaic effect. A crystal solar cell panel is also called a photovoltaic solar cell panel, which is usually composed of multiple photovoltaic cells. These photovoltaic cells absorb sunlight and convert it into direct current electrical energy. These panels can be installed on the roofs, ground or other appropriate areas of buildings for power generation or power supply. As an important means of clean energy power generation, photovoltaic solar cell panels are receiving increasing attention and widespread application. Globally, governments and enterprises are investing in photovoltaic power generation projects to reduce dependence on traditional fossil fuels, reduce environmental pollution and promote sustainable development.
[0003] In the process of crystal solar cell processing and production, it is usually necessary to embed solar cell silicon wafers into the carrier fixture. Therefore, when the solar cell silicon wafers are loaded into the carrier fixture, the silicon wafers need to be aligned with the carrier pits, and then placed into the pits by the placement mechanism. Currently, the above-mentioned carrier placement process usually uses a suction cup hand to pick up the positioned silicon wafers and directly put them into the carrier pits. Since the suction cup hand is likely to cause the positioned silicon wafers to change their positions during the process of picking up the positioned silicon wafers, some silicon wafers will have a lapping phenomenon, that is, the silicon wafers cannot be placed into the carrier pits as expected, resulting in a high rejection rate of the products and affecting the processing efficiency. In view of this, the utility model provides a semi-sheet silicon wafer alignment and placement device. Summary of the Utility Model
[0004] To solve the above problems, the utility model provides a semi-sheet silicon wafer alignment and placement device, which can perform position calibration and adjustment when the silicon wafers are moved into the carrier pits, enable the silicon wafers to be accurately embedded into the carrier pits, greatly reduce the defective phenomena caused by silicon wafer lapping, and improve the production efficiency.
[0005] The utility model is realized through the following technical solutions:
[0006] A semi-sheet silicon wafer alignment and placement device includes
[0007] A silicon wafer splicing table mechanism, which is provided with carrier pits for receiving and placing silicon wafers;
[0008] A vision mechanism, which is arranged above the silicon wafer splicing table mechanism for aligning and correcting the silicon wafers and the carrier pits;
[0009] The silicon wafer alignment adjustment mechanism is arranged below the silicon wafer bonding table mechanism and is electrically connected to the vision mechanism, and is used for aligning and correcting the silicon wafer and the carrier plate pit and embedding the positioned silicon wafer into the carrier plate pit.
[0010] As a preferred technical solution, the vision mechanism includes a vision camera and an L-shaped fixing plate, and the vision camera is fixed on the L-shaped fixing plate.
[0011] As a preferred technical solution, the vision mechanism further includes a positive light source shooting plate, a positive light source hole is arranged in the middle of the positive light source shooting plate, and the vision camera is arranged directly above the positive light source hole.
[0012] As a preferred technical solution, the silicon wafer alignment adjustment mechanism includes an XYR three-axis adjustment platform, the carrier plate pit includes a first pit position, the silicon wafer alignment adjustment mechanism further includes a first backlight plate, a first silicon wafer suction cup and a first silicon wafer lifting cylinder, the first backlight plate corresponds to the first pit position, the first silicon wafer suction cup is arranged in the first backlight plate, the upper end of the first silicon wafer lifting cylinder is connected to the first backlight plate, and the lower end is connected to the XYR three-axis adjustment platform.
[0013] As a preferred technical solution, the carrier plate pit further includes a second pit position, the silicon wafer alignment adjustment mechanism further includes a second backlight plate, a second silicon wafer suction cup and a second silicon wafer lifting cylinder, the second backlight plate corresponds to the second pit position, the second silicon wafer suction cup is arranged in the second backlight plate, the upper end of the second lifting cylinder is connected to the second backlight plate, and the lower end is connected to the XYR three-axis adjustment platform.
[0014] As a preferred technical solution, the carrier plate pit further includes a third pit position, the silicon wafer alignment adjustment mechanism further includes a third backlight plate, a third silicon wafer suction cup and a third silicon wafer lifting cylinder, the third backlight plate corresponds to the third pit position, the third silicon wafer suction cup is arranged in the third backlight plate, the upper end of the third lifting cylinder is connected to the third backlight plate, and the lower end is connected to the XYR three-axis adjustment platform.
[0015] As a preferred technical solution, the carrier plate pit further includes a fourth pit position, the silicon wafer alignment adjustment mechanism further includes a fourth backlight plate, a fourth silicon wafer suction cup and a fourth silicon wafer lifting cylinder, the fourth backlight plate corresponds to the fourth pit position, the fourth silicon wafer suction cup is arranged in the fourth backlight plate, the upper end of the fourth lifting cylinder is connected to the fourth backlight plate, and the lower end is connected to the XYR three-axis adjustment platform.
[0016] Beneficial effects:
[0017] 1. The utility model undertakes and places silicon wafers through the carrier plate pits arranged on the silicon wafer bonding table mechanism, and uses the vision mechanism and the vision alignment adjustment mechanism to correct the alignment of the silicon wafers and the carrier plate pits. After the alignment is completed, the positioned silicon wafers are embedded into the carrier plate pits through the silicon wafer alignment adjustment mechanism. Position calibration and adjustment can be carried out when the silicon wafers are moved into the carrier plate pits for placement, enabling the silicon wafers to be accurately embedded into the carrier plate pits, greatly reducing the defective phenomena caused by silicon wafer overlap, and improving production efficiency.
[0018] 2. The utility model is provided with four carrier plate pits on the silicon wafer bonding table mechanism, and correspondingly, four sets of backlight plates, silicon wafer suction cups, and silicon wafer lifting cylinders are arranged on the silicon wafer alignment adjustment mechanism. The four sets of backlight plates, silicon wafer suction cups, and silicon wafer lifting cylinders are uniformly linked and adjusted by the XYR three-axis adjustment platform and the vision mechanism to achieve the position alignment of the silicon wafers and the carrier plate pits. The whole set of equipment can complete the adjustment, alignment, and embedding of four silicon wafers, with high processing efficiency. Description of the Drawings
[0019] Figure 1 It is the overall assembly drawing of the structure of a half-silicon wafer alignment and placement device;
[0020] Figure 2 It is Figure 1 the detailed structure drawing of the vision mechanism in
[0021] Figure 3 It is Figure 1 the detailed structure drawing of the silicon wafer bonding table mechanism and the silicon wafer alignment adjustment mechanism in
[0022] Figure 4 It is Figure 3 the front view structure schematic diagram of the first backlight plate, the first silicon wafer suction cup, and the first silicon wafer lifting cylinder in
[0023] Reference Signs in the Drawings:
[0024] 1. Vision mechanism; 2. Silicon wafer bonding table mechanism; 3. Silicon wafer alignment adjustment mechanism; 4. Carrier plate pit; 5. First pit position; 6. Second pit position; 7. Third pit position; 8. Fourth pit position; 11. L-shaped fixing plate; 12. Vision camera; 13. Positive light emitting plate; 14. Positive light hole; 31. XYR three-axis adjustment platform; 32. First silicon wafer lifting cylinder; 33. First silicon wafer suction cup; 34. First backlight plate. Detailed Embodiment
[0025] For further public disclosure of the technical solution of the present utility model, the following clearly and completely describes a half-silicon wafer alignment and placement device with reference to the drawings.
[0026] It should be noted that the terms such as "inside", "middle", and "one" cited in this specification are only for the convenience of clear description, rather than used to limit the scope of implementation of the present utility model. The change or adjustment of their relative relationship, without substantial change in the technical content, should also be regarded as the scope of implementation of the present utility model. This is stated first for clarity.
[0027] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation to the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood through specific circumstances.
[0028] Embodiment:
[0029] Please refer to Figures 1 to 4 , specifically refer to the attached Figure 1 , the present utility model provides a semi - wafer alignment and placement device, which includes a wafer receiving and placing table mechanism 2 for receiving and placing wafers, a vision mechanism 1 for aligning and correcting the wafers and the carrier plate pits, and a wafer alignment adjustment mechanism 3 for aligning and correcting the wafers and the carrier plate pits and embedding the positioned wafers into the carrier plate pits. The wafer receiving and placing table mechanism 2 is provided with a carrier plate pit 4. The vision mechanism 1 is arranged above the wafer receiving and placing table mechanism 2. The wafer alignment adjustment mechanism 3 is arranged below the wafer receiving and placing table mechanism 2 and is electrically connected to the vision mechanism 1. During operation, the wafers are received and placed through the carrier plate pit 4 provided on the wafer receiving and placing table mechanism 2. The wafers and the carrier plate pits are aligned and corrected through the vision mechanism 1 and the wafer alignment adjustment mechanism 3. After alignment, the positioned wafers are embedded into the carrier plate pits through the wafer alignment adjustment mechanism 3.
[0030] In this embodiment, please refer to the attached Figure 2, the vision mechanism 1 includes a vision camera 12 and an L-shaped fixing plate 11. The vision camera 12 is fixed on the L-shaped fixing plate 11. The vision mechanism 1 further includes a positive light source shooting plate 13. A positive light source hole 14 is provided in the middle of the positive light source shooting plate 13. The vision camera 12 is arranged directly above the positive light source hole 14. The vision camera 12 is fixed directly above the silicon wafer bonding table mechanism 2 through the L-shaped fixing plate 11. The vision camera 12 takes pictures through the positive light source emitted from the positive light source hole 14 in the middle of the positive light source shooting plate 13. That is, the vision camera 12 records the pit position of the carrier plate pit 4 in one shot. After the silicon wafer is placed, the position of the silicon wafer is reflected by the backlight emitted from the backlight plate. The vision camera 12 takes a second picture to compare the offset from the pit position. Then, the silicon wafer alignment adjustment mechanism 3 adjusts according to the position offset feedback by vision, and adjusts the silicon wafer well in four times.
[0031] In this embodiment, please refer to the attached Figure 3 and the attached Figure 4 , four carrier plate pits 4 are provided on the silicon wafer bonding table mechanism 2. An XYR three-axis adjustment platform 31 is provided on the silicon wafer alignment adjustment mechanism 3. Four sets of backlight plates, silicon wafer suction cups and silicon wafer lifting cylinders are provided on the XYR three-axis adjustment platform 31. Each set of backlight plates, silicon wafer suction cups and silicon wafer lifting cylinders corresponds to a carrier plate pit 4 to adjust and position a silicon wafer.
[0032] That is, the silicon wafer alignment adjustment mechanism 3 includes an XYR three-axis adjustment platform 31. The carrier plate pit 4 includes a first pit position 5. The silicon wafer alignment adjustment mechanism 3 further includes a first backlight plate 34, a first silicon wafer suction cup 33 and a first silicon wafer lifting cylinder 32. The first backlight plate 34 corresponds to the first pit position 5. The first silicon wafer suction cup 33 is arranged inside the first backlight plate 34. The upper end of the first silicon wafer lifting cylinder 32 is connected to the first backlight plate 34, and the lower end is connected to the XYR three-axis adjustment platform 31.
[0033] The carrier plate pit 4 further includes a second pit position 6. The silicon wafer alignment adjustment mechanism 3 further includes a second backlight plate, a second silicon wafer suction cup and a second silicon wafer lifting cylinder. The second backlight plate corresponds to the second pit position 6. The second silicon wafer suction cup is arranged inside the second backlight plate. The upper end of the second lifting cylinder is connected to the second backlight plate, and the lower end is connected to the XYR three-axis adjustment platform 31.
[0034] The carrier plate pit 4 further includes a third pit position 7. The silicon wafer alignment adjustment mechanism 3 further includes a third backlight plate, a third silicon wafer suction cup, and a third silicon wafer lifting cylinder. The third backlight plate corresponds to the third pit position 7. The third silicon wafer suction cup is disposed within the third backlight plate. The upper end of the third lifting cylinder is connected to the third backlight plate, and the lower end is connected to the XYR three-axis adjustment platform 31.
[0035] The carrier plate pit 4 further includes a fourth pit position 8. The silicon wafer alignment adjustment mechanism 3 further includes a fourth backlight plate, a fourth silicon wafer suction cup, and a fourth silicon wafer lifting cylinder. The fourth backlight plate corresponds to the fourth pit position 8. The fourth silicon wafer suction cup is disposed within the fourth backlight plate. The upper end of the fourth lifting cylinder is connected to the fourth backlight plate, and the lower end is connected to the XYR three-axis adjustment platform 31.
[0036] It should be noted that the four pit positions on the carrier plate pit 4 respectively correspond to four sets of backlight plates, silicon wafer suction cups, and silicon wafer lifting cylinders. Each set of backlight plates, silicon wafer suction cups, and silicon wafer lifting cylinders is adjusted by the XYR three-axis adjustment platform 31. The silicon wafers are adjusted four times. The structure of each pit position and each set of backlight plates, silicon wafer suction cups, and silicon wafer lifting cylinders is the same. Here, the first pit position 5, the first backlight plate 34, the first silicon wafer suction cup 33, and the first silicon wafer lifting cylinder 32 are used to illustrate the mechanism. Since the structures of the other backlight plates, silicon wafer suction cups, and silicon wafer lifting cylinders are the same, only the second, third, and fourth are used for differential description, so they are not marked in the drawings either.
[0037] The working principle of the present invention is as follows: The vision camera 12 takes the first photo and records the position of the first pit position 5. The first silicon wafer lifting cylinder 32 rises, and the first backlight plate 34 is placed above the first pit position 5. The silicon wafer is moved above the first pit position 5 through the transplanting tool, and the silicon wafer is placed on the first backlight plate 34. The silicon wafer is vacuum adsorbed by the first silicon wafer suction cup 33. The vision camera 12 takes the second photo, calculates the offset of the silicon wafer, and feeds it back to the PLC. The PLC feeds back the obtained offset to the XYR three-axis adjustment platform 31 for offset adjustment to align the silicon wafer with the first pit position 5. After the adjustment is completed, the first silicon wafer lifting cylinder 32 descends to complete the alignment and embedding. After the first pit position 5 completes the alignment and embedding, the other pit positions sequentially complete the alignment and falling into the pit actions. It should be noted that the transplanting of four silicon wafers can be completed at one time. After each pit position completes the alignment, the silicon wafer lifting cylinders have all descended, and the alignment of other pit positions will not be affected during the offset adjustment.
[0038] With the above structure, the utility model can perform position calibration adjustment when the silicon wafer is moved into the carrier plate pit, enabling the silicon wafer to be accurately embedded in the carrier plate pit, greatly reducing the defective phenomena caused by the silicon wafer overlapping the edge, improving production efficiency, and at the same time having a delicate structure and high automation degree. A set of operations can complete the alignment adjustment and embedding of four silicon wafers, greatly improving the working efficiency and being easier to control.
[0039] The utility model is not limited to the above implementation forms. If various changes or deformations of the utility model do not depart from the spirit and scope of the utility model, and provided that these changes and deformations are within the scope of the claims of the utility model and equivalent technologies, the utility model also includes these deformations and changes.
Claims
1. A semi - wafer alignment and placement device, characterized in that: including a silicon wafer bonding table mechanism, which is provided with a carrier plate pit for receiving and placing silicon wafers; a vision mechanism, which is arranged above the silicon wafer bonding table mechanism and is used for aligning and correcting the silicon wafers and the carrier plate pit; a silicon wafer alignment adjustment mechanism, which is arranged below the silicon wafer bonding table mechanism and is electrically connected to the vision mechanism, and is used for aligning and correcting the silicon wafers and the carrier plate pit and embedding the positioned silicon wafers into the carrier plate pit.
2. The half-silicon-wafer alignment and placement device according to claim 1, characterized in that: The vision mechanism includes a vision camera and an L-shaped fixing plate, and the vision camera is fixed on the L-shaped fixing plate.
3. The half-silicon-wafer alignment and placement device according to claim 2, characterized in that: The vision mechanism further includes a positive light source shooting plate, a positive light source hole is arranged in the middle of the positive light source shooting plate, and the vision camera is arranged directly above the positive light source hole.
4. The half-wafer alignment and placement device according to claim 1, wherein: The silicon wafer alignment adjustment mechanism includes an XYR three-axis adjustment platform, the carrier plate pit includes a first pit position, the silicon wafer alignment adjustment mechanism further includes a first backlight plate, a first silicon wafer suction cup and a first silicon wafer lifting cylinder, the first backlight plate corresponds to the first pit position, the first silicon wafer suction cup is arranged in the first backlight plate, the upper end of the first silicon wafer lifting cylinder is connected to the first backlight plate, and the lower end is connected to the XYR three-axis adjustment platform.
5. The half-silicon-wafer alignment and placement device according to claim 4, characterized in that: The carrier plate pit further includes a second pit position, the silicon wafer alignment adjustment mechanism further includes a second backlight plate, a second silicon wafer suction cup and a second silicon wafer lifting cylinder, the second backlight plate corresponds to the second pit position, the second silicon wafer suction cup is arranged in the second backlight plate, the upper end of the second silicon wafer lifting cylinder is connected to the second backlight plate, and the lower end is connected to the XYR three-axis adjustment platform.
6. The half - wafer alignment and placement device according to claim 4, characterized in that: The carrier plate pit further includes a third pit position, the silicon wafer alignment adjustment mechanism further includes a third backlight plate, a third silicon wafer suction cup and a third silicon wafer lifting cylinder, the third backlight plate corresponds to the third pit position, the third silicon wafer suction cup is arranged in the third backlight plate, the upper end of the third silicon wafer lifting cylinder is connected to the third backlight plate, and the lower end is connected to the XYR three-axis adjustment platform.
7. The semi-silicon wafer alignment and placement device according to claim 4, characterized in that: The carrier plate pit further includes a fourth pit position, the silicon wafer alignment adjustment mechanism further includes a fourth backlight plate, a fourth silicon wafer suction cup and a fourth silicon wafer lifting cylinder, the fourth backlight plate corresponds to the fourth pit position, the fourth silicon wafer suction cup is arranged in the fourth backlight plate, the upper end of the fourth silicon wafer lifting cylinder is connected to the fourth backlight plate, and the lower end is connected to the XYR three-axis adjustment platform.