Receiving and discharging device for silicon wafers

Abstract

The utility model provides a silicon wafer collecting and discharging device, which comprises a workbench, a positioning assembly, a feeding assembly and a discharging assembly, the bearing assembly is arranged in the positioning assembly and comprises a control panel arranged in the positioning assembly, a carrier plate is arranged above the control panel, and a bearing structure is installed on the upper surface of the control panel; and the limiting assembly is installed below the bearing assembly and comprises two bearing seats installed on the bottom surface of the carrier plate and two slide ways arranged on the upper surface of the carrier plate. The silicon wafer receiving and discharging device can control the carrier plate to move up and down through the lifting assembly, so that the bearing assembly moves up and down; according to the silicon wafer clamping device, the silicon wafers can be clamped through the clamping assembly, the bearing assembly bears the silicon wafers, the limiting assembly can be used for limiting the silicon wafers when the silicon wafers get close to each other, and therefore the silicon wafers of different sizes can be clamped, inclination when the silicon wafers are too many is prevented, the silicon wafers are more stable, and the phenomenon that the silicon wafers topple over is prevented.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafers, in particular to a feeding and discharging device for silicon wafers. Background Technique

[0002] A silicon wafer usually refers to a silicon chip, also known as a silicon wafer or a silicon substrate, which is a basic material widely used in the electronics industry. It is mainly used to manufacture integrated circuits (ICs) and other semiconductor devices. A silicon wafer is a thin slice cut from a single crystal silicon rod, usually having a circular or square shape. The thickness of these thin slices is usually between dozens of micrometers and hundreds of micrometers, and the diameter can range from a few millimeters to dozens of centimeters, depending on the required application and process requirements.

[0003] Referring to the patent document with the publication number CN221041077U, a feeding and discharging device for silicon wafers includes a frame plate, on which sliding rails are symmetrically arranged. A bin drawer is slidably arranged between the two sliding rails. On the frame plate and symmetrically on both sides of the bin drawer, top sensors are arranged. Above the bin drawer, a material plate is arranged, and a number of pallet positioning blocks are arranged in a rectangular array above the material plate. At the same time, an active pallet is arranged on the material plate between the pallet positioning blocks. Secondly, in order to ensure the neatness of the silicon wafers during the feeding and discharging process, a number of material positioning blocks are arranged on the side of the active pallet on the material plate; at the same time, a positioning limit adapted to the material positioning blocks is opened on the side of the active pallet; through the movement of the material positioning blocks, during the feeding process, after the silicon wafers are sequentially placed on the active pallet, the silicon wafers can be aligned by the movement of the material positioning blocks, ensuring that the picking and placing equipment can accurately pick up the silicon wafers during the picking and placing process.

[0004] Although the above solution can feed and discharge silicon wafers during use, there are still some deficiencies during the use process. For example, during the feeding and discharging process of silicon wafers, it is not convenient to position silicon wafers of different sizes, resulting in difficulty in positioning the silicon wafers. The silicon wafers are prone to shaking, causing the phenomenon of silicon wafer dumping. Summary of the Utility Model

[0005] The utility model provides a feeding and discharging device for silicon wafers to solve the technical problems existing in the above background technique.

[0006] The purpose and efficacy of a feeding and discharging device for silicon wafers of the present utility model are achieved by the following specific technical means: A feeding and discharging device for silicon wafers, including a workbench, comprising: a positioning component installed above the workbench; a carrying component arranged inside the positioning component, including a control board arranged inside the positioning component, a carrier board arranged above the control board, and a carrying structure installed on the upper surface of the control board; a limiting component installed below the carrying component, including two bearing seats installed on the bottom surface of the carrier board and two sliding grooves opened on the upper surface of the carrier board, wherein a motor is fixedly connected to the left side surface of one of the bearing seats, and a limiting structure is arranged on the inner rings of the two bearing seats.

[0007] Preferably, the positioning component includes a U-shaped plate installed on the workbench, and two guiding grooves are opened on the inner wall of the U-shaped plate.

[0008] Preferably, the carrying structure of the carrying component includes two guiding bars installed on the outer surface of the control board, the two guiding bars are respectively slidably connected with the two guiding grooves, two groups of sliding holes are opened on the upper surface of the carrier board, a sliding rod is slidably connected to the inner wall of each sliding hole, and the bottom end of each sliding rod is fixedly connected to the upper surface of the control board.

[0009] Preferably, two first positioning magnets are fixedly connected to the upper surface of the control board, two second positioning magnets are fixedly connected to the upper surface of the U-shaped plate, the two first positioning magnets are respectively attracted to the two second positioning magnets, and a pull handle is fixedly connected to the right side surface of the control board.

[0010] Preferably, the limiting structure of the limiting component includes a left-right threaded rod installed on the inner rings of the two bearing seats, two perforated control blocks are threadedly connected to the outer surface of the left-right threaded rod, a sliding plate is fixedly connected to the upper surface of each perforated control block, the upper surfaces of the two sliding plates respectively penetrate through the two sliding grooves and extend above the sliding grooves, a bracket is fixedly connected to the upper surface of each sliding plate, a positioning clamping plate is fixedly connected to one side surface of the two brackets close to each other, and a photoelectric sensor is fixedly connected to one side surface of the two positioning clamping plates close to each other.

[0011] Preferably, the lifting component includes a frame installed on the bottom surface of the workbench, a second servo motor is fixedly connected to the bottom surface of the frame, a threaded adjusting rod is rotatably connected to the inner bottom wall of the frame through a bearing, a perforated adjusting plate is threadedly connected to the outer surface of the threaded adjusting rod, two ejector rods are fixedly connected to the upper surface of the perforated adjusting plate, and a top plate is fixedly connected to the bottom ends of the two ejector rods together.

[0012] Preferably, sliding grooves are opened on the left and right side surfaces of the frame, a slider is slidably connected to the inner wall of each sliding groove, and one side surfaces of the two sliders close to each other are respectively fixedly connected to the left and right side surfaces of the perforated adjusting plate.

[0013] Preferably, the top plate is located directly below the carrier plate.

[0014] Beneficial effects:

[0015] 1. The lifting assembly can be used to control the up and down movement of the carrier, thereby moving the bearing assembly up and down, so that the bearing assembly can carry the silicon wafer, and the limiting assembly can be used to limit the position of the silicon wafer when they are close to each other, so that silicon wafers of different sizes can be clamped to prevent tilting when there are many silicon wafers, making the silicon wafer more stable and preventing the silicon wafer from tipping over.

[0016] 2. By providing a motor, the positive and negative threaded rods can be controlled so that the positive and negative threaded rods can be connected with the threaded adjustment plate with holes to drive the slide plate to move, so that the slide plates can move closer to and away from each other, and then the bracket can drive the distance of the positioning clamp to adjust, clamp silicon wafers of different sizes, limit the silicon wafers, and prevent the silicon wafers from shaking. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0018] Figure 2 It is a three-dimensional structural schematic diagram of the limiting component of the utility model.

[0019] Figure 3 It is a three-dimensional structural schematic diagram of the load-bearing assembly of the utility model.

[0020] Figure 4 It is a three-dimensional structural schematic diagram of the limiting component of the utility model.

[0021] Figure 5 It is a three-dimensional structural schematic diagram of the lifting component of the utility model.

[0022] Figures 1-5 In the figure, the corresponding relationship between the component names and the figure numbers is as follows:

[0023] 1. Workbench; 2. Positioning component; 201. U-shaped plate; 202. Guide groove; 3. Carrying component; 301. Control board; 302. Carrier plate; 303. Guide bar; 304. Slide hole; 305. Slide bar; 306. First positioning magnet; 307. Second positioning magnet; 308. Pull handle; 4. Limiting component; 401. Bearing seat; 402. Slideway; 403. First servo motor; 404. Forward and reverse threaded rod; 405. Holed control block; 406. Slide plate; 407. Bracket; 408. Positioning clamping plate; 409. Photoelectric sensor; 5. Lifting component; 501. Frame; 502. Second servo motor; 503. Thread adjusting rod; 504. Holed adjusting plate; 505. Jack rod; 506. Top plate; 507. Chute; 508. Slide block. Detailed implementation manner

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0025] First embodiment

[0026] As shown in the attached Figure 1 to the attached Figure 5 As shown: A silicon wafer loading and unloading device includes a workbench 1, including: a positioning component 2 installed above the workbench 1; a carrying component 3 disposed inside the positioning component 2, including a control board 301 disposed inside the positioning component 2, a carrier plate 302 provided above the control board 301, and a carrying structure installed on the upper surface of the control board 301; a limiting component 4 installed below the carrying component 3, including two bearing seats 401 installed on the bottom surface of the carrier plate 302 and two slideways 402 opened on the upper surface of the carrier plate 302. A motor 403 is fixedly connected to the left side surface of one of the bearing seats 401, and a limiting structure is provided on the inner rings of the two bearing seats 401.

[0027] In order to make the carrier plate 302 move more stably during the up and down movement, as shown in Figure 1 and Figure 3 As shown, the carrying structure of the carrying component 3 includes two guide bars 303 installed on the outer surface of the control board 301. The two guide bars 303 are respectively slidably connected to the two guide grooves 202. Two groups of slide holes 304 are opened on the upper surface of the carrier plate 302. A slide bar 305 is slidably connected to the inner wall of each slide hole 304. The bottom end of each slide bar 305 is fixedly connected to the upper surface of the control board 301. The carrier plate 302 can be guided through the slide bars 305 to prevent the carrier plate 302 from tilting during the up and down movement.

[0028] To enable the positioning clamping plates 408 to adjust the distance between the positioning clamping plates 408 according to the size of the silicon wafer, as Figure 1 , Figure 3 and Figure 4 shown, the limiting structure of the limiting component 4 includes a positive and negative threaded rod 404 installed in the inner rings of two bearing seats 401. The outer surface of the positive and negative threaded rod 404 is threadedly connected with two perforated control blocks 405. The upper surface of each perforated control block 405 is fixedly connected with a sliding plate 406. The upper surfaces of the two sliding plates 406 respectively penetrate through the two sliding channels 402 and extend above the sliding channels 402. The upper surface of each sliding plate 406 is fixedly connected with a support 407. The mutually approaching side surfaces of the two supports 407 are fixedly connected with positioning clamping plates 408. The mutually approaching side surfaces of the two positioning clamping plates 408 are fixedly connected with photoelectric sensors 409. The first servo motor provides power to the positive and negative threaded rod 404, enabling the sliding plates 406 and the supports 407 to drive the positioning clamping plates 408 to approach each other, limiting the silicon wafer and preventing the silicon wafer from tipping over.

[0029] To prevent the control board 301 from sliding, as Figure 1 and Figure 3 shown, two first positioning magnets 306 are fixedly connected to the upper surface of the control board 301. Two second positioning magnets 307 are fixedly connected to the upper surface of the U-shaped plate 201. The two first positioning magnets 306 are respectively attracted to the two second positioning magnets 307. A pull handle 308 is fixedly connected to the right side surface of the control board 301. The control board 301 can be positioned through the first positioning magnets 306 and the second positioning magnets 307, preventing the control board 301 from sliding.

[0030] Second Embodiment

[0031] To make the movement of the bearing component 3 smoother, as Figure 1 and Figure 2 shown, the positioning component 2 includes a U-shaped plate 201 installed on the workbench 1. Two guiding grooves 202 are formed in the inner wall of the U-shaped plate 201. Through the guiding grooves 202, the movement of the bearing component 3 can be smoother during the movement process, avoiding the occurrence of jamming phenomena.

[0032] Third Embodiment

[0033] In order to control the up-and-down movement of the carrier plate 302, the lifting assembly 5 includes a frame body 501 installed on the bottom surface of the workbench 1. A second servo motor 502 is fixedly connected to the bottom surface of the frame body 501. A threaded adjustment rod 503 is rotatably connected to the inner bottom wall of the frame body 501 through a bearing. A perforated adjustment plate 504 is threadedly connected to the outer surface of the threaded adjustment rod 503. Two ejector rods 505 are fixedly connected to the upper surface of the perforated adjustment plate 504. The bottom ends of the two ejector rods 505 are commonly fixedly connected to a top plate 506. The top plate 506 is located directly below the carrier plate 302. Through the threaded connection between the threaded adjustment rod 503 and the perforated adjustment plate 504, the ejector rods 505 can push the top plate 506 to move, causing the carrier plate 302 to move up and down for loading and unloading the silicon wafers.

[0034] In order to make the movement of the perforated adjustment plate 504 more stable during the up-and-down movement, as Figure 5 shown, sliding grooves 507 are formed in the left and right side surfaces of the frame body 501. A slider 508 is slidably connected to the inner wall of each sliding groove 507. The left and right side surfaces of the perforated adjustment plate 504 are respectively fixedly connected to the one side surfaces of the two sliders 508 close to each other. The perforated adjustment plate 504 can be limited by the sliders 508 and the sliding grooves 507, keeping the perforated adjustment plate 504 horizontal and preventing jamming.

[0035] Working principle: When in use, by starting the second servo motor 502, the threaded adjustment rod 503 rotates. The threaded adjustment rod 503 pushes the top plate 506 to move upward through the perforated adjustment plate 504 and the ejector rods 505, causing the carrier plate 302 to move upward and to a specified height. When the silicon wafers are placed on the carrier plate 302, the photoelectric sensor 409 senses the silicon wafers, causing the second servo motor 502 to control the top plate 506 to descend by the height of one silicon wafer for loading the silicon wafers. And by starting the first servo motor 403, the forward and reverse threaded rod 404 rotates, and then the perforated control block 405 drives the two sliding plates 406 to approach each other, causing the support 407 to push the two positioning clamping plates 408 to move and adjust the distance between the positioning clamping plates 408, so as to be able to position silicon wafers of different sizes.

Claims

1. A loading and unloading device for silicon wafers, comprising a workbench (1), characterized in that: Including: A positioning component (2), installed above the workbench (1); A bearing component (3), arranged inside the positioning component (2), including a control board (301) arranged inside the positioning component (2), a carrier board (302) arranged above the control board (301), and a bearing structure installed on the upper surface of the control board (301); A limiting component (4), installed below the bearing component (3), including two bearing seats (401) installed on the bottom surface of the carrier board (302), two sliding grooves (402) opened on the upper surface of the carrier board (302), a motor (403) fixedly connected to the left side surface of one of the bearing seats (401), and a limiting structure arranged on the inner rings of the two bearing seats (401); A lifting component (5), installed below the workbench (1).

2. The wafer loading and unloading device according to claim 1, wherein: The positioning component (2) includes a U-shaped plate (201) installed on the workbench (1), and two guiding grooves (202) are opened on the inner wall of the U-shaped plate (201).

3. The wafer loading and unloading device according to claim 2, characterized in that: The bearing structure of the bearing component (3) includes two guiding bars (303) installed on the outer surface of the control board (301), the two guiding bars (303) are respectively slidably connected with the two guiding grooves (202), two groups of sliding holes (304) are opened on the upper surface of the carrier board (302), a sliding rod (305) is slidably connected to the inner wall of each sliding hole (304), and the bottom end of each sliding rod (305) is fixedly connected to the upper surface of the control board (301).

4. The wafer loading and unloading device according to claim 3, characterized in that: Two first positioning magnets (306) are fixedly connected to the upper surface of the control board (301), two second positioning magnets (307) are fixedly connected to the upper surface of the U-shaped plate (201), the two first positioning magnets (306) are respectively attracted to the two second positioning magnets (307), and a pull handle (308) is fixedly connected to the right side surface of the control board (301).

5. The wafer loading and unloading device according to claim 3, characterized in that: The limiting structure of the limiting component (4) includes a positive and reverse threaded rod (404) installed on the inner rings of the two bearing seats (401), two perforated control blocks (405) are threadedly connected to the outer surface of the positive and reverse threaded rod (404), a sliding plate (406) is fixedly connected to the upper surface of each perforated control block (405), the upper surfaces of the two sliding plates (406) respectively penetrate through the two sliding grooves (402) and extend above the sliding grooves (402), a bracket (407) is fixedly connected to the upper surface of each sliding plate (406), a positioning clamping plate (408) is fixedly connected to one side surface of the two brackets (407) close to each other, and a photoelectric sensor (409) is fixedly connected to one side surface of the two positioning clamping plates (408) close to each other.

6. The feeding and discharging device for silicon wafers according to claim 1, wherein: The lifting assembly (5) includes a frame body (501) installed on the bottom surface of the workbench (1). A second servo motor (502) is fixedly connected to the bottom surface of the frame body (501). A threaded adjustment rod (503) is rotatably connected to the inner bottom wall of the frame body (501) through a bearing. A perforated adjustment plate (504) is threadedly connected to the outer surface of the threaded adjustment rod (503). Two ejector rods (505) are fixedly connected to the upper surface of the perforated adjustment plate (504). The bottom ends of the two ejector rods (505) are fixedly connected to a top plate (506) together.

7. The feeding and discharging device for silicon wafers according to claim 6, wherein: Chute grooves (507) are formed in the left and right side surfaces of the frame body (501). A slider (508) is slidably connected to the inner wall of each chute groove (507). One side surfaces of the two sliders (508) close to each other are fixedly connected to the left and right side surfaces of the perforated adjustment plate (504) respectively.

8. The wafer loading and unloading device according to claim 6, wherein: The top plate (506) is located directly below the carrier plate (302).

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