Heat dissipation device and energy storage device
By combining the design of insulating coolant, refrigeration sheet and thermal conductor plate, the problem of poor heat dissipation effect of MOSFET is solved, and an efficient and energy-saving heat dissipation effect is achieved, reducing the temperature of high-voltage devices and reducing the module volume.
Patent Information
- Application Number
- CN202421528139.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-06-28
AI Technical Summary
The existing MOSFET heat dissipation solution has poor heat dissipation effect and cannot effectively reduce the temperature of high-voltage devices.
A heat dissipation device including a shell, a cover plate, a refrigeration sheet and an insulating coolant is adopted. By combining the insulating coolant and the refrigeration sheet, the boiling condensation cycle of the fluoride liquid and the temperature difference effect of the semiconductor refrigeration sheet are used to combine the heat exchange between the heat conducting plate and the water-cooled plate to achieve efficient heat dissipation.
It improves heat dissipation effect, reduces the temperature of high-voltage devices, saves energy consumption, reduces the module's volume and cooling cost, and improves space utilization.
Smart Images
Figure CN223079120U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device and an energy storage device. Background Art
[0002] The battery high-voltage distribution box is an important component unit of the battery system and can perform power battery energy distribution and safety protection. It mainly includes a housing, a control wire harness (including plugging), a fuse, a contactor, a current sensor, a pre-charge resistor, a conductive bar, etc. Since the Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) will not have problems such as contact arc, bounce or conduction resistance decline, has excellent anti-shock and vibration performance, is not sensitive to position, and can operate silently, etc., MOSFET is selected to replace the contactor. After packaging, the volume of the MOSFET is small, and it is necessary to fit the top or bottom surface with a radiator for heat dissipation.
[0003] However, the existing MOSFET heat dissipation solutions mostly rely on heat dissipation fans, resulting in poor heat dissipation effects. Summary of the Utility Model
[0004] The utility model provides a heat dissipation device and an energy storage device to solve the defect of poor heat dissipation effect of MOSFET in the prior art.
[0005] In a first aspect, the utility model provides a heat dissipation device, including: a housing, a cover plate, a Peltier cooler and an insulating coolant;
[0006] The housing and the cover plate are matched to form a sealed cavity. The Peltier cooler is arranged on one side of the cover plate facing the sealed cavity. The insulating coolant is encapsulated in the sealed cavity, and a high-voltage device is arranged in the sealed cavity;
[0007] The insulating coolant and the Peltier cooler are used to dissipate heat from the high-voltage device in the sealed cavity.
[0008] According to the heat dissipation device provided by the utility model, the bottom plate of the housing includes: a heat conduction plate;
[0009] The heat conduction plate is arranged at the bottom of the housing. The high-voltage device includes a field effect transistor. The field effect transistor is arranged on a circuit board, and the circuit board is arranged on the heat conduction plate;
[0010] The heat conduction plate is in contact with the water-cooled plate of the battery system, and the heat conduction plate is used to dissipate heat from the field effect transistor through the water-cooled plate.
[0011] According to a heat dissipation device provided by the present utility model, blind holes are provided on one side of the heat conduction plate close to the field effect transistor;
[0012] The blind holes are used to fix the field effect transistor.
[0013] According to a heat dissipation device provided by the present utility model, the heat conduction surface of the field effect transistor is attached to the heat conduction plate and performs heat transfer with the heat conduction plate.
[0014] According to a heat dissipation device provided by the present utility model, the refrigeration sheet includes a semiconductor refrigeration sheet;
[0015] The refrigeration surface of the semiconductor refrigeration sheet faces the inside of the sealed cavity, and the heat dissipation surface of the semiconductor refrigeration sheet faces the outside of the sealed cavity;
[0016] The semiconductor refrigeration sheet is used to dissipate heat from the high-voltage devices inside the sealed cavity.
[0017] According to a heat dissipation device provided by the present utility model, the insulating coolant includes: fluorinated liquid;
[0018] The fluorinated liquid is encapsulated in the sealed cavity, and the fluorinated liquid submerges the high-voltage devices;
[0019] The semiconductor refrigeration sheet is used to condense the vaporized fluorinated liquid into a liquid, and the liquid dissipates heat from the high-voltage devices.
[0020] According to a heat dissipation device provided by the present utility model, it further includes a cooling fan;
[0021] The cooling fan is arranged on the cover plate, and the cooling fan is used to dissipate heat from the heat dissipation surface of the semiconductor refrigeration sheet.
[0022] According to a heat dissipation device provided by the present utility model, the housing further includes: an input interface and an output interface;
[0023] Both the input interface and the output interface are connected to the high-voltage devices and are used to form a closed loop.
[0024] According to a heat dissipation device provided by the present utility model, the input interface includes a high-voltage input interface and a low-voltage input interface;
[0025] The high-voltage input interface is used to form a high-voltage loop, and the low-voltage input interface is used to control the high-voltage devices.
[0026] In a second aspect, the present utility model also protects an energy storage device including the heat dissipation device as described in any one of the above.
[0027] A heat dissipation device and an energy storage device provided by the present utility model include: a housing, a cover plate, a Peltier element, and an insulating coolant; the housing and the cover plate are matched to form a sealed cavity, the Peltier element is disposed on one side of the cover plate facing the sealed cavity, the insulating coolant is encapsulated in the sealed cavity, and high-voltage devices are disposed in the sealed cavity; the insulating coolant and the Peltier element are used to dissipate heat from the high-voltage devices in the sealed cavity. Compared with the simple heat dissipation by a fan, the heat dissipation method through the Peltier element and the insulating coolant has lower energy consumption and better cooling and heat dissipation effects. Description of the Drawings
[0028] In order to more clearly illustrate the technical solutions in the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0029] Figure 1 is a schematic internal structure diagram of the heat dissipation device provided in this embodiment;
[0030] Figure 2 is a schematic structural diagram of the field effect transistor and the circuit board provided in this embodiment;
[0031] Figure 3 is a schematic structural diagram of the circuit board and the heat conducting plate provided in this embodiment;
[0032] Figure 4 is a schematic structural diagram of the housing provided in this embodiment;
[0033] Figure 5 is Figure 4 a schematic structural diagram after installing the circuit board;
[0034] Figure 6 is a schematic structural diagram of the cover plate and the Peltier element provided in this embodiment;
[0035] Figure 7 is a schematic partial structure diagram of the heat dissipation device provided in this embodiment.
[0036] Reference Signs:
[0037] 1. Housing; 11. High-voltage input interface; 12. Low-voltage input interface; 13. Output interface; 2. Cover plate; 3. Peltier element; 4. Insulating coolant; 5. Heat conducting plate; 51. Blind hole; 6. Heat dissipation fan; A. Water-cooling plate; B. Field effect transistor; C. Circuit board. Detailed Embodiments
[0038] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions in the present utility model will be clearly and completely described below with reference to the accompanying drawings in the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0039] The following will Figures 1 - 7 describe the heat dissipation device and energy storage device of the present utility model.
[0040] Figure 1 is a schematic internal structure diagram of the heat dissipation device provided in this embodiment.
[0041] As Figure 1 shown, a heat dissipation device provided in this embodiment includes: a housing 1, a cover plate 2, a Peltier cooler 3, and an insulating coolant 4; the housing 1 and the cover plate 2 are matched to form a sealed cavity, the Peltier cooler 3 is disposed on one side of the cover plate 2 facing the sealed cavity, the insulating coolant 4 is encapsulated in the sealed cavity, and high-voltage devices are disposed in the sealed cavity; the insulating coolant 4 and the Peltier cooler 3 are used to dissipate heat from the high-voltage devices in the sealed cavity. The high-voltage switch includes components such as a high-voltage contact switch.
[0042] In a specific implementation process, the high-voltage devices can be integrally disposed on a circuit board C. The circuit board C can be a PCB circuit board, and the circuit board C can be fixedly disposed at the bottom of the housing 1 by means of bolts or the like, where the bottom refers to the other side opposite to the cover plate 2. Since the circuit board and the high-voltage devices generate heat during operation, continuous high temperature will affect the working state of the high-voltage devices. Therefore, it is selected to use the insulating coolant 4 and the Peltier cooler 3 to dissipate heat and cool the high-voltage devices. Among them, seals can be provided at different positions of the housing 1 to ensure the tightness of the sealed cavity formed by the housing 1 and the cover plate 2 and prevent leakage of the insulating coolant 4. The Peltier cooler 3 is also disposed inside the sealed cavity, and the Peltier cooler 3 and the insulating coolant 4 cooperate with each other to efficiently complete the cooling of the high-voltage contactor and the circuit board.
[0043] The Peltier cooler 3 is directly connected to an external circuit through the housing 1, ensuring the circuit connection of the Peltier cooler 3. At the same time, the insulating property of the insulating coolant 4 will not affect the circuit connection of the Peltier cooler 3, the circuit connection of the high-voltage devices, and the circuit connection of the circuit board C.
[0044] The working process is as follows. After the high-voltage device in the circuit is closed when the heat dissipation device is connected to the circuit, the circuit is connected. At this time, the high-voltage device and the circuit board C work and generate heat. At this time, the insulating coolant 4 itself has a certain cooling effect, effectively reducing the temperature of the high-voltage device. As the temperature continues to rise, the battery management system will start the thermoelectric cooler 3 to participate in the heat dissipation process. After the circuit is connected, the surface temperature of the cooling surface of the thermoelectric cooler 3 can quickly drop below zero degrees. Since it is in a closed space, it can quickly cool the high-voltage device and the circuit board C. At the same time, the insulating coolant 4 is cooled, and the insulating coolant 4 cools the high-voltage device and the circuit board C quickly, ensuring good heat dissipation and cooling effects.
[0045] Figure 2 It is a schematic structural diagram of the field effect transistor and the circuit board provided by this embodiment. Figure 3 It is a schematic structural diagram of the circuit board and the heat conducting plate provided by this embodiment. Figure 4 It is a schematic structural diagram of the housing provided by this embodiment. Figure 5 is Figure 4 A schematic structural diagram after installing the circuit board.
[0046] Furthermore, as Figure 1 shown, the bottom of the housing 1 of the heat dissipation device in this embodiment includes: a heat conducting plate 5; the heat conducting plate 5 is arranged at the bottom of the housing 1, and the high-voltage device includes a field effect transistor B; the field effect transistor B is arranged on the circuit board C, and the circuit board C is arranged on the heat conducting plate 5; the heat conducting plate 5 is in contact with the water cooling plate A of the battery system, and the heat conducting plate 5 is used to dissipate heat from the field effect transistor B through the water cooling plate A.
[0047] Specifically, the function of the heat conducting plate 5 is to exchange heat between the temperature of the field effect transistor B and the temperature of the water cooling plate A of the battery system through heat transfer, so as to reduce the temperature of the field effect transistor B and the circuit board C. Among them, the field effect transistor B can be a MOSFET. As Figure 2 shown, it is a schematic diagram of the connection and fixation of the MOSFET and the circuit board C. After the MOSFET pins are bent, they are welded and fixed to the circuit board C. The heat dissipation surface of the MOSFET faces away from the PCB board, so that the heat dissipation surface of the MOSFET is in contact with the heat conducting plate 5, which is convenient for using the heat conducting plate 5 to dissipate heat from the MOSFET. Corresponding through holes also need to be opened on the circuit board C corresponding to the fixing holes of the MOSFET to fix the circuit board C welded with the MOSFET to the bottom of the housing 1 through fixing bolts.
[0048] Among them, the highly heat-conductive heat conducting plate 5 at the bottom of the housing 1 can be an aluminum plate. The bottom plate has a certain thickness, so as to better achieve heat transfer and quickly complete the heat dissipation of the MOSFET. As Figure 4 and Figure 5As shown in the figure, a blind hole 51 is provided on one side of the heat conduction plate 5 at the bottom of the housing 1 close to the field effect transistor B; the blind hole 51 is used to fix the field effect transistor B, and the heat conduction surface of the field effect transistor B is arranged against the heat conduction plate 5 at the bottom of the housing 1, so that the field effect transistor B can better transfer heat to the water cooling plate of the battery system through the heat conduction plate 5 to achieve heat dissipation and temperature reduction.
[0049] Specifically, after the heat dissipation surface of the MOSFET coated with heat conduction glue at the bottom is fixedly attached to the heat conduction plate 5, a reliable and efficient heat conduction path is established to realize the heat exchange between the MOSFET and the water cooling plate A, and the MOSFET is cooled and dissipated. The heat dissipation surface of the MOSFET is attached to the heat conduction plate 5, which further improves the heat dissipation effect of the heat conduction plate 5. The design of the heat conduction plate 5 enables the temperature of the MOSFET to be reduced while the temperature of the battery cell is reduced by the water cooling plate A, saving separate energy consumption and effectively saving space.
[0050] Figure 6 It is a schematic structural diagram of the cover plate and the refrigeration sheet provided in this embodiment.
[0051] Furthermore, on the basis of the above embodiment, as Figure 6 shown, the refrigeration sheet 3 in this embodiment includes a semiconductor refrigeration sheet; the refrigeration surface of the semiconductor refrigeration sheet faces the inside of the sealed cavity, and the heat dissipation surface of the semiconductor refrigeration sheet faces the outside of the sealed cavity; the semiconductor refrigeration sheet is used to dissipate heat from the high-voltage devices inside the sealed cavity.
[0052] As Figure 1 shown, the insulating coolant 4 includes: fluorinated liquid; the fluorinated liquid is encapsulated in the sealed cavity, and the fluorinated liquid submerges the high-voltage devices; the semiconductor refrigeration sheet is used to condense the vaporized fluorinated liquid into a liquid, and the liquid dissipates heat from the high-voltage devices.
[0053] Specifically, the semiconductor refrigeration sheet can be embedded in the cover plate 2, and the heat dissipation surface communicates with the outside of the sealed cavity to release heat, and the refrigeration surface of the refrigeration sheet faces the circuit board C inside the sealed cavity, so that when heat is generated inside the sealed cavity, the heat can be absorbed in time to realize the temperature reduction inside the sealed cavity and at the same time realize the temperature reduction of the MOSFET.
[0054] During the operation of the thermoelectric cooler, the temperature difference between the cooling surface and the heat dissipation surface can reach 60°C. Since the boiling point of the fluorinated liquid is between 34°C and 174°C, a fluorinated liquid with a boiling point of 35°C can be selected as the insulating coolant 4. When the temperature of the fluorinated liquid inside the sealed cavity reaches the boiling temperature of 35°C due to the heat generated by the MOSFET, the fluorinated liquid will boil and vaporize into a vapor state. When it rises to the cooling surface of the thermoelectric cooler at the top, it will condense and turn back into a liquid and flow back, so that the cooled liquid fluorinated liquid can cool the MOSFET again. In this way, the MOSFET and the circuit board can be efficiently cooled by repeating this cycle.
[0055] Figure 7 It is a partial structural schematic diagram of the heat dissipation device provided in this embodiment.
[0056] As Figure 7 shown, on the basis of the above embodiment, the heat dissipation device in this embodiment further includes a heat dissipation fan 6. The heat dissipation fan 6 is arranged on the cover plate 2, and the heat dissipation fan 6 is used to dissipate heat from the heat dissipation surface of the thermoelectric cooler.
[0057] Specifically, the main function of the heat dissipation fan 6 is to dissipate heat from the cooling chip 3 to ensure the normal operation of the thermoelectric cooler and avoid poor heat dissipation of the thermoelectric cooler due to excessive temperature.
[0058] Furthermore, as Figure 7 shown, the housing 1 in this embodiment further includes: an input interface and an output interface 13; both the input interface and the output interface 13 are connected to high-voltage devices to form a closed loop. Among them, the input interface includes a high-voltage input interface 11 and a low-voltage input interface 12; the high-voltage input interface 11 is used to form a high-voltage loop, and the low-voltage input interface 12 is used to control the high-voltage device.
[0059] Specifically, the high-voltage input interface 11, the high-voltage output interface 13 and the low-voltage input port are connected to the high-voltage loop and the low-voltage loop of the main board of the battery management system through conductive bars and wire harnesses. The main function is to connect the high-voltage loop and the low-voltage loop. The high-voltage loop is the power supply loop of the power battery, and the low-voltage loop is the control loop of the MOSFET. Among them, the MOSFET is used to replace the contactor to play the role of a switch, so that the volume of the entire heat dissipation device is relatively small, occupies less space, and is more flexible.
[0060] Overall, the heat dissipation device will be described. As a whole, a sealed cavity is formed by a housing 1 and a cover plate 2. Inside the sealed cavity, there is a circuit board C including a MOSFET. The circuit board C is connected to an external circuit through an input interface and an output interface 13. The bottom of the housing 1 is provided with a heat conducting plate 5, which is directly attached to the circuit board C. The heat conducting plate 5 is in contact with and fixedly attached to a water cooling plate A through a heat conducting adhesive. An insulating cooling liquid is also provided inside the sealed cavity, and a Peltier cooler 3 is provided on the side of the cover plate 2 facing the circuit board C. After the circuit board C is powered on and in a working state, if the water cooling plate A is in a working state, the water cooling plate A realizes the heat exchange between the MOSFET and the water cooling plate A through the heat transfer of the heat conducting plate 5, completing the cooling of the MOSFET. The insulating cooling liquid 4 inside the sealed cavity also cools the circuit board C. When it is necessary to further improve the heat dissipation effect, the battery management system will control the Peltier cooler 3 to work. After absorbing the high temperature inside the sealed cavity, it will dissipate it to the outside of the sealed cavity. At the same time, when the vaporized insulating cooling liquid 4 encounters the Peltier cooler 3, it will condense into a liquid, cooling the MOSFET and the circuit board C again, and achieving a good heat dissipation effect through circulation. At this time, the fan will also be controlled to work to dissipate heat from the Peltier cooler 3 to ensure the continuous and efficient operation of the Peltier cooler 3.
[0061] Through the combination of the heat conducting plate 5 and the water cooling plate A, and the combination of the insulating cooling liquid 4 and the Peltier cooler 3, the heat dissipation and cooling effect of the circuit board C are better guaranteed. And since the MOSFET replaces the contactor, the module has a small volume, so the immersion cooling effect is better, the consumption is lower, and the cooling cost is reduced. Due to the good insulation performance of the fluorinated liquid, the safety gap between components can be appropriately reduced, and thus the size of the entire module can be reduced, reducing the occupancy of the space inside the package and improving the utilization rate of the space inside the package. When the water cooling plate A is not working, the module can be cooled by the boiling and tumbling of the fluorinated liquid. When the temperature further rises, the Peltier cooler 3 and the cooling fan 6 can be turned on for cooling; when the water cooling plate A is turned on, heat can be dissipated through the bottom, and then the Peltier cooler 3 and the cooling fan 6 can be turned off for energy saving; when the temperature of the immersion liquid inside the module further increases, the water cooling plate A and the Peltier cooler 3 work simultaneously to limit the further increase of the temperature. The cooling mode can be selected according to needs, which is more energy-saving and efficient, and the reliability of the cooling effect is higher.
[0062] Based on the same general utility model concept, the present utility model also protects an energy storage device including the heat dissipation device of any of the above embodiments.
[0063] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. A person of ordinary skill in the art can understand and implement it without creative work.
[0064] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the essence of the above technical solution, or the part that contributes to the prior art, can be embodied in the form of a software product. The computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.
[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A heat dissipation device, characterized in that, Comprising: A housing, a cover plate, a thermoelectric cooler, and an insulating coolant; The housing and the cover plate are matched to form a sealed cavity. The thermoelectric cooler is disposed on one side of the cover plate facing the sealed cavity. The insulating coolant is encapsulated in the sealed cavity, and high-voltage devices are disposed in the sealed cavity; The insulating coolant and the thermoelectric cooler are used to dissipate heat from the high-voltage devices in the sealed cavity; The bottom plate of the housing includes: a heat conducting plate; the heat conducting plate is disposed at the bottom of the housing. The high-voltage device includes a field effect transistor; the field effect transistor is disposed on a circuit board, and the circuit board is disposed on the heat conducting plate; the heat conducting plate is in contact with a water-cooling plate of a battery system, and the heat conducting plate is used to dissipate heat from the field effect transistor through the water-cooling plate.
2. The heat dissipation device according to claim 1, characterized in that, Blind holes are disposed on one side of the heat conducting plate close to the field effect transistor; The blind holes are used to fix the field effect transistor.
3. The heat dissipation device according to claim 1, wherein The heat conducting surface of the field effect transistor is disposed in abutment against the heat conducting plate for heat transfer with the heat conducting plate.
4. The heat dissipation device according to claim 1, wherein The thermoelectric cooler includes a semiconductor thermoelectric cooler; The cooling surface of the semiconductor thermoelectric cooler faces the inside of the sealed cavity, and the heat dissipation surface of the semiconductor thermoelectric cooler faces the outside of the sealed cavity; The semiconductor thermoelectric cooler is used to dissipate heat from the high-voltage devices inside the sealed cavity.
5. The heat dissipation device according to claim 4, wherein, The insulating coolant includes: a fluorinated liquid; The fluorinated liquid is encapsulated in the sealed cavity, and the fluorinated liquid submerges the high-voltage devices; The semiconductor thermoelectric cooler is used to condense the vaporized fluorinated liquid into a liquid, and the liquid dissipates heat from the high-voltage devices.
6. The heat dissipation device according to claim 4, wherein It further includes a cooling fan; The cooling fan is disposed on the cover plate, and the cooling fan is used to dissipate heat from the heat dissipation surface of the semiconductor thermoelectric cooler.
7. The heat dissipation device according to any one of claims 1-6, characterized in that, The housing further includes: an input interface and an output interface; Both the input interface and the output interface are connected to the high-voltage devices for forming a closed loop.
8. The heat dissipation device according to claim 7, characterized in that, The input interface includes a high-voltage input interface and a low-voltage input interface; The high-voltage input interface is used to form a high-voltage loop, and the low-voltage input interface is used to control the high-voltage devices.
9. A energy storage device, characterized in that, It includes a heat dissipation device according to any one of claims 1-8.