Functional module and electronic equipment
By introducing metal foil and ground back structure into the functional module, the impact of the functional module on antenna performance is solved, and the improvement of antenna performance and the heat dissipation effect of the module body is achieved.
Patent Information
- Application Number
- CN202421524436.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-06-28
AI Technical Summary
Functional modules in the top area of the electronic device, such as front cameras, proximity sensors, etc., will affect the performance of the antenna on the top bezel.
The metal foil is introduced into the functional module, and at least two back-ground structures extending in different directions are provided on its surface to disperse the induced current and reduce clutter interference to the antenna.
By dispersing the induced current, the clutter interference of the metal foil to the antenna radiator is reduced, the antenna performance is improved, and the heat dissipation effect of the module body is increased.
Smart Images

Figure CN223079361U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electronic technology, and particularly relates to a functional module and an electronic device. Background Art
[0002] With the development of antenna technology, the number of antennas in electronic devices such as mobile phones has increased significantly. In order to provide a better clearance environment for the antennas, the antennas are usually arranged on the frames of electronic devices such as mobile phones. Among them, since the top frame has fewer holding scenarios, it is usually used to arrange important antennas.
[0003] However, functional modules such as a front camera and a proximity sensor also need to be arranged in the top area of the electronic device, and the metal structures in these functional modules will affect the antenna performance on the top frame. Summary of the Utility Model
[0004] The utility model provides a functional module and an electronic device, which can solve the problem that the functional module in the top area of the electronic device affects the antenna performance of the top frame.
[0005] The technical solutions are as follows:
[0006] On the one hand, a functional module is provided, and the functional module is close to the antenna radiator of the electronic device;
[0007] The functional module includes: a module body and a metal foil, and the metal foil is located on at least one surface of the module body;
[0008] The metal foil includes at least two ground return structures, the at least two ground return structures extend outward in different directions respectively, and the at least two ground return structures are grounded respectively.
[0009] In some embodiments, the metal foil is located on the back of the module body, and the metal foil is used to increase the heat dissipation area of the module body.
[0010] In some embodiments, the extension length of at least one of the at least two ground return structures is less than or equal to a first target value.
[0011] In some embodiments, the module body is a camera, a sensor, a receiver or a speaker.
[0012] On the other hand, an electronic device is provided, and the electronic device includes the functional module of the utility model.
[0013] In some embodiments, the electronic device further includes an antenna radiator; the antenna radiator is close to the functional module.
[0014] In some embodiments, the electronic device further includes a main board module, and the functional module is located on one side of the main board module;
[0015] The main board module includes a shielding cover, and at least one of the at least two ground return structures is connected to the shielding cover.
[0016] In some embodiments, the main board module further includes a connecting component for fixing the main board module;
[0017] At least one of the at least two ground return structures is connected to the connecting component.
[0018] In some embodiments, the electronic device includes a middle frame support portion, and the connecting component is connected to the middle frame support portion.
[0019] In some embodiments, the connecting component includes a cushion block and a screw member;
[0020] The cushion block is located between the main board module and the middle frame support portion, and the screw member is threadedly connected through the main board module, the cushion block and the middle frame support portion;
[0021] The ground return structure connected to the connecting component extends between two adjacent ones of the main board module, the cushion block and the middle frame support portion.
[0022] In some embodiments, the cushion block is a surface mount structure on the main board module.
[0023] In some embodiments, the module body is a front camera;
[0024] The functional module is located at the top edge of the main board module, the shielding cover is located below the functional module, and the connecting component is located on the horizontal side of the functional module;
[0025] The metal foil is located on the back of the module body. The metal foil includes a first ground return structure and a second ground return structure. The first ground return structure extends downward to connect to the shielding cover, and the second ground return structure extends to the horizontal side to connect to the connecting component.
[0026] The beneficial effects brought by the technical solution provided by the present utility model at least include:
[0027] For the functional module of the present utility model, a metal foil is provided on at least one surface of the module body. Since it is close to the antenna radiator, when the antenna radiator works, an induced current will be generated in the metal foil. Affected by at least two ground return structures, the induced current is dispersed and flows along at least two current paths to the two ground return structures respectively. The dispersion of the induced current is beneficial to reducing the clutter interference of the metal foil on the antenna radiator, thereby solving the influence of the functional module on the antenna performance. Brief Description of the Drawings
[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0029] Figure 1 is a schematic structural diagram of a functional module provided by an embodiment of the present invention;
[0030] Figure 2 is a schematic structural diagram of a metal foil provided by an embodiment of the present invention;
[0031] Figure 3 is a partial structural schematic diagram of an electronic device provided by an embodiment of the present invention;
[0032] Figure 4 is a connection schematic diagram of a connection component and a ground return structure provided by an embodiment of the present invention.
[0033] The reference numerals in the drawings are respectively represented as:
[0034] 1, module body;
[0035] 2, metal foil;
[0036] 21, ground return structure; 211, first ground return structure; 212, second ground return structure; 22, adhering structure;
[0037] 3, antenna radiator;
[0038] 4, main board module;
[0039] 41, shielding cover; 42, connection component; 421, spacer; 422, screw member;
[0040] 5, middle frame support portion. Detailed Description of the Embodiments
[0041] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. On the contrary, they are only examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.
[0042] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the Figure 1 orientation or positional relationship shown, and it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present utility model.
[0043] It should be understood that in the present utility model, "electrically connected" can be understood as physical contact and electrical conduction between components; it can also be understood as a form of connection between different components in a circuit structure through physical lines such as copper foils or wires of a printed circuit board (PCB) that can transmit electrical signals. "Communication connection" can refer to the transmission of electrical signals, including wireless communication connection and wired communication connection. Wireless communication connection does not require a physical medium and does not belong to the connection relationship that limits the product structure. "Connection" and "connected" can both refer to a mechanical connection relationship or a physical connection relationship, that is, A is connected to B or A is connected with B can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or A and B are in contact with each other and it is difficult to separate A and B.
[0044] Unless otherwise defined, all technical terms used in the embodiments of the present utility model have the same meaning as commonly understood by those of ordinary skill in the art.
[0045] The technical solutions provided by the present utility model are applicable to electronic devices that adopt one or more of the following communication technologies: Bluetooth (BT) communication technology, Global Positioning System (GPS) communication technology, Wireless Fidelity (WiFi) communication technology, Global System for Mobile Communications (GSM) communication technology, Wideband Code Division Multiple Access (WCDMA) communication technology, Long Term Evolution (LTE) communication technology, 5G communication technology, and other future communication technologies, etc.
[0046] The electronic device in the embodiment of the present utility model may be a mobile phone, a tablet computer, a laptop computer, a smart bracelet, a smart watch, a smart helmet, a smart glasses, etc. The electronic device may also be a cellular phone, a cordless phone, a Session Initiation Protocol (SIP) phone, a Wireless Local Loop (WLL) station, a Personal Digital Assistant (PDA), a handheld device with wireless communication function, a computing device or other processing devices connected to a wireless modem, a vehicle-mounted device, an electronic device in a 5G network or an electronic device in a future evolved Public Land Mobile Network (PLMN), etc. The embodiment of the present utility model does not limit this.
[0047] To make the objectives, technical solutions and advantages of the present utility model clearer, the embodiments of the present utility model will be further described in detail below with reference to the accompanying drawings.
[0048] On the one hand, as shown in combination with Figure 1 and Figure 2 this embodiment provides a functional module, and the functional module is close to the antenna radiator 3 of the electronic device.
[0049] The functional module includes: a module body 1 and a metal foil 2, and the metal foil 2 is located on at least one surface of the module body 1; the metal foil 2 includes at least two ground return structures 21, and the at least two ground return structures 21 extend outward in different directions respectively, and the at least two ground return structures 21 are grounded respectively.
[0050] In the functional module of this embodiment, since there is a metal foil 2 on at least one surface of the module body 1 and it is close to the antenna radiator 3, when the antenna radiator 3 works, an induced current will be generated in the metal foil 2. Affected by the at least two ground return structures 21, the induced current is dispersed and then flows along at least two current paths to the two ground return structures 21 respectively. The dispersion of the induced current is beneficial to reducing the clutter interference of the metal foil 2 on the antenna radiator 3, thereby solving the influence of the functional module on the antenna performance.
[0051] Exemplarily, the metal foil 2 further includes an adhering structure 22, and the adhering structure 22 is arranged on the surface of the module body 1, which can simultaneously play the roles of signal shielding and heat dissipation. Exemplarily, the metal foil 2 is a composite material of metal copper and graphite material, and has conductive and heat-conducting characteristics.
[0052] Exemplarily, the number of the ground return structures 21 is, for example, two, three, four, etc.
[0053] In addition, by arranging at least two ground return structures 21, the area of the metal foil 2 can also be increased, which is beneficial to further improving the signal shielding and heat dissipation effects of the module body 1.
[0054] As shown in combination with Figure 1 In some embodiments, the metal foil 2 is located on the back of the module body 1, and the metal foil 2 is used to increase the heat dissipation area of the module body 1.
[0055] By arranging the metal foil 2 on the back of the module body 1, the heat dissipation area of the back of the module body 1 can be increased, and the heat dissipation effect of the module body 1 can be improved.
[0056] In some embodiments, the extension length of at least one of the at least two ground return structures 21 is less than or equal to a first target value. When the extension length of the ground return structure 21 is less than or equal to the first target value, it can ensure that the metal foil 2 is grounded at a short distance, which is beneficial to reducing the electrical length of the induced current, thereby reducing the clutter interference of the metal foil 2 on the antenna radiator 3.
[0057] Exemplarily, the first target value can be determined according to the stacking environment of the metal foil 2. For example, the first target value is the distance between the ground return point closest to the metal foil 2 and the metal foil 2. When the extension length of one of the ground return structures 21 is equal to the first target value, the metal foil 2 can be grounded nearby.
[0058] In some embodiments, the module body 1 is a camera, a sensor, a receiver or a speaker. The above functional devices are all relatively common functional devices in electronic devices, and they may all be arranged near the antenna radiator. When the functional module of the embodiment of the present invention is adopted, the clutter influence of the functional module on the antenna can be reduced, which is beneficial to improving the stacking efficiency of the electronic device.
[0059] The camera can be a front camera, a rear camera, an infrared camera, a natural light camera, a wide-angle camera, etc. The sensor can be a proximity sensor, a brightness sensor, a distance sensor, etc.
[0060] On the other hand, as shown in combination with Figure 3 and Figure 4 This embodiment provides an electronic device, and the electronic device includes the functional module of the present invention.
[0061] The electronic device of this embodiment adopts the functional module of the present invention and has all the beneficial technical effects of all the embodiments herein.
[0062] As shown in combination with Figure 3As shown, in some embodiments, the electronic device further includes an antenna radiator 3; the antenna radiator 3 is close to the functional module. The functional module can achieve grounding by using at least two grounding structures 21, without affecting the working performance of the antenna radiator 3.
[0063] Combined with Figure 3 As shown, in some embodiments, the electronic device further includes a main board module 4, and the functional module is located on one side of the main board module 4; the main board module 4 includes a shielding cover 41, and at least one of the at least two grounding structures 21 is connected to the shielding cover 41.
[0064] In this embodiment, the main board module 4 is the core component of the electronic device, equivalent to the "brain" of the electronic device, responsible for processing all information and controlling all functions. The main board module 4 is based on a circuit board, on which a processor, a memory, a storage chip, a communication chip, a power management chip, an audio decoding chip, a display chip, and various interfaces are respectively integrated, and so on.
[0065] In order to shield the electromagnetic radiation and interference of electronic components such as the processor in the main board module 4, a shielding cover 41 is covered on the electronic components. Exemplarily, the shielding cover 41 is made of a metal material, such as copper, aluminum, iron, etc., and is designed as a covering layer matching the main board module 4. The shielding cover 41 is directly welded to the circuit board of the main board module 4 and is grounded. The shape and size of the shielding cover 41 depend on the design of the main board module 4.
[0066] In the electronic device, the functional module needs to be connected to the main board module 4, and the main board module 4 provides electrical energy for it and conducts data exchange. Therefore, in this embodiment, the functional module is located on one side of the main board module 4, and at least one grounding structure 21 is connected to the shielding cover 41, so that the grounding of the metal foil 2 can be achieved by using the shielding cover 41.
[0067] Combined with Figure 3 and Figure 4 As shown, in some embodiments, the main board module 4 further includes a connection component 42, and the connection component 42 is used to fix the main board module 4; at least one of the at least two grounding structures 21 is connected to the connection component 42.
[0068] In this embodiment, the main board module 4 can be fixedly connected to the middle frame by using the connection component 42. Therefore, by connecting the grounding structure 21 to the connection component 42, the grounding of the metal foil 2 can be achieved.
[0069] Combined with Figure 4 As shown, in some embodiments, the electronic device includes a middle frame support part 5, the middle frame support part 5 is a part of the middle frame of the electronic device, and the connection component 42 is connected to the middle frame support part 5, so as to realize the fixed connection between the main board module 4 and the middle frame.
[0070] Combined withFigure 4 As shown, in some embodiments, the connection component 42 includes a spacer 421 and a screw member 422.
[0071] The spacer 421 is located between the main board module 4 and the middle frame support portion 5, and the screw member 422 is threadedly connected through the main board module 4, the spacer 421, and the middle frame support portion 5; the ground return structure 21 connected to the connection component 42 extends between two adjacent ones of the main board module 4, the spacer 421, and the middle frame support portion 5. The spacer 421 is made of a metal material.
[0072] With the above arrangement, by using the screw member 422 to press the ground return structure 21, the ground return of the metal foil 2 can be achieved. Exemplarily, the ground return structure 21 extends between the main board module 4 and the spacer 421, and the ground return structure 21 is connected to the middle frame support portion 5 through the spacer 421, and the middle frame support portion 5 provides the ground return potential. Another example is that the ground return structure 21 extends between the spacer 421 and the middle frame support portion 5, and the ground return structure 21 is directly connected to the middle frame support portion 5, and the middle frame support portion 5 provides the ground return potential.
[0073] Exemplarily, referring to Figure 1 or Figure 2 , the end of the ground return structure 21 has a hole-shaped structure, which can be used to pass through the screw member 422.
[0074] In some embodiments, the spacer 421 is a surface mount structure (or surface mount component) on the upper surface of the main board module 4.
[0075] In this embodiment, the surface mount structure is a component installed by SMT (Surface Mount Technology). By directly mounting the spacer 421 on the surface of the main board module 4 and then welding, the assembly of the spacer 421 is achieved.
[0076] Combined with Figure 3 As shown, in some embodiments, the module body 1 is a front camera. Among them, the front camera, or front shooter, can be a camera arranged on the front of the electronic device, and can be used for functions such as selfies, video calls, and face recognition.
[0077] The functional module is located at the top edge of the main board module 4, the shielding cover 41 is located below the functional module, and the connection component 42 is located on the horizontal side of the functional module.
[0078] The metal foil 2 is located on the back of the module body 1. The metal foil 2 includes a first ground return structure 211 and a second ground return structure 212. The first ground return structure 211 extends downward to connect to the shielding cover 41, and the second ground return structure 212 extends to the horizontal side to connect to the connection component 42.
[0079] In this embodiment, the main board module 4 is arranged at the upper part of the electronic device, the functional module (i.e., the front camera) is arranged at the top edge of the main board module 4, close to the top frame of the electronic device, and the antenna radiator 3 is located on the top frame. The bottom edge of the metal foil 2 is close to the shielding cover 41 of the main board module 4. Therefore, the first ground return structure 211 extends downward from the bottom edge of the metal foil 2 to connect to the shielding cover 41, realizing the first path of ground return. The left side of the metal foil 2 is closer to the connection component 42. Therefore, the second ground return structure 212 extends horizontally to the left from the left edge of the metal foil 2 to connect to the connection component 42, realizing the second path of ground return.
[0080] Both the first ground return structure 211 and the second ground return structure 212 are arranged at positions on the metal foil 2 that are relatively close to the ground return point, and both have short ground return paths, which can further reduce the influence of clutter.
[0081] In some possible implementation manners, the electronic device may include components such as a radio frequency (RF) circuit, a memory including one or more computer-readable storage media, an input unit, a display unit, a sensor, an audio circuit, a Wi-Fi module, a processor including one or more processing cores, and a power supply.
[0082] It should be noted that in the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0083] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "beneath", and "under" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.
[0084] In the description of this specification, the description referring to the terms "certain embodiments", "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present utility model.
[0085] The above are only the embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A functional module, characterized in that, The functional module is close to the antenna radiator of the electronic device; The functional module includes: a module body (1) and a metal foil (2), and the metal foil (2) is located on at least one surface of the module body (1); The metal foil (2) includes at least two ground return structures (21), the at least two ground return structures (21) extend outward in different directions respectively, and the at least two ground return structures (21) are grounded respectively.
2. The functional module according to claim 1, wherein The metal foil (2) is located on the back of the module body (1), and the metal foil (2) is used to increase the heat dissipation area of the module body (1).
3. The functional module according to claim 1, wherein The extension length of at least one of the at least two ground return structures (21) is less than or equal to a first target value.
4. The functional module according to any one of claims 1 to 3, characterized in that, The module body (1) is a camera, a sensor, a receiver or a speaker.
5. An electronic device, characterized in that, The electronic device includes the functional module according to any one of claims 1 to 4.
6. The electronic device according to claim 5, wherein The electronic device further includes an antenna radiator (3); the antenna radiator (3) is close to the functional module.
7. The electronic device according to claim 6, wherein The electronic device further includes a main board module (4), and the functional module is located on one side of the main board module (4); The main board module (4) includes a shielding cover (41), and at least one of the at least two ground return structures (21) is connected to the shielding cover (41).
8. The electronic device according to claim 7, wherein The main board module (4) further includes a connecting component (42), and the connecting component (42) is used to fix the main board module (4); At least one of the at least two ground return structures (21) is connected to the connecting component (42).
9. The electronic device according to claim 8, wherein The electronic device includes a middle frame support part (5), and the connecting component (42) is connected to the middle frame support part (5).
10. The electronic device according to claim 9, characterized in that, The connecting component (42) includes a cushion block (421) and a screw member (422); The cushion block (421) is located between the main board module (4) and the middle frame support part (5), and the screw member (422) threadedly penetrates through the main board module (4), the cushion block (421) and the middle frame support part (5); The ground return structure (21) connected to the connecting component (42) extends between two adjacent ones of the main board module (4), the cushion block (421) and the middle frame support part (5).
11. The electronic device according to claim 10, wherein The cushion block (421) is a surface mounting structure on the main board module (4).
12. The electronic device according to any one of claims 8 to 11, characterized in that, The module body (1) is a front camera; The functional module is located at the top edge of the main board module (4), the shielding cover (41) is located below the functional module, and the connecting component (42) is located on the horizontal side of the functional module; The metal foil (2) is located on the back of the module body (1), the metal foil (2) includes a first ground return structure (211) and a second ground return structure (212), the first ground return structure (211) extends downward to connect the shielding cover (41), and the second ground return structure (212) extends to the horizontal side to connect the connecting component (42).