Circuit board assembly and camera module
By designing circuit board components with sinking grooves and hollow channels in the vehicle camera module, embedded heat sinks and accommodating sensors, the problem of increasing circuit board thickness caused by heat dissipation is solved, and the reliability and adaptability of the camera module are improved.
Patent Information
- Application Number
- CN202421879329.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-02
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-08-02
AI Technical Summary
The heat dissipation method of existing vehicle cameras leads to an increase in circuit board thickness, affecting vehicle assembly, and the high thermal load of the sensor affects module reliability.
The circuit board components are designed including sinking grooves and hollow channels, embedded in the heat sink and fixed the sensor in the heat sink, and the sensor is accommodated in the hollow channels. Combined with the COB wire drawing and SMT piece drawing process, it ensures that the heat sink does not affect the overall thickness and circuit connection.
It improves the heat dissipation efficiency of the sensor, ensures the reliability and adaptability of the camera module, and reduces the thickness of the circuit board components, reducing production costs and RF interference.
Smart Images
Figure CN223080091U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vehicle-mounted cameras, in particular to a circuit board assembly and a camera module. Background Art
[0002] Assisted driving is an important part of the intelligent functions of automobiles, and vehicle-mounted cameras are an important component of assisted driving. The operational reliability and miniaturization of the internal modules of vehicle-mounted cameras have always been the design goals of vehicle-mounted cameras.
[0003] With the development of society and economy, the requirements for the automation and intelligent functions of automobiles are getting higher and higher. In order to adapt to these changing requirements, the pixel of the vehicle-mounted camera needs to be improved, and the working power of the sensor also increases accordingly. Since the camera is always in a working state during driving, continuous operation generates a high thermal load, and the ambient temperature will also affect the operation of the internal module of the camera and even reduce the service life of the module, resulting in a decline in the reliability of the camera module.
[0004] Existing heat dissipation methods, such as punching multiple vias and dissipating heat through the vias, or adopting a more direct and effective method: attaching the sensor to a steel sheet for heat dissipation, but adding a steel sheet for reinforcement will increase the thickness of the circuit board, resulting in an increase in the overall thickness of the module, thus affecting the existing vehicle assembly. Summary of the Utility Model
[0005] Based on the problem that the heat dissipation scheme of the circuit board in the existing vehicle-mounted camera easily leads to an increase in the overall thickness of the camera module and affects the existing vehicle assembly, it is necessary to provide a circuit board assembly and a camera module.
[0006] The circuit board assembly includes:
[0007] A circuit board body having a sunken groove and a hollow channel penetrating the circuit board body from the bottom of the sunken groove;
[0008] A heat sink embedded in the sunken groove of the circuit board body; and
[0009] A sensor heat-transferably fixed to the heat sink and electrically connected to the circuit board body.
[0010] With such a setting, the sensor is directly fixed to the heat sink, which improves the heat dissipation efficiency of the sensor, ensures that the camera module using the circuit board assembly can work stably, improves the reliability of the camera module, and at the same time, the sunken groove design of the circuit board body provides a mounting space for the heat sink, reducing the overall thickness of the circuit board assembly, thus avoiding the influence on the shape of the circuit board assembly after adding the heat sink and ensuring the adaptability of the circuit board assembly to the existing camera module.
[0011] In one of the embodiments, in order to further reduce the influence of the thickness of the sensor on the circuit board assembly, the sensor is accommodated in the hollow channel.
[0012] With such an arrangement, the sensor will not protrude from the top surface of the circuit board body, which is beneficial to reducing the thickness of the circuit board body. In addition, placing the sensor in the hollow channel can also prevent the heat of the sensor from affecting other circuit elements on the circuit board body.
[0013] In one of the embodiments, in order to facilitate the COB (Chips on Board) wiring connection between the sensor and the circuit board body, the heat sink includes a first heat dissipation part inserted into the sinking groove and fixedly connected to the circuit board body, and a second heat dissipation part extending from the first heat dissipation part to the hollow channel, and the sensor is attached to the second heat dissipation part.
[0014] With such arrangement, the second heat dissipation part moves the position of the sensor from the channel opening connected to one side of the sinking groove through the hollow channel toward the other channel opening, thereby shortening the height difference between the side of the sensor facing away from the heat sink and the top surface of the circuit board body, thereby facilitating the COB wiring connection between the sensor and the circuit board body.
[0015] In one of the embodiments, in order to further reduce the thickness of the circuit board assembly, the first heat dissipation portion is accommodated in the sinking groove.
[0016] With such arrangement, the heat sink will not protrude from the bottom surface of the circuit board body. In addition, when SMT mounting is performed on the bottom surface of the circuit board body, the heat sink will not interfere with the mounting process.
[0017] In one embodiment, a side of the first heat dissipation portion facing away from the second heat dissipation portion is flush with a board surface of the circuit board body.
[0018] With such a configuration, the heat sink fills the sink groove of the circuit board without affecting the overall shape of the circuit board assembly, and there is no need to change the layout of other structures inside the entire camera module for the heat sink.
[0019] In one embodiment, the heat sink is a metal piece, and the circuit board assembly further includes a grounding pad located in the sinking groove, and the grounding pad is electrically connected to the circuit board body and the heat sink.
[0020] With this arrangement, the heat sink is also used for grounding, and no additional wiring is required, thereby reducing production costs.
[0021] In one of the embodiments, the ground pad is located at the bottom of the sinking groove.
[0022] With such a setting, compared with setting the grounding pad on the side wall of the sunken groove, this setting method can provide more installation space for the grounding pad, will not limit the size of the grounding pad, is beneficial to reducing the installation difficulty of the grounding pad and improving the welding quality, thereby ensuring the grounding effect.
[0023] In one embodiment, the grounding pad is embedded in the circuit board body.
[0024] With such a setting, it is beneficial to reduce the occupation of the internal space of the sunken groove by the grounding pad, thereby increasing the thickness of the heat sink and enhancing the reinforcement effect of the heat sink on the circuit board assembly.
[0025] In one embodiment, the hollow channel has a channel opening communicating with the sunken groove, and the size of the channel opening is smaller than the size of the bottom of the sunken groove.
[0026] With such a setting, the contact area between the heat sink and the circuit board body is larger, the connection is more firm, and the reinforcement effect of the heat sink on the circuit board body is increased.
[0027] This application also provides a camera module, including the circuit board assembly and the lens assembly as described above, and the lens assembly is arranged on the light sensing path of the sensor of the circuit board assembly.
[0028] With such a setting, since the circuit board assembly of this application has a better heat dissipation effect and its size does not increase due to the introduction of the heat sink, it is convenient to use sensors with larger pixels and higher powers, and at the same time, it will not affect the installation of other structures when applied to existing camera modules, so it has wide adaptability. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 is a schematic structural diagram of a circuit board assembly in an embodiment of the present utility model;
[0030] Figure 2 is Figure 1 an exploded structural diagram of the shown circuit board assembly;
[0031] Figure 3 is Figure 1 a cross-sectional view of the shown circuit board assembly;
[0032] Figure 4 is a cross-sectional view of a circuit board assembly in another embodiment of the present utility model.
[0033] Reference numerals:
[0034] 10. Circuit board body; 11. Sunken groove; 12. Hollow channel; 13. Top surface; 14. Bottom surface; 20. Heat sink; 21. First heat dissipation part; 22. Second heat dissipation part; 30. Sensor; 40. Grounding pad. Detailed implementation manners
[0035] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the following provides a detailed description of the specific implementation manners of the present utility model with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a thorough understanding of the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.
[0036] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of the present utility model.
[0037] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.
[0038] In the present utility model, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0039] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0040] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.
[0041] Assisted driving is an important part of the intelligent functions of automobiles, and in-vehicle cameras are an important component of assisted driving. The operational reliability and miniaturization of the internal modules of in-vehicle cameras have always been the design goals of in-vehicle cameras.
[0042] With the development of society and economy, the requirements for the automation and intelligent functions of automobiles are getting higher and higher. In order to adapt to these changing requirements, the pixel of the in-vehicle camera needs to be improved, and the working power of the sensor also increases accordingly. Since the camera is in a working state all the time during driving, continuous operation generates a relatively high thermal load, and the ambient temperature will also affect the operation of the internal module of the camera and even reduce the service life of the module, resulting in a decrease in the reliability of the camera module.
[0043] Existing heat dissipation methods, such as punching multiple vias and dissipating heat through the vias, or adopting a more direct and effective method: attaching the sensor to a steel sheet for heat dissipation, but adding a steel sheet for reinforcement will increase the thickness of the circuit board, resulting in an increase in the overall thickness of the module, thus affecting the existing vehicle assembly, let alone achieving the design goal of miniaturizing the in-vehicle camera module.
[0044] Based on this, it is necessary to provide a circuit board assembly and a camera module that can improve the heat dissipation effect and avoid affecting the existing vehicle assembly.
[0045] Please refer to Figure 1 and Figure 2 , Figure 1 which is a schematic structural diagram of a circuit board assembly in an embodiment of the present utility model, Figure 2 is Figure 1Exploded structural schematic diagram of the shown circuit board assembly Figure 3 is Figure 1 a cross-sectional view of the shown circuit board assembly.
[0046] The circuit board assembly provided by this application includes a circuit board body 10, a heat sink 20, and a sensor 30. The circuit board body 10 has a sunken groove 11 and a hollow channel 12 that penetrates the circuit board body 10 from the bottom of the sunken groove 11. The heat sink 20 is embedded in the sunken groove 11 of the circuit board body 10. The sensor 30 is thermally conductively fixed to the heat sink 20 and electrically connected to the circuit board body 10. In this way, the heat dissipation efficiency of the sensor 30 is improved, thereby ensuring that the camera using this circuit board assembly can work stably, enhancing the reliability of the camera module. The design of the sunken groove 11 makes way for the installation of the heat sink 20 and is used to accommodate part or all of the heat sink 20, avoiding the heat sink 20 occupying the installation space of other parts of the camera module or other electronic components of the circuit board body 10, ensuring that the size or shape of this circuit board assembly will not change greatly, and thus ensuring the compatibility of this circuit board assembly with the existing camera module.
[0047] Furthermore, in order to reduce the influence of the thickness of the sensor 30 on the circuit board assembly, the sensor 30 is accommodated in the hollow channel 12, so that the sensor 30 does not protrude from the top surface 13 (top surface) of the circuit board body 10, avoiding increasing the height of the circuit board assembly due to the installation of the sensor 30. In addition, the hollow channel 12 can also limit the heat transfer path of the sensor 30, so that the heat of the sensor 30 will not affect other circuit components on the circuit board body 10. It should be noted that the circuit board body 10 has a top surface 13 (top surface) and a bottom surface 14 (bottom surface). In the embodiment provided by this application, the bottom surface 14 (bottom surface) is the side of the circuit board body 10 where the sunken groove 11 is opened, and the top surface 13 (top surface) is the other side of the circuit board body 10.
[0048] Further, since the sensor 30 and the circuit board are usually connected by a COB (Chips on Board) process, to facilitate the implementation of this process, the heat sink 20 includes a first heat dissipation part 21 inserted into the sinking groove 11 and fixedly connected to the circuit board body 10, and a second heat dissipation part 22 extending from the first heat dissipation part 21 into the hollow channel 12. The sensor 30 is attached to the second heat dissipation part 22. The second heat dissipation part 22 shifts the position of the sensor 30 from the channel opening on one side where the hollow channel 12 communicates with the sinking groove 11 towards the other channel opening, that is, raises the position of the sensor 30, shortening the height difference between the side of the sensor 30 facing away from the heat sink 20 and the top surface 13 (top surface) of the circuit board body 10. Therefore, when performing the COB wire bonding operation between the sensor 30 and the circuit board body 10, the travel of the nozzle for bonding the gold wire is shorter, and the formed gold wire is not easily collapsed, which is beneficial to improving the connection quality between the sensor 30 and the circuit board body 10.
[0049] Further, in the production of the circuit board assembly, the SMT component mounting process is usually used to install circuit components. The SMT component mounting operation positions the surface-mounted components onto the pads of the PCB through an SMT machine. If the heat sink 20 protrudes from the bottom surface 14 (bottom surface) of the circuit board body 10, the part of the heat sink 20 protruding from the bottom surface 14 (bottom surface) will interfere with the picking and placing path of the fixture for picking and placing circuit components, and will also affect the printing of solder paste. To avoid this problem, the first heat dissipation part 21 is accommodated in the sinking groove 11, so that the heat sink 20 does not protrude from the bottom surface 14 (bottom surface) of the circuit board body 10. Therefore, when performing SMT component mounting on the bottom surface 14 (bottom surface) of the circuit board body 10, the heat sink 20 will not interfere with the component mounting process. In addition, this can further reduce the height of the circuit board assembly.
[0050] Further, in an embodiment provided by the present application, the side of the first heat dissipation part 21 facing away from the second heat dissipation part 22 is flush with the board surface of the circuit board body 10. In other words, the heat sink 20 fills the sinking groove 11 of the circuit board and will not affect the overall shape of the circuit board assembly, and there is no need to change the layout of other structures inside the entire camera module to arrange the heat sink 20.
[0051] Please refer to Figure 4 , Figure 4 which is a cross-sectional view of the circuit board assembly in another embodiment of the present invention.
[0052] Furthermore, in order to better ground the circuit board body 10 to cope with radio frequency interference, the heat sink 20 is a metal part. The circuit board assembly further includes a ground pad 40 located in the sinking groove 11. The ground pad 40 is electrically connected to the circuit board body 10 and the heat sink 20. In this way, additional ground wires do not need to be provided, and radio frequency interference can be reduced, thereby reducing production costs. Optionally, in an embodiment provided by the present application, the metal part is a SUS steel sheet. Since the thickness of the circuit board body 10 is relatively thin, in this embodiment, the SUS steel sheet is formed into a first heat dissipation part 21 and a second heat dissipation part 22 by an etching process.
[0053] Optionally, in an embodiment provided by the present application, the ground pad 40 is located at the bottom of the sinking groove 11. Compared with setting the ground pad 40 on the side wall of the sinking groove 11, this setting method can provide more installation space for the ground pad 40, does not limit the size of the ground pad 40, is beneficial to reducing the installation difficulty of the ground pad 40 and improving the welding quality, thereby ensuring the grounding effect.
[0054] Furthermore, the ground pad 40 is embedded in the circuit board body 10. Preferably, the side of the ground pad 40 facing the heat sink 20 is flush with the bottom of the sinking groove 11. In this way, the occupation of the internal space of the sinking groove 11 by the ground pad 40 can be reduced. Relatively, the thickness of the heat sink 20 can be increased, and the structural strength of the heat sink 20 is also correspondingly increased, thereby improving the reinforcement effect of the heat sink 20 on the circuit board assembly.
[0055] Optionally, the hollow channel 12 has a channel opening communicating with the sinking groove 11, and the size of the channel opening is smaller than the size of the bottom of the sinking groove 11. In other words, the hollow channel 12 is a partial opening at the bottom of the sinking groove 11 and extends towards the top surface 13 (top surface) of the circuit board body 10. In this way, the contact area between the heat sink 20 and the circuit board body 10 is larger, the connection is more firm, and the reinforcement effect of the heat sink 20 on the circuit board body 10 is increased.
[0056] The present application also provides a camera module, including the circuit board assembly and the lens assembly as described above. The lens assembly is arranged on the light sensing path of the sensor 30 of the circuit board assembly. Since the heat dissipation effect of the circuit board assembly of the present application is better and the size is not increased due to the introduction of the heat sink 20, when a sensor 30 with a larger pixel and higher power is used, the reliability of the camera module will not be reduced, and at the same time, when it is applied to an existing camera module, the installation of other structures will not be affected, so it has wide adaptability.
[0057] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.
[0058] The embodiments described above only represent several implementation manners of the present utility model. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the present utility model patent shall be subject to the appended claims.
Claims
1. Circuit board assembly, characterized in that, Comprising: A circuit board body having a sunken groove and a hollow channel penetrating the circuit board body from the bottom of the sunken groove; A heat sink embedded in the sunken groove of the circuit board body; and A sensor heat-conductively fixed to the heat sink and electrically connected to the circuit board body.
2. The circuit board assembly according to claim 1, wherein The sensor is accommodated in the hollow channel.
3. The circuit board assembly according to claim 2, wherein The heat sink includes a first heat dissipation portion inserted into the sunken groove and fixedly connected to the circuit board body, and a second heat dissipation portion extending from the first heat dissipation portion into the hollow channel, and the sensor is attached to the second heat dissipation portion.
4. The circuit board assembly according to claim 3, wherein, The first heat dissipation portion is accommodated in the sunken groove.
5. The circuit board assembly according to claim 4, characterized in that, One side of the first heat dissipation portion facing away from the second heat dissipation portion is flush with the board surface of the circuit board body.
6. The circuit board assembly according to claim 3, wherein The heat sink is a metal part, and the circuit board assembly further includes a ground pad located in the sunken groove, and the ground pad is electrically connected to the circuit board body and the heat sink.
7. The circuit board assembly according to claim 6, wherein, The ground pad is located at the bottom of the sunken groove.
8. The circuit board assembly according to claim 7, wherein, The ground pad is embedded in the circuit board body.
9. The circuit board assembly according to any one of claims 1 to 8, characterized in that, The hollow channel has a channel opening communicating with the sunken groove, and the size of the channel opening is smaller than the size of the bottom of the sunken groove.
10. Camera module, characterized in that, Comprising: The circuit board assembly according to any one of claims 1 to 9; And A lens assembly provided on the light-sensitive path of the sensor of the circuit board assembly.