Camera module and electronic equipment

Abstract

The embodiment of the utility model provides a camera module and electronic equipment, and relates to the technical field of camera devices. The camera module comprises a hard circuit board and a plastic component, and the plastic component comprises a plastic part and a metal component embedded in the plastic part. The metal assembly comprises a terminal part protruding out of the plastic part. The hard circuit board is provided with a gap structure penetrating through the hard circuit board, and the terminal part is arranged in the gap structure in a penetrating mode and connected with the hard circuit board through the bonding medium. The terminal part comprises a joint sub-part jointed with the joint medium, and the projection of one end, close to the plastic part, of the joint sub-part in the first direction is located in the projection of one end, away from the plastic part, of the joint sub-part in the first direction. The projection area of one end, close to the plastic part, of the joint sub-part in the first direction is smaller than that of one end, away from the plastic part, of the joint sub-part in the first direction, and the first direction is the thickness direction of the hard circuit board. Therefore, the connection strength between the plastic component and the hard circuit board is high.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of camera devices, and particularly to a camera module and an electronic device. Background Art

[0002] In electronic devices such as mobile phones and tablet computers, a camera module is often included, and the camera module can be used to collect external images so that the electronic device can implement the camera function.

[0003] In the related art, the camera module may include a rigid circuit board and a plastic component fixedly arranged on the rigid circuit board. For example, the rigid circuit board can be a circuit board for carrying a photosensitive chip, and the plastic component can be a base of a lens component or a housing of a motor component. The plastic component includes a plastic part and a metal component embedded in the plastic part, and the plastic component can be connected to the rigid circuit board by means of welding, bonding, etc.

[0004] However, in the related art, the connection between the plastic component and the rigid circuit board is prone to cracking, so that the plastic component is easily detached from the rigid circuit board. Summary of the Utility Model

[0005] The embodiments of the present application provide a camera module and an electronic device, in which the connection strength between the plastic component and the rigid circuit board is relatively strong, and the plastic component is not easily detached from the rigid circuit board.

[0006] In a first aspect of the embodiments of the present application, a camera module is provided. The camera module includes a rigid circuit board and a plastic component. The plastic component includes a plastic part and a metal component, and the metal component is embedded in the plastic part. The plastic part includes a first surface, and the first surface is located on one side of the plastic part in a first direction and is opposite to the rigid circuit board. The metal component includes a terminal portion protruding from the first surface in the first direction. The rigid circuit board has a void structure, and the void structure penetrates through both surfaces of the rigid circuit board in the first direction in the first direction. The terminal portion is inserted into the void structure, and the terminal portion is connected to the rigid circuit board through a bonding medium. The terminal portion includes a bonding sub-portion that is bonded to the bonding medium. The projection of the end of the bonding sub-portion close to the first surface in the first direction is located within the projection of the end of the bonding sub-portion far from the first surface in the first direction, and the area of the projection of the end of the bonding sub-portion close to the first surface in the first direction is smaller than the area of the projection of the end of the bonding sub-portion far from the first surface in the first direction. Herein, the first direction is the thickness direction of the rigid circuit board

[0007] In the camera module provided by the embodiments of the present application, when a separating force in the first direction acts on the plastic component and the rigid circuit board, the terminal portion will generate a pressing force in the first direction on the bonding medium. At this time, the reaction force generated by the bonding medium on the terminal portion can prevent the plastic component from separating from the rigid circuit board, so that the bonding strength between the bonding sub-portion and the bonding medium is relatively high, and the bonding medium on the surface of the bonding sub-portion is not prone to cracking. That is to say, the connection between the plastic component and the rigid circuit board is not prone to cracking, and the plastic component is not prone to separating from the rigid circuit board.

[0008] In a possible implementation manner, from one end of the bonding sub-portion close to the first surface to the end of the bonding sub-portion far from the first surface, the projection of the bonding sub-portion in the first direction gradually expands outward.

[0009] In this way, it is convenient to fill the bonding medium between the terminal portion and the rigid circuit board. In addition, the terminal portion can be formed by etching, which is beneficial to forming a terminal portion with a smaller size.

[0010] In a possible implementation manner, the terminal portion includes a first section and a second section. The first section includes a first end, and the first end is located at the end of the first section far from the first surface. The second section includes a second end, and the second end is located at the end of the second section close to the first surface. The second end is connected to the first end, and the end face of the second end is opposite to the first surface. The projection of the end face of the first end in the first direction is located within the projection of the end face of the second end in the first direction, and the area of the projection of the end face of the first end in the first direction is smaller than the area of the projection of the end face of the second end in the first direction. The bonding sub-portion includes at least a part of the first section and at least a part of the second section.

[0011] In this way, the crimping between the end face of the second end and the bonding medium is relatively stable, the bonding strength between the bonding sub-portion and the bonding medium is relatively high, and the bonding medium on the surface of the bonding sub-portion is not prone to cracking.

[0012] In a possible implementation manner, the projection of the terminal portion in the first direction is located within the projection of the void structure in the first direction.

[0013] In this way, it is convenient for the terminal portion to be inserted into the void structure in the first direction, making the assembly of the plastic component and the rigid circuit board relatively easy. In addition, the limitation on the shape of the void structure is also relatively small. The void structure can be a through-hole structure with a closed circumferential structure, or a notch structure with a partially open circumferential structure.

[0014] In a possible implementation manner, the void structure is a through-hole structure.

[0015] In this way, a relatively large bonding surface can be provided between the bonding medium and the rigid circuit board, which is beneficial to improving the bonding strength between the bonding medium and the rigid circuit board, and further improving the connection strength between the rigid circuit board and the plastic component.

[0016] In a possible implementation, the void structure is a notch structure located at the edge of the rigid circuit board.

[0017] In this way, it is beneficial to reduce the size of the rigid circuit board. In addition, the terminal portion can be placed into the void structure through the opening structure circumferentially of the void structure. It is more convenient and easier to place the terminal portion in the void structure, and the limitation on the shape of the terminal portion can be reduced.

[0018] In a possible implementation, a sealant is provided between the bonding medium and the plastic part. The sealant surrounds the terminal portion for one week, and the sealant seals the gap between the bonding medium and the plastic part.

[0019] In this way, after the portion of the terminal portion located between the bonding medium and the plastic part is sealed by the sealant, the portion of the terminal portion located between the bonding medium and the plastic part is not easily oxidized, which is beneficial to improving the connection strength between the plastic component and the rigid circuit board. In addition, the sealant can also prevent impurities from entering the gap between the bonding medium and the plastic part and affecting the performance of the terminal portion.

[0020] In a possible implementation, the rigid circuit board includes a second surface, and the second surface is located on one side of the rigid circuit board in the first direction and is opposite to the first surface. A first adhesive is provided between the first surface and the second surface, and the first surface is bonded to the second surface through the first adhesive.

[0021] In this way, it is beneficial to further improve the bonding strength between the plastic component and the rigid circuit board.

[0022] In a possible implementation, the metal component includes a plurality of terminal portions, and the rigid circuit board has a plurality of void structures corresponding to the terminal portions one by one, and the terminal portions are inserted into the corresponding void structures. At least some of the terminal portions are welding terminal portions, and the void structures corresponding to the welding terminal portions are welding void structures. The rigid circuit board includes a third surface, and the third surface is located on the side of the rigid circuit board away from the first surface in the first direction. The third surface includes a connection area located at the edge of the welding void structure, and at least one of the surface of the connection area and the inner wall surface of the welding void structure has a metal connection structure, and the welding terminal portion is welded to the metal connection structure through solder. Wherein, the bonding medium connecting the welding terminal portion and the rigid circuit board is solder.

[0023] In this way, it is convenient to achieve a firm welding between the welding terminal portion and the rigid circuit board. In addition, it is also convenient to achieve the electrical connection between the metal component and the rigid circuit board.

[0024] In a possible implementation, the rigid circuit board includes a first side portion and a second side portion. The first side portion and the second side portion are respectively located on both sides of the rigid circuit board in the second direction, and both the first side portion and the second side portion have a welding gap structure. Here, the second direction is perpendicular to the first direction.

[0025] In this way, on the basis of enabling a relatively large number of welding terminal portions to be welded to the rigid circuit board, the distance between the first side portion and the second side portion is relatively large, which can reduce the heat accumulation of the rigid circuit board due to the welding of the first side portion and the second side portion, and the heat dissipation is relatively fast when the first side portion and the second side portion are welded, so that the thermal deformation of the rigid circuit board is relatively small when a relatively large number of welding terminal portions need to be welded.

[0026] In a possible implementation, the metal component includes a plurality of terminal portions, the rigid circuit board has a plurality of gap structures corresponding to the terminal portions one by one, and the terminal portions are inserted into the corresponding gap structures. At least some of the terminal portions are bonding terminal portions, and the bonding terminal portions are bonded to the rigid circuit board through a second adhesive. Here, the bonding medium connecting the bonding terminal portions and the rigid circuit board is the second adhesive.

[0027] In this way, the connection between the rigid circuit board and the plastic component can be realized by bonding. In addition, the bonding terminal portions are connected to the rigid circuit board by the bonding method of the second adhesive, which is not likely to cause thermal deformation of the rigid circuit board.

[0028] In a possible implementation, the metal component includes a plurality of terminal portions, the rigid circuit board has a plurality of gap structures corresponding to the terminal portions one by one, and the terminal portions are inserted into the corresponding gap structures. Some of the terminal portions are welding terminal portions, some of the terminal portions are bonding terminal portions, the welding terminal portions are welded to the rigid circuit board through solder, and the bonding terminal portions are bonded to the rigid circuit board through a second adhesive. Here, the bonding medium connecting the welding terminal portions and the rigid circuit board is solder, and the bonding medium connecting the bonding terminal portions and the rigid circuit board is the second adhesive.

[0029] In this way, it is convenient to make the connection between the rigid circuit board and the plastic component relatively stable on the basis of realizing the electrical connection between the metal component and the rigid circuit board, and the thermal deformation of the rigid circuit board due to welding is relatively small.

[0030] In a possible implementation manner, the void structure corresponding to the welding terminal portion is a welding void structure, and the void structure corresponding to the bonding terminal portion is a bonding void structure. The circuit board includes a first side portion, a second side portion, a third side portion, and a fourth side portion. The first side portion and the second side portion are respectively located on both sides of the rigid circuit board in the second direction, and both the first side portion and the second side portion have welding void structures. The third side portion and the fourth side portion are respectively located on both sides of the rigid circuit board in the third direction, and at least one of the third side portion and the fourth side portion has a bonding void structure. Wherein, both the second direction and the third direction are perpendicular to the first direction, and the second direction is perpendicular to the third direction.

[0031] In this way, a relatively large number of welding terminal portions can be welded to the rigid circuit board, and the thermal deformation of the rigid circuit board caused by welding of the first side portion and the second side portion is small. At least one of the third side portion and the fourth side portion is bonded to the bonding terminal portion, which can further improve the connection strength between the rigid circuit board and the plastic component.

[0032] A second aspect of the embodiments of the present application provides an electronic device, which includes the camera module in any of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a front view of an electronic device provided by an embodiment of the present application;

[0034] Figure 2 is a rear view of an electronic device provided by an embodiment of the present application;

[0035] Figure 3 is a schematic diagram of a camera module provided by an embodiment of the present application;

[0036] Figure 4 is Figure 3 an enlarged view of part A in

[0037] Figure 5 is a cross-sectional view of a camera module provided by an embodiment of the present application;

[0038] Figure 6 is a cross-sectional view of another camera module provided by an embodiment of the present application;

[0039] Figure 7 is a cross-sectional view of another camera module provided by an embodiment of the present application;

[0040] Figure 8 is a schematic diagram of a rigid circuit board on one side in the first direction provided by an embodiment of the present application;

[0041] Figure 9 is a schematic diagram of another rigid circuit board provided by an embodiment of the present application;

[0042] Figure 10 Perspective view of an imaging module provided by an embodiment of the present application;

[0043] Figure 11 Schematic diagram of another imaging module provided by an embodiment of the present application;

[0044] Figure 12 is Figure 11 Exploded view of the imaging module provided in

[0045] Figure 13 Perspective view of another imaging module provided by an embodiment of the present application;

[0046] Figure 14 is Figure 13 Enlarged view of part B in

[0047] Figure 15 Perspective view of another imaging module provided by an embodiment of the present application;

[0048] Figure 16 Cross-sectional schematic diagram of another imaging module provided by an embodiment of the present application.

[0049] Explanation of reference numerals:

[0050] 10, display screen; 20, housing assembly; 21, rear cover; 22, frame; 30, imaging module; 30a, front imaging module; 30b, rear imaging module; 31, plastic component;

[0051] 100, rigid circuit board; 110, second surface; 120, third surface; 121, connection area; 130, void structure; 130a, welding void structure; 130b, bonding void structure; 140, metal connection structure; 140a, first metal connection structure; 140b, second metal connection structure; 150, first side portion; 160, second side portion; 170, third side portion; 180, fourth side portion; 190, overlapping portion;

[0052] 200, plastic part; 210, first surface;

[0053] 300, metal component; 310, terminal portion; 310a, welding terminal portion; 310b, bonding terminal portion; 311, joint portion; 312, first section; 313, second section; 314, overlapping sub-portion;

[0054] 400, bonding medium;

[0055] 500, sealant;

[0056] 600, first adhesive;

[0057] x, the first direction; y, the second direction; z, the third direction. Detailed implementation manners

[0058] The terms used in the implementation manners part of this application are only used to explain the specific embodiments of this application, rather than being intended to limit this application. The implementation manners of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0059] The embodiments of this application provide an electronic device, which may include, but is not limited to, devices with a camera function such as mobile phones, tablet computers, laptop computers, cameras, cameras, in-vehicle devices, etc. The embodiments of this application will be described by taking a mobile phone as an example of the electronic device.

[0060] Figure 1 is a front schematic view of an electronic device provided by an embodiment of this application, Figure 2 is a back schematic view of an electronic device provided by an embodiment of this application.

[0061] As Figure 1 , Figure 2 shown, in the embodiments of this application, the electronic device includes a housing assembly 20 and a display screen 10. The display screen 10 is covered and connected to the housing assembly 20. The housing assembly 20 can be used to carry the display screen 10. The display screen 10 can be used to display images. The display screen 10 and the housing assembly 20 enclose a device installation space. The electronic device further includes components such as a main board and a battery disposed in the device installation space.

[0062] The housing assembly 20 includes a frame 22 and a rear cover 21. The frame 22 can surround the outer periphery of the rear cover 21 for one week. The rear cover 21 is fixedly disposed on one side of the frame 22. In some examples, the rear cover 21 and the frame 22 are a split structure, and the rear cover 21 can be fixedly disposed on the frame 22 by means of bonding, snap connection, fastener connection, etc. In other examples, the rear cover 21 and the frame 22 can be an integral structure. The display screen 10 is covered and connected to the side of the frame 22 away from the rear cover 21. That is to say, the display screen 10 and the rear cover 21 are respectively located on both sides of the frame 22. The frame 22 can surround the outer periphery of the display screen 10 for one week. The display screen 10, the frame 22 and the rear cover 21 enclose a device installation space. Exemplarily, the display screen 10 can be bonded to the frame 22.

[0063] In the embodiments of this application, the electronic device further includes one or more camera modules 30. The camera modules 30 can be installed in the device installation space, and the camera modules 30 can be electrically connected to the main board.

[0064] Exemplarily, the electronic device may include a front camera module 30a. The front camera module 30a is disposed on one side of the display screen 10. The display screen 10 has a light-transmitting portion, and the light outside the display screen 10 can enter the front camera module 30a through the light-transmitting portion. The front camera module 30a can facilitate functions such as user selfies and video calls. The front camera module 30a refers to the camera module 30 disposed on one side of the display screen 10.

[0065] Exemplarily, the electronic device may include a rear camera module 30b. The rear camera module 30b is disposed on one side of the rear cover 21. The rear cover 21 has a light-transmitting hole, and the light outside the rear cover 21 can enter the rear camera module 30b through the light-transmitting hole. The rear camera module 30b can facilitate the shooting of external objects. The rear camera module 30b refers to the camera module 30 disposed on one side of the rear cover 21.

[0066] In an embodiment of the present application, the camera module 30 may include, but is not limited to, the front camera module 30a, the rear camera module 30b, etc.

[0067] In an embodiment of the present application, the camera module 30 includes a photosensitive component. The photosensitive component may include a rigid circuit board and a photosensitive chip. The photosensitive chip may also be called an image sensor or a photosensitive element. The photosensitive chip is disposed on the rigid circuit board and electrically connected to the rigid circuit board. The photosensitive chip is used to convert the optical signal irradiated on the photosensitive chip into an electrical signal. The rigid circuit board is used to carry the photosensitive chip, and the rigid circuit board is electrically connected to the main board, so that the photosensitive chip can be electrically connected to the main board through the rigid circuit board.

[0068] The camera module 30 further includes a lens assembly. The lens assembly may include a base, a lens barrel, and a lens group. The lens group is disposed in the lens barrel. The lens barrel is disposed on the base. The lens barrel is disposed opposite to the photosensitive chip. The photosensitive chip is located on the light-emitting side of the lens barrel. The light passing through the lens group can irradiate on the photosensitive chip.

[0069] In some examples, the camera module 30 may further include a motor assembly. The motor assembly may include a housing and a driving device. The housing may be fixedly connected to the rigid circuit board. The driving device is fixedly disposed with the housing. The base of the lens assembly is connected to the driving device. The lens assembly can be disposed on the rigid circuit board through the driving device and the housing. The driving device can adjust the relative position between the lens assembly and the photosensitive chip.

[0070] In some examples, the camera module 30 may not include a motor assembly either. The base of the lens assembly may be fixedly connected to the rigid circuit board to dispose the lens assembly on the rigid circuit board.

[0071] Figure 3Schematic diagram of an imaging module provided by an embodiment of the present application. Among them, the x-direction is the first direction, the y-direction is the second direction, the z-direction is the third direction, the first direction is the thickness direction of the rigid circuit board 100, the second direction and the third direction are both perpendicular to the first direction, and the second direction is perpendicular to the third direction.

[0072] As Figure 3 shown, in the embodiment of the present application, the imaging module 30 includes a plastic component 31 fixedly connected to the rigid circuit board 100. In some examples, the plastic component 31 may be the base of the lens component. In other examples, the plastic component 31 may be the housing of the motor component.

[0073] Exemplarily, the rigid circuit board 100 fixedly connected to the plastic component 31 may be the rigid circuit board of the photosensitive component. That is to say, the rigid circuit board 100 fixedly connected to the plastic component 31 may be the rigid circuit board for carrying the photosensitive chip, and the rigid circuit board 100 fixedly connected to the plastic component 31 may also be other rigid circuit boards of the imaging module 30.

[0074] The plastic component 31 includes a plastic part 200 and a metal component 300. The metal component 300 is embedded in the plastic part 200, and the plastic part 200 and the metal component 300 are an integrated structure. For example, the plastic component 31 can be formed by processes such as insert molding.

[0075] Figure 4 For Figure 3 the enlarged view of part A in

[0076] As Figure 4 shown, the plastic part 200 includes a first surface 210. The first surface 210 is located on one side of the plastic part 200 in the first direction, the first surface 210 faces the rigid circuit board 100, and the metal component 300 includes a terminal part 310 protruding from the first surface 210 along the first direction.

[0077] The rigid circuit board 100 includes a second surface 110 and a third surface 120. The second surface 110 and the third surface 120 are respectively located on both sides of the rigid circuit board 100 in the first direction. The second surface 110 faces the first surface 210, and the third surface 120 is located on the side of the rigid circuit board 100 away from the first surface 210 in the first direction.

[0078] The rigid circuit board 100 has a void structure 130. The void structure 130 penetrates through the two side surfaces of the rigid circuit board 100 in the first direction. That is to say, the void structure 130 penetrates through the second surface 110 and the third surface 120, and the terminal part 310 is inserted into the void structure 130.

[0079] Figure 5A cross-sectional schematic diagram of an imaging module provided by an embodiment of the present application.

[0080] As Figure 5 shown, and referring to Figure 4 , the terminal portion 310 is connected to the rigid circuit board 100 through the bonding medium 400 so that the plastic component 31 is fixedly connected to the rigid circuit board 100.

[0081] The terminal portion 310 includes a joining portion 311 joined to the bonding medium 400. The bonding medium 400 coats the surface of the joining portion 311 and is joined to the surface of the joining portion 311. The bonding medium 400 is also joined to the surface of the rigid circuit board 100 so that the terminal portion 310 is fixedly connected to the rigid circuit board 100.

[0082] The joining portion 311 refers to the portion of the terminal portion 310 joined to the bonding medium 400. The joining portion 311 can be part or all of the terminal portion 310. For example, the surface of the terminal portion 310 can be joined to the bonding medium 400. At this time, the joining portion 311 is the whole of the terminal portion 310.

[0083] Exemplarily, the bonding medium 400 can include, but is not limited to, glue and solder. For example, the terminal portion 310 can be bonded to the rigid circuit board 100 through glue. Also, for example, the terminal portion 310 can be soldered to the rigid circuit board 100 through solder.

[0084] In the related art, the terminal portion is often a rectangular block structure or a columnar structure. The circumferential dimension of the terminal portion from the end connected to the plastic part to the end far from the plastic part remains unchanged. When the plastic component and the rigid circuit board are subjected to a separating force in the first direction, the bonding medium on the surface of the joining portion is subjected to a shearing force in the first direction and is prone to cracking. That is to say, the connection between the plastic component and the rigid circuit board is prone to cracking, making the plastic component easy to detach from the rigid circuit board.

[0085] Based on this, as Figure 5 shown, in the embodiment of the present application, the projection of the end of the joining portion 311 close to the first surface 210 in the first direction is located within the projection of the end of the joining portion 311 far from the first surface 210 in the first direction. The area of the projection of the end of the joining portion 311 close to the first surface 210 in the first direction is smaller than the area of the projection of the end of the joining portion 311 far from the first surface 210 in the first direction. That is to say, the circumferential dimension of the end of the joining portion 311 close to the first surface 210 is smaller than the circumferential dimension of the end of the joining portion 311 far from the first surface 210.

[0086] In this way, when the plastic component 31 and the rigid circuit board 100 are subjected to a separating force in the first direction, the terminal portion 310 will generate a pressing force in the first direction on the bonding medium 400. At this time, the reaction force generated by the bonding medium 400 on the terminal portion 310 can prevent the plastic component 31 from separating from the rigid circuit board 100, so that the bonding strength between the bonding sub-portion 311 and the bonding medium 400 is relatively high, and the bonding medium 400 on the surface of the bonding sub-portion 311 is not likely to crack. That is to say, the connection between the plastic component 31 and the rigid circuit board 100 is not likely to crack, and the plastic component 31 is not likely to detach from the rigid circuit board 100.

[0087] In some examples, the metal component 300 can be electrically connected to the rigid circuit board 100 through the terminal portion 310 to achieve the interaction of electrical signals between the plastic component 31 and the rigid circuit board 100.

[0088] In some possible implementation manners, a sealant 500 is provided between the bonding medium 400 and the plastic part 200. The sealant 500 surrounds the terminal portion 310 for one week, and the sealant 500 seals the gap between the bonding medium 400 and the plastic part 200.

[0089] In this way, after the portion of the terminal portion 310 located between the bonding medium 400 and the plastic part 200 is sealed by the sealant 500, the portion of the terminal portion 310 located between the bonding medium 400 and the plastic part 200 is not likely to be oxidized, which is beneficial to improving the connection strength between the plastic component 31 and the rigid circuit board 100. In addition, the sealant 500 can also prevent impurities from entering the gap between the bonding medium 400 and the plastic part 200 and affecting the performance of the terminal portion 310. For example, it can prevent conductive impurities from entering the gap between the bonding medium 400 and the plastic part 200, so that short circuits are not likely to occur between different terminal portions 310. At this time, the sealant 500 is an insulating sealant 500.

[0090] In some possible implementation manners, from one end of the bonding sub-portion 311 close to the first surface 210 to the end of the bonding sub-portion 311 far from the first surface 210, the projection of the bonding sub-portion 311 in the first direction gradually expands outward.

[0091] In this way, it is convenient to fill the bonding medium 400 between the terminal portion 310 and the rigid circuit board 100. In addition, the terminal portion 310 can be formed by etching, which is beneficial to forming a terminal portion 310 with a smaller size.

[0092] Exemplarily, from one end of the terminal portion 310 connected to the first surface 210 to the end of the terminal portion 310 far from the first surface 210, the projection of the terminal portion 310 in the first direction gradually expands outward.

[0093] In some examples, the terminal portion 310 can be a wedge-shaped structure.

[0094] In some other examples, the terminal portion 310 may be a frustum structure or a prismoid structure.

[0095] Figure 6 It is a schematic cross-sectional view of another camera module provided by an embodiment of the present application.

[0096] As Figure 6 shown, in some possible implementation manners, the terminal portion 310 includes a first section 312 and a second section 313. The first section 312 includes a first end, and the first end is located at an end of the first section 312 away from the first surface 210. The second section 313 includes a second end, and the second end is located at an end of the second section 313 close to the first surface 210. The second end is connected to the first end, and the end surface of the second end faces the first surface 210. The projection of the end surface of the first end along the first direction is located within the projection of the end surface of the second end along the first direction, and the area of the projection of the end surface of the first end along the first direction is smaller than the area of the projection of the end surface of the second end along the first direction.

[0097] The bonding portion 311 includes at least a part of the first section 312 and at least a part of the second section 313, that is to say, the bonding medium 400 is bonded to at least a part of the surface of the first section 312 and is bonded to at least a part of the surface of the second section 313.

[0098] In this way, the pressing between the end surface of the second end and the bonding medium 400 is relatively stable, the bonding strength between the bonding portion 311 and the bonding medium 400 is relatively high, and the bonding medium 400 located on the surface of the bonding portion 311 is not likely to crack.

[0099] Since the bonding medium 400 extends from one end of the bonding portion 311 to the other end of the bonding portion 311, when the bonding portion 311 includes at least a part of the first section 312 and at least a part of the second section 313, the bonding portion 311 at least includes the end surfaces of the first end and the second end, and the bonding portion 311 is bonded to the peripheral surface of the first end and is bonded to the end surface of the second end.

[0100] In some examples, the first section 312 may be a columnar structure or a rectangular block structure, and the circumferential dimension of the first section 312 from the end close to the first surface 210 to the first end remains unchanged.

[0101] In some other examples, from the end of the first section 312 close to the first surface 210 to the first end, the projection of the first section 312 along the first direction gradually expands outwards. In this way, it is beneficial to further improve the bonding strength between the bonding portion 311 and the bonding medium 400.

[0102] In some examples, the second segment 313 may be a columnar structure or a rectangular block structure, and the circumferential dimension of the second segment 313 from the second end to the end away from the first surface 210 remains unchanged.

[0103] In other examples, from the second end to the end of the second segment 313 away from the first surface 210, the projection of the second segment 313 in the first direction gradually expands outward, and at least part of the circumferential surface of the second segment 313 is joined to the joining medium 400. In this way, it is beneficial to further improve the joining strength between the joining sub - part 311 and the joining medium 400.

[0104] In some examples, one end of the first segment 312 away from the first end is connected to the plastic part 200.

[0105] In other examples, one end of the first segment 312 away from the first end may also be connected to the plastic part 200 through other parts of the terminal part 310.

[0106] As Figure 5 shown, in some possible implementation manners, the projection of the terminal part 310 in the first direction is located within the projection of the gap structure 130 in the first direction.

[0107] In this way, it is convenient for the terminal part 310 to be inserted into the gap structure 130 in the first direction, making the assembly of the plastic component 31 and the rigid circuit board 100 relatively easy. In addition, the limitation on the shape of the gap structure 130 is also small. The gap structure 130 can be a through - hole structure with a circumferentially closed structure, or a notch structure with a circumferentially partially open structure.

[0108] Figure 7 This is a schematic cross - sectional view of another camera module provided by the embodiment of the present application.

[0109] As Figure 7 shown, in other possible implementation manners, the rigid circuit board 100 includes an overlapping part 190 located at the edge of the gap structure 130. The part of the terminal part 310 located on the side of the rigid circuit board 100 away from the first surface 210 includes an overlapping sub - part 314. The projection of the overlapping sub - part 314 in the first direction coincides with the projection of the overlapping part 190 in the first direction, and at least part of the overlapping sub - part 314 is connected to the overlapping part 190 through the joining medium 400. That is to say, the joining sub - part 311 includes at least part of the overlapping sub - part 314.

[0110] In this way, when the plastic component 31 and the rigid circuit board 100 are subjected to a separating force in the first direction, the overlapping part 190 can apply a force to the overlapping sub - part 314 through the joining medium 400 to prevent the plastic component 31 from separating from the rigid circuit board 100, which can further improve the joining strength between the joining sub - part 311 and the joining medium 400.

[0111] Figure 8 A schematic diagram of a rigid circuit board on one side in a first direction provided in an embodiment of the present application.

[0112] like Figure 8 As shown, in some possible implementations, the void structure 130 is a through-hole structure, and the circumference of the void structure 130 is a closed structure.

[0113] In this way, a larger bonding surface can be provided between the bonding medium 400 and the rigid circuit board 100 , which is beneficial to improving the bonding strength between the bonding medium 400 and the rigid circuit board 100 , and further improving the connection strength between the rigid circuit board 100 and the plastic component 31 .

[0114] Figure 9 A schematic diagram of another rigid circuit board provided in an embodiment of the present application.

[0115] like Figure 9 As shown, in some possible implementations, the gap structure 130 is a notch structure located at the edge of the rigid circuit board 100 , that is, a circumferential portion of the gap structure 130 is an open structure.

[0116] In this way, it is helpful to reduce the size of the rigid circuit board 100. In addition, the terminal portion 310 can be placed in the gap structure 130 through the opening structure of the gap structure 130 in the circumferential direction, and it is convenient and easy to place the terminal portion 310 in the gap structure 130. In addition, it is convenient to place the larger terminal portion 310 located on the side of the rigid circuit board 100 away from the first surface 210 into the gap structure 130, which can reduce the restrictions on the shape of the terminal portion 310.

[0117] Figure 10 A perspective view of a camera module provided in an embodiment of the present application.

[0118] like Figure 10 As shown, in some possible implementations, a first adhesive 600 is disposed between the first surface 210 and the second surface 110 , and the first surface 210 is bonded to the second surface 110 through the first adhesive 600 .

[0119] In this way, the bonding strength between the plastic component 31 and the rigid circuit board 100 can be further improved.

[0120] Exemplarily, the first adhesive 600 may be an annular structure, that is, the first adhesive 600 may surround the center of the rigid circuit board 100 , and the terminal portion 310 is located outside the first adhesive 600 .

[0121] Figure 11 A schematic diagram of another camera module provided in an embodiment of the present application, Figure 12For Figure 11 the exploded view of the camera module provided in

[0122] As Figure 11 , Figure 12 shown, in some possible embodiments, the metal component 300 includes a plurality of terminal portions 310, and the rigid circuit board 100 has a plurality of void structures 130 corresponding one-to-one to the terminal portions 310, and the terminal portions 310 are inserted into the corresponding void structures 130.

[0123] In some examples, at least part of the terminal portions 310 are welding terminal portions 310a, the void structure 130 corresponding to the welding terminal portion 310a is a welding void structure 130a, the welding terminal portion 310a is welded to the rigid circuit board 100 through solder, and the bonding medium 400 connecting the welding terminal portion 310a and the rigid circuit board 100 is solder.

[0124] In this way, the connection between the welding terminal portion 310a and the rigid circuit board 100 is relatively stable. In addition, it is also convenient to realize the electrical connection between the metal component 300 and the rigid circuit board 100.

[0125] The rigid circuit board 100 includes a first side portion 150, a second side portion 160, a third side portion 170, and a fourth side portion 180. The first side portion 150 and the second side portion 160 are respectively located on both sides of the rigid circuit board 100 in the second direction, and the third side portion 170 and the fourth side portion 180 are respectively located on both sides of the rigid circuit board 100 in the third direction.

[0126] In some examples, one of the first side portion 150, the second side portion 160, the third side portion 170, and the fourth side portion 180 has a welding void structure 130a. For example, the first side portion 150 has a plurality of welding void structures 130a arranged in rows in the third direction, and the first side portion 150 is welded to a plurality of welding terminal portions 310a arranged in rows in the third direction through solder.

[0127] In some examples, two of the first side portion 150, the second side portion 160, the third side portion 170, and the fourth side portion 180 have welding void structures 130a.

[0128] In this way, a larger number of welding terminal portions 310a can be welded to the rigid circuit board 100, so that a larger number of signal channels can be formed between the rigid circuit board 100 and the plastic component 31.

[0129] Exemplarily, both the first side portion 150 and the second side portion 160 have welding void structures 130a.

[0130] In this way, on the basis that a relatively large number of welding terminal portions 310a can be welded to the rigid circuit board 100, the distance between the first side portion 150 and the second side portion 160 is relatively large, so that the heat accumulation of the rigid circuit board 100 due to the welding of the first side portion 150 and the second side portion 160 is less, and the heat dissipation is faster when the first side portion 150 and the second side portion 160 are welded, so that the thermal deformation of the rigid circuit board 100 is smaller when a relatively large number of welding terminal portions 310a need to be welded.

[0131] For example, the first side portion 150 has a plurality of welding void structures 130a arranged in a row along the third direction, the first side portion 150 is welded to a plurality of welding terminal portions 310a arranged in a row along the third direction through solder, the second side portion 160 has a plurality of welding void structures 130a arranged in a row along the third direction, and the second side portion 160 is welded to a plurality of welding terminal portions 310a arranged in a row along the third direction through solder.

[0132] In some examples where both the first side portion 150 and the second side portion 160 have the welding void structures 130a, the third side portion 170 and the fourth side portion 180 do not have the welding void structures 130a, so that the thermal deformation of the rigid circuit board 100 during welding is smaller.

[0133] Exemplarily, both the first side portion 150 and the third side portion 170 have the welding void structures 130a.

[0134] In other examples, at least three of the first side portion 150, the second side portion 160, the third side portion 170, and the fourth side portion 180 have the welding void structures 130a.

[0135] In this way, the number of welding terminal portions 310a welded to the rigid circuit board 100 can be further increased, and the number of signal channels that can be formed between the rigid circuit board 100 and the plastic component 31 can be further increased.

[0136] For example, the first side portion 150 has a plurality of welding void structures 130a arranged in a row along the third direction, and the first side portion 150 is welded to a plurality of welding terminal portions 310a arranged in a row along the third direction through solder. The second side portion 160 has a plurality of welding void structures 130a arranged in a row along the third direction, and the second side portion 160 is welded to a plurality of welding terminal portions 310a arranged in a row along the third direction through solder. The third side portion 170 has a plurality of welding void structures 130a arranged in a row along the second direction, and the third side portion 170 is welded to a plurality of welding terminal portions 310a arranged in a row along the second direction through solder. The fourth side portion 180 has a plurality of welding void structures 130a arranged in a row along the second direction, and the fourth side portion 180 is welded to a plurality of welding terminal portions 310a arranged in a row along the second direction through solder.

[0137] Figure 13 This is a perspective view of another camera module provided by an embodiment of the present application. Figure 14 It is Figure 13 an enlarged view of part B in

[0138] As shown in Figure 13 and Figure 14 , and referring to Figure 11 and Figure 12 , in some possible implementation manners, at least part of the terminal portion 310 is an adhesive terminal portion 310b, the gap structure 130 corresponding to the adhesive terminal portion 310b is an adhesive gap structure 130b, the adhesive terminal portion 310b is adhered to the rigid circuit board 100 through a second adhesive, and the bonding medium 400 connecting the adhesive terminal portion 310b and the rigid circuit board 100 is the second adhesive.

[0139] In this way, the connection between the rigid circuit board 100 and the plastic component 31 can be realized by adhesion. In addition, the adhesive terminal portion 310b is connected to the rigid circuit board 100 by the second adhesive, which is not likely to cause thermal deformation of the rigid circuit board 100.

[0140] In some examples, the second adhesive and the sealant 500 can be the same adhesive. At this time, the second adhesive and the sealant 500 can be an integral structure. The sealant 500 can be formed when the adhesive terminal portion 310b is adhered to the rigid circuit board 100, or the sealant 500 can also be formed after the adhesive terminal portion 310b is adhered to the rigid circuit board 100.

[0141] In other examples, the second adhesive and the sealant 500 can also be different adhesives, and the sealant 500 can be formed after the adhesive terminal portion 310b is adhered to the rigid circuit board 100.

[0142] In some examples, one of the first side portion 150, the second side portion 160, the third side portion 170, and the fourth side portion 180 has an adhesive gap structure 130b. For example, the third side portion 170 has a plurality of adhesive gap structures 130b arranged in a row along the second direction, and the third side portion 170 is adhered to a plurality of adhesive terminal portions 310b arranged in a row along the second direction through a second adhesive.

[0143] In some examples, two of the first side portion 150, the second side portion 160, the third side portion 170, and the fourth side portion 180 have adhesive gap structures 130b.

[0144] In this way, a larger number of adhesive terminal portions 310b can be adhered to the rigid circuit board 100, which is beneficial to improving the connection strength between the rigid circuit board 100 and the plastic component 31.

[0145] Exemplarily, both the third side portion 170 and the fourth side portion 180 have the adhesive void structure 130b.

[0146] For example, the third side portion 170 has a plurality of adhesive void structures 130b arranged in rows along the second direction. The third side portion 170 is welded to a plurality of adhesive terminal portions 310b arranged in rows along the second direction through a second adhesive. The fourth side portion 180 has a plurality of adhesive void structures 130b arranged in rows along the second direction. The fourth side portion 180 is welded to a plurality of adhesive terminal portions 310b arranged in rows along the second direction through a second adhesive.

[0147] Exemplarily, both the first side portion 150 and the third side portion 170 have the adhesive void structure 130b.

[0148] In some other examples, at least three of the first side portion 150, the second side portion 160, the third side portion 170, and the fourth side portion 180 have the adhesive void structure 130b.

[0149] For example, the first side portion 150 has a plurality of adhesive void structures 130b arranged in rows along the third direction. The first side portion 150 is adhered to a plurality of adhesive terminal portions 310b arranged in rows along the third direction through a second adhesive. The second side portion 160 has a plurality of adhesive void structures 130b arranged in rows along the third direction. The second side portion 160 is welded to a plurality of adhesive terminal portions 310b arranged in rows along the third direction through a second adhesive. The third side portion 170 has a plurality of adhesive void structures 130b arranged in rows along the second direction. The third side portion 170 is adhered to a plurality of adhesive terminal portions 310b arranged in rows along the second direction through a second adhesive. The fourth side portion 180 has a plurality of adhesive void structures 130b arranged in rows along the second direction. The fourth side portion 180 is adhered to a plurality of adhesive terminal portions 310b arranged in rows along the second direction through a second adhesive.

[0150] As Figure 11 , Figure 12 shown, in some possible implementation manners, some of the terminal portions 310 are welding terminal portions 310a, and some of the terminal portions 310 are adhesive terminal portions 310b. The welding terminal portions 310a are welded to the rigid circuit board 100 through solder, and the adhesive terminal portions 310b are adhered to the rigid circuit board 100 through a second adhesive.

[0151] In this way, on the basis of realizing the electrical connection between the metal component 300 and the rigid circuit board 100, it is convenient to make the connection between the rigid circuit board 100 and the plastic component 31 relatively stable, and the thermal deformation of the rigid circuit board 100 due to welding is small.

[0152] In some possible embodiments, both the first side portion 150 and the second side portion 160 have a welding gap structure 130a, and at least one of the third side portion 170 and the fourth side portion 180 has an adhesive bonding gap structure 130b.

[0153] In this way, a relatively large number of welding terminal portions 310a can be welded to the rigid circuit board 100, and the thermal deformation of the rigid circuit board 100 caused by the welding of the first side portion 150 and the second side portion 160 is relatively small. At least one of the third side portion 170 and the fourth side portion 180 is adhesively bonded to the adhesive bonding terminal portion 310b, which can further improve the connection strength between the rigid circuit board 100 and the plastic component 31.

[0154] Exemplarily, both the third side portion 170 and the fourth side portion 180 have an adhesive bonding gap structure 130b.

[0155] For example, the first side portion 150 has a plurality of welding gap structures 130a arranged in rows along the third direction, and the first side portion 150 is welded to a plurality of welding terminal portions 310a arranged in rows along the third direction through solder. The second side portion 160 has a plurality of welding gap structures 130a arranged in rows along the third direction, and the second side portion 160 is welded to a plurality of welding terminal portions 310a arranged in rows along the third direction through solder. The third side portion 170 has a plurality of adhesive bonding gap structures 130b arranged in rows along the second direction, and the third side portion 170 is adhesively bonded to a plurality of adhesive bonding terminal portions 310b arranged in rows along the second direction through a second adhesive. The fourth side portion 180 has a plurality of adhesive bonding gap structures 130b arranged in rows along the second direction, and the fourth side portion 180 is adhesively bonded to a plurality of adhesive bonding terminal portions 310b arranged in rows along the second direction through a second adhesive.

[0156] In some other possible embodiments, all the terminal portions 310 are welding terminal portions 310a.

[0157] In still some other possible embodiments, all the terminal portions 310 are adhesive bonding terminal portions 310b.

[0158] Figure 15 This is a perspective view of another camera module provided by an embodiment of the present application.

[0159] As Figure 15 shown, when the connection strength between the plastic component 31 and the rigid circuit board 100 connected through the terminal portions 310 meets the requirements, the first adhesive 600 may not be provided on the first surface 210 and the second surface 110 either.

[0160] Figure 16 This is a cross-sectional schematic diagram of another camera module provided by an embodiment of the present application.

[0161] AsFigure 16 As shown, in some possible embodiments, the third surface 120 includes a connection area 121 located at the edge of the welding void structure 130a. At least one of the surface of the connection area 121 and the inner wall of the welding void structure 130a has a metal connection structure 140, and the welding terminal portion 310a is welded to the metal connection structure 140 by solder.

[0162] In this way, it is convenient to firmly weld the welding terminal portion 310a to the rigid circuit board 100. In addition, it is also convenient to realize the electrical connection between the metal component 300 and the rigid circuit board 100.

[0163] Exemplarily, the metal connection structure 140 is electrically connected to the trace of the rigid circuit board 100 to facilitate the interaction of electrical signals between the metal component 300 and the rigid circuit board 100.

[0164] In some examples, the connection area 121 has a first metal connection structure 140a, and the welding terminal portion 310a is welded to the first metal connection structure 140a by solder. Among them, the first metal connection structure 140a is the metal connection structure 140 located in the connection area 121.

[0165] Exemplarily, the first metal connection structure 140a can be a solder pad.

[0166] Exemplarily, the first metal connection structure 140a can be a part of the metal layer of the rigid circuit board 100. The part of the metal layer of the rigid circuit board 100 can be exposed by removing a part of the insulating layer on the surface of the rigid circuit board 100 to form the first metal connection structure 140a.

[0167] In some examples, the surface of the inner wall of the welding void structure 130a has a second metal connection structure 140b, and the welding terminal portion 310a is welded to the second metal connection structure 140b by solder. Among them, the second metal connection structure 140b is the metal connection structure 140 located on the surface of the inner wall of the welding void structure 130a.

[0168] Exemplarily, the second metal connection structure 140b can be a metal wall, and the second metal connection structure 140b can be formed on the surface of the inner wall of the welding void structure 130a by electroplating.

[0169] In some possible embodiments, the inner wall of the bonding void structure 130b has a rough structure to make the bonding of the second adhesive to the inner wall of the bonding void structure 130b more stable. For example, the rough structure can be a rib structure, a texture structure, etc.

[0170] In some possible embodiments, before the second adhesive is bonded to the rigid circuit board 100, the inner wall of the bonding gap structure 130b can be activated to improve the bonding strength between the second adhesive and the inner wall of the bonding gap structure 130b.

[0171] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, or an indirect connection through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0172] The device or element referred to in the embodiments of the present application or implied must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation on the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise precisely and specifically defined.

[0173] The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims, and above-mentioned drawings of the embodiments of the present application are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these process, method, product, or device.

[0174] The term "a plurality of" herein refers to two or more. The term "and / or" herein is merely a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after; in a formula, the character " / " represents a "division" relationship between the associated objects before and after.

[0175] It can be understood that the various numerical numbers involved in the embodiments of the present application are only for the convenience of description and are not used to limit the scope of the embodiments of the present application.

[0176] It is understood that in the embodiments of the present application, the sequence numbers of the above processes do not indicate the order of execution, and the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

Claims

1. An imaging module (30), characterized in that, It includes a rigid circuit board (100), a plastic part (200) and a metal component (300); The metal component (300) is embedded in the plastic part (200); The plastic part (200) includes a first surface (210), the first surface (210) is located on one side of the plastic part (200) in the first direction, the first surface (210) faces the rigid circuit board (100), and the metal component (300) includes a terminal part (310) protruding from the first surface (210) along the first direction; The rigid circuit board (100) has a void structure (130), the void structure (130) penetrates through both side surfaces of the rigid circuit board (100) in the first direction along the first direction, the terminal part (310) is inserted into the void structure (130), and the terminal part (310) is connected to the rigid circuit board (100) through a bonding medium (400); The terminal part (310) includes a bonding sub - part (311) that is bonded to the bonding medium (400). The projection of the end of the bonding sub - part (311) close to the first surface (210) along the first direction is located within the projection of the end of the bonding sub - part (311) far from the first surface (210) along the first direction. The area of the projection of the end of the bonding sub - part (311) close to the first surface (210) along the first direction is smaller than the area of the projection of the end of the bonding sub - part (311) far from the first surface (210) along the first direction; Wherein, the first direction is the thickness direction of the rigid circuit board (100).

2. The camera module (30) according to claim 1, characterized in that, From the end of the bonding sub - part (311) close to the first surface (210) to the end of the bonding sub - part (311) far from the first surface (210), the projection of the bonding sub - part (311) along the first direction gradually expands outward.

3. The camera module (30) according to claim 1, characterized in that, The terminal part (310) includes a first section (312) and a second section (313); The first section (312) includes a first end, the first end is located at the end of the first section (312) far from the first surface (210), the second section (313) includes a second end, the second end is located at the end of the second section (313) close to the first surface (210), the second end is connected to the first end, and the end face of the second end faces the first surface (210); The projection of the end face of the first end along the first direction is located within the projection of the end face of the second end along the first direction. The area of the projection of the end face of the first end along the first direction is smaller than the area of the projection of the end face of the second end along the first direction. The bonding sub - part (311) includes at least part of the first section (312) and at least part of the second section (313).

4. The imaging module (30) according to claim 1, wherein The projection of the terminal part (310) along the first direction is located within the projection of the void structure (130) along the first direction.

5. The camera module (30) according to claim 1, characterized in that, The void structure (130) is a through - hole structure.

6. The camera module (30) according to claim 1, wherein, The void structure (130) is a notch structure located at the edge of the rigid circuit board (100).

7. The imaging module (30) according to claim 1, characterized in that, A sealant (500) is provided between the bonding medium (400) and the plastic part (200). The sealant (500) surrounds the terminal part (310) in a circle, and the sealant (500) seals the gap between the bonding medium (400) and the plastic part (200).

8. The camera module (30) according to claim 1, wherein The rigid circuit board (100) includes a second surface (110) which is located on one side of the rigid circuit board (100) in the first direction, and the second surface (110) is opposite to the first surface (210). A first adhesive (600) is provided between the first surface (210) and the second surface (110), and the first surface (210) is bonded to the second surface (110) through the first adhesive (600).

9. The imaging module (30) according to any one of claims 1-8, characterized in that, The metal component (300) includes a plurality of the terminal parts (310), and the rigid circuit board (100) has a plurality of the void structures (130) corresponding to the terminal parts (310) one by one. The terminal parts (310) are inserted into the corresponding void structures (130). At least part of the terminal parts (310) are welding terminal parts (310a), and the void structure (130) corresponding to the welding terminal part (310a) is a welding void structure (130a). The rigid circuit board (100) includes a third surface (120) which is located on the side of the rigid circuit board (100) away from the first surface (210) in the first direction. The third surface (120) includes a connection area (121) located at the edge of the welding void structure (130a). At least one of the surface of the connection area (121) and the inner wall surface of the welding void structure (130a) has a metal connection structure (140), and the welding terminal part (310a) is welded to the metal connection structure (140) through solder. Wherein, the bonding medium (400) connecting the welding terminal part (310a) and the rigid circuit board (100) is the solder.

10. The camera module (30) according to claim 9, characterized in that, The rigid circuit board (100) includes a first side part (150) and a second side part (160). The first side part (150) and the second side part (160) are respectively located on both sides of the rigid circuit board (100) in the second direction, and both the first side part (150) and the second side part (160) have the welding void structure (130a). Wherein, the second direction is perpendicular to the first direction.

11. The camera module (30) according to any one of claims 1-8, characterized in that, The metal component (300) includes a plurality of the terminal parts (310), and the rigid circuit board (100) has a plurality of the void structures (130) corresponding to the terminal parts (310) one by one. The terminal parts (310) are inserted into the corresponding void structures (130). At least a part of the terminal portion (310) is an adhesive terminal portion (310b), and the adhesive terminal portion (310b) is adhered to the rigid circuit board (100) through a second adhesive; Wherein, the bonding medium (400) connecting the adhesive terminal portion (310b) and the rigid circuit board (100) is the second adhesive.

12. The imaging module (30) according to any one of claims 1-8, characterized in that, The metal component (300) includes a plurality of the terminal portions (310), the rigid circuit board (100) has a plurality of the void structures (130) corresponding one-to-one to the terminal portions (310), and the terminal portions (310) are inserted into the corresponding void structures (130); Some of the terminal portions (310) are soldering terminal portions (310a), some of the terminal portions (310) are adhesive terminal portions (310b), the soldering terminal portions (310a) are soldered to the rigid circuit board (100) through solder, and the adhesive terminal portions (310b) are adhered to the rigid circuit board (100) through a second adhesive; Wherein, the bonding medium (400) connecting the soldering terminal portion (310a) and the rigid circuit board (100) is the solder, and the bonding medium (400) connecting the adhesive terminal portion (310b) and the rigid circuit board (100) is the second adhesive.

13. The camera module (30) according to claim 12, wherein The void structure (130) corresponding to the soldering terminal portion (310a) is a soldering void structure (130a), and the void structure (130) corresponding to the adhesive terminal portion (310b) is an adhesive void structure (130b); The circuit board includes a first side portion (150), a second side portion (160), a third side portion (170), and a fourth side portion (180); The first side portion (150) and the second side portion (160) are respectively located on both sides of the rigid circuit board (100) in the second direction, and both the first side portion (150) and the second side portion (160) have the soldering void structures (130a); The third side portion (170) and the fourth side portion (180) are respectively located on both sides of the rigid circuit board (100) in the third direction, and at least one of the third side portion (170) and the fourth side portion (180) has the adhesive void structure (130b); Wherein, both the second direction and the third direction are perpendicular to the first direction, and the second direction is perpendicular to the third direction.

14. An electronic device, characterized in that, Including the camera module (30) according to any one of claims 1-13.

Images