Heat dissipation structure and vehicle-mounted terminal
By designing multiple tooth-shaped protrusions parallel to each other on the thermally conductive patch, the problem of poor heat dissipation caused by the thinning of the thermally conductive patch is solved, and the effect of stable heat conduction and component protection is achieved.
Patent Information
- Application Number
- CN202421978228.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-08-15
AI Technical Summary
In the prior art, the thinning of the thickness of the thermally conductive patch causes the impact of the tolerance of the heat dissipation boss and the chip on the gap that cannot be ignored. Insufficient or excessive compression will lead to poor heat dissipation effect or deformation of other components.
A zigzag thermal paste is designed, and the first surface of the thermal paste has a plurality of first tooth-shaped protrusions parallel to each other, increasing the compression amount to compensate for manufacturing tolerances, avoiding insufficient or excessive contact, and having a small deformation resilience without affecting other components.
The stable contact between the thermal tape and the heat dissipation boss is achieved to ensure effective heat dissipation, while avoiding adverse effects on other components, improving the heat dissipation effect and reliability.
Smart Images
Figure CN223080342U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation structures, and particularly to a heat dissipation structure for a vehicle-mounted terminal. The utility model also relates to a vehicle-mounted terminal provided with the heat dissipation structure. Background Art
[0002] Chips of vehicle-mounted terminals such as T-BOX are generally cooled through heat dissipation bosses provided on a housing. There are manufacturing tolerances in both the height direction of the heat dissipation bosses and the thickness direction of the chips. By selecting thermal conductive tapes with different thicknesses, calculating the compression amount of the thermal conductive tapes, heat conduction and dissipation are carried out through the thermal conductive tapes clamped between the heat dissipation bosses and the chips.
[0003] However, with the increasingly strong demands of various vehicle manufacturers to improve the heat conduction efficiency and reduce the cost of heat sinks, the thickness of the thermal conductive tapes has been greatly reduced, making the influence of the tolerances of the heat dissipation bosses and the chips on the gap non-negligible. If the designed compression amount of the thermal conductive tape is too small, the compression amount will be insufficient and the heat dissipation effect will be lost. If the designed compression amount of the thermal conductive tape is too large, deformation of other components will be caused.
[0004] Therefore, how to avoid insufficient or excessive contact of the thermal conductive tape due to the uncertainty of the gap amount is a technical problem to be solved. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a heat dissipation structure to solve the above technical problem.
[0006] Another purpose of the utility model is to provide a vehicle-mounted terminal provided with the heat dissipation structure.
[0007] To achieve the above purpose, the heat dissipation structure provided by the utility model is used for a vehicle-mounted terminal.
[0008] The heat dissipation structure includes a housing and a heat-generating electronic component located inside the housing. The housing is provided with a heat dissipation boss protruding inward. A thermal conductive tape is provided between the heat-generating electronic component and the heat dissipation boss. The thermal conductive tape includes a base portion, the base portion has a first surface and a second surface. The first surface is provided with a plurality of first tooth-shaped protrusions parallel to each other. The first tooth-shaped protrusions are in contact with the heat dissipation boss, and the second surface is in contact with the heat-generating electronic component.
[0009] Optionally, the thickness of the thermal conductive tape is not greater than 1 mm.
[0010] Optionally, the height of the first tooth-shaped protrusion is less than or equal to the thickness of the base portion.
[0011] Optionally, the tolerance in the height direction of the heat dissipation boss is 0.05 mm to 0.2 mm, and the manufacturing tolerance of the heat-generating electronic component is 0.2 mm to 0.5 mm.
[0012] Optionally, the top of the first serrated protrusion is a flat surface or a curved surface.
[0013] Optionally, the pitch between the tops of the first serrated protrusions is 0.5 mm to 1.5 mm.
[0014] Optionally, a plurality of second serrated protrusions that are parallel to each other and in contact with the heat-generating electronic component are provided on the second surface of the heat-conducting sticker.
[0015] Optionally, the length directions of the first serrated protrusions on the first surface and the second serrated protrusions on the second surface are arranged at an angle.
[0016] Optionally, the heat dissipation boss is installed on the housing, or the heat dissipation boss is integrally formed with the housing.
[0017] To achieve the above-mentioned another purpose, the in-vehicle terminal provided by the utility model has a heat dissipation structure, and moreover, the heat dissipation structure is the heat dissipation structure described in any one of the above technical solutions.
[0018] For the heat dissipation structure provided by the utility model, the structure of the heat-conducting sticker is redesigned. A plurality of first serrated protrusions parallel to each other are designed on the first surface of the heat-conducting sticker, thereby forming a serrated heat-conducting sticker. The top width of the first serrated protrusions is relatively narrow and they are spaced apart from each other, and stress is likely to concentrate. When contacting the heat dissipation boss, it will deform under the action of the extrusion force, which can increase the compression amount of the heat-conducting sticker, make up for the influence of the manufacturing tolerances of the heat dissipation boss and the heat-generating electronic component on the clearance value, and avoid the heat-conducting sticker from not contacting or contacting insufficiently. Moreover, compared with the overall deformation of the surface of the heat-conducting sticker, the resilience of the simultaneous deformation of the plurality of first serrated protrusions is small and will not cause excessive force on other components, and can avoid causing adverse effects on other components.
[0019] The in-vehicle terminal provided by the utility model is provided with the heat dissipation structure. Since the heat dissipation structure has the above technical effects, the in-vehicle terminal provided with this heat dissipation structure should also have corresponding technical effects. Description of the Drawings
[0020] Figure 1 is a cross-sectional view of a heat dissipation structure provided by an embodiment of the utility model;
[0021] Figure 2 is an exploded schematic view of the cooperation of the heat dissipation boss, the heat-conducting sticker and the chip;
[0022] Figure 3 is a structural schematic view of a rectangular heat-conducting sticker;
[0023] Figure 4 is a structural schematic view of an L-shaped heat-conducting sticker;
[0024] Figure 5 Schematic structural diagram of the cross-section of the first tooth-shaped protrusion a being trapezoidal;
[0025] Figure 6 Schematic structural diagram of the cross-section of the first tooth-shaped protrusion a being sinusoidal;
[0026] Figure 7 Schematic structural diagram of the cross-section of the first tooth-shaped protrusion a being a trapezoid with a smooth top transition;
[0027] Figure 8 Schematic structural diagram of the heat-conducting sticker having both the first tooth-shaped protrusion a and the second tooth-shaped protrusion b;
[0028] In the figure:
[0029] 10. Housing 20. Circuit board 30. Heat-generating electronic component 40. Heat dissipation boss 41. Heat dissipation groove 42. Heat dissipation rib 50. Heat-conducting sticker 53. Base. Detailed implementation manners
[0030] To enable those skilled in the art to better understand the solution of the present utility model, the present utility model will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners.
[0031] In this article, terms such as "upper, lower, inner, outer" are established based on the positional relationship shown in the accompanying drawings. Depending on the different accompanying drawings, the corresponding positional relationship may also change accordingly. Therefore, it cannot be understood as an absolute limitation of the protection scope; moreover, relational terms such as "first" and "second" are only used to distinguish one component with the same name from another, and do not necessarily require or imply any such actual relationship or order between these components.
[0032] Please refer to Figure 1 、 Figure 2 、 Figure 3 , Figure 1 A cross-sectional view of a heat dissipation structure provided by an embodiment of the present utility model; Figure 2 Exploded schematic diagram of the cooperation between the heat dissipation boss, the heat-conducting sticker and the chip; Figure 3 Schematic structural diagram of a rectangular heat-conducting sticker.
[0033] As shown in the figure, in a specific embodiment, the heat dissipation structure provided by the present utility model is mainly used for in-vehicle terminals, and it has a housing 10 and a circuit board 20 located inside the housing 10. The circuit board 20 is provided with heat-generating electronic components 30 that dissipate heat during operation, such as chips and the like.
[0034] In order to dissipate heat from heat-generating electronic components 30 such as chips, the housing 10 is provided with a heat dissipation boss 40 protruding inward, and a heat-conducting pad 50 is provided between the heat-generating electronic component 30 and the heat dissipation boss 40. The tolerance in the height direction of the heat dissipation boss 40 is 0.05 mm to 0.2 mm. For example, it can be 0.05 mm, 0.1 mm, or 0.2 mm, etc. The manufacturing tolerance of the heat-generating electronic component 30 is 0.2 mm to 0.5 mm. For example, it can be 0.2 mm, 0.3 mm, 0.4 mm, or 0.5 mm, etc. The thickness of the heat-conducting pad is not greater than 1 mm. For example, its thickness can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.8 mm, 1 mm, etc. On the one hand, since the heat-conducting pad 50 has heat conductivity, the heat-conducting pad 50 is used to transfer the heat of the heat-generating electronic component 30 to the heat dissipation boss 40. On the other hand, since the heat-conducting pad 50 has elasticity, the installation tolerance between the heat dissipation boss 40 and the heat-generating electronic component 30 is compensated by the compressible amount.
[0035] In view of this, the heat-conducting pad 50 has a flat base 53, and its base 53 has a first surface and a second surface. Among them, the first surface is the upper surface shown in the figure, and the second surface is the lower surface shown in the figure. The first surface is provided with a plurality of first tooth-shaped protrusions a parallel to each other. During assembly, the heat-conducting pad 50 contacts the surface of the heat-generating electronic component 30 through the second surface, and contacts the heat dissipation boss 40 through the first tooth-shaped protrusions a.
[0036] Since the first surface of the heat-conducting pad 50 has a plurality of first tooth-shaped protrusions a parallel to each other, the first surface of the heat-conducting pad 50 is serrated. The top width of the first tooth-shaped protrusions a is relatively narrow and they are spaced apart from each other, and stress is easily concentrated. When it contacts the heat dissipation boss 40, it will deform under the action of the extrusion force, which can increase the compression amount of the heat-conducting pad 50, make up for the influence of the manufacturing tolerances of the heat dissipation boss 40 and the heat-generating electronic component 40 on the clearance value, and avoid the heat-conducting pad 50 from not contacting or contacting insufficiently, so that the heat dissipation boss 40 and the heat-conducting pad 50 are in stable and continuous contact and heat transfer. Moreover, compared with the traditional heat-conducting pad, the resilience of the deformation is small, and it will not cause excessive force on components such as chips and circuit boards, and can avoid causing adverse effects on other components.
[0037] The heat dissipation boss 40 can be made of a metal material so as to utilize excellent heat conduction characteristics and better dissipate heat. Specifically, the heat dissipation boss 40 can be separately processed and formed, and then installed in the frame opening area reserved on the housing 10, so as to become a part of the housing 10. If such a structure is adopted, the housing 10 can be made of a metal material or other materials such as plastic.
[0038] Alternatively, the heat dissipation boss 40 can also be integrally formed with the housing 10. If such a structure is adopted, the housing 10 can be made of a metal material. In this way, not only can the heat dissipation boss 40 dissipate heat by itself, but also the heat dissipation boss 40 can transfer heat to the housing 10, and the metal housing 10 can be used to dissipate heat together to further improve the heat dissipation effect.
[0039] In this embodiment, a plurality of parallel heat dissipation grooves 41 are provided on the back of the heat dissipation boss 40, and heat dissipation ribs 42 are formed between the heat dissipation grooves 41, thereby effectively increasing the heat dissipation area. During use, the chip generates a large amount of heat due to high-speed operation. The heat generated is first transferred to the thermal conductive pad 50, then transferred from the thermal conductive pad 50 to the heat dissipation boss 40, and then the heat dissipation boss 40 transfers the heat to the outside air through the external surface, heat dissipation grooves 41, heat dissipation ribs 42 and other parts, thereby realizing the heat dissipation and temperature reduction of the chip and ensuring that the chip can operate stably at a safe temperature.
[0040] In the above embodiment, the shape of the chip as the heat-generating electronic component 30 is rectangular. Therefore, in order to fully cover the chip and avoid heat dissipation dead angles, the shape of the thermal conductive pad 50 is also rectangular, and its area size is consistent with the upper surface of the chip, so as to conduct all the heat dissipated from the upper surface of the chip to the heat dissipation boss 40.
[0041] It can be understood that according to the different shapes of the heat-generating electronic component 30, the shape of the thermal conductive pad 50 can also be different. For example, in another embodiment, if the shape of the chip is "L" shaped, then the shape of the thermal conductive pad 50 can also be "L" shaped (see Figure 4 ), and their sizes and shapes are consistent.
[0042] Please refer to Figures 5 to 7 , Figure 5 for the schematic cross-sectional view of the first tooth-shaped protrusion a with a trapezoidal cross-section; Figure 6 for the schematic cross-sectional view of the first tooth-shaped protrusion a with a sinusoidal waveform cross-section; Figure 7 for the schematic cross-sectional view of the first tooth-shaped protrusion a with a trapezoidal cross-section with a smooth transition at the top.
[0043] As shown in the figure, the cross-sectional width of the first tooth-shaped protrusion a gradually increases from the top to the root, and the top of the first tooth-shaped protrusion a is a plane or a curved surface.
[0044] For example, the cross-section of the first tooth-shaped protrusion a is trapezoidal with a flat top (see Figure 5 ); or, the cross-section of the first tooth-shaped protrusion a is trapezoidal with a curved top (see Figure 6 ); or, the cross-section of the first tooth-shaped protrusion a is sinusoidal (see Figure 7 ).
[0045] In this way, not only can it be ensured that the thermal conductive pad 50 can still have a large deformation amount even when the thickness is relatively thin, so as to compensate for the clearance tolerance between the heat dissipation boss 40 and the heat-generating electronic component 30. At the same time, it can also ensure that there is still sufficient contact area between the thermal conductive pad 50 and the heat dissipation boss 40, enabling effective heat conduction. Since there are no sharp corners at the tooth tips, it avoids excessive stress concentration at the sharp corners of the tooth tips and plastic deformation, and then prevents the compression amount of the thermal conductive pad 50 from increasing and resulting in functional failure.
[0046] In other embodiments, the height of the first tooth-shaped protrusion a can be less than or equal to the thickness of the base 53 of the thermal conductive pad 50. In this way, it is ensured that the base 53 has sufficient thickness to avoid insufficient support force of the thermal conductive pad 50.
[0047] Please refer to Figure 8 , Figure 8 which is a schematic structural diagram of the thermal conductive pad provided with both the first tooth-shaped protrusion a and the second tooth-shaped protrusion b at the same time.
[0048] As shown in the figure, compared with the first embodiment, the difference in this embodiment is that:
[0049] A plurality of mutually parallel second tooth-shaped protrusions b are provided on the second surface of the thermal conductive pad 50. When assembling, the thermal conductive pad 50 contacts the heat-generating electronic component 30 through the second tooth-shaped protrusions b.
[0050] Moreover, the length direction of the first tooth-shaped protrusion a and the length direction of the second tooth-shaped protrusion b can be set at an angle.
[0051] In this embodiment, the length direction of the first tooth-shaped protrusion a is perpendicular to the length direction of the second tooth-shaped protrusion b.
[0052] By simultaneously designing tooth-shaped protrusions on the first surface and the second surface of the thermal conductive pad 50, the upper and lower surfaces of the thermal conductive pad 50 can both be serrated, and the clearance tolerance can also be compensated, enabling the heat-generating electronic component 30, the thermal conductive pad 50, and the heat dissipation boss 40 to be in full contact without affecting other components.
[0053] In this embodiment, the same parts as those in the first embodiment are given the same reference numerals and the same textual descriptions are omitted.
[0054] In addition to the above heat dissipation structure, the in-vehicle terminal provided by the present utility model can be an in-vehicle multimedia host, an intelligent driving controller, or an in-vehicle T-BOX, etc., which has the heat dissipation structure described above. For the remaining structures of the in-vehicle terminal, please refer to the prior art and will not be elaborated herein.
[0055] The above embodiments are only the preferred solutions of the present utility model, and are not specifically limited thereto. On this basis, targeted adjustments can be made according to actual needs to obtain different implementation manners. For example, if the shape of the heating electronic component 30 changes, the shape of the heat-conducting sticker 50 can be adaptively adjusted accordingly, and so on. Since there are many possible implementation manners, they will not be enumerated one by one here.
[0056] The present utility model solves the problem that the heat-conducting sticker 50 is not in sufficient contact due to the uncertain clearance amount. Since the structure of the heat-conducting sticker 50 is redesigned, the traditional flat heat-conducting sticker is designed into a serrated heat-conducting sticker. When the top of the first tooth-shaped protrusion a and / or the second tooth-shaped protrusion b contacts the heat dissipation boss 40, it is easy to deform, and the deformation resilience can be controlled within a reasonable range without causing adverse effects on other components of the vehicle-mounted terminal, thereby increasing the compression amount of the serrated heat-conducting sticker, compensating for the influence of manufacturing tolerances on the clearance value, and ensuring the contact stability of the heat-conducting sticker.
[0057] The heat dissipation structure and the vehicle-mounted terminal provided by the present utility model have been introduced in detail above. Specific examples are used in this article to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the core idea of the present utility model. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present utility model, several improvements and modifications can be made to the present utility model, and these improvements and modifications also fall within the protection scope of the claims of the present utility model.
Claims
1. A heat dissipation structure for a vehicle-mounted terminal, characterized in that, The heat dissipation structure includes a housing (10) and a heat - generating electronic component (30) located inside the housing (10). The housing (10) is provided with a heat dissipation boss (40) protruding inward. A heat - conducting sticker (50) is provided between the heat - generating electronic component (30) and the heat dissipation boss (40). The heat - conducting sticker (50) includes a base (53). The base (53) has a first surface and a second surface. The first surface is provided with a plurality of mutually parallel first tooth - shaped protrusions (a). The first tooth - shaped protrusions (a) are in contact with the heat dissipation boss (40), and the second surface is in contact with the heat - generating electronic component (30).
2. The heat dissipation structure according to claim 1, wherein The thickness of the heat - conducting sticker (50) is not greater than 1 mm.
3. The heat dissipation structure according to claim 2, wherein The height of the first tooth - shaped protrusion (a) is less than or equal to the thickness of the base (53).
4. The heat dissipation structure according to claim 1, wherein, The tolerance in the height direction of the heat dissipation boss (40) is 0.05 mm to 0.2 mm, and the manufacturing tolerance of the heat - generating electronic component (30) is 0.2 mm to 0.5 mm.
5. The heat dissipation structure according to claim 1, characterized in that, The top of the first tooth - shaped protrusion (a) is a flat surface or a curved surface.
6. The heat dissipation structure according to claim 1, wherein The pitch between the tops of the first tooth - shaped protrusions (a) is 0.5 mm to 1.5 mm.
7. The heat dissipation structure according to claim 1, characterized in that, The second surface of the heat - conducting sticker (50) is provided with a plurality of mutually parallel second tooth - shaped protrusions (b) that are in contact with the heat - generating electronic component (30).
8. The heat dissipation structure according to claim 7, characterized in that, The length directions of the first tooth - shaped protrusions (a) on the first surface and the second tooth - shaped protrusions (b) on the second surface are arranged at an angle.
9. The heat dissipation structure according to any one of claims 1 to 7, characterized in that, The heat dissipation boss (40) is installed on the housing (10), or the heat dissipation boss (40) is integrally formed with the housing (10).
10. A vehicle-mounted terminal has a heat dissipation structure, characterized in that, The heat dissipation structure is the heat dissipation structure according to any one of claims 1 to 9 above.