Ceramic chip heat dissipation device for electronic component

Abstract

The utility model relates to the technical field of electronic components, and discloses a ceramic chip heat dissipation device for electronic components, which comprises a processing box, the outer surface of the processing box is fixedly connected with a heat energy recovery box, the upper surface of the processing box is fixedly provided with an air pump through bolts, and the input end of the air pump is fixedly connected with a heat absorption pipe. Heat on the surface of the ceramic chip is sucked out through the air pump and the heat absorption pipe, hot air is conveyed into the heat energy recycling box through the heat conveying pipe, heat is effectively transferred and recycled, solid media can conduct heat exchange through the circulation holes due to the design of the preheating box, and therefore the purpose of preheating is achieved. An operator can conveniently replace and add a solid medium through the auxiliary handle, in addition, due to the design of the liquid filling port, the operator can easily add a liquid medium, leakage is prevented through the water plug, the liquid medium is preheated, and the solid medium and the liquid medium can be used for various purposes such as heat supply and hot water supply after being preheated respectively.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a ceramic sheet heat dissipation device for electronic components. Background Art

[0002] The ceramic sheet for electronic components is a material widely used in the electronic industry. It has excellent electrical insulation performance, high thermal conductivity, low thermal expansion coefficient, good chemical stability and mechanical strength. These characteristics make the ceramic sheet an ideal material for manufacturing electronic packaging substrates, high-frequency electronic components, sensors and other high-performance electronic devices.

[0003] Publication No.: CN216700837U discloses a ceramic sheet heat dissipation device for electronic components, which includes a box body. Inside the box body, there is a ceramic mounting plate. Placement cavities are equidistantly opened on the ceramic mounting plate. And a heat exchange mechanism is arranged inside the ceramic mounting plate. Both ends of the ceramic mounting plate are connected to the inner wall of the box body through a sliding mechanism. Below the ceramic mounting plate, ceramic heat dissipation fins are equidistantly arranged through a clamping mechanism. And the ceramic heat dissipation fins pass through the card slots and extend to the outside. The card slots are equidistantly opened at the bottom end of the box body. Inside the box body, air exchange mechanisms are symmetrically arranged. Through the mutual cooperation of the above-mentioned mechanisms, the utility model can not only quickly discharge the heat generated when the electronic components work, so as to ensure that the equipment works in a relatively safe temperature environment, ensure the working efficiency and service life of the equipment, but also when the heat dissipation equipment needs to be cleaned or maintained, it can be disassembled one by one, and dust and the like can be thoroughly cleaned, ensuring the heat dissipation effect of the radiator.

[0004] However, there are some defects in the actual use of the above device: the above device mainly quickly exports the heat generated when the electronic components work to the outside through the heat dissipation holes and the ceramic heat dissipation fins. Although this heat dissipation method is effective, it also directly leads to the waste of heat energy. The direct emission of heat energy not only causes great waste of energy, but also may have a negative impact on the environment. Summary of the Utility Model

[0005] To solve the above technical problems, the utility model provides a ceramic sheet heat dissipation device for electronic components.

[0006] The utility model is realized by adopting the following technical solutions: a ceramic sheet heat dissipation device for electronic components, including a processing box, the outer surface of the processing box is fixedly connected with a heat energy recovery box, the upper surface of the processing box is fixedly installed with an air pump through bolts, the input end of the air pump is fixedly connected with a heat absorption pipe, the heat absorption pipe is arranged inside the processing box, the output end of the air pump is fixedly connected with a heat delivery pipe, the heat delivery pipe is arranged inside the heat energy recovery box, and pipe brackets are fixedly connected to the outer surfaces of the heat absorption pipe and the heat delivery pipe, and the pipe brackets are fixedly connected to the outer surface of the processing box.

[0007] Through the above technical solution, by combining the ceramic sheet heat dissipation device with the heat energy recovery system, the heat generated by the electronic components can be effectively recovered and utilized, improving the energy utilization efficiency and reducing energy waste. At the same time, through the design of the air pump and pipeline system, the heat can be transported to the designated heat energy recovery box for further utilization, such as preheating air, water or other media, thus realizing the comprehensive utilization of heat.

[0008] As a further improvement of the above solution, a sealing door panel is hinged to the front end of the processing box, and finger grooves are provided on both sides of the outer surface of the sealing door panel.

[0009] Through the above technical solution, the sealing door panel is installed at the front end of the processing box by means of hinge, so that the door panel can be easily opened and closed, facilitating the maintenance and repair of the inside of the processing box. The design of the sealing door panel can effectively prevent external air from entering the inside of the processing box, maintaining the temperature stability inside the box and improving the heat energy recovery efficiency. The design of the finger grooves enables the operator to hold the door panel more conveniently for opening and closing operations, improving the operation convenience.

[0010] As a further improvement of the above solution, support seats are fixedly connected to the four corners of the inner bottom wall of the processing box, and a ceramic sheet group is arranged on the surface of the support seats.

[0011] As a further improvement of the above solution, an assembly frame is fixedly installed on the inner top wall of the processing box through bolts, and a heat dissipation fan is arranged inside the assembly frame.

[0012] Through the above technical solution, the heat dissipation fan can effectively improve the air circulation inside the processing box, thereby reducing the temperature of the ceramic sheets inside the processing box and preventing failures and safety hazards caused by overheating of electrical components or ceramic sheets.

[0013] As a further improvement of the above solution, grooves are provided on the inner wall of the heat energy recovery box, a preheating box is slidably connected inside the grooves, and a plurality of circulation holes are provided on the inner bottom wall of the preheating box.

[0014] Through the above technical solution, some solid substances can be placed in the preheating box, and heat can flow inside and outside the preheating box through the circulation holes, thereby preheating the solid medium and improving the utilization rate of heat energy. The slidable connection design of the preheating box enables it to be conveniently taken out and put in, facilitating the replacement and addition of the preheated solid medium. The design of the circulation holes can ensure the full circulation of heat inside and outside the preheating box, improving the preheating efficiency of the solid medium.

[0015] As a further improvement of the above solution, an auxiliary handle is fixedly connected to the front end of the preheating box, and the preheating box is slidably connected to the inner wall of the heat energy recovery box.

[0016] As a further improvement of the above solution, a liquid filling port is provided on the upper surface of the heat energy recovery box, and a water blocking plug is clamped inside the liquid filling port.

[0017] Through the above technical solution, the design of the liquid filling port and the water blocking plug can not only preheat the solid medium, but also conveniently add the liquid medium and preheat the liquid medium, improving the versatility of the equipment. The opening of the liquid filling port enables the operator to conveniently add the liquid medium into the heat energy recovery box without opening the entire equipment.

[0018] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0019] In the present utility model, the heat on the surface of the ceramic sheet is sucked out through the air pump and the heat absorption pipe, and the hot air is transported into the heat energy recovery box through the heat delivery pipe, realizing the effective transfer and recovery of heat. The design of the preheating box enables the solid medium to conduct heat exchange through the circulation holes, thereby achieving the purpose of preheating. The operator can conveniently replace and add the solid medium through the auxiliary handle. In addition, the design of the liquid filling port enables the operator to easily add the liquid medium and prevent leakage through the water blocking plug, realizing the preheating of the liquid medium. After preheating the solid and liquid media respectively, they can be used for various purposes, such as heating, hot water supply, etc. Description of the Drawings

[0020] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0021] Figure 2 is a schematic diagram of the structure of the ceramic sheet group of the present utility model;

[0022] Figure 3 is a schematic diagram of the structure of the heat dissipation fan of the present utility model;

[0023] Figure 4 is a schematic diagram of the structure of the water blocking plug of the present utility model;

[0024] Figure 5 is an exploded structure schematic diagram of the preheating box of the present utility model.

[0025] Main Symbol Description:

[0026] 1. Processing box; 2. Heat energy recovery box; 3. Air pump; 4. Heat absorption pipe; 5. Heat delivery pipe; 6. Pipe bracket; 7. Sealed door panel; 8. Finger groove; 9. Support seat; 10. Ceramic sheet group; 11. Assembly frame; 12. Heat dissipation fan; 13. Preheating box; 14. Circulation hole; 15. Auxiliary handle; 16. Liquid filling port; 17. Water blocking plug. Detailed Embodiment

[0027] Next, in combination with the accompanying drawings and specific embodiments, the present utility model will be further described. It should be noted that, on the premise of no conflict, the following-described embodiments or technical features can be arbitrarily combined to form new embodiments.

[0028] Embodiment:

[0029] Please refer to Figures 1-5 , a ceramic sheet heat dissipation device for an electronic component in this embodiment includes a processing box 1. A heat energy recovery box 2 is fixedly connected to the outer surface of the processing box 1. An air pump 3 is fixedly installed on the upper surface of the processing box 1 through bolts. An endothermic pipe 4 is fixedly connected to the input end of the air pump 3. The endothermic pipe 4 is arranged inside the processing box 1. An air supply pipe 5 is fixedly connected to the output end of the air pump 3. The air supply pipe 5 is arranged inside the heat energy recovery box 2. Pipe brackets 6 are fixedly connected to the outer surfaces of the endothermic pipe 4 and the air supply pipe 5. The pipe brackets 6 are fixedly connected to the outer surface of the processing box 1. The air pump 3 sucks the hot air inside the processing box 1 through the endothermic pipe 4. The endothermic pipe 4 is located inside the processing box 1 and can effectively absorb the heat dissipated by the ceramic sheet heat dissipation device. The air pump 3 transports the sucked hot air to the inside of the heat energy recovery box 2 through the air supply pipe 5. The air supply pipe 5 is located inside the heat energy recovery box 2 and can transfer the heat in the hot air to the medium in the heat energy recovery box 2 such as water, air, etc. The medium in the heat energy recovery box 2 exchanges heat with the hot air in the air supply pipe 5 and absorbs heat, thereby achieving the purpose of preheating. The preheated medium can be used for various purposes such as heating, hot water supply, etc.

[0030] A sealing door panel 7 is hinged to the front end of the processing box 1. Finger grooves 8 are opened on both sides of the outer surface of the sealing door panel 7. An operator holds the sealing door panel 7 through the finger grooves 8 and pulls it outwards, causing the door panel to rotate around the hinge point to open the front end of the processing box 1. The operator pushes the sealing door panel 7 back to its original position to make it closely fit with the front end of the processing box 1, ensuring the sealing inside the processing box 1. The sealing design between the sealing door panel 7 and the processing box 1 can effectively prevent external air from entering the box, maintain the temperature stability inside the box, improve the heat energy recovery efficiency, and at the same time facilitate the cleaning and maintenance of the internal ceramic sheet.

[0031] Support seats 9 are fixedly connected to the four corners of the inner bottom wall of the processing box 1. A ceramic sheet group 10 is arranged on the surface of the support seats 9.

[0032] An assembly frame 11 is fixedly installed on the inner top wall of the processing box 1 through bolts. A cooling fan 12 is arranged inside the assembly frame 11. The cooling fan 12 can effectively improve the air circulation inside the processing box 1, thereby reducing the temperature of the ceramic sheet inside the processing box 1.

[0033] The inner wall of the heat energy recovery box 2 is provided with a groove, and a preheating box 13 is slidably connected inside the groove. A plurality of circulation holes 14 are opened on the inner bottom wall of the preheating box 13. The heat can enter the inside of the preheating box 13 through these holes, preheating the solid medium placed in the preheating box 13. The solid medium exchanges heat with the heat flowing through the circulation holes 14 inside the preheating box 13, so as to achieve the purpose of preheating. Since the preheating box 13 and the groove are slidably connected, the operator can conveniently take out or put the preheating box 13 into the heat energy recovery box 2, which is convenient for replacing and adding solid medium.

[0034] The front end of the preheating box 13 is fixedly connected with an auxiliary handle 15, and the preheating box 13 is slidably connected to the inner wall of the heat energy recovery box 2.

[0035] A liquid filling port 16 is opened on the upper surface of the heat energy recovery box 2, and a water blocking plug 17 is clamped inside the liquid filling port 16. The operator adds the liquid medium into the heat energy recovery box 2 through the liquid filling port 16. After the filling is completed, the operator clamps the water blocking plug 17 into the liquid filling port 16 to prevent the liquid medium from leaking. The heat inside the heat energy recovery box 2 exchanges heat with the liquid medium, transferring the heat to the liquid medium, so as to achieve the preheating of the liquid medium.

[0036] The implementation principle of a ceramic chip heat dissipation device for electronic components in this application embodiment is as follows: The cooling fan 12 is fixed inside the assembly frame 11 through bolts, and the assembly frame 11 is fixed on the inner top wall of the processing box 1. The cooling fan 12 can effectively improve the air circulation inside the processing box 1, thereby reducing the temperature of the ceramic chips inside the processing box 1. The air pump 3 sucks the hot air inside the processing box 1 through the heat absorption pipe 4. The heat absorption pipe 4 is located inside the processing box 1 and can effectively absorb the heat dissipated by the ceramic chip group 10. The air pump 3 transports the sucked hot air to the inside of the heat energy recovery box 2 through the heat delivery pipe 5. The heat delivery pipe 5 is located inside the heat energy recovery box 2 and can transfer the heat in the hot air to the heat energy recovery box 2. The circulation holes 14 enable the heat to enter the inside of the preheating box 13 through these holes, preheating the solid medium placed in the preheating box 13. The operator can conveniently take out or put the preheating box 13 into the heat energy recovery box 2 through the auxiliary handle 15, which is convenient for replacing and adding solid medium. At the same time, the operator can also add the liquid medium into the heat energy recovery box 2 through the liquid filling port 16. After the filling is completed, the operator clamps the water blocking plug 17 into the liquid filling port 16 to prevent the liquid medium from leaking. The heat inside the heat energy recovery box 2 exchanges heat with the liquid medium, transferring the heat to the liquid medium, so as to achieve the preheating of the liquid medium. The preheated medium can be used for various purposes, such as heating, hot water supply, etc.

[0037] The above embodiments are only the preferred embodiments of the present utility model, and the scope of protection of the present utility model cannot be limited thereby. Any non-substantial changes and substitutions made by those skilled in the art based on the present utility model fall within the scope of protection required by the present utility model.

Claims

1. A ceramic chip heat dissipation device for electronic components, characterized in that, It includes a processing box (1), the outer surface of the processing box (1) is fixedly connected with a heat energy recovery box (2), the upper surface of the processing box (1) is fixedly installed with an air pump (3) through bolts, the input end of the air pump (3) is fixedly connected with a heat absorption pipe (4), the heat absorption pipe (4) is arranged inside the processing box (1), the output end of the air pump (3) is fixedly connected with a heat delivery pipe (5), the heat delivery pipe (5) is arranged inside the heat energy recovery box (2), the outer surfaces of the heat absorption pipe (4) and the heat delivery pipe (5) are both fixedly connected with pipe brackets (6), and the pipe brackets (6) are fixedly connected to the outer surface of the processing box (1).

2. The ceramic sheet heat dissipation device for an electronic component according to claim 1, wherein: A sealing door panel (7) is hinged to the front end of the processing box (1), and finger grooves (8) are opened on both sides of the outer surface of the sealing door panel (7).

3. The ceramic sheet heat dissipation device for an electronic component according to claim 1, characterized in that: Support seats (9) are fixedly connected to the four corners of the inner bottom wall of the processing box (1), and a ceramic chip group (10) is arranged on the surface of the support seats (9).

4. The ceramic sheet heat dissipation device for an electronic component according to claim 1, wherein: An assembly frame (11) is fixedly installed on the inner top wall of the processing box (1) through bolts, and a heat dissipation fan (12) is arranged inside the assembly frame (11).

5. The ceramic sheet heat dissipation device for an electronic component according to claim 1, wherein: A groove is opened on the inner wall of the heat energy recovery box (2), a preheating box (13) is slidably connected inside the groove, and a plurality of flow holes (14) are opened on the inner bottom wall of the preheating box (13).

6. The ceramic sheet heat dissipation device for an electronic component according to claim 5, wherein: An auxiliary handle (15) is fixedly connected to the front end of the preheating box (13), and the preheating box (13) is slidably connected to the inner wall of the heat energy recovery box (2).

7. The ceramic chip heat dissipation device for an electronic component according to claim 1, characterized in that: A liquid filling port (16) is opened on the upper surface of the heat energy recovery box (2), and a water blocking plug (17) is clamped inside the liquid filling port (16).

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