Structure based on COB integrated circuit board packaging technology

Abstract

The utility model discloses a structure based on COB integrated circuit board packaging technology, comprising an integrated circuit board, the integrated circuit board is provided with a countersink pad, the countersink pad is provided with a reflective structure, the countersink pad is internally provided with a plurality of LED light sources, the countersink pad is filled with a packaging material used for packaging the plurality of LED light sources, and the LED light sources are arranged in the packaging material. A reinforcing structure is arranged between the packaging material and the counter bore bonding pad, the packaging adhesive is filled into the counter bore structure, the bonding area with the inner wall is increased, the stability is improved, meanwhile, the periphery is provided with the open groove extending outwards and the transverse shaft structure, the packaging adhesive can be locked on the transverse shaft after being formed and cured, the stability is further improved, and the service life is further prolonged. Meanwhile, a light reflecting structure is arranged, light source divergence is avoided, and the light gathering capacity is improved.

Description

Technical Field

[0001] The utility model relates to an integrated circuit board and a COB packaging structure, and particularly to a structure based on a COB integrated circuit board packaging technology. Background Art

[0002] An integrated circuit board is a substrate for connecting and supporting electronic components. The COB surface light source, namely chip-on-board packaging, is one of the bare chip mounting technologies. COB is a light source structure connected to an integrated circuit board. Multiple LED light sources are encapsulated through encapsulation glue. If the paste between the COB chip and the circuit board is not firm or the adhesion is insufficient after aging, it may cause the COB chip to fall off and even lead to a short circuit in the circuit.

[0003] Therefore, the existing integrated circuit boards and COB packaging structures need to be further improved. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a structure based on a COB integrated circuit board packaging technology, which can improve the stability of the connection between the encapsulation glue and the circuit board, avoid situations such as short circuits in the circuit, and improve the service life.

[0005] To achieve the above purpose, the utility model adopts the following scheme:

[0006] A structure based on a COB integrated circuit board packaging technology includes an integrated circuit board. A counterbore pad is arranged on the integrated circuit board. A reflective structure is arranged on the counterbore pad. Multiple LED light sources are arranged in the counterbore pad. The counterbore pad is filled with an encapsulation material for encapsulating the multiple LED light sources. A reinforcement structure is arranged between the encapsulation material and the counterbore pad.

[0007] Further, the counterbore pad is circularly arranged.

[0008] Further, the sinking dimension of the counterbore pad is 3 mm - 6 mm.

[0009] Further, the reflective structure includes an inclined surface arranged on the edge of the counterbore pad, and a reflective material is coated on the inclined surface.

[0010] Further, the encapsulation material is a light-transmitting material.

[0011] Further, the reinforcement structure includes multiple slots extending outwardly arranged inside the counterbore pad, and a transverse axis structure is arranged in the slots.

[0012] Further, the multiple slots are arranged in a circumferentially uniform distribution around the center of the counterbore pad.

[0013] Further, the encapsulation material is filled into the slotted opening.

[0014] In summary, the beneficial effects of the present utility model compared with the prior art are as follows:

[0015] The present utility model solves the deficiencies existing in the existing integrated circuit board and COB packaging structure. Through the structural arrangement of the present utility model, the following advantages are achieved. The encapsulation glue is filled into the counterbore structure, increasing the bonding area with the inner wall and improving stability. At the same time, slotted openings and transverse axis structures extending outward are provided around, which can lock on the transverse axis after the encapsulation glue is formed and cured, further improving stability and service life. Meanwhile, a light-reflecting structure is provided to avoid light source divergence, improve the light-gathering ability, and has a simple structure and convenient use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a top view of the present utility model;

[0017] Figure 2 is a schematic diagram of the internal structure of the present utility model;

[0018] Figure 3 is the Figure 2 partial enlarged view of part A of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0020] Please refer to Figures 1-3 , the present utility model provides a structure based on COB integrated circuit board packaging technology, including an integrated circuit board 1, a counterbore pad 2 is provided on the integrated circuit board 1, a light-reflecting structure 3 is provided on the counterbore pad 2, a plurality of LED light sources 4 are provided in the counterbore pad 2, an encapsulation material 5 for encapsulating the plurality of LED light sources 4 is filled on the counterbore pad 2, and a reinforcement structure 6 is provided between the encapsulation material 5 and the counterbore pad 2;

[0021] The plurality of LED light sources 4 are welded and fixed in the counterbore pad 2, and the encapsulation material 5 is filled in the counterbore pad 2. The encapsulation material 5 is connected to the inner wall of the counterbore pad 2 to increase the contact area and improve the bonding stability;

[0022] The plurality of the slots 601 are also filled with the encapsulating material 5, and the encapsulating material 5 also wraps the horizontal axis structure 602; after the encapsulating material 5 is formed, the horizontal axis structure 602 is grasped to make the whole encapsulating material 5 firmer and improve the service life.

[0023] The counterbore pad 2 of the present utility model is circularly arranged.

[0024] The sinking dimension of the counterbore pad 2 of the present utility model is 3 mm - 6 mm.

[0025] The light reflecting structure 3 of the present utility model includes an inclined surface 301 arranged at the edge of the counterbore pad 2, and a light reflecting material 302 is coated on the inclined surface 301;

[0026] The light reflecting material 302 is inclined to prevent the light source from diverging.

[0027] The encapsulating material 5 of the present utility model is a light-transmitting material.

[0028] The reinforcing structure 6 of the present utility model includes a plurality of slots 601 arranged inside the counterbore pad 2 and extending outward, and a horizontal axis structure 602 is arranged in the slots 601.

[0029] The plurality of the slots 601 of the present utility model are circumferentially and uniformly arranged around the center of the counterbore pad 2.

[0030] The encapsulating material 5 of the present utility model is filled into the slots 601.

[0031] The above shows and describes the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A structure based on COB integrated circuit board packaging technology, comprising an integrated circuit board (1), characterized in that: A counterbore pad (2) is provided on the integrated circuit board (1), a reflective structure (3) is provided on the counterbore pad (2), a plurality of LED light sources (4) are provided in the counterbore pad (2), a packaging material (5) for encapsulating the plurality of LED light sources (4) is filled in the counterbore pad (2), and a reinforcement structure (6) is provided between the packaging material (5) and the counterbore pad (2); The reinforcement structure (6) includes a plurality of slots (601) extending outwardly provided inside the counterbore pad (2), and a horizontal axis structure (602) is provided in the slots (601).

2. The structure according to claim 1 based on the COB integrated circuit board packaging technology, characterized in that: The counterbore pad (2) is circularly arranged.

3. A structure based on the COB integrated circuit board packaging technology according to claim 1, characterized in that: The sinking dimension of the counterbore pad (2) is 3 mm - 6 mm.

4. A structure according to claim 2 based on a COB integrated circuit board packaging technology, characterized in that: The reflective structure (3) includes an inclined surface (301) provided at the edge of the counterbore pad (2), and a reflective material (302) is coated on the inclined surface (301).

5. A structure according to claim 4 based on a COB integrated circuit board packaging technology, characterized in that: The packaging material (5) is a light-transmitting material.

6. A structure according to the COB integrated circuit board packaging technology described in claim 5, characterized in that: The plurality of slots (601) are evenly distributed circumferentially around the center of the counterbore pad (2).

7. A structure based on the COB integrated circuit board packaging technology according to claim 6, characterized in that: The packaging material (5) is filled into the slots (601).

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