Cleaning device for semiconductor wafer production

Abstract

The utility model relates to a cleaning device for semiconductor wafer production, which is applied to the field of semiconductor wafer production and processing and comprises a plasma cleaning machine body, an L-shaped air inlet hole is formed in the upper end of the plasma cleaning machine body, an exhaust hole is formed in the lower end of the plasma cleaning machine body, and a controller is fixedly embedded in the front end of the plasma cleaning machine body. Supporting seats are fixedly connected to the four corners of the lower end of the plasma cleaning machine body, a cleaning cavity is formed in the front end of the plasma cleaning machine body, a mounting plate is fixedly connected to the front end of the plasma cleaning machine body, a positioning plate is in threaded connection to the front end of the mounting plate, and an electronic rotating disc is fixedly connected to the rear end of the positioning plate. The multiple fixing assemblies are driven by the electronic rotating disc to rotate in the cleaning cavity, so that plasma electron clouds are blown to different positions of the wafer, the wafer processing effect and the surface processing uniformity are improved, meanwhile, the two faces of the wafer can be cleaned, the wafer does not need to be turned over, and the wafer cleaning efficiency is improved.

Description

Technical Field

[0001] The utility model relates to a cleaning device, in particular to a cleaning device for semiconductor wafer production applied to the field of semiconductor wafer production and processing. Background Art

[0002] The plasma cleaner is also called the plasma cleaning machine or the plasma surface treatment instrument. It is a brand-new high-tech technology that uses plasma to achieve effects that cannot be achieved by conventional cleaning methods. Plasma is a state of matter, also known as the fourth state of matter, and does not belong to the common three states of solid, liquid, and gas. Applying sufficient energy to the gas to ionize it will turn it into a plasma state. The "active" components of plasma include ions, electrons, atoms, active groups, excited nuclides (metastable states), photons, etc. The plasma cleaner processes the surface of the sample by utilizing the properties of these active components to achieve purposes such as cleaning and coating.

[0003] In the plasma cleaner, gas is filled into the plasma cleaner through the exhaust component, but generally the gas only enters the plasma cleaner in one direction, resulting in uneven distribution of the mixed gas inside the plasma cleaner, and further causing uneven cleaning of the semiconductor wafer, greatly reducing the cleaning effect. Summary of the Utility Model

[0004] Aiming at the above-mentioned prior art, the technical problem to be solved by the utility model is that the gas inside the plasma cleaner generally only enters in one direction, resulting in uneven distribution of the mixed gas inside the plasma cleaner, and further causing uneven cleaning of the semiconductor wafer and poor cleaning effect.

[0005] To solve the above problems, the present utility model provides a cleaning device for semiconductor wafer production, including a plasma cleaner body. An L-shaped air inlet hole is drilled at the upper end of the plasma cleaner body, and an exhaust hole is drilled at the lower end of the plasma cleaner body. A controller is fixedly embedded at the front end of the plasma cleaner body. Support seats are fixedly connected to the four corners at the lower end of the plasma cleaner body. A cleaning chamber is drilled at the front end of the plasma cleaner body. The L-shaped air inlet hole and the exhaust hole are both communicated with the cleaning chamber. An installation plate is fixedly connected to the front end of the plasma cleaner body. A positioning plate is threadedly connected to the front end of the installation plate. An electronic turntable is fixedly connected to the rear end of the positioning plate. Two installation bars are fixedly connected to the rear end of the electronic turntable. A plurality of fixing components are fixedly connected to the corresponding ends of the two installation bars. The fixing component includes a fixing plate fixedly installed between the two installation bars. A circular accommodating groove is drilled on the surface of the fixing plate. A plurality of installation grooves are drilled on the inner wall of the accommodating groove. A toothed plate is slidably connected to the inner wall of the installation groove. A limiting groove is drilled on the surface of the toothed plate. A limiting rod is arranged in the limiting groove, and both ends of the limiting rod are fixedly connected to the left and right inner walls of the installation groove respectively. A plurality of adjusting rods corresponding to the plurality of installation grooves respectively are arranged on the right side of the fixing plate. The left end of the adjusting rod rotates through the installation groove and is rotatably connected to the inner wall of the installation groove. A gear is fixedly sleeved on the outer surface of the adjusting rod. The gear meshes with the toothed plate. A clamping plate is fixedly connected to the end of the toothed plate facing the central axis of the accommodating groove. Two knobs are rotatably connected to the right end of the fixing plate. A pulley group is jointly sleeved on the outer surfaces of the two longitudinally opposite adjusting rods and the knobs.

[0006] In the above cleaning device for semiconductor wafer production, the electronic turntable drives a plurality of fixing components to rotate inside the cleaning chamber, so that the plasma electron cloud blows to different positions of the wafer, improving the processing effect of the wafer and the uniformity of surface treatment. At the same time, both sides of the wafer can be cleaned without turning the wafer over, improving the wafer cleaning efficiency.

[0007] As a further improvement of the present application, a plug rod is fixedly connected to the rear end of the fixing component located at the rearmost side, and a slot matching the plug rod is drilled on the circular inner wall of the cleaning chamber.

[0008] As a further improvement of the present application, the positioning plate includes a circular plate and a threaded plate fixedly installed at the rear end of the circular plate. The diameter of the circular plate is larger than that of the threaded plate, and a handle is fixedly connected to the front end of the circular plate.

[0009] As a further improvement of the present application, the diameter of the electronic turntable is smaller than the inner diameter of the cleaning chamber, and the electronic turntable is signal-connected to the controller.

[0010] As another improvement of the present application, the plurality of installation grooves are distributed in a circular array around the central axis of the accommodating groove. The longitudinal section of the clamping plate is an arc coaxial with the accommodating groove. The clamping plate is made of an elastic material, and a plurality of magnetic strips are fixedly embedded inside the clamping plate.

[0011] As yet another improvement of the present application, the front end of the mounting plate is rotatably connected with a mounting block, the front end of the mounting block is fixedly connected with an L-shaped plate, and one end of the L-shaped plate close to the mounting plate is fixedly connected with a plurality of rubber bumps.

[0012] In summary, in the actual application process, the wafer is placed in the accommodating groove of the fixing plate, and then the knob is rotated to drive the pulley group to rotate, so that the adjusting rod rotates. The adjusting rod drives the gear to rotate, causing the toothed plate to move towards the inside of the accommodating groove, thereby driving the clamping plate to move towards the central axis of the accommodating groove, so that the clamping plate clamps and fixes the wafer. Then, the positioning plate is screwed into the cleaning cavity, and the insertion rod is inserted into the insertion slot, thereby installing and limiting a plurality of fixing components. When the plasma cleaning machine body is started, the electronic turntable can be started to drive a plurality of fixing components to rotate simultaneously. At this time, the plasma electron cloud can be blown to different positions of the wafer, thereby improving the processing effect of the wafer and the uniformity of the surface treatment. At the same time, both sides of the wafer can be cleaned, and there is no need to turn the wafer over, improving the wafer cleaning efficiency. Description of the Drawings

[0013] Figure 1 is a three-dimensional structural schematic diagram of the first embodiment of the present application;

[0014] Figure 2 is a sectional view of the structure of the plasma cleaning machine body of the first embodiment of the present application;

[0015] Figure 3 is a structural schematic diagram of the positioning plate of the first embodiment of the present application;

[0016] Figure 4 is an exploded view of the structure of the fixing component of the first embodiment of the present application;

[0017] Figure 5 is a sectional view of the structure of the clamping plate of the first embodiment of the present application;

[0018] Figure 6 is a three-dimensional structural schematic diagram of the second embodiment of the present application.

[0019] Explanation of the reference numerals in the drawings:

[0020] 1 Plasma cleaning machine body, 2 Controller, 3 Support seat, 4 Cleaning cavity, 5 Mounting plate, 6 Positioning plate, 7 Electronic turntable, 8 Mounting strip, 9 Fixing plate, 10 Mounting groove, 11 Toothed plate, 12 Limiting groove, 13 Limiting rod, 14 Adjusting rod, 15 Gear, 16 Clamping plate, 17 Knob, 18 Pulley group, 19 Insertion rod, 20 Mounting block, 21 L-shaped plate. Detailed Embodiments

[0021] The following will describe in detail the two embodiments of the present application with reference to the drawings.

[0022] The first implementation mode:

[0023] Figure 1 and Figure 2 Shown: A cleaning device for semiconductor wafer production, including a plasma cleaner body 1. An L-shaped air inlet hole is drilled at the upper end of the plasma cleaner body 1, and an exhaust hole is drilled at the lower end of the plasma cleaner body 1. A controller 2 is fixedly embedded at the front end of the plasma cleaner body 1. Those skilled in the art can select a suitable model of the controller 2 according to actual needs. For example: OHR-B300A-A. Support seats 3 are fixedly connected to the four corners at the lower end of the plasma cleaner body 1. The support seats 3 can support the plasma cleaner body 1 to improve the stability of the plasma cleaner body 1. A cleaning chamber 4 is drilled at the front end of the plasma cleaner body 1. The L-shaped air inlet hole and the exhaust hole are both communicated with the cleaning chamber. The diameter of the electronic turntable 7 is smaller than the inner diameter of the cleaning chamber 4 to facilitate the rotation of the electronic turntable 7. The electronic turntable 7 is signal-connected to the controller 2. Those skilled in the art can select a suitable model of the electric turntable 2 according to actual needs. For example: Y200RA.

[0024] Figure 2 and Figure 3 Shown: An installation plate 5 is fixedly connected to the front end of the plasma cleaner body 1. A positioning plate 6 is threadedly connected to the front end of the installation plate 5. The cleaning chamber 4 can be sealed through the positioning plate 6. An electronic turntable 7 is fixedly connected to the rear end of the positioning plate 6. Starting the rotation of the electronic turntable 7 can drive the fixing component to rotate, so that the wafer rotates inside the cleaning chamber 4. Two installation bars 8 are fixedly connected to the rear end of the electronic turntable 7. A plurality of fixing components are fixedly connected to the corresponding ends of the two installation bars 8. The positioning plate 6 includes a circular plate and a threaded plate fixedly installed at the rear end of the circular plate. The diameter of the circular plate is larger than the diameter of the threaded plate. A handle is fixedly connected to the front end of the circular plate. A plug rod 19 is fixedly connected to the rear end of the last fixing component. A slot matching the plug rod 19 is drilled on the circular inner wall of the cleaning chamber 4. The plug rod 19 can limit the fixing component.

[0025] Figure 4 and Figure 5It is shown that the fixing component includes a fixing plate 9 fixedly installed between two mounting bars 8. A circular accommodating groove is formed on the surface of the fixing plate 9, and a wafer can be placed in the accommodating groove. A plurality of mounting grooves 10 are formed on the inner wall of the accommodating groove. A toothed plate 11 is slidably connected to the inner wall of the mounting groove 10. A limiting groove 12 is formed on the surface of the toothed plate 11, and a limiting rod 13 is arranged in the limiting groove 12. The two ends of the limiting rod 13 are respectively fixedly connected to the left and right inner walls of the mounting groove 10. The limiting groove 12 and the limiting rod 13 can limit the toothed plate 11, forcing the toothed plate 11 to move only linearly, improving the stability of the toothed plate 11 during movement. A plurality of adjusting rods 14 corresponding to the plurality of mounting grooves 10 respectively are arranged on the right side of the fixing plate 9. The left end of the adjusting rod 14 rotates through the mounting groove 10 and is rotatably connected to the inner wall of the mounting groove 10. A gear 15 is fixedly sleeved on the outer surface of the adjusting rod 14. The gear 15 meshes with the toothed plate 11. The gear 15 can drive the toothed plate 11 to move, thereby driving the movement of the clamping plate 16. One end of the toothed plate 11 facing the central axis of the accommodating groove is fixedly connected to the clamping plate 16. Two knobs 17 are rotatably connected to the right end of the fixing plate 9. A pulley group 18 is jointly sleeved on the outer surfaces of the two longitudinally opposite adjusting rods 14 and the knobs 17. The knob 17 can drive the pulley group 18 to rotate, thereby rotating the adjusting rod 14, and further driving the gear 15 to rotate, improving work efficiency. The plurality of mounting grooves 10 are distributed in an annular array around the central axis of the accommodating groove. The longitudinal section of the clamping plate 16 is an arc coaxial with the accommodating groove. The clamping plate 16 is made of an elastic material, and a plurality of magnetic strips are fixedly embedded inside the clamping plate 16. When the wafer is limited and fixed, the plurality of magnetic strips inside the clamping plate 16 attract each other, thereby improving the clamping effect and further improving the stability of the wafer during cleaning.

[0026] During use, place the wafer in the accommodating groove of the fixing plate 9, and then rotate the knob 17 to drive the pulley group 18 to rotate, thereby rotating the adjusting rod 14. The adjusting rod 14 drives the gear 15 to rotate, causing the toothed plate 11 to move towards the inside of the accommodating groove, thereby driving the clamping plate 16 to move towards the central axis of the accommodating groove, so that the clamping plate 16 clamps and fixes the edge of the wafer. Then, screw the positioning plate 6 into the cleaning chamber 4, so that the insertion rod 19 is inserted into the insertion slot, thereby installing and limiting the plurality of fixing components. When starting the plasma cleaning machine body 1, the electronic turntable 7 can be started to drive the plurality of fixing components to rotate simultaneously. At this time, the plasma electron cloud can blow to different positions of the wafer, thereby improving the processing effect of the wafer and the uniformity of surface treatment. At the same time, both sides of the wafer can be cleaned without flipping the wafer again, improving the wafer cleaning efficiency.

[0027] The second implementation mode:

[0028] Based on the first implementation mode, this implementation mode adds a mounting block 20 and an L-shaped plate 21, and the rest is the same as the first implementation mode.

[0029] Figure 6 It is shown that: a mounting block 20 is rotatably connected to the front end of the mounting plate 5, a front end of the mounting block 20 is fixedly connected to an L-shaped plate 21, and a plurality of rubber bumps are fixedly connected to an end of the L-shaped plate 21 close to the mounting plate 5.

[0030] During use, the mounting block 20 can be rotated to drive the L-shaped plate 21 to rotate, so that the L-shaped plate 21 is located at the front end of the positioning plate 6, and the rubber bumps are in contact with the positioning plate 6, thereby limiting and fixing the positioning plate 6 and improving the stability of the positioning plate 6.

[0031] Combined with the current actual requirements, the above-described implementation manner adopted in this application, the scope of protection is not limited thereto. Within the scope of knowledge possessed by those skilled in the art, various changes made without departing from the concept of this application still fall within the protection scope of this utility model.

Claims

1. A cleaning device for semiconductor wafer production, comprising a plasma cleaning machine body (1). An L-shaped air inlet is drilled at the upper end of the plasma cleaning machine body (1), and an exhaust hole is drilled at the lower end of the plasma cleaning machine body (1). It is characterized in that: A controller (2) is fixedly inlaid at the front end of the plasma cleaner body (1). Four corners at the lower end of the plasma cleaner body (1) are fixedly connected with support seats (3). A cleaning chamber (4) is dug at the front end of the plasma cleaner body (1). Both the L-shaped air inlet hole and the exhaust hole communicate with the cleaning chamber (4). An installation plate (5) is fixedly connected to the front end of the plasma cleaner body (1). A positioning plate (6) is threadedly connected to the front end of the installation plate (5). An electronic turntable (7) is fixedly connected to the rear end of the positioning plate (6). Two installation bars (8) are fixedly connected to the rear end of the electronic turntable (7). Multiple fixing components are fixedly connected to the corresponding ends of the two installation bars (8). The fixing component includes a fixing plate (9) fixedly installed between the two installation bars (8). A circular accommodation groove is dug on the surface of the fixing plate (9). Multiple installation grooves (10) are dug on the inner wall of the accommodation groove. A toothed plate (11) is slidably connected to the inner wall of the installation groove (10). A limiting groove (12) is dug on the surface of the toothed plate (11). A limiting rod (13) is arranged in the limiting groove (12). Two ends of the limiting rod (13) are respectively fixedly connected to the left and right inner walls of the installation groove (10). Multiple adjusting rods (14) corresponding to the multiple installation grooves (10) are arranged on the right side of the fixing plate (9). The left end of the adjusting rod (14) rotates through the installation groove (10) and is rotatably connected to the inner wall of the installation groove (10). A gear (15) is fixedly sleeved on the outer surface of the adjusting rod (14). The gear (15) meshes with the toothed plate (11). A clamping plate (16) is fixedly connected to the end of the toothed plate (11) facing the central axis of the accommodation groove. Two knobs (17) are rotatably connected to the right end of the fixing plate (9). A pulley group (18) is jointly sleeved on the outer surfaces of the longitudinally opposite two adjusting rods (14) and the knob (17).

2. The cleaning device for semiconductor wafer production according to claim 1, wherein: A plug rod (19) is fixedly connected to the rear end of the fixing component at the rearmost position. A slot matching the plug rod (19) is dug on the circular inner wall of the cleaning chamber (4).

3. A cleaning device for semiconductor wafer production according to claim 1, characterized in that: The positioning plate (6) includes a circular plate and a threaded plate fixedly installed at the rear end of the circular plate. The diameter of the circular plate is larger than that of the threaded plate. A handle is fixedly connected to the front end of the circular plate.

4. A cleaning device for semiconductor wafer production according to claim 1, characterized in that: The diameter of the electronic turntable (7) is smaller than the inner diameter of the cleaning chamber (4). The electronic turntable (7) is signal-connected to the controller (2).

5. The cleaning device for semiconductor wafer production according to claim 1, wherein: The multiple installation grooves (10) are distributed in an annular array around the central axis of the accommodation groove. The longitudinal section of the clamping plate (16) is an arc coaxial with the accommodation groove. The clamping plate (16) is made of an elastic material, and multiple magnetic strips are fixedly inlaid inside the clamping plate (16).

6. The cleaning device for semiconductor wafer production according to claim 1, wherein: An installation block (20) is rotatably connected to the front end of the installation plate (5). An L-shaped plate (21) is fixedly connected to the front end of the installation block (20). Multiple rubber bumps are fixedly connected to the end of the L-shaped plate (21) close to the installation plate (5).

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