Battery cell positive electrode wafer punching die

Abstract

The utility model discloses a battery cell positive electrode wafer punching die, which relates to the technical field of wafer punching and comprises a bottom plate, a circular groove is arranged in the middle of the bottom plate, internal threads are arranged in the circular groove, and the internal threads are matched with external threads arranged at the bottom of a support pillar; a plurality of sliding columns are fixedly installed on one side of the bottom plate, and springs are arranged on the surfaces of the sliding columns in a sleeving mode. The end, away from the bottom plate, of the sliding column is movably installed in a circular groove in the bottom of the movable plate. The middle position of the moving plate is provided with a circular groove which is convenient for the jacking column to penetrate through. The top of the top column is located in the groove of the movable plate. During use, firstly, the top column is effectively matched with an internal thread in a middle groove of the bottom plate through an external thread at the bottom, during installation, the top column penetrates through a circular groove in the middle of the moving plate, then a raw material of a wafer is placed on the moving plate, the top plate drives the punching plate to move towards the moving plate through the driving device, and in the moving process, the punching plate is driven by the driving device to move towards the moving plate. And effective punching of the wafer is realized.

Description

Technical Field

[0001] The utility model specifically relates to the technical field of wafer punching, specifically a punching die for the positive electrode wafer of a battery cell. Background Art

[0002] The wafer of the positive electrode of the battery cell is the positive electrode during the connection of the battery cell and has good electrical conductivity. After the installation of the wafer is completed, it can also effectively protect the internal structure of the battery cell. The positive electrode wafer of the battery cell has concavities and convexities. When punching, the punching die needs to have grooves. However, when punching traditional wafers, usually the wafer is first punched, and then the concavities and convexities of the wafer are effectively processed by other equipment. This reduces the work efficiency and may also cause unqualified situations during the processing of the concavities and convexities of the wafer, resulting in waste products.

[0003] When the traditional punching device punches the wafer, it cannot effectively punch the concave and convex platforms on the wafer at the same time, which increases the processing procedures of the wafer and greatly reduces the processing efficiency of the wafer.

[0004] After retrieval, Chinese Patent Publication No. CN202220307631.8 discloses a punching device for metal aluminum wafers; it includes a punching assembly and a collection assembly. The fixed die is connected to the bed body, the punching die is fixed on the bed body, the punching die is arranged above the fixed die, the first electric push rod is fixed on the bed body, the first electric push rod is arranged on one side of the fixed die, and the push plate is connected to the output end of the first electric push rod. The collection box is arranged on one side of the bed body, the buffer connecting plate is fixed above the collection box, one end of the plate body is connected to the adjusting rod, and the support plate is connected to the output end of the second electric push rod;

[0005] When the device in the above patent punches, the punching die is effectively moved towards the fixed die through the driving device to achieve effective punching of the workpiece. After punching is completed, the workpiece is conveyed onto the plate body through the first electric push rod to achieve collection of the workpiece. During the process of conveying the workpiece, it is necessary to remove the unpunched raw materials and then use the first electric push rod to effectively convey the punched workpiece. The device in the above patent will affect the processing efficiency during the processing of the workpiece. Therefore, the structure in the above patent still has certain defects. Summary of the Utility Model

[0006] Objective of the present utility model: Aiming at the defects of the prior art in the background technology, we provide a punching die for the positive electrode wafer of the battery cell. In this device, the workpiece raw material is placed on the moving plate, and the driving device is used to drive the top plate to drive the punching plate to move towards the moving plate. When the punching plate is in contact with the moving plate, effective punching of the wafer on the raw material is achieved. During punching, the ejector pin is installed in the middle position of the moving plate. In this way, when the punching plate presses down on the moving plate, the moving plate moves downward under the action of the spring. At this time, the top of the ejector pin is higher than the upper end surface of the moving plate and is effectively in contact with the groove opened in the punching plate. In this way, the concave and convex shapes in the wafer can be effectively punched synchronously. After punching, the moving plate bounces upward under the action of the spring, realizing the effective separation between the punched wafer and the raw material. By moving the raw material, the punching position is changed, and at the same time, the punched wafers can be effectively collected, greatly improving the production efficiency.

[0007] To achieve the above objective, the present utility model provides the following technical solutions:

[0008] A punching die for the positive electrode wafer of the battery cell, including a bottom plate. A circular groove is opened in the middle position of the bottom plate, and internal threads are provided in the circular groove, which are cooperatively installed with the external threads provided at the bottom of the ejector pin; A plurality of sliding columns are fixedly installed on one side of the bottom plate, and springs are sleeved on the surfaces of the sliding columns; The ends of the sliding columns away from the bottom plate are movably installed in the circular grooves at the bottom of the moving plate.

[0009] A circular groove for facilitating the penetration of the ejector pin is opened in the middle position of the moving plate; The top of the ejector pin is located inside the groove of the moving plate.

[0010] Further, two mounting seats are also provided on the bottom plate; The mounting seats are threadedly connected with the screw rods; The ends of the screw rods away from the bottom plate are cooperatively installed with the bushings provided on the top plate.

[0011] Further, the two screw rods are located at two diagonals of the moving plate and are symmetrically arranged. When the top plate drives the punching plate to move downward, through the cooperation between the two rotating sleeves installed on the top plate and the screw rods, it is effectively ensured that the punching plate will not deviate when moving downward, effectively ensuring the quality and efficiency of the wafer during punching.

[0012] Further, a punching plate is provided at the bottom of the top plate, and the punching plate is fixedly installed on the top plate through bolts; A groove is opened in the middle position of the punching plate.

[0013] Furthermore, the end of the top column away from the bottom plate is arranged in a gradually widening shape; the diameter of the top of the top column is the same as the inner diameter of the groove. When stamping the concave-convex shape of the wafer, the top of the top column is higher than the moving plate, and the top of the top column extends into the groove of the punching plate, effectively realizing the stamping of the concave-convex shape.

[0014] Furthermore, the top plate and the bushing are movably installed through a bearing; the bushing extends to the outside of the top plate on the side where the punching plate is arranged, so that during the downward movement of the moving plate, the situation where the punching plate and the moving plate cannot be effectively separated will not occur.

[0015] Compared with the prior art, the beneficial effects of the present utility model are:

[0016] 1. When the punching die for the positive electrode wafer of the battery cell is in use, first, the top column is effectively fitted with the internal thread inside the middle groove of the bottom plate through the external thread at the bottom. During installation, the top column penetrates the circular groove in the middle of the moving plate, and then the raw material of the wafer is placed on the moving plate. The top plate drives the punching plate to move towards the moving plate through the driving device, and during the movement, effective punching of the wafer is achieved.

[0017] 2. When the die is punching, the end face of the punching plate is attached to the end face of the moving plate. At this time, the moving plate is driven by the punching plate and moves downward, pressing the spring on the sliding column. At this time, the top end of the top column will be higher than the end face of the moving plate and fit with the groove opened in the middle of the punching plate. In this way, during punching, effective processing of the concave-convex shape in the wafer can be effectively achieved.

[0018] 3. After the die finishes punching, the punching plate is driven by the top plate and moves downward. At this time, the moving plate bounces upward under the action of the spring, realizing the separation of the punched wafer from the punching plate. In this way, only by moving the raw material, the punching position can be effectively changed. During the movement of the raw material plate, while changing the punching position, the punched wafers can also be effectively collected, which can greatly improve the punching efficiency. Description of the Drawings

[0019] Figure 1 is a schematic structural diagram of the punching die for the positive electrode wafer of the battery cell in this embodiment.

[0020] Figure 2 is a side view of the punching die for the positive electrode wafer of the battery cell in this embodiment.

[0021] Figure 3 is a schematic bottom structural diagram of the punching die for the positive electrode wafer of the battery cell in this embodiment.

[0022] Figure 4 is Figure 1Schematic diagram of the splitting structure.

[0023] Figure 5 For Figure 4 Bottom structure bottom view.

[0024] In the figure: 1 - top plate, 2 - bushing, 3 - bottom plate, 4 - moving plate, 5 - screw rod, 6 - punching plate, 7 - spring, 8 - ejector pin, 9 - external thread, 10 - internal thread, 11 - groove, 12 - sliding column. Specific implementation mode

[0025] Next, in conjunction with the attached drawings, the technical solution of the present utility model will be clearly and completely described in the form of embodiments.

[0026] Please refer to Figures 1-5 , in the embodiment of the present utility model, the cell positive electrode wafer punching die includes a bottom plate 3, a circular groove is provided in the middle position of the bottom plate 3, and an internal thread 10 is provided in the circular groove, and the internal thread 10 is cooperatively installed with an external thread 9 provided at the bottom of the ejector pin 8; a plurality of sliding columns 12 are fixedly installed on one side of the bottom plate 3, and a spring 7 is sleeved on the surface of the sliding columns 12; the end of the sliding column 12 away from the bottom plate 3 is movably installed in a circular groove at the bottom of the moving plate 4.

[0027] A circular groove for the ejector pin 8 to penetrate is provided in the middle position of the moving plate 4; the top of the ejector pin 8 is located inside the groove of the moving plate 4.

[0028] Specifically, two mounting seats are further provided on the bottom plate 3; the mounting seats are threadedly connected with the screw rod 5; the end of the screw rod 5 away from the bottom plate 3 is cooperatively installed with a bushing 2 provided on the top plate 1.

[0029] By adopting the above technical solution, during use, first, the ejector pin 8 is effectively cooperated with the internal thread 10 inside the middle groove of the bottom plate 3 through the external thread 9 at the bottom. During installation, the ejector pin 8 penetrates the circular groove in the middle position of the moving plate 4, and then the raw material of the wafer is placed on the moving plate 4. The top plate 1 drives the punching plate 6 to move towards the moving plate 4 through the driving device, and during the moving process, effective punching of the wafer is achieved.

[0030] The two screw rods 5 are located at two diagonals of the moving plate 4 and are symmetrically arranged.

[0031] In this embodiment, a punching plate 6 is provided at the bottom of the top plate 1, and the punching plate 6 is fixedly installed on the top plate 1 through bolts; a groove 11 is provided in the middle position of the punching plate 6.

[0032] By adopting the above technical solution, during punching, the end face of the punching plate 6 fits with the end face of the moving plate 4. At this time, the moving plate 4 is driven by the punching plate 6 and moves downward, pressing the spring 7 on the sliding column. At this time, the top end of the ejector pin 8 will be higher than the end face of the moving plate 4 and fit with the groove 11 opened in the middle of the punching plate 6. In this way, during punching, it can effectively process the concave and convex shapes in the wafer.

[0033] In this embodiment, the end of the ejector pin 8 away from the bottom plate 3 is arranged in a gradually widening shape; the diameter of the top of the ejector pin 8 is the same as the inner diameter of the groove 11.

[0034] The top plate 1 and the bushing 2 are movably installed through a bearing; the bushing 2 extends to the outside of the top plate 1 on the side where the punching plate 6 is provided.

[0035] By adopting the above technical solution, after punching is completed, the punching plate 6 is driven by the top plate 1 and moves downward. At this time, the moving plate 4 bounces upward under the action of the spring 7, realizing the separation of the punched wafer from the punching plate 6. In this way, only by moving the raw material, the punching position can be effectively changed. During the movement of the raw material plate, while changing the punching position, it can also effectively collect the punched wafers, which can greatly improve the punching efficiency.

[0036] The working principle of the present utility model is: during use, first, the ejector pin 8 is effectively matched with the internal thread 10 in the middle groove of the bottom plate 3 through the external thread 9 at the bottom. During installation, the ejector pin 8 passes through the circular groove in the middle of the moving plate 4, and then the raw material of the wafer is placed on the moving plate 4. The top plate 1 drives the punching plate 6 to move towards the moving plate 4 through the driving device, and during the movement, the wafer is effectively punched;

[0037] During punching, the end face of the punching plate 6 fits with the end face of the moving plate 4. At this time, the moving plate 4 is driven by the punching plate 6 and moves downward, pressing the spring 7 on the sliding column. At this time, the top end of the ejector pin 8 will be higher than the end face of the moving plate 4 and fit with the groove 11 opened in the middle of the punching plate 6. In this way, during punching, it can effectively process the concave and convex shapes in the wafer;

[0038] After punching is completed, the punching plate 6 is driven by the top plate 1 and moves downward. At this time, the moving plate 4 bounces upward under the action of the spring 7, realizing the separation of the punched wafer from the punching plate 6. In this way, only by moving the raw material, the punching position can be effectively changed. During the movement of the raw material plate, while changing the punching position, it can also effectively collect the punched wafers, which can greatly improve the punching efficiency.

[0039] The embodiments of the present utility model have been described in detail above in conjunction with the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art, various changes, modifications, substitutions, and variations can be made without departing from the gist of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A punching die for the positive electrode wafer of an electric core, characterized in that: It includes a bottom plate, a circular groove is provided at the middle position of the bottom plate, an internal thread is provided in the circular groove, and the internal thread is fitted and installed with an external thread provided at the bottom of the top column. A plurality of sliding columns are fixedly installed on one side of the bottom plate, a spring is sleeved on the surface of the sliding column, and the end of the sliding column away from the bottom plate is movably installed in a circular groove at the bottom of the moving plate. A circular groove for the top column to penetrate through is provided at the middle position of the moving plate, and the top of the top column is located inside the groove of the moving plate.

2. The positive electrode wafer punching die for the battery cell according to claim 1, characterized in that: Two mounting seats are also provided on the bottom plate; the mounting seats are threadedly connected with the screw rods; one end of the screw rod away from the bottom plate is fitted and installed with a bushing provided on the top plate.

3. The positive electrode wafer punching die for the battery cell according to claim 2, wherein: The two screw rods are located at two diagonals of the moving plate and are symmetrically arranged.

4. The positive electrode wafer punching die for the battery cell according to claim 2, characterized in that: A punching plate is provided at the bottom of the top plate, and the punching plate is fixedly installed on the top plate by bolts; a groove is provided at the middle position of the punching plate.

5. The positive electrode wafer punching die for the battery cell according to claim 4, characterized in that: The end of the top column away from the bottom plate is provided in a gradually widening shape; the diameter of the top of the top column is the same as the inner diameter of the groove.

6. The punching die for the positive electrode wafer of the battery cell according to claim 2, wherein: The top plate and the bushing are movably installed through a bearing; the bushing extends to the outside of the top plate on the side where the punching plate is provided on the top plate.

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