Plastic package mold

Abstract

The utility model discloses a plastic package mould, relates to semiconductor package technical field, including the plastic package mould main part, the plastic package mould main part top is provided with the square through hole, the inside of the square through hole of plastic package mould main part is detachably equipped with the first fixed plate, the top of the first fixed plate evenly passes through and is connected with a plurality of groups of injection molding pipe. According to the plastic package mold, residual gas and overflowed plastic package liquid are stored in a buffer space vacated by the second fixing plate through the overflow groove formed in the bottom mold plate and the piston plate, it is guaranteed that the gas in the bottom mold plate is exhausted completely, and the plastic package quality is improved; and the heat dissipation efficiency of the second fixing plate is reduced through an air medium arranged between the first heating plate and the second fixing plate, the heat preservation effect on the bottom template is improved, the heat preservation capacity of the bottom template is improved, plastic packaging liquid is prevented from being solidified early to generate a cavity, the structure is simple, operation of workers is convenient, and compared with traditional additional heat preservation, the use cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, and particularly relates to a plastic packaging mold. Background Technique

[0002] Semiconductor packaging refers to the process of processing wafers that have passed tests into independent chips according to product models and functional requirements. The packaging process is as follows: the wafers are cut into small chips through a dicing process, and then the cut chips are attached to the islands of the corresponding substrate holder with glue. Then, ultra-fine metal wires or conductive resins are used to connect the bonding pads of the chips to the corresponding pins of the substrate and form the required circuit. Then, the independent chips are encapsulated and protected with a plastic shell. After plastic packaging, a series of operations are required. After packaging is completed, final product testing is carried out, usually through processes such as incoming inspection, testing, and packaging, and finally stored and shipped. Among them, the plastic packaging process requires a plastic packaging mold to form the product. During plastic packaging, the mold is preheated by a preheating table, and the parts to be plastic-packaged are placed into the mold and then the mold is closed for injection molding and plastic packaging.

[0003] However, the plastic packaging molds in the existing semiconductor plastic packaging process are usually metal molds, with too fast heat dissipation and poor heat preservation effect, and additional heat preservation is required to maintain the temperature. Moreover, most of the existing plastic packaging molds have fixed exhaust ports, and the molten plastic packaging liquid in the mold is easy to block the exhaust ports, resulting in incomplete exhaust and bubbles in the plastic packaging. In order to solve the deficiencies of the existing technology, we propose a plastic packaging mold. Summary of the Utility Model

[0004] The main purpose of the utility model is to provide a plastic packaging mold, which can effectively solve the problems in the background technique.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0006] A plastic encapsulation mold, comprising a plastic encapsulation mold main body, wherein a square through hole is opened at the top of the plastic encapsulation mold main body, a first fixing plate is detachably installed inside the square through hole opened in the plastic encapsulation mold main body, a plurality of injection pipes are uniformly connected through the top of the first fixing plate, heating rods are movably penetrated through the four corners of the top of the first fixing plate, a first heating plate is detachably installed at one end of the heating rod, a fixing column is movably penetrated through the top of the first heating plate, a plug rod is connected through the top of the fixing column, movable rods are uniformly movably penetrated through the periphery of the bottom of the fixing column, a piston plate is detachably installed at one end of the movable rod, an exhaust cylinder is connected through the top of the piston plate, a second fixing plate is movably penetrated through one end of the piston plate, sealing plates are symmetrically and detachably installed at the bottom of the second fixing plate, a bottom template is abutted against the bottom of the second fixing plate, bottom mold grooves are symmetrically opened at the top of the bottom template, an overflow groove is opened at the top of the bottom template, the inside of the bottom mold groove opened in the bottom template is slidably connected with the outside of the sealing plate, a second heating plate is detachably installed at the bottom of the bottom template, and a heat preservation frame is detachably installed on the outside of the bottom template.

[0007] Preferably, the bottom of the second heating plate is detachably installed with the inner bottom of the heat preservation frame, and the top of the heat preservation frame is abutted against the bottom of the plastic encapsulation mold main body.

[0008] Preferably, positioning pins are connected through the four corners of the top of the heat preservation frame, and the top of the positioning pins is movably penetrated through the bottom of the plastic encapsulation mold main body.

[0009] Preferably, one end of the injection pipe is movably penetrated through the top of the first heating plate, the end of the injection pipe penetrating through the first heating plate is connected through the top of the second fixing plate, and the end of the injection pipe penetrating through the second fixing plate is connected through the top of the sealing plate.

[0010] Preferably, an exhaust groove is opened at the top of the fixing column, one end of the fixing column is movably penetrated through the top of the first fixing plate, the other end of the fixing column is connected through the top of the second fixing plate, and the outside of the second fixing plate is detachably installed inside the square through hole opened in the plastic encapsulation mold main body.

[0011] Preferably, a cavity is formed inside the square through hole opened in the plastic encapsulation mold main body by the second fixing plate and the first fixing plate, and the outside of the first heating plate is slidably connected with the inside of the cavity of the plastic encapsulation mold main body.

[0012] Beneficial effects

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] 1. In the utility model, by arranging the overflow groove opened in the bottom template and the buffer space vacated by the piston plate entering the second fixing plate to receive the residual gas and the overflowing plastic encapsulation liquid, the gas in the bottom template is ensured to be exhausted, and the plastic encapsulation quality is improved.

[0015] 2. In the present utility model, the heat dissipation efficiency of the second fixed plate is reduced by the air medium between the first heating plate and the second fixed plate, the heat preservation effect on the bottom template is improved, the heat preservation ability of the bottom template is enhanced, and the cavity formation caused by premature solidification of the encapsulation liquid is prevented. The structure is simple and convenient for the staff to operate, and the use cost is saved compared with the traditional additional heat preservation method. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is the overall structural schematic diagram of the present utility model;

[0017] Figure 2 is the overall disassembled structural schematic diagram of the present utility model;

[0018] Figure 3 is the exploded view of the bottom template of the present utility model;

[0019] Figure 4 is the exploded view of the fixed column of the present utility model.

[0020] In the figure: 1, plastic encapsulation mold body; 2, first fixed plate; 3, injection tube; 4, heating rod; 5, first heating plate; 6, fixed column; 7, insertion rod; 8, movable rod; 9, piston plate; 10, exhaust cylinder; 11, second fixed plate; 12, sealing plate; 13, bottom template; 14, second heating plate; 15, heat preservation frame; 16, positioning pin. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] In order to make the technical means, creative features, achieved purposes and effects of the present utility model easy to understand, the present utility model will be further described below in conjunction with the specific embodiments.

[0022] As Figures 1-4 shown, a plastic encapsulation mold includes a plastic encapsulation mold body 1. During plastic encapsulation, the molten encapsulation liquid is transported into the bottom template 13 through the injection tube 3. The gas in the bottom template 13 is discharged through the overflow groove opened on the bottom template 13 into the exhaust cylinder 10 and then discharged through the exhaust groove of the fixed column 6. Under the pressure of continuous injection of the injection tube 3, the gas in the bottom template 13 is completely discharged and part of the encapsulation liquid overflows. The encapsulation liquid overflows through the overflow groove and pushes the piston plate 9 into the second fixed plate 11. The buffer space vacated by pushing the piston plate 9 into the second fixed plate 11 receives the gas and the encapsulation liquid finally discharged from the bottom template 13, so as to utilize the overflow groove opened on the bottom template 13 and the buffer space vacated by the piston plate 9 entering the second fixed plate 11 to collect the residual gas and the overflowed encapsulation liquid, ensuring that the gas in the bottom template 13 is exhausted and improving the plastic encapsulation quality.

[0023] As Figure 3 and Figure 4As shown in the figure, during the injection molding process, the heat preservation frame 15 outside the bottom template 13 keeps the bottom template 13 warm. Then, the heating rod 4 is pulled to drive the first heating plate 5 away from the second fixed plate 11. There is air as a medium between the first heating plate 5 and the second fixed plate 11. The air medium reduces the heat dissipation efficiency of the second fixed plate 11, improves the heat preservation effect on the bottom template 13, enhances the heat preservation ability of the bottom template 13, prevents the plastic sealing liquid from solidifying prematurely to generate cavities, has a simple structure and is convenient for workers to operate, and saves the use cost compared with traditional additional heat preservation.

[0024] Working principle

[0025] It should be noted that the present utility model is a plastic sealing mold. When in use, first, the staff preheats the heat preservation frame 15 and the plastic sealing mold body 1. The heat preservation frame 15 conducts heat to the second heating plate 14 when heated, and the second heating plate 14 conducts heat into the bottom template 13, thereby preheating the bottom template 13. The plastic sealing mold body 1 conducts heat to the first fixed plate 2, the second fixed plate 11, and the sealing plate 12 when heated, thereby preheating the sealing plate 12. At the same time, the heating rod 4 is pushed to drive the first heating plate 5 to slide in the cavity of the plastic sealing mold body 1. The bottom of the first heating plate 5 abuts against the top of the second fixed plate 11. Then, the first heating plate 5 is heated by conducting heat to the heating rod 4, and the first heating plate 5 heats the second fixed plate 11. The second fixed plate 11 conducts heat to the sealing plate 12. Then, the staff places the parts to be plastic sealed into the bottom template 13. Then, the plastic sealing mold body 1 is pulled to drive the first fixed plate 2, the second fixed plate 11, and the sealing plate 12. The four corners of the plastic sealing mold body 1 are aligned with the positioning pins 16. The positioning pins 16 penetrate through the four corners of the plastic sealing mold body 1, thereby positioning and installing the plastic sealing mold body 1. The plastic sealing mold body 1 is placed on the heat preservation frame 15 under the positioning of the positioning pins 16. The plastic sealing mold body 1 drives the second fixed plate 11 to drive the sealing plate 12 into the bottom template 13. After closing the mold, injection molding is carried out in the bottom template 13 through the injection molding pipe 3 to achieve the purpose of injection molding.

[0026] After the molten encapsulation liquid enters the bottom template 13 through the injection pipe 3, it gradually fills the inside of the bottom template 13. During the process of filling the inside of the bottom template 13, the gas inside the bottom template 13 is discharged to the exhaust cylinder 10 through the overflow groove opened on the bottom template 13. The gas enters the gap formed between the exhaust cylinder 10 and the second fixing plate 11 in cooperation with the fixing column 6, and then the gas is discharged through the exhaust groove of the fixing column 6. When the gas inside the bottom template 13 is basically discharged, the molten encapsulation liquid inside the bottom template 13 reaches the piston plate 9 through the overflow groove opened on the bottom template 13 and pushes the piston plate 9. Driven by the overflowing molten encapsulation liquid, the piston plate 9 drives the exhaust cylinder 10 and the movable rod 8 to move upward. The exhaust cylinder 10 is inserted into the fixing column 6, and the insertion rod 7 installed on the fixing column 6 is inserted into the exhaust cylinder 10 to discharge the encapsulation liquid entering the exhaust cylinder 10. The insertion rod 7 blocks the exhaust cylinder 10, and the encapsulation liquid can only push the piston plate 9 into the second fixing plate 11. Through the buffering of the piston plate 9, the encapsulation liquid completely discharges the gas inside the bottom template 13 from the bottom template 13. The residual gas enters the overflow groove and the buffer zone between the piston plate 9 and the second fixing plate 11, achieving the purpose of evacuating the gas inside the bottom template 13.

[0027] During the injection molding process, it is necessary to keep the inside of the bottom template 13 warm to prevent the encapsulation liquid from solidifying earlier and generating cavities. By pulling the heating rod 4 to drive the first heating plate 5 away from the second fixing plate 11, the first heating plate 5 slides in the cavity of the encapsulation mold body 1. There is air as a medium between the first heating plate 5 and the second fixing plate 11. The heat inside the bottom template 13 is conducted to the second fixing plate 11 through the sealing plate 12 and then conducted through the air, reducing the heat dissipation efficiency and improving the heat preservation effect. At the same time, the heat preservation frame 15 outside the bottom template 13 keeps the bottom template 13 warm, further strengthening the heat preservation of the bottom template 13 and achieving the purpose of improving the heat preservation ability of the bottom template 13.

[0028] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A plastic encapsulation mold, comprising a plastic encapsulation mold body (1), characterized in that: A square through-hole is provided at the top of the plastic encapsulation mold body (1). A first fixing plate (2) is detachably installed inside the square through-hole provided in the plastic encapsulation mold body (1). A plurality of injection tubes (3) are uniformly and penetratingly connected to the top of the first fixing plate (2). Heating rods (4) are movably penetrated through the four corners of the top of the first fixing plate (2). A first heating plate (5) is detachably installed at one end of the heating rod (4). A fixing column (6) is movably penetrated through the top of the first heating plate (5). A plug rod (7) is penetratingly connected to the top of the fixing column (6). A movable rod (8) is uniformly and movably penetrated through the periphery of the bottom of the fixing column (6). A piston plate (9) is detachably installed at one end of the movable rod (8). An exhaust cylinder (10) is penetratingly connected to the top of the piston plate (9). One end of the piston plate (9) is movably penetrated through a second fixing plate (11). Sealing plates (12) are symmetrically and detachably installed at the bottom of the second fixing plate (11). A bottom template (13) abuts against the bottom of the second fixing plate (11). Bottom mold grooves are symmetrically provided at the top of the bottom template (13). An overflow groove is provided at the top of the bottom template (13). The inside of the bottom mold groove provided in the bottom template (13) is slidably connected to the outside of the sealing plate (12). A second heating plate (14) is detachably installed at the bottom of the bottom template (13). A heat preservation frame (15) is detachably installed on the outside of the bottom template (13).

2. A plastic encapsulation mold according to claim 1, characterized in that: The bottom of the second heating plate (14) is detachably installed with the inner bottom wall of the heat preservation frame (15), and the top of the heat preservation frame (15) abuts against the bottom of the plastic encapsulation mold body (1).

3. A plastic encapsulation mold according to claim 1, characterized in that: Positioning pins (16) are penetratingly connected to the four corners of the top of the heat preservation frame (15), and the top of the positioning pins (16) is movably penetrated through the bottom of the plastic encapsulation mold body (1).

4. A plastic encapsulation mold according to claim 1, wherein: One end of the injection tube (3) is movably penetrated through the top of the first heating plate (5). The end of the injection tube (3) penetrating through the first heating plate (5) is penetratingly connected to the top of the second fixing plate (11). The end of the injection tube (3) penetrating through the second fixing plate (11) is penetratingly connected to the top of the sealing plate (12).

5. A plastic encapsulation mold according to claim 1, characterized in that: An exhaust groove is provided at the top of the fixing column (6). One end of the fixing column (6) is movably penetrated through the top of the first fixing plate (2). The other end of the fixing column (6) is penetratingly connected to the top of the second fixing plate (11). The outside of the second fixing plate (11) is detachably installed inside the square through-hole provided in the plastic encapsulation mold body (1).

6. A plastic encapsulation mold according to claim 1, characterized in that: The second fixing plate (11) and the first fixing plate (2) form a cavity inside the square through-hole provided in the plastic encapsulation mold body (1), and the outside of the first heating plate (5) is slidably connected to the inside of the cavity of the plastic encapsulation mold body (1).

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