Integrated valve base body, integrated valve assembly, heat management module, management system and vehicle

Abstract

The utility model discloses an integrated valve base body, an integrated valve assembly, a heat management module, a management system and a vehicle. The pile-up valve base body comprises a top wall and a bottom wall which are opposite to each other, and a side wall connecting the top wall and the bottom wall. The top wall is provided with a first interface, and the first interface is used for accessing a switching module. The side wall is provided with a second interface, and the second interface is used for accessing a board exchange module. A flow channel is arranged in the pile-up valve base body, and the first connector and the second connector are communicated through the flow channel to form a refrigerant circulation channel so as to achieve follow-up heat management. Besides, due to the fact that the first connector is arranged on the top wall and the second connector is arranged on the side wall, the switching module connected into the first connector and the plate exchange module connected into the second connector are arranged regularly, and the pile-up valve base body is simple in structure and small in occupied installation space. In addition, the switching module and the plate switching module can be installed in two directions, and the installation difficulty is small.

Description

Technical Field

[0001] The present application relates to the technical field of vehicles, and particularly to an integrated valve base, an integrated valve assembly, a thermal management module, a management system and a vehicle. Background Art

[0002] The thermal management solutions for electric vehicles or hybrid vehicles are quite different from those for traditional fuel vehicles. The thermal management solutions for traditional fuel vehicles can be divided into a relatively independent engine cooling system and an air conditioning system. However, the thermal management solutions for electric vehicles or hybrid vehicles need to consider the vehicle's endurance and minimize power consumption as much as possible. Generally, it is necessary to comprehensively set up a battery management system (i.e., the battery management system, including battery cooling and battery heating) and an air conditioning system (including refrigeration and heating).

[0003] Currently, the thermal management module is an important component for comprehensively setting up the battery management system and the air conditioning system. According to functional requirements, various valve bodies such as electronic expansion valves and solenoid valves are usually provided on the integrated valve base of the thermal management module. In addition, external devices such as compressors, condensers, and direct cooling plates in the battery in the plate heat exchange module also need to be connected to the integrated valve base to form a refrigerant circulation path for realizing thermal management. Since the valve bodies and external devices are generally dispersedly arranged, the structure of the thermal management module is complex and occupies a large installation space; at the same time, the dispersed arrangement of the valve bodies and external devices increases the installation difficulty. Summary of the Invention

[0004] The present application provides an integrated valve base, an integrated valve assembly, a thermal management module, a management system and a vehicle.

[0005] In a first aspect, the present application provides an integrated valve base, which includes an opposite top wall and bottom wall, and a side wall connecting the top wall and the bottom wall. The top wall is provided with a first interface for accessing a switching module. The side wall is provided with a second interface for accessing a plate heat exchange module. A flow channel is provided in the integrated valve base, and the first interface and the second interface are communicated through the flow channel to form a refrigerant circulation path.

[0006] In some embodiments, the flow channel includes an upper layer flow channel and a lower layer flow channel. In the direction from the top wall to the bottom wall, the upper layer flow channel is closer to the top wall than the lower layer flow channel. The side wall includes opposite first side wall and second side wall, and the upper layer flow channel extends along the first side wall to the second side wall. Both the first interface and the second interface are communicated with the upper layer flow channel, and the lower layer flow channel is communicated with the upper layer flow channel.

[0007] In some embodiments, the first interface includes a valve body interface and a sensor interface. The valve body interface is used to connect to the valve body in the switching module, and the sensor interface is used to connect to the sensor in the switching module. The side wall further includes an opposite third side wall and a fourth side wall, and both the third side wall and the fourth side wall are connected to the first side wall and the second side wall. The upper flow channels include a plurality of them. The second interface includes a plurality of them. The plurality of upper flow channels are arranged in sequence in the direction from the third side wall to the fourth side wall, and at least one valve body interface is provided on each upper flow channel and is communicated with one second interface. The sensor interface is provided on at least one upper flow channel.

[0008] In some embodiments, the lower flow channels include a plurality of them, and the plurality of lower flow channels are spaced from each other. The valve body interfaces on at least two upper flow channels are communicated through the lower flow channels. The sensor interface is provided on at least one lower flow channel.

[0009] In some embodiments, the upper flow channels include a first upper flow channel, a second upper flow channel, a third upper flow channel, a fourth upper flow channel, a fifth upper flow channel, and a sixth upper flow channel arranged in sequence in the direction from the third side wall to the fourth side wall. The lower flow channels include a first lower flow channel, a second lower flow channel, and a third lower flow channel. The second interface includes a first sub-interface, a second sub-interface, a third sub-interface, a fourth sub-interface, a fifth sub-interface, and a sixth sub-interface that are respectively communicated with the first upper flow channel, the second upper flow channel, the third upper flow channel, the fourth upper flow channel, the fifth upper flow channel, and the sixth upper flow channel. The first lower flow channel communicates with the first upper flow channel, the second upper flow channel, and the third upper flow channel. The second lower flow channel communicates with the first upper flow channel and the third upper flow channel. The third lower flow channel communicates with the fourth upper flow channel, the fifth upper flow channel, and the sixth upper flow channel.

[0010] In some embodiments, the valve body interface includes a solenoid valve interface and an electronic expansion valve interface. The sensor interface and the solenoid valve interface are both provided on the first upper flow channel and the third upper flow channel. The sensor interface and the electronic expansion valve interface are both provided on the second upper flow channel, the fourth upper flow channel, and the sixth upper flow channel. The electronic expansion valve interface is provided on the fifth upper flow channel.

[0011] In some embodiments, the sensor interfaces on the first upper flow channel, the second upper flow channel, the third upper flow channel, the fourth upper flow channel, and the sixth upper flow channel are closer to the first side wall or the second side wall than the valve body interfaces.

[0012] In some embodiments, the sensor interface includes a temperature sensor interface, a pressure sensor interface, and a temperature and pressure sensor interface. The temperature sensor interface is provided on both the fourth upper flow channel and the sixth upper flow channel, the temperature sensor interface is provided on the third lower flow channel, the temperature and pressure sensor interface is provided on the second upper flow channel, and the pressure sensor interface is provided on both the first upper flow channel and the third upper flow channel.

[0013] In some embodiments, an installation part is provided on the side wall, an installation hole is provided on the installation part, and a shock absorber is provided in the installation hole.

[0014] In some embodiments, a positioning part is provided on the top wall or the bottom wall, and the positioning part is used for positioning and installing an adapter plate.

[0015] In some embodiments, a wire harness part is provided on the side wall, the wire harness part protrudes and extends relative to the side wall, and the wire harness part is used for constraining wires.

[0016] In some embodiments, a plug cover is provided on the side wall, and the plug cover is used for plugging some process holes.

[0017] In a second aspect, the present application provides an integrated valve assembly. The integrated valve assembly includes the integrated valve base body and a switching module described in any one of the above embodiments. The switching module is installed on the first interface.

[0018] In some embodiments, the switching module includes a valve body and a sensor. The valve body is installed on the valve body interface of the first interface. The sensor is installed on the sensor interface of the first interface and is spaced from the valve body.

[0019] In some embodiments, the valve body includes an electromagnetic valve and an electronic expansion valve. The electromagnetic valve is installed on the electromagnetic valve interface in the valve body interface. The electronic expansion valve is installed on the electronic expansion valve interface in the valve body interface.

[0020] In some embodiments, the sensor includes a temperature sensor, a pressure sensor, and a temperature and pressure sensor. The temperature sensor is installed on the temperature sensor interface in the sensor interface. The pressure sensor is installed on the pressure sensor interface in the sensor interface. The temperature and pressure sensor is installed on the temperature and pressure sensor interface in the sensor interface.

[0021] In a third aspect, the present application provides a thermal management module. The thermal management module includes the integrated valve assembly described in any one of the above embodiments.

[0022] In some embodiments, the thermal management module further includes a heat exchanger. The heat exchanger is connected to the integrated valve assembly and is located on the side where the bottom wall is located. The heat exchanger communicates with at least one of the first interfaces.

[0023] In some embodiments, the thermal management module further includes a heat exchanger. The heat exchanger is connected to the integrated valve assembly and is located on the side where the top wall is located. The heat exchanger communicates with at least one of the first interfaces.

[0024] In some embodiments, the thermal management module further includes an adapter plate disposed between the heat exchanger and the integrated valve assembly. The heat exchanger is connected to the integrated valve assembly through the adapter plate.

[0025] In some embodiments, a fitting is provided on the adapter plate. The fitting cooperates with a positioning member on the top wall or the bottom wall to position the connection between the adapter plate and the integrated valve assembly.

[0026] In a fourth aspect, the present application provides a management system. The management system includes the thermal management module and the plate heat exchanger module according to any one of the above embodiments. The plate heat exchanger module communicates with the second interface.

[0027] In some embodiments, the plate heat exchanger module includes a compressor, a gas separation tank, a condenser, an evaporator, and a direct cooling plate of a battery. The compressor communicates with a first sub-interface of the second interface. The compressor communicates with a third sub-interface of the second interface. The condenser communicates with a fourth sub-interface of the second interface. The evaporator communicates with a fifth sub-interface of the second interface. The direct cooling plate is provided with a cavity, a first opening communicating with the cavity, and a second opening communicating with the cavity. The first opening communicates with a second sub-interface of the second interface, and the second opening communicates with a sixth sub-interface of the second interface.

[0028] In some embodiments, when the management system is in the air-conditioning cooling mode, a solenoid valve communicating with both the first upper flow channel and the second lower flow channel in the flow channel is opened, and an electronic expansion valve on the third lower flow channel in the flow channel throttles and reduces the pressure. The high-temperature refrigerant discharged by the compressor sequentially passes through the pressure sensor on the first upper flow channel, the first upper flow channel, reaches the heat exchanger, and exchanges heat to output a low-temperature refrigerant. The low-temperature refrigerant sequentially passes through the pressure sensor on the third lower flow channel, the third lower flow channel, the fifth upper flow channel in the flow channel, and then reaches the evaporator and is converted into the high-temperature refrigerant. The high-temperature refrigerant output by the evaporator returns to the compressor after passing through the gas separation tank.

[0029] In certain embodiments, when the management system is in battery cooling mode, the high-temperature refrigerant discharged from the compressor passes through the first upper flow channel in the flow channel to reach the heat exchanger and then exchanges heat to output low-temperature refrigerant, the low-temperature refrigerant passes through the third lower flow channel in the flow channel, and the electronic expansion valve of the third lower flow channel throttles and reduces the pressure of the low-temperature refrigerant, and then the low-temperature refrigerant passes through the sixth upper flow channel in the flow channel to reach the direct cooling plate, the low-temperature refrigerant passes through the direct cooling plate and is converted into the high-temperature refrigerant, the high-temperature refrigerant passes through the second upper flow channel in the flow channel, and the electronic expansion valve of the second upper flow channel in the flow channel throttles and reduces the pressure of the high-temperature refrigerant, and then the high-temperature refrigerant passes through the first lower flow channel and the third upper flow channel and returns to the compressor from the gas distribution tank.

[0030] In some embodiments, when the management system is in the air conditioning refrigeration and battery cooling mode, the high-temperature refrigerant discharged by the compressor passes through the first upper flow channel in the flow channel in sequence to reach the heat exchanger and then exchanges heat to output a low-temperature refrigerant, the low-temperature refrigerant includes a first low-temperature refrigerant and a second low-temperature refrigerant, the first low-temperature refrigerant passes through the third lower flow channel in the flow channel, and the electronic expansion valve of the third lower flow channel throttles and reduces the pressure of the first low-temperature refrigerant, the first low-temperature refrigerant passes through the fifth upper flow channel in the flow channel to reach the evaporator and is converted into the high-temperature refrigerant, and the high-temperature refrigerant output by the evaporator returns to the compressor; the second low-temperature refrigerant passes through the sixth upper flow channel in the flow channel to reach the direct cooling plate, the second low-temperature refrigerant passes through the direct cooling plate and is converted into the high-temperature refrigerant, the high-temperature refrigerant passes through the second upper flow channel in the flow channel, and the electronic expansion valve of the second upper flow channel throttles and reduces the pressure of the high-temperature refrigerant, the high-temperature refrigerant passes through the first lower flow channel in the flow channel and the third upper flow channel in the flow channel and then returns to the compressor from the gas separator.

[0031] In certain embodiments, when the management system is in the air conditioning and heating mode, the high-temperature refrigerant discharged from the compressor enters the condenser, the high-temperature refrigerant is converted into a low-temperature refrigerant after releasing heat in the condenser, the low-temperature refrigerant passes through the fourth upper flow channel in the flow channel, and after the electronic expansion valve of the fourth upper flow channel throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger, the heat exchanger exchanges heat and outputs the high-temperature refrigerant, and the high-temperature refrigerant passes through the third upper flow channel in the flow channel and enters the compressor through the gas separator tank.

[0032] In some embodiments, when the management system is in the battery heating mode, the high-temperature refrigerant discharged by the compressor passes through the first upper flow channel, the first lower flow channel, and the second upper flow channel in the flow channel. The electronic expansion valve of the second upper flow channel throttles and depressurizes the high-temperature refrigerant and then inputs it into the direct cooling plate. The high-temperature refrigerant passes through the direct cooling plate and is converted into a low-temperature refrigerant. The low-temperature refrigerant passes through the sixth upper flow channel and the third lower flow channel in the flow channel. After the electronic expansion valve of the third lower flow channel throttles and depressurizes the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger. The heat exchanger exchanges heat and outputs the high-temperature refrigerant. The high-temperature refrigerant passes through the third upper flow channel in the flow channel and then enters the compressor through the gas-liquid separator.

[0033] In some embodiments, when the management system is in the air-conditioning heating and battery heating modes, the high-temperature refrigerant discharged by the compressor includes a first high-temperature refrigerant and a second high-temperature refrigerant. The first high-temperature refrigerant enters the condenser. After the first high-temperature refrigerant releases heat in the condenser, it is converted into a low-temperature refrigerant. The low-temperature refrigerant passes through the fourth upper flow channel in the flow channel. After the electronic expansion valve of the fourth upper flow channel throttles and depressurizes the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger. The heat exchanger exchanges heat and outputs the high-temperature refrigerant. The high-temperature refrigerant passes through the third upper flow channel in the flow channel and then enters the compressor through the gas-liquid separator. The second high-temperature refrigerant passes through the first upper flow channel, the first lower flow channel, and the second upper flow channel in the flow channel. The electronic expansion valve of the second upper flow channel throttles and depressurizes the high-temperature refrigerant and then inputs it into the direct cooling plate. The high-temperature refrigerant passes through the direct cooling plate and is converted into a low-temperature refrigerant. The low-temperature refrigerant passes through the sixth upper flow channel and the third lower flow channel in the flow channel. After the electronic expansion valve of the third lower flow channel throttles and depressurizes the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger. The heat exchanger exchanges heat and outputs the high-temperature refrigerant. The high-temperature refrigerant passes through the third upper flow channel and then enters the compressor through the gas-liquid separator.

[0034] In some embodiments, when the management system is in the air-conditioning dehumidification mode, the high-temperature refrigerant discharged by the compressor is converted into a low-temperature refrigerant after passing through the condenser. The low-temperature refrigerant sequentially passes through the fourth upper flow channel and the third lower flow channel in the flow channel. After the electronic expansion valve of the third lower flow channel throttles and depressurizes the low-temperature refrigerant, the low-temperature refrigerant passes through the fifth upper flow channel in the flow channel and reaches the evaporator and is converted into the high-temperature refrigerant. The high-temperature refrigerant output by the evaporator returns to the compressor.

[0035] In some embodiments, when the management system is in the air-conditioning dehumidification and battery heating mode, the high-temperature refrigerant discharged by the compressor includes a first high-temperature refrigerant and a second high-temperature refrigerant. The first high-temperature refrigerant is converted into a low-temperature refrigerant after passing through the condenser. The low-temperature refrigerant sequentially passes through the fourth upper flow channel in the flow channel and the third lower flow channel in the flow channel. After the electronic expansion valve of the third lower flow channel throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant reaches the evaporator through the fifth upper flow channel and is converted into a high-temperature refrigerant. The high-temperature refrigerant output by the evaporator returns to the compressor. The second high-temperature refrigerant passes through the first upper flow channel in the flow channel, the first lower flow channel in the flow channel, and the second upper flow channel in the flow channel. After the electronic expansion valve of the second upper flow channel throttles and reduces the pressure of the high-temperature refrigerant, it is input into the direct cooling plate. The high-temperature refrigerant passes through the direct cooling plate and is converted into a low-temperature refrigerant. The low-temperature refrigerant passes through the sixth upper flow channel in the flow channel and the third lower flow channel in the flow channel. After the electronic expansion valve of the third lower flow channel throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger. The heat exchanger exchanges heat and outputs a high-temperature refrigerant. The high-temperature refrigerant passes through the third upper flow channel and then enters the compressor through the gas-liquid separator.

[0036] In a fifth aspect, the present application provides a vehicle, which includes the management system according to any one of the above embodiments.

[0037] In the integrated valve matrix, integrated valve assembly, thermal management module, management system, and vehicle of the present application, the integrated valve matrix is provided with a first interface on the top wall, a second interface on the side wall, and a flow channel inside, and the flow channel is used to connect the first interface and the second interface to form a refrigerant circulation path, so as to realize subsequent thermal management. In addition, since the first interface is provided on the top wall and the second interface is provided on the side wall, the switching module connected to the first interface and the plate heat exchanger module connected to the second interface are arranged regularly, making the structure of the integrated valve matrix simple and occupying a small installation space; moreover, the switching module and the plate heat exchanger module can be installed separately from two directions, and the installation difficulty is small.

[0038] The additional aspects and advantages of the present application will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The above and / or additional aspects and advantages of the present application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0040] Figure 1 is an exploded schematic diagram of a partial structure of the management system according to some embodiments of the present application;

[0041] Figure 2 isFigure 1 Schematic three-dimensional structure diagram of the integrated valve base of the thermal management module in the management system shown;

[0042] Figure 3 is Figure 2 Front view of the integrated valve base in;

[0043] Figure 4 is Figure 3 Schematic sectional view of the integrated valve base taken along line A-A in;

[0044] Figure 5 is Figure 2 Top view of the integrated valve base in;

[0045] Figure 6 is Figure 5 Schematic sectional view of the integrated valve base taken along line B-B in and shown;

[0046] Figure 7 is Figure 5 Schematic sectional view of the integrated valve base taken along line C-C in and shown.;

[0047] Figure 8 is Figure 2 Planar schematic diagram of the connection relationship between the various flow channels in the integrated valve base;

[0048] Figure 9 is Figure 1 Planar structure schematic diagram of the integrated valve assembly of the thermal management module in;

[0049] Figure 10 is Figure 1 Planar schematic diagram of the adapter plate of the thermal management module in;

[0050] Figure 11 Schematic three-dimensional structure diagram of the thermal management module in some other embodiments of the present application;

[0051] Figure 12 is Figure 1 or Figure 11 Schematic principle diagram of the management system in;

[0052] Figure 13 is Figure 1 Schematic diagram of the cooling circulation path when the management system is in the air-conditioning refrigeration mode;

[0053] Figure 14 is Figure 1 Schematic diagram of the cooling circulation path when the management system is in the battery cooling mode;

[0054] Figure 15 is Figure 1 Schematic diagram of the cooling circulation path when the management system is in the air-conditioning refrigeration and battery cooling modes;

[0055] Figure 16 is Figure 1 A schematic diagram of the cooling circulation path when the management system in the air - conditioning heating mode;

[0056] Figure 17 is Figure 1 A schematic diagram of the cooling circulation path when the management system in the battery heating mode;

[0057] Figure 18 is Figure 1 A schematic diagram of the cooling circulation path when the management system in the air - conditioning heating and battery heating modes;

[0058] Figure 19 is Figure 1 A schematic diagram of the cooling circulation path when the management system in the air - conditioning dehumidification mode;

[0059] Figure 20 is Figure 1 A schematic diagram of the cooling circulation path when the management system in the air - conditioning dehumidification and battery heating modes;

[0060] Figure 21 A schematic diagram of the structure of the vehicle in some embodiments of the present application.

[0061] Description of the main component numbers:

[0062] Vehicle 30000; Management system 10000; Thermal management module 1000; Integrated valve assembly 100; Integrated valve base 10; Top wall 101; First interface 11; Valve body interface 111; Solenoid valve interface 1110; First solenoid valve interface 1111; Second solenoid valve interface 1112; Third solenoid valve interface 1113; Fourth solenoid valve interface 1114; Electronic expansion valve interface 1120; First electronic expansion valve interface 1121; Second electronic expansion valve interface 1122; Third electronic expansion valve interface 1123; Fourth electronic expansion valve interface 1124; Sensor interface 113; Temperature sensor interface 1130; First temperature sensor interface 1131; Second temperature sensor interface 1132; Third temperature sensor interface 1133; Pressure sensor interface 1140; First pressure sensor interface 1141; Second pressure sensor interface 1142; Temperature and pressure sensor interface 1150; Bottom wall 103; Positioning member 13; First positioning member 131; Second positioning member 132; Side wall 105; First side wall 151; Second side wall 152; Third side wall 153; Fourth side wall 154; Mounting portion 155; Mounting hole 1550; First mounting portion 1551; Second mounting portion 1552; Third mounting portion 1553; Fourth mounting portion 1554; Shock absorber 159; Plug cover 156; Wiring harness portion 157; Second interface 158; First sub-interface 1581; Second sub-interface 1582; Third sub-interface 1583; Fourth sub-interface 1584; Fifth sub-interface 1585; Sixth sub-interface 1586; Flow channel 107; Upper flow channel 171; First upper flow channel 1711; Second upper flow channel 1712; Third upper flow channel 1713; Fourth upper flow channel 1714; Fifth upper flow channel 1715; Sixth upper flow channel 1716; Lower flow channel 173; First lower flow channel 1731; Second lower flow channel 1732; Third lower flow channel 1733; Switching module 30; Valve body 31; Solenoid valve 311; First solenoid valve 3111; Second solenoid valve 3112; Third solenoid valve 3113; Fourth solenoid valve 3114; Electronic expansion valve 312; First electronic expansion valve 3121; Second electronic expansion valve 3122; Third electronic expansion valve 3123; Fourth electronic expansion valve 3124; Sensor 32; Temperature sensor 321; First temperature sensor 3211; Second temperature sensor 3212; Third temperature sensor 3213; Pressure sensor 322; First pressure sensor 3221; Second pressure sensor 3222; Temperature and pressure sensor 323; Heat exchanger 300; Adapter plate 500; Fitting 50A; First fitting 501; Second fitting 502; Plate heat exchanger module 3000; Compressor 3100; Direct cooling plate 3200; Inner cavity 3210; First opening 3220; Second opening 3230; Gas separation tank 3300; Condenser 3400; Evaporator 3500. Detailed implementation mode

[0063] In the description of the present application, some of the disclosed content has been correspondingly shown in the drawings, where the same or similar reference numerals throughout denote the same or similar elements or elements having the same or similar functions. The content described below with reference to the drawings is exemplary and is only used to explain the present application and should not be construed as a limitation of the present application.

[0064] In the description of the present application, many different contents or examples are disclosed to implement different structures of the present application. To simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present application.

[0065] In addition, the terms "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0066] In the description of the present application, it should be understood that the terms used to indicate the orientation or positional relationship (such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc.) are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and facilitating the understanding of the corresponding embodiments, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms used to indicate the orientation or positional relationship should not be construed as a limitation of the present application.

[0067] In the description of the present application, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0068] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection. It may be a mechanical connection or an electrical connection. It may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0069] Please refer to Figure 1 , Figure 2 , Figure 4 and Figure 8 , the present application provides a management system 10000. The management system 10000 includes a thermal management module 1000 and a plate heat exchanger module 3000. The thermal management module 1000 includes an integrated valve assembly 100, and the integrated valve assembly 100 includes an integrated valve base 10. The integrated valve base 10 includes an opposite top wall 101 and a bottom wall 103, and side walls 105 connecting the top wall 101 and the bottom wall 103. The top wall 101 is provided with a first interface 11, and the first interface 11 is used to access the switching module 30. The side wall 105 is provided with a second interface 158, and the second interface 158 is used to access the plate heat exchanger module 3000. A flow channel 107 is provided in the integrated valve base 10, and the first interface 11 is communicated with the second interface 158 through the flow channel 107 to form a refrigerant circulation path.

[0070] Specifically, in the present application, the length direction of the integrated valve base 10 is taken as the first direction X, the width direction of the integrated valve base 10 is taken as the second direction Y, and the height direction of the integrated valve base 10 is taken as the third direction Z. The first interface 11 is used to connect to the switching module 30. The switching module 30 is used to control parameters such as the flow direction, flow rate, and flow volume of the refrigerant in the integrated valve base 10. The switching module 30 can also throttle and depressurize the refrigerant, monitor the state of the refrigerant, and is also used to detect the pressure and temperature of the refrigerant in the integrated valve base 10, as well as other parameters. It can be understood that the switching module 30 can be directly connected to the first interface 11 by means of threads or the like, and the installation and disassembly of the switching module 30 are both in the third direction Z. After connection, both the switching module 30 and the first interface 11 are provided on the side where the top wall 101 is located, which can ensure that the layout of the first interface 11 and the switching module 30 is compact and saves space. The second interface 158 is used to connect the plate heat exchanger module 3000 and the integrated valve base 10. The plate heat exchanger module 3000 is a component in the management system 10000 that is connected to the integrated valve base 10 to form a complete cooling circulation path. The plate heat exchanger module 3000 includes, but is not limited to, components such as a compressor 3100, a condenser 3400, a water pump, an engine, a radiator, a cooling fan assembly, an evaporator 3500, a blower, and a gas-liquid separator. The plate heat exchanger module 3000 is used to cooperate with the thermal management module 1000 to achieve functions such as air conditioning refrigeration, heating, dehumidification, and battery cooling and heating. It can be understood that since the management system 10000 is usually installed inside the vehicle 30000( Figure 21 as shown), and the internal space of the vehicle 30000 is limited, and the sizes and shapes of the components in the plate heat exchanger module 3000 are different, after the second interface 158 is directly or indirectly externally connected to the plate heat exchanger module 3000 through a pipeline, the components in the plate heat exchanger module 3000 need to be placed at different positions in the space according to different layout requirements. That is, the installation and disassembly of the plate heat exchanger module 3000 are both in the second direction Y, but the spatial position relationship between the components in the installed plate heat exchanger module 3000 and the integrated valve base 10 is not fixed. Therefore, setting the first interface 11 on the top wall 101 and the second interface 158 on the side wall 105 can make the installation directions of the plate heat exchanger module 3000 and the switching module 30 different, and avoid interference after the plate heat exchanger module 3000 and the switching module 30 are installed. The integrated valve base 10 is provided with flow channels 107. The flow channels 107 can be one or more. Different flow channels 107 can be distributed at different positions in the third direction Z for layered setting, thereby saving the dimensions in the first direction X and the second direction Y.

[0071] The integrated valve base 10 of the present application is provided with a first interface 11 on the top wall 101, a second interface 158 on the side wall 105, and a flow channel 107 inside. The first interface 11 and the second interface 158 are connected by the flow channel 107 to form a refrigerant circulation path, so as to achieve subsequent thermal management. In addition, since the first interface 11 is provided on the top wall 101 and the second interface 158 is provided on the side wall 105, the switching module 30 connected to the first interface 11 and the plate heat exchanger module 3000 connected to the second interface 158 are arranged regularly, making the structure of the integrated valve base 10 simple and occupying less installation space. Moreover, the switching module 30 and the plate heat exchanger module 3000 can be installed from two directions respectively, and the installation difficulty is small. In addition, since the management system 10000, the thermal management module 1000, and the integrated valve assembly 100 include the integrated valve base 10, the management system 10000, the thermal management module 1000, and the integrated valve assembly 100 also have the above-mentioned effects.

[0072] Please refer to Figure 2 , Figure 3 , Figure 4 and Figure 8 , in some embodiments, the flow channel 107 includes an upper flow channel 171 and a lower flow channel 173. In the direction from the top wall 101 to the bottom wall 103, the upper flow channel 171 is closer to the top wall 101 than the lower flow channel 173. The side wall 105 includes a first side wall 151 and a second side wall 152 that face away from each other, and the upper flow channel 171 extends along the first side wall 151 to the second side wall 152. Both the first interface 11 and the second interface 158 are connected to the upper flow channel 171, and the lower flow channel 173 is connected to the upper flow channel 171.

[0073] Specifically, in the third direction Z, the integrated valve base 10 is provided with an upper flow channel 171 and a lower flow channel 173. The upper flow channel 171 and the lower flow channel 173 can be one or more, and are not limited in the present application. The upper flow channel 171 is used to connect the first interface 11 and the second interface 158, and can also connect different first interfaces 11. The lower flow channel 173 is used to connect different upper flow channels 171. The manufacturing methods of the upper flow channel 171 and the lower flow channel 173 can be the same or different. In the present application, the upper flow channel 171 is formed by casting or machining, and the lower flow channel 173 is formed by forging. Different forming methods can meet the different production efficiency and cost requirements of the integrated valve base 10.

[0074] The flow channel 107 can replace the pipeline and directly connect the first interface 11 and the second interface 158, reducing the setting of pipelines on the integrated valve base 10, thereby improving the integration degree of the integrated valve base 10. In addition, the setting of the flow channel 107 makes full use of the space inside the integrated valve base 10, can reduce the occupied space of the integrated valve base 10, and the flow channel 107 does not need to be installed, which can reduce the installation difficulty of the integrated valve base 10.

[0075] Please refer to Figure 2 、 Figure 3 and Figure 4 In some embodiments, the first interface 11 includes a valve body interface 111 and a sensor interface 113. The valve body interface 111 is used to access the valve body 31 in the switching module 30, and the sensor interface 113 is used to access the sensor 32 in the switching module 30. The side wall 105 also includes an opposite third side wall 153 and a fourth side wall 154, and both the third side wall 153 and the fourth side wall 154 are connected to the first side wall 151 and the second side wall 152. The upper layer flow channels 171 include a plurality. The second interface 158 includes a plurality. The multiple upper layer flow channels 171 are arranged in sequence in the direction from the third side wall 153 to the fourth side wall 154, and at least one valve body interface 111 is provided on each upper layer flow channel 171 and is communicated with a second interface 158. At least one sensor interface 113 is provided on at least one upper layer flow channel 171.

[0076] Specifically, the upper layer flow channels 171 include a plurality. In this application, six upper layer flow channels 171 are used for illustration. In other embodiments, the number of upper layer flow channels 171 can be different according to requirements. The multiple upper layer flow channels 171 are arranged in sequence in the direction from the third side wall 153 to the fourth side wall 154 (i.e., the second direction Y), which can make the flow channels 107 arranged neatly and compactly, reducing the space occupied by the flow channels 107. At least one valve body interface 111 is provided on each upper layer flow channel 171 and is communicated with a second interface 158, which can enable the integrated valve base 10 to control the flow direction, flow rate and pressure of the refrigerant in the flow channel 107 through the valve body 31. Through the arrangement and combination of the multiple upper layer flow channels 171 and the multiple valve bodies 31, the refrigerant can have a number of flow paths greater than the number of upper layer flow channels 171. Then, through different connection and combination methods between the upper layer flow channels 171 and the components in the plate heat exchanger module 3000, multiple refrigerant circulation paths can be formed, thereby realizing different heat management modes. At least one sensor interface 113 (such as the second pressure sensor interface 1142 of the third upper layer flow channel 1713) is provided on at least one upper layer flow channel 171 for installing the second pressure sensor interface 1142, and the second pressure sensor interface 1142 can monitor the pressure of the refrigerant passing through the upper layer flow channel 171.

[0077] Please refer to Figure 2 、 Figures 5 to 9In some embodiments, the lower flow channels 173 include a plurality of them, and the plurality of lower flow channels 173 are spaced apart from each other. The valve body interfaces 111 on at least two upper flow channels 171 are connected through the lower flow channels 173 (each lower flow channel 173 is used to connect at least two upper flow channels 171). At least one of the lower flow channels 173 is provided with a sensor interface 113.

[0078] Specifically, the lower flow channels 173 include a plurality of them, which can be set according to different requirements of the integrated valve base 10. In this application, three lower flow channels 173 are used for illustration. The lower flow channels 173 are used to connect at least two upper flow channels 171, so that the first interfaces 11 and / or the second interfaces 158 connected to at least two upper flow channels 171 are connected. The setting direction of the lower flow channels 173 is not limited in this application. For example, the lower flow channels 173 can be arranged along the first direction X, or along the second direction Y, or can be arranged along multiple directions. At least one of the lower flow channels 173 is provided with a sensor interface 113 (such as the first temperature sensor interface 1131 of the third lower flow channel 1733), which is used to install the first temperature sensor interface 1131, and the first temperature sensor interface 1131 can monitor the temperature of the refrigerant flowing through the lower flow channel 173.

[0079] Please refer to Figure 2 、 Figures 4 to 9 In some embodiments, the upper flow channels 171 include a first upper flow channel 1711, a second upper flow channel 1712, a third upper flow channel 1713, a fourth upper flow channel 1714, a fifth upper flow channel 1715, and a sixth upper flow channel 1716 arranged in sequence in the direction from the third side wall 153 to the fourth side wall 154. The lower flow channels 173 include a first lower flow channel 1731, a second lower flow channel 1732, and a third lower flow channel 1733. The second interface 158 includes a first sub-interface 1581, a second sub-interface 1582, a third sub-interface 1583, a fourth sub-interface 1584, a fifth sub-interface 1585, and a sixth sub-interface 1586 respectively connected to the first upper flow channel 1711, the second upper flow channel 1712, the third upper flow channel 1713, the fourth upper flow channel 1714, the fifth upper flow channel 1715, and the sixth upper flow channel 1716. The first lower flow channel 1731 connects the first upper flow channel 1711, the second upper flow channel 1712, and the third upper flow channel 1713. The second lower flow channel 1732 connects the first upper flow channel 1711 and the third upper flow channel 1713. The third lower flow channel 1733 connects the fourth upper flow channel 1714, the fifth upper flow channel 1715, and the sixth upper flow channel 1716.

[0080] Specifically, the upper flow channels 171 are arranged in sequence in the direction from the third side wall 153 to the fourth side wall 154, that is, the upper flow channels 171 are arranged in sequence in the first direction X. In the second direction Y, the first upper flow channel 1711 is sequentially connected to the first sub-interface 1581, the first pressure sensor interface 1141, the third solenoid valve interface 1113, and the second solenoid valve interface 1112; the second upper flow channel 1712 is sequentially connected to the second sub-interface 1582, the temperature and pressure sensor interface 1150, and the fourth electronic expansion valve interface 1124; the third upper flow channel 1713 is sequentially connected to the third sub-interface 1583, the second pressure sensor interface 1142, the fourth solenoid valve interface 1114, and the first solenoid valve interface 1111; the fourth upper flow channel 1714 is sequentially connected to the fourth sub-interface 1584, the third temperature sensor interface 1133, and the third electronic expansion valve interface 1123; the fifth upper flow channel 1715 is sequentially connected to the fifth sub-interface 1585 and the first electronic expansion valve interface 1121; the sixth upper flow channel 1716 is sequentially connected to the sixth sub-interface 1586, the second temperature sensor interface 1132, and the second electronic expansion valve interface 1122. The first lower flow channel 1731 connects the first upper flow channel 1711, the second upper flow channel 1712, and the third upper flow channel 1713. Therefore, the third solenoid valve interface 1113, the fourth electronic expansion valve interface 1124, and the fourth solenoid valve interface 1114 are connected to each other through the first upper flow channel 1711, the second upper flow channel 1712, the third upper flow channel 1713, and the first lower flow channel 1731; the second lower flow channel 1732 connects the first upper flow channel 1711 and the third upper flow channel 1713. Therefore, the first temperature sensor interface 1131, the second solenoid valve interface 1112, and the first solenoid valve interface 1111 are sequentially connected through the first upper flow channel 1711, the second lower flow channel 1732, and the third upper flow channel 1713; the third lower flow channel 1733 connects the fourth upper flow channel 1714, the fifth upper flow channel 1715, and the sixth upper flow channel 1716. Therefore, the second electronic expansion valve interface 1122 and the first electronic expansion valve interface 1121 are sequentially connected through the sixth upper flow channel 1716 and the third lower flow channel 1733; the third electronic expansion valve interface 1123 and the first electronic expansion valve interface 1121 are sequentially connected through the fourth upper flow channel 1714 and the third lower flow channel 1733; the second electronic expansion valve interface 1122 and the third electronic expansion valve interface 1123 are sequentially connected through the sixth upper flow channel 1716, the third lower flow channel 1733, and the fourth upper flow channel 1714. The first upper flow channel 1711, the second upper flow channel 1712, the third upper flow channel 1713, the fourth upper flow channel 1714, the fifth upper flow channel 1715, and the sixth upper flow channel 1716 are arranged in sequence in the direction from the third side wall 153 to the fourth side wall 154, which can make the distribution of the flow channel 107 neat and regular.The different upper flow channels 171 are connected to different first interfaces 11 and / or second interfaces 158, and can form multiple refrigerant paths, thereby forming multiple refrigerant circulation paths to achieve different refrigerant circulation modes. The lower flow channel 173 can be connected to different upper flow channels 171, and the lower flow channel 173 and the upper flow channel 171 are arranged in layers in the third direction Z, which can make the layout of the overall flow channel 107 clear.

[0081] Please refer to Figure 2 and Figure 9 , in some embodiments, the valve body interface 111 includes a solenoid valve interface 1110 and an electronic expansion valve interface 1120. Sensor interfaces 113 and solenoid valve interfaces 1110 are provided on both the first upper flow channel 1711 and the third upper flow channel 1713. Sensor interfaces 113 and electronic expansion valve interfaces 1120 are provided on the second upper flow channel 1712, the fourth upper flow channel 1714, and the sixth upper flow channel 1716. An electronic expansion valve interface 1120 is provided on the fifth upper flow channel 1715. Specifically, the solenoid valve interface 1110 includes a first solenoid valve interface 1111, a second solenoid valve interface 1112, a third solenoid valve interface 1113, and a fourth solenoid valve interface 1114; the electronic expansion valve interface 1120 includes a first electronic expansion valve interface 1121, a second electronic expansion valve interface 1122, a third electronic expansion valve interface 1123, and a fourth electronic expansion valve interface 1124. The solenoid valve interface 1110 can install a solenoid valve 311 to control parameters such as the refrigerant flow direction, flow rate, and flow volume of the refrigerant circulation path. The electronic expansion valve interface 1120 can install an electronic expansion valve 312 to control the throttling and pressure reduction of the refrigerant circulation path.

[0082] Please refer to Figure 2 and Figure 4 , in some embodiments, the sensor interfaces 113 on the first upper flow channel 1711, the second upper flow channel 1712, the third upper flow channel 1713, the fourth upper flow channel 1714, and the sixth upper flow channel 1716 are closer to the first side wall 151 or the second side wall 152 than the valve body interface 111. Specifically, the sensor interfaces 113 on the first upper flow channel 1711, the second upper flow channel 1712, the third upper flow channel 1713, the fourth upper flow channel 1714, and the sixth upper flow channel 1716 are closer to the first side wall 151 or the second side wall 152 than the valve body interface 111, which can make the layout of the sensor interfaces 113 concentrated on one side, arranged more neatly, and more conducive to the unified installation of the sensors 32.

[0083] Please refer to Figure 2 , Figure 4 and Figure 8, in some embodiments, the sensor interface 113 includes a temperature sensor interface 1130, a pressure sensor interface 1140, and a temperature and pressure sensor interface 1150. The temperature sensor interface 1130 is provided on both the fourth upper flow channel 1714 and the sixth upper flow channel 1716. The temperature sensor interface 1130 is provided on the third lower flow channel 1733. The temperature and pressure sensor interface 1150 is provided on the second upper flow channel 1712. The pressure sensor interface 1140 is provided on both the first upper flow channel 1711 and the third upper flow channel 1713. Specifically, the temperature sensor interface 1130 can mount a temperature sensor 321 to detect the temperature of the refrigerant flowing in the flow channel 107 where the temperature sensor interface 1130 is located. The temperature sensor interface 1130 includes a first temperature sensor interface 1131, a second temperature sensor interface 1132, and a third temperature sensor interface 1133. After the first temperature sensor interface 1131 is connected to the fourth upper flow channel 1714, the fifth upper flow channel 1715, and the sixth upper flow channel 1716 through the third lower flow channel 1733, and then through the fifth upper flow channel 1715, the sixth upper flow channel 1716, and the fourth upper flow channel 1714 respectively, it is connected to the first electronic expansion valve interface 1121, the second electronic expansion valve interface 1122, and the third electronic expansion valve interface 1123. The second temperature sensor interface 1132 is provided on the sixth upper flow channel 1716. The third temperature sensor interface 1133 is provided on the fourth upper flow channel 1714. The pressure sensor interface 1140 can mount a pressure sensor 322 to detect the pressure of the refrigerant flowing in the flow channel 107 where the pressure sensor interface 1140 is located. The pressure sensor interface 1140 includes a first pressure sensor interface 1141 and a second pressure sensor interface 1142. The first pressure sensor interface 1141 is provided on the first upper flow channel 1711 near the first side wall 151. The second pressure sensor interface 1142 is provided on the third upper flow channel 1713 near the first side wall 151. The temperature and pressure sensor interface 1150 is provided on the second upper flow channel 1712 near the first side wall 151. The temperature and pressure sensor interface 1150 can mount a temperature and pressure sensor 323 to detect the temperature and pressure of the refrigerant flowing in the second upper flow channel 1712.

[0084] Please refer to Figure 1 and Figure 2, in some embodiments, an installation part 155 is provided on the side wall 105. An installation hole 1550 is provided on the installation part 155, and a shock absorber 159 is provided in the installation hole 1550. Specifically, the side wall 105 may also be provided with the installation part 155, and the installation part 155 is used for connecting and fixing to an external structure. The installation part 155 may be arranged at different positions according to different requirements of the layout of the management system 10000. The installation part 155 is provided with the installation hole 1550, and the shock absorber 159 is provided in the installation hole 1550. After the shock absorber 159 is in interference fit with the installation hole 1550, it is fixed and installed to the external structure through a screw passing through the installation hole 1550. In this way, the shock absorber 159 can absorb external impacts and vibrations and avoid damage to the installation part. In other embodiments of the present application, the installation part 155 may also be connected to the external structure in other detachable ways or in a non-detachable way. In the present application, the installation part 155 includes a first installation part 1551, a second installation part 1552, a third installation part 1553 and a fourth installation part 1554. The first side wall 151 is not provided with the installation part 155, the second side wall 152 is provided with the first installation part 1551 and the second installation part 1552 at intervals in the first direction X, the third side wall 153 is provided with the third installation part 1553, and the fourth side wall 154 is provided with the fourth installation part 1554. The second side wall 152, the third side wall 153 and the fourth side wall 154 are provided with the installation part 155, which can enable the integrated valve base 10 to cooperate and be installed with an external structure (such as a vehicle body bracket), facilitating the installation and disassembly of the integrated valve base 10 in the management system 10000. In addition, the first side wall 151 is not provided with the installation part 155. On the one hand, it can free up space to provide more second interfaces 158, and on the other hand, it can avoid interference between the installation part 155 and the second interface 158, facilitating the communication between each component in the plate heat exchanger module 3000 ( Figures 13 to 20 any one of the figures) and the second interface 158.

[0085] Please refer to Figure 1 , Figure 8 and Figure 10In some embodiments, a positioning member 13 is provided on the top wall 101 or the bottom wall 103. The positioning member 13 is used to position and install the adapter plate 500. Specifically, a positioning member 13 is further provided on the top wall 101 or the bottom wall 103. The positioning member 13 can cooperate with the mating member 50A corresponding to the adapter plate 500 to install the adapter plate 500 on the integrated valve base 10. The connection between the integrated valve base 10 and the adapter plate 500 can be a detachable connection or a non-detachable connection. In this application, the integrated valve base 10 and the adapter plate 500 are sealed by furnace enthalpy welding. The number of the positioning members 13 is not limited. In this application, the positioning members 13 include two, namely a first positioning member 131 and a second positioning member 132. The adapter plate 500 is correspondingly provided with a first mating member 501 and a second mating member 502. The first positioning member 131 is connected to the first mating member 501, and the second positioning member 132 is connected to the second mating member 502, thereby connecting the adapter plate 500 and the integrated valve base 10. The connection between the positioning member 13 and the mating member 50A can avoid installation misalignment, thereby avoiding leakage of the integrated valve base 10. At the same time, the setting of the positioning member 13 can simplify the requirements for auxiliary connection tools (such as jigs) during the connection process between the adapter plate 500 and the integrated valve base 10, and reduce the installation cost.

[0086] Please refer to Figure 1 , Figure 2 and Figure 9 , in some embodiments, a wire harness portion 157 is provided on the side wall 105. The wire harness portion 157 protrudes and extends relative to the side wall 105. The wire harness portion 157 is used to restrain the wires. Specifically, the controller in the management system 10000 is electrically connected to the switching module 30 through a plurality of wires to control the valve body 31 and the sensor 32 in the switching module 30. The wire harness portion 157 can restrain a plurality of wires to avoid messy wire arrangement. In this application, the wire harness portion 157 is provided on the fourth side wall 154. In other embodiments, it can also be provided on other side walls 105 without the second interface 158 (such as the second side wall 152 and the third side wall 153 in this application). In this application, the wire harness portion 157 is provided on the fourth side wall 154, and the second interface 158 is provided on the first side wall 151, which can avoid the components connected at the second interface 158 from interfering with the wires of the wire harness portion 157. The first interface 11 is provided on the top wall 101, which can avoid the components (valve body 31 and sensor 32) connected to the first interface 11 from interfering with the wire harness portion 157, and also makes the layout of the integrated valve base 10 more regular.

[0087] Please refer to Figure 11, in some embodiments, a plug cover 156 is provided on the side wall 105, and the plug cover 156 is used to block part of the process holes. Specifically, during the manufacturing of the integrated valve base 10, due to process reasons, some process holes will be generated. By welding the plug cover 156 to the process holes on the integrated valve base 10, the process holes can be sealed to avoid the leakage of refrigerant during the use of the integrated valve base 10.

[0088] Please refer to Figure 1 , Figure 2 and Figure 9 , the present application provides an integrated valve assembly 100. The integrated valve assembly 100 includes the integrated valve base 10 of any one of the above embodiments and a switching module 30. The switching module 30 is installed on the first interface 11. Specifically, the switching module 30 is used to control parameters such as the flow direction, flow rate, and flow volume of the refrigerant in the refrigerant circulation path. The switching module 30 can also throttle and depressurize the refrigerant and monitor the state of the refrigerant. The integrated valve base 10 of the integrated valve assembly 100 is provided with a first interface 11 on the top wall 101, a second interface 158 on the side wall 105, and a flow channel 107 inside, and the flow channel 107 is used to connect the first interface 11 and the second interface 158 to form a refrigerant circulation path for subsequent thermal management. In addition, since the first interface 11 is provided on the top wall 101 and the second interface 158 is provided on the side wall 105, the switching module 30 connected to the first interface 11 and the plate heat exchanger module 3000 connected to the second interface 158 are arranged regularly, making the structure of the integrated valve base 10 simple and occupying a small installation space; moreover, the switching module 30 and the plate heat exchanger module 3000 can be installed separately from two directions, and the installation difficulty is small.

[0089] Please refer to Figure 1 , Figure 2 and Figure 9 , in some embodiments, the switching module 30 includes a valve body 31 and a sensor 32. The valve body 31 is installed on the valve body interface 111 of the first interface 11. The sensor 32 is installed on the sensor interface 113 of the first interface 11 and is spaced from the valve body 31.

[0090] Specifically, the valve body 31 includes, but is not limited to, a solenoid valve 311, an electronic expansion valve 312, a four-way valve, etc. The valve body 31 is used to control parameters such as the flow direction, flow rate, and flow volume of the refrigerant in the refrigerant circulation path, and can also throttle and depressurize the refrigerant and monitor the state of the refrigerant. The sensor 32 includes, but is not limited to, a temperature sensor 321, a pressure sensor 322, etc., to detect the state parameters of the refrigerant passing through the sensor interface 113. The state parameters of the refrigerant include, but are not limited to, temperature and pressure, etc.

[0091] Please refer to Figure 2 , Figure 4 , Figure 8 and Figure 9, in some embodiments, the valve body 31 includes a solenoid valve 311 and an electronic expansion valve 312. The solenoid valve 311 is installed on the solenoid valve interface 1110 in the valve body interface 111. The electronic expansion valve 312 is installed on the electronic expansion valve interface 1120 in the valve body interface 111. Specifically, the solenoid valve 311 includes a first solenoid valve 3111, a second solenoid valve 3112, a third solenoid valve 3113, and a fourth solenoid valve 3114. The first solenoid valve 3111 is disposed in the third upper flow channel 1713 and communicates with the second lower flow channel 1732 through the third upper flow channel 1713. The first solenoid valve 3111 is installed on the first solenoid valve interface 1111, and the first solenoid valve 3111 can control parameters such as the flow direction, flow velocity, and flow rate of the refrigerant in the first upper flow channel 1711 and / or the second lower flow channel 1732. The second solenoid valve 3112 is disposed in the first upper flow channel 1711 and the second lower flow channel 1732, and is installed on the second solenoid valve interface 1112. The second solenoid valve 3112 can control parameters such as the flow direction, flow velocity, and flow rate of the refrigerant in the first upper flow channel 1711 and / or the second lower flow channel 1732. The third solenoid valve 3113 is disposed in the first upper flow channel 1711 and the first lower flow channel 1731, and is installed on the third solenoid valve interface 1113. The third solenoid valve 3113 can control parameters such as the flow direction, flow velocity, and flow rate of the refrigerant in the first upper flow channel 1711 and / or the first lower flow channel 1731. The fourth solenoid valve 3114 is disposed in the third upper flow channel 1713 and the first lower flow channel 1731, and is installed on the fourth solenoid valve interface 1114. The fourth solenoid valve 3114 can control parameters such as the flow direction, flow velocity, and flow rate of the refrigerant in the third upper flow channel 1713 and / or the first lower flow channel 1731. The electronic expansion valve 312 includes a first electronic expansion valve 3121, a second electronic expansion valve 3122, a third electronic expansion valve 3123, and a fourth electronic expansion valve 3124.The first electronic expansion valve 3121 is disposed in the third lower flow channel 1733 and installed at the first electronic expansion valve interface 1121. The first electronic expansion valve 3121 can throttle and depressurize the refrigerant flowing through the third lower flow channel 1733. The second electronic expansion valve 3122 is disposed in the third lower flow channel 1733 and the sixth upper flow channel 1716 and installed at the second electronic expansion valve interface 1122. The second electronic expansion valve 3122 can throttle and depressurize the refrigerant flowing through the third lower flow channel 1733 and / or the sixth upper flow channel 1716. The third electronic expansion valve 3123 is disposed in the third lower flow channel 1733 and the fifth upper flow channel 1715 and installed at the third electronic expansion valve interface 1123. The third electronic expansion valve 3123 can throttle and depressurize the refrigerant flowing through the third lower flow channel 1733 and / or the fifth upper flow channel 1715. The fourth electronic expansion valve 3124 is disposed in the first lower flow channel 1731 and the second upper flow channel 1712 and installed at the fourth electronic expansion valve interface 1124. The fourth electronic expansion valve 3124 can throttle and depressurize the refrigerant flowing through the first lower flow channel 1731 and / or the second upper flow channel 1712.

[0092] Please refer to Figure 2 and Figure 9, in some embodiments, the sensor 32 includes a temperature sensor 321, a pressure sensor 322, and a temperature and pressure sensor 323. The temperature sensor 321 is installed in the temperature sensor interface 1130 in the sensor interface 113. The pressure sensor 322 is installed in the pressure sensor interface 1140 in the sensor interface 113. The temperature and pressure sensor 323 is installed in the temperature and pressure sensor interface 1150 in the sensor interface 113. Specifically, the temperature sensor 321 includes a first temperature sensor 3211, a second temperature sensor 3212, and a third temperature sensor 3213. The first temperature sensor 3211 is installed in the first temperature sensor interface 1131 and can detect the temperature of the refrigerant passing through the first temperature sensor interface 1131. The second temperature sensor 3212 is installed in the second temperature sensor interface 1132 and can detect the temperature of the refrigerant passing through the second temperature sensor interface 1132. The third temperature sensor 3213 is installed in the third temperature sensor interface 1133 and can detect the temperature of the refrigerant passing through the third temperature sensor interface 1133. The pressure sensor 322 includes a first pressure sensor 3221 and a second pressure sensor 3222. The first pressure sensor 3221 is installed in the first pressure sensor interface 1141 and can detect the temperature of the refrigerant passing through the first pressure sensor interface 1141. The second pressure sensor 3222 is installed in the second pressure sensor interface 1142 and can detect the temperature of the refrigerant passing through the second pressure sensor interface 1142. The temperature and pressure sensor 323 is installed in the temperature and pressure sensor interface 1150 in the sensor interface 113 and can detect the temperature and pressure of the refrigerant passing through the temperature and pressure sensor interface 1150.

[0093] Please refer to Figure 1 , Figure 2 , the present application provides a thermal management module 1000. The thermal management module 1000 includes the integrated valve assembly 100 of any one of the above embodiments. Specifically, the integrated valve base 10 of the integrated valve assembly 100 of the present application has a first interface 11 on the top wall 101, a second interface 158 on the side wall 105, and a flow channel 107 inside, and the flow channel 107 is used to connect the first interface 11 and the second interface 158 to form a refrigerant circulation path, so as to realize subsequent thermal management. In addition, since the first interface 11 is provided on the top wall 101 and the second interface 158 is provided on the side wall 105, the switching module 30 connected to the first interface 11 and the plate heat exchanger module 3000 connected to the second interface 158 are arranged regularly, so that the structure of the integrated valve base 10 is simple and the occupied installation space is small; moreover, the switching module 30 and the plate heat exchanger module 3000 can be installed from two directions respectively, and the installation difficulty is small.

[0094] Please refer to Figure 1 , Figure 2, in some embodiments, the thermal management module 1000 further includes a heat exchanger 300. The heat exchanger 300 is connected to the integrated valve assembly 100 and is located on the side where the bottom wall 103 is located. The heat exchanger 300 is in communication with at least one first interface 11. Specifically, the heat exchanger 300 simultaneously functions as a plate heat exchanger and a water-cooled condenser. In the air-conditioning refrigeration mode, battery cooling mode, air-conditioning refrigeration and battery cooling mode of the management system 10000, it acts as a water-cooled condenser to exchange heat with the refrigerant in the refrigerant circulation path. In the air-conditioning heating mode, battery heating mode, air-conditioning heating and battery heating mode of the management system 10000, it acts as a plate heat exchanger 300 to exchange heat with the refrigerant in the refrigerant circulation path. One side of the heat exchanger 300 is connected to the bottom wall 103, and the other side is connected to other components (such as the engine cooling system) to exchange heat with the refrigerant. The heat exchanger 300 is provided on one side of the bottom wall 103, that is, the heat exchanger 300 and the integrated valve assembly 100 are arranged in the third direction Z, which can maximize the space utilization rate in the vertical direction and reduce the size of the thermal management module 1000 in the first direction X and the second direction Y.

[0095] Please refer to Figure 1 、 Figure 2 , in some embodiments, the thermal management module 1000 further includes a heat exchanger 300. The heat exchanger 300 is connected to the integrated valve assembly 100 and is located on the side where the top wall 101 is located. The heat exchanger 300 is in communication with at least one first interface 11. The heat exchanger 300 is provided on one side of the top wall 101, which can achieve a more flexible layout according to different requirements of the management system 10000.

[0096] Please refer to Figure 1 、 Figure 2 , in some embodiments, the thermal management module 1000 further includes an adapter plate 500. The adapter plate 500 is provided between the heat exchanger 300 and the integrated valve assembly 100, and the heat exchanger 300 is connected to the integrated valve assembly 100 through the adapter plate 500.

[0097] Specifically, the adapter plate 500 is used to connect the heat exchanger 300 and the integrated valve assembly 100. The adapter plate 500 is provided with components (such as the mating parts in this application) connected to the integrated valve assembly 100. The heat exchanger 300 can be welded to the adapter plate 500 through a connector, and an O-ring can also be provided in the connector to seal the heat exchanger 300 and the adapter plate 500. Therefore, the setting of the adapter plate 500 can realize the connection between the heat exchanger 300 and the integrated valve assembly 100.

[0098] Please refer to Figure 1 、 Figure 2 and Figure 10, in some embodiments, a fitting 50A is provided on the adapter board 500, and the fitting 50A cooperates with the positioning member 13 on the top wall 101 or the bottom wall 103 to position the connection between the adapter board 500 and the integrated valve assembly 100.

[0099] Specifically, a fitting 50A is provided on the adapter board 500, and the fitting 50A cooperates with the positioning member 13 on the top wall 101 or the bottom wall 103 to mount the adapter board 500 on the integrated valve base 10. The fitting 50A can be one or more. In this application, there are 2 fittings 50A, namely the first fitting 501 and the second fitting 502 respectively. It can be understood that the number of the fittings 50A corresponds to that of the positioning members 13. There are two positioning members 13 in this application, namely the first positioning member 131 and the second positioning member 132. The first positioning member 131 is connected to the first fitting 501, and the second positioning member 132 is connected to the second fitting 502, whereby the adapter board 500 and the integrated valve base 10 can be connected. The cooperation between the fitting 50A and the positioning member 13 can avoid installation misalignment, thereby avoiding leakage of the integrated valve base 10. At the same time, the setting of the fitting 50A can simplify the requirements for auxiliary connection tools (such as jigs) during the connection process between the adapter board 500 and the integrated valve base 10, and reduce the installation cost.

[0100] Please refer to Figure 1 , and Figures 13 to 21 any one of the figures. This application provides a management system 10000. The management system 10000 includes the heat management module 1000 and the plate heat exchanger module 3000 of any one of the above embodiments. The plate heat exchanger module 3000 is communicated with the second interface 158.

[0101] For the integrated valve base 10 of the management system 10000 of this application, a first interface 11 is provided on the top wall 101, a second interface 158 is provided on the side wall 105, and a flow channel 107 is provided inside. The flow channel 107 is used to communicate the first interface 11 and the second interface 158 to form a refrigerant circulation path, so as to achieve subsequent heat management. In addition, since the first interface 11 is provided on the top wall 101 and the second interface 158 is provided on the side wall 105, the switching module 30 connected to the first interface 11 and the plate heat exchanger module 3000 connected to the second interface 158 are arranged regularly, making the structure of the integrated valve base 10 simple and occupying a small installation space; moreover, the switching module 30 and the plate heat exchanger module 3000 can be installed from two directions respectively, and the installation difficulty is small.

[0102] Please refer to Figure 2 , and Figure 13 (or Figures 14 to 20(in any one of the figures), in some embodiments, the plate heat exchanger module 3000 communicates with the second interface 158 of the thermal management module 1000. The plate heat exchanger module 3000 includes a compressor 3100, a gas-liquid separator 3300, a condenser 3400, an evaporator 3500, and a direct cooling plate 3200 of the battery. The compressor 3100 communicates with the first sub-interface 1581 in the second interface 158. The compressor 3100 communicates with the third sub-interface 1583 in the second interface 158. The condenser 3400 communicates with the fourth sub-interface 1584 in the second interface 158. The evaporator 3500 communicates with the fifth sub-interface 1585 in the second interface 158. The direct cooling plate 3200 is provided with an inner cavity 3210, a first opening 3220 communicating with the inner cavity 3210, and a second opening 3230 communicating with the inner cavity 3210. The first opening 3220 communicates with the second sub-interface 1582 in the second interface 158, and the second opening 3230 communicates with the sixth sub-interface 1586 in the second interface 158. By connecting different components of the plate heat exchanger module 3000 through the second interface 158 and combining different components with the thermal management module 1000, different refrigerant circulation paths can be formed to achieve different heat management modes.

[0103] Please refer to Figure 1 and Figures 13 to 21 any one of the figures. The present application provides a vehicle 30000. The vehicle 30000 includes a management system 10000. The integrated valve base 10 of the vehicle 30000 of the present application is provided with a first interface 11 on the top wall 101, a second interface 158 on the side wall 105, and a flow channel 107 inside, and the first interface 11 and the second interface 158 are connected through the flow channel 107 to form a refrigerant circulation path for subsequent thermal management. In addition, since the first interface 11 is provided on the top wall 101 and the second interface 158 is provided on the side wall 105, the switching module 30 connected to the first interface 11 and the plate heat exchanger module 3000 connected to the second interface 158 are arranged regularly, making the structure of the integrated valve base 10 simple and occupying a small installation space; moreover, the switching module 30 and the plate heat exchanger module 3000 can be installed separately from two directions, and the installation difficulty is small. The management system 10000 of the vehicle 30000 has a total of eight heat management modes, namely: air-conditioning refrigeration mode, battery cooling mode, air-conditioning refrigeration and battery cooling mode, air-conditioning heating mode, battery heating mode, air-conditioning heating and battery heating mode, air-conditioning dehumidification mode, air-conditioning dehumidification and battery heating mode. The specific working states of the heat management modes are as follows:

[0104] Please refer to Figure 2 , Figure 4 , Figure 8 , Figure 9 , Figure 12 and Figure 13, in some embodiments, when the management system 10000 is in the air-conditioning cooling mode, the high-temperature refrigerant discharged by the compressor 3100 sequentially passes through the first upper flow channel 1711, reaches the heat exchanger 300, exchanges heat and outputs a low-temperature refrigerant. The low-temperature refrigerant passes through the third lower flow channel 1733. After the electronic expansion valve 312 of the third lower flow channel 1733 throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant passes through the fifth upper flow channel 1715, reaches the evaporator 3500 and is converted into a high-temperature refrigerant. The high-temperature refrigerant output by the evaporator 3500 returns to the compressor 3100.

[0105] In the air-conditioning cooling mode, the second solenoid valve 3112 is opened. The high-temperature refrigerant discharged by the compressor 3100 sequentially passes through the first pressure sensor 3221 and the second solenoid valve 3112 on the first upper flow channel 1711, reaches the heat exchanger 300. After the heat exchanger 300 exchanges heat, it outputs a low-temperature refrigerant. The low-temperature refrigerant sequentially passes through the first temperature sensor 3211 and the first electronic expansion valve 3121 of the third lower flow channel 1733 to throttle and reduce the pressure, then passes through the fifth upper flow channel 1715. The low-temperature liquid refrigerant enters the evaporator 3500, absorbs ambient heat and evaporates. The evaporated low-temperature refrigerant is blown into the place to be cooled by a blower (not shown) to achieve refrigeration. The low-temperature refrigerant after passing through the evaporator 3500 is converted into a high-temperature refrigerant, and the high-temperature refrigerant returns to the compressor 3100, thereby forming a refrigerant circulation path in the air-conditioning cooling mode.

[0106] Please refer to Figure 2 , Figure 4 , Figure 8 , Figure 9 , Figure 12 and Figure 14 , in some embodiments, when the management system 10000 is in the battery cooling mode, the high-temperature refrigerant discharged by the compressor 3100 passes through the first upper flow channel 1711, reaches the heat exchanger 300, exchanges heat and outputs a low-temperature refrigerant. The low-temperature refrigerant passes through the third lower flow channel 1733. After the electronic expansion valve 312 of the third lower flow channel 1733 throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant passes through the sixth upper flow channel 1716 to reach the direct cooling plate 3200 of the battery. The low-temperature refrigerant passes through the direct cooling plate 3200 and is converted into a high-temperature refrigerant. The high-temperature refrigerant passes through the second upper flow channel 1712. After the electronic expansion valve 312 of the second upper flow channel 1712 throttles and reduces the pressure of the high-temperature refrigerant, the high-temperature refrigerant passes through the first lower flow channel 1731 and the third upper flow channel 1713, and then returns to the compressor 3100 from the gas separation tank 3300.

[0107] In the battery cooling mode, the second solenoid valve 3112 is opened, and the high-temperature refrigerant discharged by the compressor 3100 sequentially passes through the first pressure sensor 3221 on the first upper flow channel 1711 and the second solenoid valve 3112 and reaches the heat exchanger 300. After heat exchange in the heat exchanger 300, the low-temperature refrigerant is output. After entering the heat exchanger 300, the high-temperature refrigerant exchanges heat with the coolant side of the heat exchanger 300. After heat exchange, the high-temperature refrigerant is transformed into a low-temperature refrigerant. The low-temperature refrigerant sequentially passes through the second electronic expansion valve 3122 and the second temperature sensor 3212 on the third lower flow channel 1733 for throttling and pressure reduction, and then enters the direct cooling plate 3200 of the battery through the sixth upper flow channel 107. The low-temperature refrigerant exchanges heat in the direct cooling plate 3200 and is transformed into a high-temperature refrigerant. The high-temperature refrigerant enters the second upper flow channel 1712 through the second sub-interface 1582, passes through the temperature and pressure sensor 323 and the fourth electronic expansion valve 3124 for throttling and pressure reduction, the fourth solenoid valve 3114 is opened, and after passing through the first lower flow channel 1731 and the third upper flow channel 1713, the high-temperature refrigerant returns to the compressor 3100 after passing through the gas-liquid separator 3300, thereby forming a refrigerant circulation path in the battery cooling mode.

[0108] Please refer to Figure 2 , Figure 4 , Figure 8 , Figure 9 , Figure 12 and Figure 15 , in some embodiments, when the management system 10000 is in the air-conditioning refrigeration and battery cooling modes, the high-temperature refrigerant discharged by the compressor 3100 sequentially passes through the first upper flow channel 1711 and reaches the heat exchanger 300, and after heat exchange, the low-temperature refrigerant is output. The low-temperature refrigerant includes a first low-temperature refrigerant and a second low-temperature refrigerant. The first low-temperature refrigerant passes through the third lower flow channel 1733. After the electronic expansion valve 312 on the third lower flow channel 1733 throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant passes through the fifth upper flow channel 1715 and reaches the evaporator 3500 and is converted into a high-temperature refrigerant. The high-temperature refrigerant output by the evaporator 3500 returns to the compressor 3100; the second low-temperature refrigerant passes through the sixth upper flow channel 1716 and reaches the direct cooling plate 3200 of the battery. The low-temperature refrigerant passes through the direct cooling plate 3200 and is converted into a high-temperature refrigerant. After the electronic expansion valve 312 on the second upper flow channel 1712 throttles and reduces the pressure of the high-temperature refrigerant, the high-temperature refrigerant passes through the first lower flow channel 1731 and the third upper flow channel 1713 and then returns to the compressor 3100 from the gas-liquid separator 3300.

[0109] In the air-conditioning refrigeration and battery cooling modes, the second solenoid valve 3112 is opened, and the high-temperature refrigerant discharged from the compressor 3100 sequentially passes through the first pressure sensor 3221 on the first upper flow channel 1711 and the second solenoid valve 3112, and reaches the heat exchanger 300. After heat exchange in the heat exchanger 300, the low-temperature refrigerant is output. After the high-temperature refrigerant enters the heat exchanger 300, it exchanges heat with the coolant side of the heat exchanger 300. After heat exchange, the high-temperature refrigerant is transformed into a low-temperature refrigerant. After heat exchange, the refrigerant is split into two in the integrated valve base 10. Part of the low-temperature refrigerant (the first low-temperature refrigerant) sequentially passes through the first temperature sensor 3211 and the first electronic expansion valve 3121 on the third lower flow channel 1733 for throttling and pressure reduction. Then, the low-temperature refrigerant enters the evaporator 3500 through the fifth upper flow channel 1715, absorbs ambient heat and evaporates. The evaporated low-temperature refrigerant is blown into the place to be cooled by a blower (not shown) to achieve refrigeration. After passing through the evaporator 3500, the low-temperature refrigerant is converted into a high-temperature refrigerant, and the high-temperature refrigerant returns to the compressor 3100, thus forming the first refrigerant circulation path in the air-conditioning refrigeration and battery cooling modes.

[0110] Part of the low-temperature refrigerant (the second low-temperature refrigerant) sequentially passes through the second electronic expansion valve 3122 and the second temperature sensor 3212 on the third lower flow channel 1733 for throttling and pressure reduction, enters the direct cooling plate 3200 of the battery through the sixth upper flow channel 107 for heat exchange. After heat exchange, the low-temperature refrigerant is transformed into a high-temperature refrigerant. The high-temperature refrigerant enters the second upper flow channel 1712 through the second sub-interface 1582, passes through the temperature and pressure sensor 322 and the fourth electronic expansion valve 3124 for throttling and pressure reduction, and after passing through the first lower flow channel 1731 and the third upper flow channel 1713, the high-temperature refrigerant returns to the compressor 3100 through the gas separation tank 3300, thus forming the second refrigerant circulation path in the air-conditioning refrigeration and battery cooling modes.

[0111] Please refer to Figure 2 , Figure 4 , Figure 8 , Figure 9 , Figure 12 and Figure 16 , in some embodiments, when the management system 10000 is in the air-conditioning heating mode, the high-temperature refrigerant discharged from the compressor 3100 enters the condenser 3400. After releasing heat in the condenser 3400, the high-temperature refrigerant is transformed into a low-temperature refrigerant. The low-temperature refrigerant passes through the fourth upper flow channel 1714. After the electronic expansion valve 312 on the fourth upper flow channel 1714 throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger 300. After heat exchange in the heat exchanger 300, the high-temperature refrigerant is output. The high-temperature refrigerant passes through the third upper flow channel 1713 and then enters the compressor 3100 through the gas separation tank 3300.

[0112] In the air-conditioning heating mode, the high-temperature refrigerant discharged by the compressor 3100 directly enters the condenser 3400. The high-temperature refrigerant releases heat in the condenser 3400, and the high-temperature refrigerant is blown into the place to be cooled by the blower to achieve heating. After passing through the condenser 3400, the high-temperature refrigerant is converted into a low-temperature refrigerant. The low-temperature refrigerant enters the fourth upper flow channel 1714. After throttling and depressurizing by the third temperature sensor 3213 and the third electronic expansion valve 3123 in the fourth upper flow channel 1714, it enters the third lower flow channel 1733 and enters the heat exchanger 300 through the first temperature sensor 3211 to exchange heat with the heat exchanger 300. After heat exchange, the low-temperature refrigerant is converted into a high-temperature refrigerant. The high-temperature refrigerant enters the gas separation tank 3300 after passing through the third upper flow channel 1713 where the first electronic expansion valve 3121 is located, and enters the compressor 3100 after passing through the gas separation tank 3300, thereby forming a refrigerant circulation path in the air-conditioning heating mode.

[0113] Please refer to Figure 2 , Figure 4 , Figure 8 , Figure 9 , Figure 12 and Figure 17 , in some embodiments, when the management system 10000 is in the battery heating mode, the high-temperature refrigerant discharged by the compressor 3100 passes through the first upper flow channel 1711, the first lower flow channel 1731 and the second upper flow channel 1712. The electronic expansion valve 312 in the second upper flow channel 1712 throttles and depressurizes the high-temperature refrigerant and then inputs it into the direct cooling plate 3200 of the battery. The high-temperature refrigerant passes through the direct cooling plate 3200 and is converted into a low-temperature refrigerant. The low-temperature refrigerant passes through the sixth upper flow channel 1716 and the third lower flow channel 1733. The electronic expansion valve 312 in the third lower flow channel 1733 throttles and depressurizes the low-temperature refrigerant, and then the low-temperature refrigerant reaches the heat exchanger 300. The heat exchanger 300 outputs a high-temperature refrigerant after heat exchange. The high-temperature refrigerant enters the compressor 3100 through the gas separation tank 3300 after passing through the third upper flow channel 1713.

[0114] The high-temperature refrigerant discharged by the compressor 3100 sequentially passes through the first pressure sensor 3221 and the third solenoid valve 3113 of the first upper laminar flow channel 1711. After flowing through the first lower laminar flow channel 1731, it passes through the fourth expansion valve and the temperature and pressure sensor 323 for throttling and pressure reduction, and enters the direct cooling plate 3200 of the battery through the second upper laminar flow channel 1712. Heat exchange occurs in the direct cooling plate 3200, and the high-temperature refrigerant after heat exchange is transformed into a low-temperature refrigerant. The low-temperature refrigerant passes through the second temperature sensor 3212 and the second electronic expansion valve 3122 for throttling and pressure reduction, and then passes through the sixth upper laminar flow channel 1716 and the third lower laminar flow channel 1733 in sequence, and enters the heat exchanger 300 through the first temperature sensor 3211 to exchange heat with the coolant side of the heat exchanger 300. The low-temperature refrigerant after heat exchange is transformed into a high-temperature refrigerant. The high-temperature refrigerant passes through the first solenoid valve 3111, enters the gas separation tank 3300 through the third upper laminar flow channel 1713, and then enters the compressor 3100, thus forming a refrigerant circulation path under battery heating.

[0115] Please refer to Figure 2 , Figure 4 , Figure 8 , Figure 9 , Figure 12 and Figure 18 , in some embodiments, when the management system 10000 is in the air-conditioning heating and battery heating modes, the high-temperature refrigerant discharged by the compressor 3100 includes a first high-temperature refrigerant and a second high-temperature refrigerant. The first high-temperature refrigerant enters the condenser 3400. After releasing heat in the condenser 3400, the first high-temperature refrigerant is converted into a low-temperature refrigerant. The low-temperature refrigerant passes through the fourth upper laminar flow channel 1714. After the electronic expansion valve 312 in the fourth upper laminar flow channel 1714 throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger 300. The heat exchanger 300 outputs a high-temperature refrigerant after heat exchange. The high-temperature refrigerant passes through the third upper laminar flow channel 1713 and then enters the compressor 3100 through the gas separation tank 3300. The second high-temperature refrigerant passes through the first upper laminar flow channel 1711, the first lower laminar flow channel 1731, and the second upper laminar flow channel 1712. After the electronic expansion valve 312 in the second upper laminar flow channel 1712 throttles and reduces the pressure of the high-temperature refrigerant, it is input into the direct cooling plate 3200 of the battery. The high-temperature refrigerant passes through the direct cooling plate 3200 and is converted into a low-temperature refrigerant. The low-temperature refrigerant passes through the sixth upper laminar flow channel 1716 and the third lower laminar flow channel 1733. After the electronic expansion valve 312 in the third lower laminar flow channel 1733 throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger 300. The heat exchanger 300 outputs a high-temperature refrigerant after heat exchange. The high-temperature refrigerant passes through the third upper laminar flow channel 1713 and then enters the compressor 3100 through the gas separation tank 3300.

[0116] In the air-conditioning heating and battery heating modes, the high-temperature refrigerant discharged by the compressor 3100 is split into two parts. One part of the high-temperature refrigerant directly enters the condenser 3400. The high-temperature refrigerant releases heat in the condenser 3400, and the high-temperature refrigerant is blown into the place to be cooled by the blower to achieve heating. After passing through the condenser 3400, the high-temperature refrigerant is converted into a low-temperature refrigerant. The low-temperature refrigerant enters the fourth upper flow channel 1714. After throttling and depressurizing by the third temperature sensor 3213 and the third electronic expansion valve 3123 in the fourth upper flow channel 1714, it enters the third lower flow channel 1733 and enters the heat exchanger 300 through the first temperature sensor 3211 to exchange heat with the heat exchanger 300. After heat exchange, the low-temperature refrigerant is converted into a high-temperature refrigerant. The high-temperature refrigerant enters the gas separation tank 3300 after passing through the third upper flow channel 1713 where the first electronic expansion valve 3121 is located, and enters the compressor 3100 after passing through the gas separation tank 3300, thus forming the first refrigerant circulation path in the air-conditioning heating and battery heating modes; the other part of the high-temperature refrigerant sequentially passes through the first pressure sensor 3221 and the third solenoid valve 3113 in the first upper flow channel 1711, flows through the first lower flow channel 1731, and after throttling and depressurizing by the fourth expansion valve and the temperature and pressure sensor 323, enters the direct cooling plate 3200 of the battery through the second upper flow channel 1712, exchanges heat in the direct cooling plate 3200, and the high-temperature refrigerant after heat exchange is converted into a low-temperature refrigerant. The low-temperature refrigerant passes through the second temperature sensor 3212 and the second electronic expansion valve 3122 for throttling and depressurizing, and sequentially passes through the sixth upper flow channel 1716 and the third lower flow channel 1733, and then enters the heat exchanger 300 through the first temperature sensor 3211 to exchange heat with the coolant side of the heat exchanger 300. The low-temperature refrigerant after heat exchange is converted into a high-temperature refrigerant. The high-temperature refrigerant passes through the first solenoid valve 3111 and enters the gas separation tank 3300 through the third upper flow channel 1713 and then enters the compressor 3100, thus forming the second refrigerant circulation path in the air-conditioning heating and battery heating modes.

[0117] Please refer to Figure 2 , Figure 4 , Figure 8 , Figure 9 , Figure 12 and Figure 19 , in some embodiments, when the management system 10000 is in the air-conditioning dehumidification mode, the high-temperature refrigerant discharged by the compressor 3100 is converted into a low-temperature refrigerant after passing through the condenser 3400. The low-temperature refrigerant sequentially passes through the fourth upper flow channel 1714 and the third lower flow channel 1733. After the electronic expansion valve 312 in the third lower flow channel 1733 throttles and depressurizes the low-temperature refrigerant, the low-temperature refrigerant reaches the evaporator 3500 through the fifth upper flow channel 1715 and is converted into a high-temperature refrigerant. The high-temperature refrigerant output by the evaporator 3500 returns to the compressor 3100.

[0118] In the air conditioner dehumidification mode, the high-temperature refrigerant discharged by the compressor 3100 enters the condenser 3400 through pipeline connection. The high-temperature refrigerant releases heat in the condenser 3400, and the high-temperature refrigerant is blown into the place to be dehumidified by the blower, so as to heat and dehumidify. The high-temperature refrigerant is transformed into a low-temperature refrigerant. The low-temperature refrigerant enters the fourth upper flow channel 1714, and after throttling and pressure reduction by the third temperature sensor 3213, the third electronic expansion valve 3123 and the first electronic expansion valve 3121, it enters the fifth upper flow channel 1715. The low-temperature refrigerant enters the evaporator 3500 after the fifth upper flow channel 1715. The low-temperature refrigerant absorbs the environmental heat and evaporates. The low-temperature refrigerant is transformed into a high-temperature refrigerant and flows into the compressor 3100, thus forming a refrigerant circulation path in the air conditioner dehumidification mode.

[0119] Please refer to Figure 2 , Figure 4 , Figure 8 , Figure 9 , Figure 12 and Figure 20 , in some embodiments, when the management system 10000 is in the air conditioner dehumidification and battery heating modes, the high-temperature refrigerant discharged by the compressor 3100 includes a first high-temperature refrigerant and a second high-temperature refrigerant. The first high-temperature refrigerant is converted into a low-temperature refrigerant after passing through the condenser 3400. The low-temperature refrigerant sequentially passes through the fourth upper flow channel 1714 and the third lower flow channel 1733. After the electronic expansion valve 312 in the third lower flow channel 1733 throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant passes through the fifth upper flow channel 1715 to reach the evaporator 3500 and is converted into a high-temperature refrigerant. The high-temperature refrigerant output by the evaporator 3500 returns to the compressor 3100. The second high-temperature refrigerant passes through the first upper flow channel 1711, the first lower flow channel 1731 and the second upper flow channel 1712. After the electronic expansion valve 312 in the second upper flow channel 1712 throttles and reduces the pressure of the high-temperature refrigerant, it is input into the direct cooling plate 3200 of the battery. The high-temperature refrigerant passes through the direct cooling plate 3200 and is converted into a low-temperature refrigerant. The low-temperature refrigerant passes through the sixth upper flow channel 1716 and the third lower flow channel 1733. After the electronic expansion valve 312 in the third lower flow channel 1733 throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger 300. The heat exchanger 300 outputs a high-temperature refrigerant through heat exchange. The high-temperature refrigerant passes through the third upper flow channel 1713 and then enters the compressor 3100 through the gas separation tank 3300.

[0120] In the air-conditioning dehumidification and battery heating modes, the high-temperature refrigerant discharged by the compressor 3100 is divided into two parts. One part of the high-temperature refrigerant (the first high-temperature refrigerant) is connected by a pipeline and enters the condenser 3400. The high-temperature refrigerant releases heat in the condenser 3400, and the high-temperature refrigerant is blown into the place to be dehumidified by a blower, so as to heat and dehumidify. The high-temperature refrigerant is transformed into a low-temperature refrigerant, and the low-temperature refrigerant enters the fourth upper flow channel 1714. After throttling and reducing the pressure through the third temperature sensor 3213, the third electronic expansion valve 3123 and the first electronic expansion valve 3121, it enters the fifth upper flow channel 1715. The low-temperature refrigerant enters the evaporator 3500 after flowing out of the fifth upper flow channel 1715. The low-temperature refrigerant absorbs ambient heat and evaporates, and the low-temperature refrigerant is transformed into a high-temperature refrigerant and flows into the compressor 3100, thereby forming the first refrigerant circulation path in the air-conditioning dehumidification and battery heating modes. One part of the high-temperature refrigerant (the second high-temperature refrigerant) sequentially passes through the first pressure sensor 3221 and the third solenoid valve 3113 of the first upper flow channel 1711. After flowing through the first lower flow channel 1731, it passes through the fourth expansion valve and the temperature and pressure sensor 323 for throttling and reducing the pressure, and enters the direct cooling plate 3200 of the battery through the second upper flow channel 1712. Heat exchange occurs in the direct cooling plate 3200, and the high-temperature refrigerant after heat exchange is transformed into a low-temperature refrigerant. The low-temperature refrigerant passes through the second temperature sensor 3212 and the second electronic expansion valve 3122 for throttling and reducing the pressure, and sequentially passes through the sixth upper flow channel 1716 and the third lower flow channel 1733, and then enters the heat exchanger 300 through the first temperature sensor 3211 to exchange heat with the coolant side of the heat exchanger 300. The low-temperature refrigerant after heat exchange is transformed into a high-temperature refrigerant. The high-temperature refrigerant passes through the first solenoid valve 3111 and enters the gas-liquid separator 3300 through the third upper flow channel 1713 and then enters the compressor 3100, thereby forming the second refrigerant circulation path in the air-conditioning dehumidification and battery heating modes.

[0121] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to the embodiments of the present application without departing from the principles and purposes of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. An integrated valve base, characterized in that The integrated valve base includes an opposite top wall and bottom wall, and side walls connecting the top wall and the bottom wall. The top wall is provided with a first interface for accessing a switching module, and the side wall is provided with a second interface for accessing a plate heat exchanger module. A flow channel is provided in the integrated valve base, and the first interface and the second interface are communicated through the flow channel to form a refrigerant circulation path.

2. The integrated valve base according to claim 1, characterized in that, The flow channel includes an upper layer flow channel and a lower layer flow channel. In the direction from the top wall to the bottom wall, the upper layer flow channel is closer to the top wall than the lower layer flow channel. The side wall includes opposite first side wall and second side wall. The upper layer flow channel extends from the first side wall to the second side wall. The first interface and the second interface are both communicated with the upper layer flow channel, and the lower layer flow channel is communicated with the upper layer flow channel.

3. The integrated valve base according to claim 2, wherein The first interface includes a valve body interface and a sensor interface. The valve body interface is used for accessing the valve body in the switching module, and the sensor interface is used for accessing the sensor in the switching module. The side wall further includes opposite third side wall and fourth side wall, and both the third side wall and the fourth side wall are connected to the first side wall and the second side wall. There are multiple upper layer flow channels, and there are multiple second interfaces. The multiple upper layer flow channels are arranged in sequence in the direction from the third side wall to the fourth side wall. At least one valve body interface is provided on each upper layer flow channel and is communicated with one second interface, and the sensor interface is provided on at least one upper layer flow channel.

4. The integrated valve base according to claim 3, characterized in that, There are multiple lower layer flow channels, and the multiple lower layer flow channels are spaced from each other. The valve body interfaces on at least two upper layer flow channels are communicated through the lower layer flow channel, and the sensor interface is provided on at least one lower layer flow channel.

5. The integrated valve base according to claim 3, characterized in that, The upper layer flow channel includes a first upper layer flow channel, a second upper layer flow channel, a third upper layer flow channel, a fourth upper layer flow channel, a fifth upper layer flow channel and a sixth upper layer flow channel arranged in sequence in the direction from the third side wall to the fourth side wall. The lower layer flow channel includes a first lower layer flow channel, a second lower layer flow channel and a third lower layer flow channel. The second interface includes a first sub-interface, a second sub-interface, a third sub-interface, a fourth sub-interface, a fifth sub-interface and a sixth sub-interface respectively communicated with the first upper layer flow channel, the second upper layer flow channel, the third upper layer flow channel, the fourth upper layer flow channel, the fifth upper layer flow channel and the sixth upper layer flow channel. The first lower layer flow channel communicates with the first upper layer flow channel, the second upper layer flow channel and the third upper layer flow channel. The second lower layer flow channel communicates with the first upper layer flow channel and the third upper layer flow channel. The third lower layer flow channel communicates with the fourth upper layer flow channel, the fifth upper layer flow channel and the sixth upper layer flow channel.

6. The integrated valve base according to claim 5, wherein The valve body interface includes a solenoid valve interface and an electronic expansion valve interface. The sensor interface and the solenoid valve interface are both provided on the first upper layer flow channel and the third upper layer flow channel. The sensor interface and the electronic expansion valve interface are both provided on the second upper layer flow channel, the fourth upper layer flow channel and the sixth upper layer flow channel. The electronic expansion valve interface is provided on the fifth upper layer flow channel.

7. The integrated valve base according to claim 6, characterized in that The sensor interfaces on the first upper flow channel, the second upper flow channel, the third upper flow channel, the fourth upper flow channel, and the sixth upper flow channel are closer to the first side wall or the second side wall than the valve body interfaces.

8. The integrated valve base according to claim 5, characterized in that, The sensor body interfaces include a temperature sensor interface, a pressure sensor interface, and a temperature and pressure sensor interface; the temperature sensor interface is provided on both the fourth upper flow channel and the sixth upper flow channel, the temperature sensor interface is provided on the third lower flow channel, the temperature and pressure sensor interface is provided on the second upper flow channel, and the pressure sensor interface is provided on both the first upper flow channel and the third upper flow channel.

9. The integrated valve base according to claim 1, characterized in that, Mounting portions are provided on the side walls, mounting holes are provided on the mounting portions, and shock-absorbing members are provided in the mounting holes.

10. The integrated valve base according to claim 1, characterized in that, Positioning members are provided on the top wall or the bottom wall, and the positioning members are used to position and mount the adapter plate.

11. The integrated valve base according to claim 1, characterized in that, A wire harness portion is provided on the side wall, the wire harness portion protrudes and extends relative to the side wall, and the wire harness portion is used to restrain wires.

12. An integrated valve assembly, characterized in that, Comprising: The integrated valve base according to any one of claims 1-11; And A switching module, the switching module is mounted on the first interface.

13. The integrated valve assembly according to claim 12, characterized in that, The switching module includes: A valve body, the valve body is mounted on the valve body interface of the first interface; and A sensor, the sensor is mounted on the sensor interface of the first interface and is spaced from the valve body.

14. The integrated valve assembly according to claim 13, wherein, The valve body includes an electromagnetic valve and an electronic expansion valve, the electromagnetic valve is mounted on the electromagnetic valve interface in the valve body interface, and the electronic expansion valve is mounted on the electronic expansion valve interface in the valve body interface.

15. The integrated valve assembly according to claim 13, wherein, The sensor includes a temperature sensor, a pressure sensor, and a temperature and pressure sensor, the temperature sensor is mounted on the temperature sensor interface in the sensor interface, the pressure sensor is mounted on the pressure sensor interface in the sensor interface, and the temperature and pressure sensor is mounted on the temperature and pressure sensor interface in the sensor interface.

16. A thermal management module, characterized in that, Comprising: The integrated valve assembly according to any one of claims 12-15.

17. The thermal management module according to claim 16, characterized in that, Further comprising: A heat exchanger, the heat exchanger is connected to the integrated valve assembly and is located on the side where the bottom wall is located, and the heat exchanger is communicated with at least one of the first interfaces.

18. The thermal management module according to claim 16, characterized in that, Further comprising: A heat exchanger, the heat exchanger is connected to the integrated valve assembly and is located on the side where the top wall is located, and the heat exchanger is communicated with at least one of the first interfaces.

19. The thermal management module according to claim 17 or 18, characterized in that, Further comprising: An adapter plate, the adapter plate is provided between the heat exchanger and the integrated valve assembly, and the heat exchanger is connected to the integrated valve assembly through the adapter plate.

20. The thermal management module according to claim 19, wherein, A fitting is provided on the adapter plate, and the fitting cooperates with the positioning member on the top wall or the bottom wall to position the connection between the adapter plate and the integrated valve assembly.

21. A management system, characterized in that, Comprising: The thermal management module according to any one of claims 17-20; And A plate heat exchanger module, the plate heat exchanger module is communicated with the second interface.

22. The management system according to claim 21, wherein The plate heat exchanger module includes: A compressor, the compressor is communicated with the first sub-interface in the second interface; A gas separation tank, the compressor is communicated with the third sub-interface in the second interface; A condenser, which is in communication with a fourth sub-interface in the second interface; An evaporator, which is in communication with a fifth sub-interface in the second interface; and A direct cooling plate of the battery, the direct cooling plate is provided with an inner cavity, a first opening communicating with the inner cavity, and a second opening communicating with the inner cavity, the first opening is in communication with a second sub-interface in the second interface, and the second opening is in communication with a sixth sub-interface in the second interface.

23. The management system according to claim 22, characterized in that, When the management system is in the air-conditioning refrigeration mode, a solenoid valve that is in communication with both the first upper flow channel and the second lower flow channel in the flow channel is opened, and an electronic expansion valve on the third lower flow channel in the flow channel throttles and reduces the pressure. The high-temperature refrigerant discharged by the compressor sequentially passes through a pressure sensor on the first upper flow channel, the first upper flow channel, reaches the heat exchanger, and exchanges heat to output a low-temperature refrigerant. The low-temperature refrigerant sequentially passes through a pressure sensor on the third lower flow channel, the third lower flow channel, and the fifth upper flow channel in the flow channel, and then reaches the evaporator and is converted into the high-temperature refrigerant. The high-temperature refrigerant output by the evaporator returns to the compressor after passing through the gas-liquid separator.

24. The management system according to claim 22, wherein When the management system is in the battery cooling mode, the high-temperature refrigerant discharged by the compressor passes through the first upper flow channel in the flow channel, reaches the heat exchanger, and exchanges heat to output a low-temperature refrigerant. The low-temperature refrigerant passes through the third lower flow channel in the flow channel. After the electronic expansion valve on the third lower flow channel throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant passes through the sixth upper flow channel in the flow channel and reaches the direct cooling plate. The low-temperature refrigerant passes through the direct cooling plate and is converted into the high-temperature refrigerant. The high-temperature refrigerant passes through the second upper flow channel in the flow channel. After the electronic expansion valve on the second upper flow channel in the flow channel throttles and reduces the pressure of the high-temperature refrigerant, the high-temperature refrigerant passes through the first lower flow channel and the third upper flow channel and then returns to the compressor from the gas-liquid separator.

25. The management system according to claim 22, wherein, When the management system is in the air-conditioning refrigeration and battery cooling modes, the high-temperature refrigerant discharged by the compressor sequentially passes through the first upper flow channel in the flow channel, reaches the heat exchanger, and exchanges heat to output a low-temperature refrigerant. The low-temperature refrigerant includes a first low-temperature refrigerant and a second low-temperature refrigerant. The first low-temperature refrigerant passes through the third lower flow channel in the flow channel. After the electronic expansion valve on the third lower flow channel throttles and reduces the pressure of the first low-temperature refrigerant, the first low-temperature refrigerant passes through the fifth upper flow channel in the flow channel and reaches the evaporator and is converted into the high-temperature refrigerant. The high-temperature refrigerant output by the evaporator returns to the compressor; The second low-temperature refrigerant passes through the sixth upper flow channel in the flow channel and reaches the direct cooling plate. The second low-temperature refrigerant passes through the direct cooling plate and is converted into the high-temperature refrigerant. The high-temperature refrigerant passes through the second upper flow channel in the flow channel. After the electronic expansion valve on the second upper flow channel throttles and reduces the pressure of the high-temperature refrigerant, the high-temperature refrigerant passes through the first lower flow channel and the third upper flow channel in the flow channel and then returns to the compressor from the gas-liquid separator.

26. The management system according to claim 22, wherein When the management system is in the air-conditioning heating mode, the high-temperature refrigerant discharged from the compressor enters the condenser, and the high-temperature refrigerant is converted into low-temperature refrigerant after releasing heat in the condenser. The low-temperature refrigerant passes through the fourth upper flow channel in the flow channel, and after the electronic expansion valve of the fourth upper flow channel throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger. The heat exchanger exchanges heat and outputs the high-temperature refrigerant. The high-temperature refrigerant passes through the third upper flow channel in the flow channel and enters the compressor through the gas separator tank.

27. The management system according to claim 22, characterized in that, When the management system is in the battery heating mode, the high-temperature refrigerant discharged from the compressor passes through the first upper flow channel in the flow channel, the first lower flow channel in the flow channel and the second upper flow channel in the flow channel. The electronic expansion valve of the second upper flow channel throttles and reduces the pressure of the high-temperature refrigerant and then inputs it into the direct cooling plate. The high-temperature refrigerant passes through the direct cooling plate and is converted into a low-temperature refrigerant. The low-temperature refrigerant passes through the sixth upper flow channel in the flow channel and the third lower flow channel in the flow channel. After the electronic expansion valve of the third lower flow channel throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger. The heat exchanger exchanges heat and outputs the high-temperature refrigerant. The high-temperature refrigerant passes through the third upper flow channel in the flow channel and enters the compressor through the gas separator tank.

28. The management system according to claim 22, wherein When the management system is in the air conditioning heating and battery heating mode, the high-temperature refrigerant discharged from the compressor includes a first high-temperature refrigerant and a second high-temperature refrigerant. The first high-temperature refrigerant enters the condenser. The first high-temperature refrigerant is converted into a low-temperature refrigerant after releasing heat in the condenser. The low-temperature refrigerant passes through the fourth upper flow channel in the flow channel. After the electronic expansion valve of the fourth upper flow channel throttles and reduces the pressure of the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger. The heat exchanger exchanges heat and outputs the high-temperature refrigerant. The high-temperature refrigerant passes through the third upper flow channel in the flow channel and then enters the compressor through the gas separator tank. The second high-temperature refrigerant The high-temperature refrigerant passes through the first upper flow channel in the flow channel, the first lower flow channel in the flow channel and the second upper flow channel in the flow channel, and the electronic expansion valve of the second upper flow channel throttles and reduces the pressure of the high-temperature refrigerant before being input into the direct cooling plate. The high-temperature refrigerant passes through the direct cooling plate and is converted into a low-temperature refrigerant. The low-temperature refrigerant passes through the sixth upper flow channel in the flow channel and the third lower flow channel in the flow channel. The electronic expansion valve of the third lower flow channel throttles and reduces the pressure of the low-temperature refrigerant before the low-temperature refrigerant reaches the heat exchanger. The heat exchanger exchanges heat and outputs the high-temperature refrigerant. The high-temperature refrigerant passes through the third upper flow channel and enters the compressor through the gas separation tank.

29. The management system according to claim 22, wherein When the management system is in the air-conditioning dehumidification mode, the high-temperature refrigerant discharged by the compressor is converted into a low-temperature refrigerant after passing through the condenser. The low-temperature refrigerant sequentially passes through the fourth upper flow channel in the flow channel and the third lower flow channel in the flow channel. After the electronic expansion valve of the third lower flow channel throttles and depressurizes the low-temperature refrigerant, the low-temperature refrigerant reaches the evaporator through the fifth upper flow channel in the flow channel and is converted into the high-temperature refrigerant. The high-temperature refrigerant output by the evaporator returns to the compressor.

30. The management system according to claim 22, wherein, When the management system is in the air-conditioning dehumidification and battery heating mode, the high-temperature refrigerant discharged by the compressor includes a first high-temperature refrigerant and a second high-temperature refrigerant. The first high-temperature refrigerant is converted into a low-temperature refrigerant after passing through the condenser. The low-temperature refrigerant sequentially passes through the fourth upper flow channel in the flow channel and the third lower flow channel in the flow channel. After the electronic expansion valve of the third lower flow channel throttles and depressurizes the low-temperature refrigerant, the low-temperature refrigerant reaches the evaporator through the fifth upper flow channel and is converted into the high-temperature refrigerant. The high-temperature refrigerant output by the evaporator returns to the compressor. The second high-temperature refrigerant passes through the first upper flow channel in the flow channel, the first lower flow channel in the flow channel, and the second upper flow channel in the flow channel. After the electronic expansion valve of the second upper flow channel throttles and depressurizes the high-temperature refrigerant, it is input into the direct cooling plate. The high-temperature refrigerant passes through the direct cooling plate and is converted into a low-temperature refrigerant. The low-temperature refrigerant passes through the sixth upper flow channel in the flow channel and the third lower flow channel in the flow channel. After the electronic expansion valve of the third lower flow channel throttles and depressurizes the low-temperature refrigerant, the low-temperature refrigerant reaches the heat exchanger. The heat exchanger outputs the high-temperature refrigerant through heat exchange. The high-temperature refrigerant passes through the third upper flow channel and then enters the compressor through the gas separation tank.

31. A vehicle, characterized in that, Comprising: The management system according to any one of claims 21-30.

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